Si貫通電極（TSV）技術の世界市場規模：製品別、用途別、地域別、予測

Si貫通電極（TSV）技術の市場規模と予測

Si貫通電極（TSV）技術の市場規模は、2024年に351億2,000万米ドルと評価され、2026～2032年にかけて26.12%のCAGRで成長し、2032年には1,922億9,000万米ドルに達すると予測されます。

スマートフォン、ノートパソコン、タブレット端末など、スマートエレクトロニクス製品の採用拡大が、Si貫通電極（TSV）技術の飛躍的な成長をもたらしています。TSVは、三次元集積回路（IC）や、スマートエレクトロニクス製造において最も重要な部品の1つであるIC包装の製造に主に使用されています。これに加えて、TSVは従来型フリップチップやワイヤボンドと比較して、より高密度な接合、最小限のスペース、最高の接続性を記載しています。TSVの有用性は、マイクロプロセッシングユニット（MPU）、PLD、DRAM、グラフィックス用電子チップ、CMOSイメージセンサなど、さまざまな電子部品に応用されています。

世界のSi貫通電極（TSV）技術市場の定義

Si貫通電極（TSV）技術は、三次元（3D）シリコンと三次元集積回路（IC）の統合を可能にする中心的かつ最も重要な技術です。最短のチップ間相互接続、最小のパッドサイズとピッチでの相互接続が可能です。Si貫通電極（TSV）技術を相互接続に用いた三次元でのチップ積層は、CMOSイメージャ、メモリ、MEMS向けの先進包装技術として台頭してきています。TSV技術には、低消費電力、電気的性能の向上、高密度化、データ幅の拡大による帯域幅の拡大、軽量化など、従来型相互接続技術と比較していくつかの利点があります。

Si貫通電極（TSV）とは、シリコンまたはダイのウエハーを完全に貫通する垂直電気接続を指します。TSVは、ワイヤボンドやフリップチップに代わる三次元集積回路や三次元包装の作成に利用される、より高性能な相互接続手法です。この手法では、デバイス密度と相互接続密度が大幅に向上し、接続長が短くなります。市場を牽引するSi貫通電極（TSV）メモリの用途には、ハンドヘルド機器のビデオ品質向上のためのロジック機能とメモリの統合、マルチチップ高性能DRAM、ソリッドステートドライブ用スタックドNANDフラッシュメモリなどがあります。

Si貫通電極（TSV）技術の世界市場概要

電力、医療、エネルギー、自動車、電気自動車、モーター制御用途、航空宇宙・防衛など、さまざまな産業で半導体チップの用途が増加していることが、世界のSi貫通電極（TSV）技術市場の成長を加速させています。製品における発光ダイオードの使用の増加は、より大容量、低コスト、高密度のデバイスの生産を刺激しています。TSV技術で三次元（3D）包装を使用すると、2D包装とは異なり、垂直配線の高密度化が可能になります。

さらに、小型チップアーキテクチャによる電子機器の小型化要求の高まりが、Si貫通電極（TSV）技術の開発を後押ししています。自動車、通信、ヘルスケア、工業生産など、さまざまなセグメントで半導体ICの小型化が求められています。また、配線長の短縮、電力損失の低減、信号速度の向上、消費電力の削減を目的とした3Dチップ包装に対するTSV技術への需要の高まりは、Si貫通電極（TSV）技術市場の成長に大きな機会をもたらしています。

しかし、ベンダーは小型ICを製造するための設備設計に多くの資金を投入しなければならないです。これに加えて、製造プロセスは複雑で時間もかかります。また、半導体ICの製造プロセスの設計が複雑化しているため、半導体ICの性能を向上させるために包装やアセンブリーの設備に多くの投資をする必要があり、半導体チップメーカーに適度な影響を与えると考えられます。

