デフォルト表紙
市場調査レポート
商品コード
1361812

耐放射線性エレクトロニクスの世界市場レポート

Global Radiation Hardened Electronics Market Report

出版日: | 発行: Value Market Research | ページ情報: 英文 190 Pages | 納期: 即日から翌営業日

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価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=151.08円
耐放射線性エレクトロニクスの世界市場レポート
出版日: 2023年10月01日
発行: Value Market Research
ページ情報: 英文 190 Pages
納期: 即日から翌営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界の耐放射線性エレクトロニクスの市場規模は、2023年~2030年の調査期間中にCAGR5%で成長すると予想されています。

耐放射線性エレクトロニクスは電子部品を指します。回路、抵抗器、トランジスタ、コンデンサ、ダイオード、シングルボードコンピュータCPU、パッケージ、および主に産業で使用される製品で構成され、非常に高い放射線被曝から機器を保護します。耐放射線性エレクトロニクスは、宇宙空間における有害な放射線による物理的な損傷や故障から電子機器を保護するという重要な役割を担っています。放射線や-55℃~125℃の極端な温度にも耐えられるように設計されています。

市場力学:

耐放射線性エレクトロニクス市場は、通信衛星の需要拡大と監視体制の強化によって牽引されています。商業宇宙計画の増加や電子機器放射線被ばくシステムの採用拡大も市場成長の主な要因です。さらに、宇宙探査計画や長距離通信の増加により、人工衛星に使用される耐放射線性エレクトロニクスの需要が増加しています。このほか、高信頼性集積回路の開発やFPGA(Field-Programmable Gate Array)技術の向上など、さまざまな技術の進歩も市場成長を後押しする主な要因となっています。しかし、耐放射線性エレクトロニクスのメンテナンスコストが高いことが、評価期間中の市場成長の妨げになる可能性があります。

この調査レポートは、ポーターのファイブフォースモデル、市場魅力度分析、バリューチェーン分析を対象としています。これらのツールは、業界の構造を明確に把握し、世界レベルでの競合の魅力を評価するのに役立ちます。さらに、これらのツールは、耐放射線性エレクトロニクスの世界市場における各セグメントを包括的に評価することもできます。耐放射線性エレクトロニクス産業の成長と動向は、本調査に総合的なアプローチを提供します。

地域分析:

このセクションでは、北米、欧州、アジア太平洋、ラテンアメリカ、中東・アフリカにおける耐放射線性エレクトロニクス市場の現在と将来の需要を強調する地域展望をカバーしています。さらに、このレポートでは、すべての主要地域における個々のアプリケーションセグメントの需要、推定・予測に焦点を当てています。

ご要望がございましたら、弊社までご連絡ください。当社の調査チームは、お客様のニーズに応じてカスタマイズしたレポートを提供することができます。

目次

第1章 序文

第2章 エグゼクティブサマリー

  • 市場のハイライト
  • 世界市場スナップショット

第3章 耐放射線性エレクトロニクス:産業分析

  • イントロダクション:市場力学
  • 市場促進要因
  • 市場抑制要因
  • 市場機会
  • 業界動向
  • ポーターのファイブフォース分析
  • 市場魅力度分析

第4章 バリューチェーン分析

  • バリューチェーン分析
  • 原材料分析
    • 原材料リスト
    • 原材料メーカーリスト
    • 主要原材料の価格動向
  • 潜在的バイヤーのリスト
  • マーケティングチャネル
    • ダイレクトマーケティング
    • インダイレクトマーケティング
    • マーケティングチャネル発展動向

第5章 COVID-19発生の影響分析

第6章 耐放射線性エレクトロニクスの世界市場分析:コンポーネント別

  • 概要:コンポーネント別
  • 実績データと予測データ
  • 分析:コンポーネント別
  • ミックスドシグナルIC
  • プロセッサー・コントローラー
  • メモリ
  • パワーマネージメント

第7章 耐放射線性エレクトロニクスの世界市場分析:製造技術別

  • 概要:製造技術別
  • 実績データと予測データ
  • 分析:製造技術別
  • 放射線硬化設計(RHBD)
  • 放射線硬化プロセス(RHBP)

第8章 耐放射線性エレクトロニクスの世界市場分析:製品タイプ別

  • 概要:製品タイプ別
  • 実績データと予測データ
  • 分析:製品タイプ別
  • 市販品(COTS)
  • カスタムメイド

第9章 耐放射線性エレクトロニクスの世界市場分析:用途別

  • 概要:用途別
  • 実績データと予測データ
  • 分析:用途別
  • 宇宙
  • 航空宇宙・防衛
  • 原子力発電所
  • 医療
  • その他

第10章 耐放射線性エレクトロニクスの世界市場分析:地域別

  • 地域別展望
  • イントロダクション
  • 北米の売上分析
    • 概要、実績と予測
    • 北米:セグメント別
    • 北米:国別
    • 米国
    • カナダ
    • メキシコ
  • 欧州の売上分析
    • 概要、実績と予測
    • 欧州:セグメント別
    • 欧州:国別
    • 英国
    • フランス
    • ドイツ
    • イタリア
    • ロシア
    • その他欧州
  • アジア太平洋地域の売上分析
    • 概要、実績と予測
    • アジア太平洋地域:セグメント別
    • アジア太平洋地域:国別
    • 中国
    • インド
    • 日本
    • 韓国
    • オーストラリア
    • その他アジア太平洋地域
  • ラテンアメリカの売上分析
    • 概要、実績と予測
    • ラテンアメリカ:セグメント別
    • ラテンアメリカ:国別
    • ブラジル
    • アルゼンチン
    • ペルー
    • チリ
    • その他ラテンアメリカ
  • 中東・アフリカの売上分析
    • 概要、実績と予測
    • 中東・アフリカ:セグメント別
    • 中東・アフリカ:国別
    • サウジアラビア
    • アラブ首長国連邦
    • イスラエル
    • 南アフリカ
    • その他中東・アフリカ

第11章 耐放射線性エレクトロニクス企業の競合情勢

  • 耐放射線性エレクトロニクス市場の競合
  • 提携・協力・合意
  • 合併・買収
  • 新製品発表
  • その他の開発

第12章 企業プロファイル

  • 上位企業シェア分析
  • 市場集中度
  • Microchip Technology Inc.(US)
  • BAE Systems(UK)
  • Renesas Electronics Corporation(Japan)
  • Infineon Technologies AG(Germany)
  • STMicroelectronics(Switzerland)
  • Xilinx Inc.(US)
  • Texas Instruments Incorporated(US)
  • Honeywell International Inc.(US)
  • Teledyne Technologies Inc.(US)
  • TTM Technologies Inc.(US).
図表

LIST OF TABLES

  • Market Snapshot
  • Drivers : Impact Analysis
  • Restraints : Impact Analysis
  • List of Raw Material
  • List of Raw Material Manufactures
  • List of Potential Buyers
  • Analysis by Component (USD MN)
  • Mixed Signal ICs Market Sales by Geography (USD MN)
  • Processors & Controllers Market Sales by Geography (USD MN)
  • Memory Market Sales by Geography (USD MN)
  • Power Management Market Sales by Geography (USD MN)
  • Analysis Market by Manufacturing Technique (USD MN)
  • Radiation-Hardening Design (RHBD) Market Sales by Geography (USD MN)
  • Radiation-Hardening Process (RHBP) Market Sales by Geography (USD MN)
  • Analysis by Product Type (USD MN)
  • Commercial-off-the-Shelf (COTS) Market Sales by Geography (USD MN)
  • Custom Made Market Sales by Geography (USD MN)
  • Analysis by Application (USD MN)
  • Space Market Sales by Geography (USD MN)
  • Aerospace & Defense Market Sales by Geography (USD MN)
  • Nuclear Power Plant Market Sales by Geography (USD MN)
  • Medical Market Sales by Geography (USD MN)
  • Others Market Sales by Geography (USD MN)
  • Global Radiation Hardened Electronics Market Sales by Geography (USD MN)
  • North America Market Analysis (USD MN)
  • United State Market Analysis (USD MN)
  • Canada Market Analysis (USD MN)
  • Mexico Market Analysis (USD MN)
  • Europe Market Analysis (USD MN)
  • Europe Market Estimate by Country (USD MN)
  • United Kingdom Market Analysis (USD MN)
  • France Market Analysis (USD MN)
  • Germany Market Analysis (USD MN)
  • Italy Market Analysis (USD MN)
  • Russia Market Analysis (USD MN)
  • Spain Market Analysis (USD MN)
  • Rest of Europe Market Analysis (USD MN)
  • Asia Pacific Market Analysis (USD MN)
  • China Market Analysis (USD MN)
  • Japan Market Analysis (USD MN)
  • India Market Analysis (USD MN)
  • South Korea Market Analysis (USD MN)
  • Australia Market Analysis (USD MN)
  • Rest of Asia Pacific Market Analysis (USD MN)
  • Latin America Market Analysis (USD MN)
  • Brazil Market Analysis (USD MN)
  • Argentina Market Analysis (USD MN)
  • Peru Market Analysis (USD MN)
  • Chile Market Analysis (USD MN)
  • Rest of Latin America Market Analysis (USD MN)
  • Middle East & Africa Market Analysis (USD MN)
  • Saudi Arabia Market Analysis (USD MN)
  • UAE Market Analysis (USD MN)
  • Israel Market Analysis (USD MN)
  • South Africa Market Analysis (USD MN)
  • Rest of Middle East and Africa Market Analysis (USD MN)
  • Partnership/Collaboration/Agreement
  • Mergers And Acquisition