目次

第1章 Si貫通電極（TSV）技術の世界市場導入

• 市場概要
• 調査範囲
• 前提条件

第2章 エグゼクティブサマリー

第3章 VERIFIED MARKET RESEARCHの調査手法

• データマイニング
• バリデーション
• 一次資料
• データソース一覧

第4章 Si貫通電極（TSV）技術の世界市場展望

• 概要
• 市場力学
  • 促進要因
  • 抑制要因
  • 機会
• ポーターのファイブフォースモデル
• バリューチェーン分析

第5章 Si貫通電極（TSV）技術の世界市場：製品別

• 概要
• ビアファーストTSV
• ビアミドルTSV
• ビアラストTSV

第6章 Si貫通電極（TSV）技術の世界市場：用途別

• 概要
• イメージセンサ
• 3Dパッケージ
• 3D集積回路
• その他

第7章 Si貫通電極（TSV）技術の世界市場：地域別

• 概要
• 北米
  • 米国
  • カナダ
  • メキシコ
• 欧州
  • ドイツ
  • 英国
  • フランス
  • イタリア
  • スペイン
  • その他の欧州
• アジア太平洋
  • 中国
  • 日本
  • インド
  • その他のアジア太平洋
• ラテンアメリカ
  • ブラジル
  • アルゼンチン
  • その他のラテンアメリカ
• 中東・アフリカ
  • アラブ首長国連邦
  • サウジアラビア
  • 南アフリカ
  • その他の中東・アフリカ

第8章 Si貫通電極（TSV）技術の世界市場競争情勢

• 概要
• 各社の市場ランキング
• 主要開発戦略

第9章 企業プロファイル

• Applied Materials
• International Business Machines Corporation
• Amkor Micralyne, Inc.
• Tezzaron Semiconductors
• STATS ChipPAC Ltd
• Xilinx.
• Intel Corporation
• Renesas Electronics Corporation
• Texas Instruments
• AMS
• Hua Tian Technology
• Samsung
• TESCAN
• Dow Inc.
• WLCSP
• ALLVIA

第10章 主要開発

• 製品上市/開発
• 合併と買収
• 事業拡大
• パートナーシップと提携

第11章 付録

関連調査

Through Silicon Via (TSV) Technology Market Size And Forecast

Through Silicon Via (TSV) Technology Market size was valued at USD 35.12 Billion in 2024 and is projected to reach USD 192.29 Billion by 2032, growing at a CAGR of 26.12% from 2026 to 2032.

The growing adoption of smart electronics products such as smartphones, laptops, tablets, and many others is leading to the exponential growth of Through Silicon Via (TSV) Technology. Since, these TSVs are majorly used in building 3D integrated circuits (ICs), and the IC packages which are one of the most vital components in smart electronics manufacturing. Besides this, the TSVs provide higher-density bonds, require minimal space, and provide the best connectivity compared to conventional flip-chips and wire bonds. The usability of TSVs and various electronic components such as microprocessing units (MPUs), PLDs, DRAMs, electronic chips for graphics and CMOS image sensors, and many others.

Global Through Silicon Via (TSV) Technology Market Definition

Through-silicon via (TSV) technology is the central and most crucial technology enabling the integration of the three-dimensional (3D) Si and 3D integrated circuit (IC). It offers the ability for the shortest chip-to-chip interconnections, and the interconnection of the smallest pad size and pitch. Stacking chips in three dimensional with through-silicon via (TSV) technology as interconnects is an emerging advanced packaging technology for CMOS imagers, memories, and MEMS. TSV technology offers several advantages as compared to traditional interconnection technology, including lower power consumption, better electrical performance, higher density, wider data width and thus bandwidth, and lighter weight.

A through-silicon via (TSV) refers to a vertical electrical connection that passes entirely through a wafer of silicone or dies. TSVs are higher-performance interconnect methods utilized to create 3D integrated circuits and 3D packages as an alternative to wire-bond and flip-chips. In this technique, the device and interconnect density is significantly higher, and the connection length becomes shorter. Market-driven application of through-silicon via (TSV) engaging memory comprises the integration of logic functions and memory for the improved video quality on handheld devices, multi-chip high-performance DRAM, and stacked NAND flash memory for solid-state drives.

Global Through Silicon Via (TSV) Technology Market Overview

The increasing use of semiconductor chips' applications in various industries such as the power, medical, energy, automobiles, electric vehicles, motor control applications, and aerospace and defense is accelerating the growth of the Global Through Silicon Via (TSV) Technology Market. The rising use of light-emitting diodes in products has stimulated the production of higher capacity, lower cost, and higher density devices. Using three-dimensional (3D) packaging in TSV technology, unlike 2D packaging, allows for a higher density of vertical interconnections.

Furthermore, the increasing demand for the miniaturization of the electronic device owing to the compact size chip architecture is driving the development of through silicon via (TSV) technology. Various sectors, such as automotive, telecommunications, healthcare, and industrial manufacturing created the requirement for miniaturized semiconductor ICs. Also, the growing demand for TSV technology for 3D chip packaging to reduce interconnection length, reduce power dissipation, increase signal speed, and reduce power consumption presents a great opportunity for the Through Silicon Via (TSV) Technology Market growth.

However, the market vendors have to capitalize a lot on designing equipment to manufacture compact ICs. In addition to this, the production process is complex and also consumes more time. Also, the designing of the semiconductor ICs manufacturing process is becoming complex, therefore it would have a moderate impact on semiconductor chip manufacturers as they need to invest a great deal in packaging and assembly equipment to improve the performance of semiconductor ICs.

Global Through Silicon Via (TSV) Technology Market: Segmentation Analysis

The Global Through Silicon Via (TSV) Technology Market is segmented on the basis of Product, Application, and Geography.

Through Silicon Via (TSV) Technology Market, By Product

• Via First TSV
• Via Middle TSV
• Via Last TSV

Based on Product, the market is segmented into Via First TSV, Via Middle TSV, and Via Last TSV. The Via Middle TSV segment accounted for the largest market share in 2021. Via-middle TSV approaches typically insert the TSV module after completion of the FEOL phases, which consists of various high-temperature processes but before BEOL processing, where multi-layer metal routing is carried out. Via-middle TSVs are presently a prevalent option for advanced three-dimensional (3D) ICs and also for interposer stacks.

Through Silicon Via (TSV) Technology Market, By Application

• Image Sensors

3D Package

3D Integrated Circuits

• Others

Based on Application, the market is segmented into Image Sensors, 3D Package, 3D Integrated Circuits, and Others. The 3D Integrated Circuits segment accounted for the largest market share in 2021. 3-dimensional integration of integrated circuits (3DIC) using Through Silicon Vias (TSV) is one of the most promising but also challenging technology. Furthermore, increasing penetration of smartphones, feature phones & tablets, and technological advancements in consumer electronic devices are major factors driving the growth of the global 3D integrated circuit with the Through Silicon Via (TSV) Technology Market.

Through Silicon Via (TSV) Technology Market, By Geography

• North America
• Europe
• Asia Pacific
• Middle East and Africa
• Latin America
• On the basis of Regional Analysis, the Global Through Silicon Via (TSV) Technology Market is classified into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America. Asia Pacific dominated the Global Through Silicon Via (TSV) Technology Market in 2019. Countries such as China, Korea, and Japan utilize through-silicon via (TSV) technology on a large scale. These regions are considered the hub of electronics parts manufacturing. The presence of a large number of smartphone companies along with the kinship of consumers to adopt newer technology such as 5G technology will drive the market in the telecommunication sector.
• These parent regions are further segmented as follows; Asia Pacific (China, India, Japan, Rest of APAC), Europe (Germany, UK, France, Spain, Italy, Rest of Europe), North America (US, Canada, Mexico), Latin America (Brazil, Argentina, Rest of LATAM), and Middle East & Africa (UAE, Saudi Arabia, South Africa, Rest of MEA).