LIST OF FIGURES

  • Research Scope of Radiation Hardened Electronics Report
  • Market Research Process
  • Market Research Methodology
  • Global Radiation Hardened Electronics Market Size, by Region (USD MN)
  • Porters Five Forces Analysis
  • Market Attractiveness Analysis by Component
  • Market Attractiveness Analysis by Manufacturing Technique
  • Market Attractiveness Analysis by Product Type
  • Market Attractiveness Analysis by Application
  • Market Attractiveness Analysis by Region
  • Value Chain Analysis
  • Global Market Analysis by Component (USD MN)
  • Mixed Signal ICs Market Sales by Geography (USD MN)
  • Processors & Controllers Market Sales by Geography (USD MN)
  • Memory Market Sales by Geography (USD MN)
  • Power Management Market Sales by Geography (USD MN)
  • Global Market Analysis by Manufacturing Technique (USD MN)
  • Radiation-Hardening Design (RHBD) Market Sales by Geography (USD MN)
  • Radiation-Hardening Process (RHBP) Market Sales by Geography (USD MN)
  • Global Market Analysis by Product Type (USD MN)
  • Commercial-off-the-Shelf (COTS) Market Sales by Geography (USD MN)
  • Custom Made Market Sales by Geography (USD MN)
  • Global Market Analysis by Application (USD MN)
  • Space Market Sales by Geography (USD MN)
  • Aerospace & Defense Market Sales by Geography (USD MN)
  • Nuclear Power Plant Market Sales by Geography (USD MN)
  • Medical Market Sales by Geography (USD MN)
  • Others Market Sales by Geography (USD MN)
  • Global Market by Revenue
  • North America Market by Revenue
  • Europe Market by Revenue
  • Asia Pacific Market by Revenue
  • Latin America Market by Revenue
  • Middle East & Africa Market by Revenue
  • Recent Development in Industry
  • Top Company Share Analysis

Kindly note that the above listed are the basic tables and figures of the report and are not limited to the TOC.

目次
Product Code: VMR11218590

The global demand for Radiation Hardened Electronics Market is presumed to reach the market size of nearly USD 3.69 MN by 2030 from USD 2.5 MN in 2022 with a CAGR of 5% under the study period 2023 - 2030.

Radiation hardened electronics refers to electronic components. It consists of circuits, resistors, transistors, capacitors, diodes, single-board computer CPUs, packages, and products primarily used in industries to protect devices from extremely high radiation exposure. The radiation hardened electronics play a crucial role in protecting electronic equipment from physical damage and failure caused by harmful radiation in outer space. They are designed to withstand radiation and extreme temperatures ranging from -55°C to 125°C.

MARKET DYNAMICS:

The market for radiation hardened electronics is driven by growing demand for communication satellites and increasing surveillance. The increasing number of commercial space programs and growing adoption of electronics radiation exposure systems are other major factors contributing to market growth. Moreover, increased demand for radiation-hardened electronics used in satellites has been driven by rising space exploration programmes and long-distance communication. Other major factors fuelling market growth are various technological advancements, such as developing highly reliable integrated circuits and improving field-programmable gate array (FPGA) technology, which will boost the market. However, the high maintenance cost of radiation hardened electronics may hamper its market growth during the assessment period.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of radiation hardened electronics. The growth and trends of radiation hardened electronics industry provide a holistic approach to this study.

MARKET SEGMENTATION:

This section of the radiation hardened electronics market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Component

  • Mixed Signal ICs
  • Processors & Controllers
  • Memory
  • Power Management

By Manufacturing Technique

  • Radiation-Hardening by Design (RHBD)
  • Radiation-Hardening by Process (RHBP)

By Product Type

  • Commercial-off-the-Shelf (COTS)
  • Custom Made

By Application

  • Space
  • Aerospace & Defense
  • Nuclear Power Plant
  • Medical
  • Others

REGIONAL ANALYSIS:

This section covers the regional outlook, which accentuates current and future demand for the Radiation Hardened Electronics market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the radiation hardened electronics market include Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), Xilinx, Inc. (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

In case you have any custom requirements, do write to us. Our research team can offer a customized report as per your need.