Key Players

The "Global Through Silicon Via (TSV) Technology Market" study report will provide valuable insight with an emphasis on the global market. The major players in the market are AMS, Hua Tian Technology, Samsung, Amkor Micralyne, Inc., Intel Corporation, TESCAN, Dow Inc., WLCSP, ALLVIA, Applied Materials, International Business Machines Corporation, Tezzaron Semiconductors, STATS ChipPAC Ltd, Xilinx, Renesas Electronics Corporation, Texas Instruments. Besides this, much new entrance and Through Silicon Via manufacturers from the respective economies are forming supply agreements with the Smart Electronics manufacturing companies to attain a competitive edge in the market.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

• Key Developments:
• Samsung Electronics Co., Ltd. announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) technology. This new technology allows for the stacking of 12 DRAM chips using more than 60,000 TSV holes while maintaining the same thickness as current 8-layer chips.
• In September 2019, Teledyne Technologies Incorporated announced today that its subsidiary, Teledyne Digital Imaging, Inc., acquired Micralyne Inc. which is a privately-owned foundry providing Micro Electro Mechanical Systems or MEMS devices. In particular, Micralyne possesses unique microfluidic technology for biotech applications, as well as capabilities in non-silicon-based MEMS (e.g. gold, polymers) often required for human-body compatibility.
• Ace Matrix Analysis
• The Ace Matrix provided in the report would help to understand how the major key players involved in this industry are performing as we provide a ranking for these companies based on various factors such as service features & innovations, scalability, innovation of services, industry coverage, industry reach, and growth roadmap. Based on these factors, we rank the companies into four categories as Active, Cutting Edge, Emerging, and Innovators.
• Market Attractiveness
• The image of market attractiveness provided would further help to get information about the region that is majorly leading in the Global Through Silicon Via (TSV) Technology Market. We cover the major impacting factors that are responsible for driving the industry growth in the given region.
• Porter's Five Forces
• The image provided would further help to get information about Porter's five forces framework providing a blueprint for understanding the behavior of competitors and a player's strategic positioning in the respective industry. Porter's five forces model can be used to assess the competitive landscape in the Global Through Silicon Via (TSV) Technology Market, gauge the attractiveness of a certain sector, and assess investment possibilities.

TABLE OF CONTENTS

1 INTRODUCTION OF THE GLOBAL THROUGH SILICON VIA (TSV) TECHNOLOGY MARKET

• 1.1 Overview of the Market
• 1.2 Scope of Report
• 1.3 Assumptions

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

• 3.1 Data Mining
• 3.2 Validation
• 3.3 Primary Interviews
• 3.4 List of Data Sources

4 GLOBAL THROUGH SILICON VIA (TSV) TECHNOLOGY MARKET OUTLOOK

• 4.1 Overview
• 4.2 Market Dynamics
  • 4.2.1 Drivers
  • 4.2.2 Restraints
  • 4.2.3 Opportunities
• 4.3 Porter's Five Force Model
• 4.4 Value Chain Analysis

5 GLOBAL THROUGH SILICON VIA (TSV) TECHNOLOGY MARKET, BY PRODUCT

• 5.1 Overview
• 5.2 Via First TSV
• 5.3 Via Middle TSV
• 5.4 Via Last TSV

6 GLOBAL THROUGH SILICON VIA (TSV) TECHNOLOGY MARKET, BY APPLICATION

• 6.1 Overview
• 6.2 Image Sensors
• 6.3 3D Package
• 6.4 3D Integrated Circuits
• 6.5 Others

7 GLOBAL THROUGH SILICON VIA (TSV) TECHNOLOGY MARKET, BY GEOGRAPHY

• 7.1 Overview
• 7.2 North America
  • 7.2.1 The U.S.
  • 7.2.2 Canada
  • 7.2.3 Mexico
• 7.3 Europe
  • 7.3.1 Germany
  • 7.3.2 The U.K.
  • 7.3.3 France
  • 7.3.4 Italy
  • 7.3.5 Spain
  • 7.3.6 Rest of Europe
• 7.4 Asia Pacific
  • 7.4.1 China
  • 7.4.2 Japan
  • 7.4.3 India
  • 7.4.4 Rest of Asia Pacific
• 7.5 Latin America
  • 7.5.1 Brazil
  • 7.5.2 Argentina
  • 7.5.3 Rest of LATAM
• 7.6 Middle East and Africa
  • 7.6.1 UAE
  • 7.6.2 Saudi Arabia
  • 7.6.3 South Africa
  • 7.6.4 Rest of the Middle East and Africa

8 GLOBAL THROUGH SILICON VIA (TSV) TECHNOLOGY MARKET COMPETITIVE LANDSCAPE

• 8.1 Overview
• 8.2 Company Market Ranking
• 8.3 Key Development Strategies

9 COMPANY PROFILES

• 9.1 Applied Materials
  • 9.1.1 Overview
  • 9.1.2 Financial Performance
  • 9.1.3 Product Outlook
  • 9.1.4 Key Developments
• 9.2 International Business Machines Corporation
  • 9.2.1 Overview
  • 9.2.2 Financial Performance
  • 9.2.3 Product Outlook
  • 9.2.4 Key Developments
• 9.3 Amkor Micralyne, Inc.
  • 9.3.1 Overview
  • 9.3.2 Financial Performance
  • 9.3.3 Product Outlook
  • 9.3.4 Key Developments
• 9.4 Tezzaron Semiconductors
  • 9.4.1 Overview
  • 9.4.2 Financial Performance
  • 9.4.3 Product Outlook
  • 9.4.4 Key Developments
• 9.5 STATS ChipPAC Ltd
  • 9.5.1 Overview
  • 9.5.2 Financial Performance
  • 9.5.3 Product Outlook
  • 9.5.4 Key Developments
• 9.6 Xilinx.
  • 9.6.1 Overview
  • 9.6.2 Financial Performance
  • 9.6.3 Product Outlook
  • 9.6.4 Key Developments
• 9.7 Intel Corporation
  • 9.7.1 Overview
  • 9.7.2 Financial Performance
  • 9.7.3 Product Outlook
  • 9.7.4 Key Developments
• 9.8 Renesas Electronics Corporation
  • 9.8.1 Overview
  • 9.8.2 Financial Performance
  • 9.8.3 Product Outlook
  • 9.8.4 Key Developments
• 9.9 Texas Instruments
  • 9.9.1 Overview
  • 9.9.2 Financial Performance
  • 9.9.3 Product Outlook
  • 9.9.4 Key Developments
• 9.10 AMS
  • 9.10.1 Overview
  • 9.10.2 Financial Performance
  • 9.10.3 Product Outlook
  • 9.10.4 Key Developments
• 9.11 Hua Tian Technology
  • 9.11.1 Overview
  • 9.11.2 Financial Performance
  • 9.11.3 Product Outlook
  • 9.11.4 Key Developments
• 9.12 Samsung
  • 9.12.1 Overview
  • 9.12.2 Financial Performance
  • 9.12.3 Product Outlook
  • 9.12.4 Key Developments
• 9.13 TESCAN
  • 9.13.1 Overview
  • 9.13.2 Financial Performance
  • 9.13.3 Product Outlook
  • 9.13.4 Key Developments
• 9.14 Dow Inc.
  • 9.14.1 Overview
  • 9.14.2 Financial Performance
  • 9.14.3 Product Outlook
  • 9.14.4 Key Developments
• 9.15 WLCSP
  • 9.15.1 Overview
  • 9.15.2 Financial Performance
  • 9.15.3 Product Outlook
  • 9.15.4 Key Developments
• 9.16 ALLVIA
  • 9.16.1 Overview
  • 9.16.2 Financial Performance
  • 9.16.3 Product Outlook
  • 9.16.4 Key Developments

10 KEY DEVELOPMENTS

• 10.1 Product Launches/Developments
• 10.2 Mergers and Acquisitions
• 10.3 Business Expansions
• 10.4 Partnerships and Collaborations

11 Appendix

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