TABLE OF CONTENTS

1 . PREFACE

  • 1.1. Report Description
    • 1.1.1. Objective
    • 1.1.2. Target Audience
    • 1.1.3. Unique Selling Proposition (USP) & offerings
  • 1.2. Research Scope
  • 1.3. Research Methodology
    • 1.3.1. Market Research Process
    • 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

  • 2.1. Highlights of Market
  • 2.2. Global Market Snapshot

3 . RADIATION HARDENED ELECTRONICS - INDUSTRY ANALYSIS

  • 3.1. Introduction - Market Dynamics
  • 3.2. Market Drivers
  • 3.3. Market Restraints
  • 3.4. Opportunities
  • 3.5. Industry Trends
  • 3.6. Porter's Five Force Analysis
  • 3.7. Market Attractiveness Analysis
    • 3.7.1 Market Attractiveness Analysis By Component
    • 3.7.2 Market Attractiveness Analysis By Manufacturing Technique
    • 3.7.3 Market Attractiveness Analysis By Product Type
    • 3.7.4 Market Attractiveness Analysis By Application
    • 3.7.5 Market Attractiveness Analysis By Region

4 . VALUE CHAIN ANALYSIS

  • 4.1. Value Chain Analysis
  • 4.2. Raw Material Analysis
    • 4.2.1. List of Raw Materials
    • 4.2.2. Raw Material Manufactures List
    • 4.2.3. Price Trend of Key Raw Materials
  • 4.3. List of Potential Buyers
  • 4.4. Marketing Channel
    • 4.4.1. Direct Marketing
    • 4.4.2. Indirect Marketing
    • 4.4.3. Marketing Channel Development Trend

5 . IMPACT ANALYSIS OF COVID-19 OUTBREAK

6 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY COMPONENT

  • 6.1 Overview by Component
  • 6.2 Historical and Forecast Data
  • 6.3 Analysis by Component
  • 6.4 Mixed Signal ICs Historic and Forecast Sales by Regions
  • 6.5 Processors & Controllers Historic and Forecast Sales by Regions
  • 6.6 Memory Historic and Forecast Sales by Regions
  • 6.7 Power Management Historic and Forecast Sales by Regions

7 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY MANUFACTURING TECHNIQUE

  • 7.1 Overview by Manufacturing Technique
  • 7.2 Historical and Forecast Data
  • 7.3 Analysis by Manufacturing Technique
  • 7.4 Radiation-Hardening Design (RHBD) Historic and Forecast Sales by Regions
  • 7.5 Radiation-Hardening Process (RHBP) Historic and Forecast Sales by Regions

8 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY PRODUCT TYPE

  • 8.1 Overview by Product Type
  • 8.2 Historical and Forecast Data
  • 8.3 Analysis by Product Type
  • 8.4 Commercial-off-the-Shelf (COTS) Historic and Forecast Sales by Regions
  • 8.5 Custom Made Historic and Forecast Sales by Regions

9 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY APPLICATION

  • 9.1 Overview by Application
  • 9.2 Historical and Forecast Data
  • 9.3 Analysis by Application
  • 9.4 Space Historic and Forecast Sales by Regions
  • 9.5 Aerospace & Defense Historic and Forecast Sales by Regions
  • 9.6 Nuclear Power Plant Historic and Forecast Sales by Regions
  • 9.7 Medical Historic and Forecast Sales by Regions
  • 9.8 Others Historic and Forecast Sales by Regions

10 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY GEOGRAPHY

  • 10.1. Regional Outlook
  • 10.2. Introduction
  • 10.3. North America Sales Analysis
    • 10.3.1. Overview, Historic and Forecast Sales Analysis
    • 10.3.2. North America By Segment Sales Analysis
    • 10.3.3. North America By Country Sales Analysis
    • 10.3.4. United State Sales Analysis
    • 10.3.5. Canada Sales Analysis
    • 10.3.6. Mexico Sales Analysis
  • 10.4. Europe Sales Analysis
    • 10.4.1. Overview, Historic and Forecast Sales Analysis
    • 10.4.2. Europe by Segment Sales Analysis
    • 10.4.3. Europe by Country Sales Analysis
    • 10.4.4. United Kingdom Sales Analysis
    • 10.4.5. France Sales Analysis
    • 10.4.6. Germany Sales Analysis
    • 10.4.7. Italy Sales Analysis
    • 10.4.8. Russia Sales Analysis
    • 10.4.9. Rest Of Europe Sales Analysis
  • 10.5. Asia Pacific Sales Analysis
    • 10.5.1. Overview, Historic and Forecast Sales Analysis
    • 10.5.2. Asia Pacific by Segment Sales Analysis
    • 10.5.3. Asia Pacific by Country Sales Analysis
    • 10.5.4. China Sales Analysis
    • 10.5.5. India Sales Analysis
    • 10.5.6. Japan Sales Analysis
    • 10.5.7. South Korea Sales Analysis
    • 10.5.8. Australia Sales Analysis
    • 10.5.9. Rest Of Asia Pacific Sales Analysis
  • 10.6. Latin America Sales Analysis
    • 10.6.1. Overview, Historic and Forecast Sales Analysis
    • 10.6.2. Latin America by Segment Sales Analysis
    • 10.6.3. Latin America by Country Sales Analysis
    • 10.6.4. Brazil Sales Analysis
    • 10.6.5. Argentina Sales Analysis
    • 10.6.6. Peru Sales Analysis
    • 10.6.7. Chile Sales Analysis
    • 10.6.8. Rest of Latin America Sales Analysis
  • 10.7. Middle East & Africa Sales Analysis
    • 10.7.1. Overview, Historic and Forecast Sales Analysis
    • 10.7.2. Middle East & Africa by Segment Sales Analysis
    • 10.7.3. Middle East & Africa by Country Sales Analysis
    • 10.7.4. Saudi Arabia Sales Analysis
    • 10.7.5. UAE Sales Analysis
    • 10.7.6. Israel Sales Analysis
    • 10.7.7. South Africa Sales Analysis
    • 10.7.8. Rest Of Middle East And Africa Sales Analysis

11 . COMPETITIVE LANDSCAPE OF THE RADIATION HARDENED ELECTRONICS COMPANIES

  • 11.1. Radiation Hardened Electronics Market Competition
  • 11.2. Partnership/Collaboration/Agreement
  • 11.3. Merger And Acquisitions
  • 11.4. New Product Launch
  • 11.5. Other Developments

12 . COMPANY PROFILES OF RADIATION HARDENED ELECTRONICS INDUSTRY

  • 12.1. Top Company Share Analysis
  • 12.2. Market Concentration Rate
  • 12.3. Microchip Technology Inc. (US)
    • 12.3.1. Company Overview
    • 12.3.2. Company Revenue
    • 12.3.3. Products
    • 12.3.4. Recent Developments
  • 12.4. BAE Systems (UK)
    • 12.4.1. Company Overview
    • 12.4.2. Company Revenue
    • 12.4.3. Products
    • 12.4.4. Recent Developments
  • 12.5. Renesas Electronics Corporation (Japan)
    • 12.5.1. Company Overview
    • 12.5.2. Company Revenue
    • 12.5.3. Products
    • 12.5.4. Recent Developments
  • 12.6. Infineon Technologies AG (Germany)
    • 12.6.1. Company Overview
    • 12.6.2. Company Revenue
    • 12.6.3. Products
    • 12.6.4. Recent Developments
  • 12.7. STMicroelectronics (Switzerland)
    • 12.7.1. Company Overview
    • 12.7.2. Company Revenue
    • 12.7.3. Products
    • 12.7.4. Recent Developments
  • 12.8. Xilinx Inc. (US)
    • 12.8.1. Company Overview
    • 12.8.2. Company Revenue
    • 12.8.3. Products
    • 12.8.4. Recent Developments
  • 12.9. Texas Instruments Incorporated (US)
    • 12.9.1. Company Overview
    • 12.9.2. Company Revenue
    • 12.9.3. Products
    • 12.9.4. Recent Developments
  • 12.10. Honeywell International Inc. (US)
    • 12.10.1. Company Overview
    • 12.10.2. Company Revenue
    • 12.10.3. Products
    • 12.10.4. Recent Developments
  • 12.11. Teledyne Technologies Inc. (US)
    • 12.11.1. Company Overview
    • 12.11.2. Company Revenue
    • 12.11.3. Products
    • 12.11.4. Recent Developments
  • 12.12. TTM Technologies Inc. (US).
    • 12.12.1. Company Overview
    • 12.12.2. Company Revenue
    • 12.12.3. Products
    • 12.12.4. Recent Developments

Note - in company profiling, financial details and recent development are subject to availability or might not be covered in case of private companies