組み込みボード・モジュール・システム

組み込みハードウェアの市場は、製品フォームファクター、顧客プロファイル、エンドユーザー産業/用途、競合情勢の構成において、高度に細分化されています。OEM/ODM、システムインテグレータ、サービスプロバイダ、企業/産業エンドユーザー自身を含むエンジニアリング組織は、製品開発に使用する組み込みハードウェアプラットフォームに対して、それぞれ異なる要件や嗜好を持っています。

当レポートでは、コンピュータオンモジュール、システムオンモジュール、マザーボード、シングルボードコンピュータ、統合コンピューティングシステム、サーバなど、さまざまな組み込みコンポーネントやシステムの市場を調査し、競合要因や収益機会に影響を与える主要な市場動向を分析しています。本レポートでは、商用組み込みハードウェア市場とその将来のサプライヤエコシステムに影響を与える最大の開発や、企業に関する調査主導の解説をお届けします。本レポートには、調査対象の各フォームファクターと、垂直市場別にセグメント化した統合コンピューティングシステムおよびサーバ市場の主要ベンダーの市場シェアデータ、Voice of the Engineer調査のデータが添付されています。

調査対象

• 組み込みボード、モジュール、統合システム、組み込み/OEMサーバーの市場規模は？
• 組み込みモジュール、マザーボード、シングルボードコンピュータ、統合システム、組み込み/OEMサーバーのフォームファクター別の主要サプライヤーは？
• 同市場における主要プロバイダーの主要な製品、サービス、差別化要因は何か、また今後5年間でシェアを獲得するために最も重要なものは何か？
• さまざまなタイプのエンジニアリング組織が、さまざまな組み込みハードウェアフォームファクターを調達する際、どの選択基準が最も重要か？

本レポートの技術サプライヤー

主な調査結果

• 世界の商用組み込みボード、モジュール、システム/サーバーの市場規模は、2023年に360億米ドル超を示す
• すべてのフォームファクターの組み込みハードウェア市場は、特定のターゲットシステムタイプやOTアプリケーションの開発支援に注力する小規模サプライヤーのロングテールにより、高度に断片化されている
• 少数の企業が複数の組み込みハードウェア市場のフォームファクターでリーダーシップを確立している：Advantech、ADLINK、Kontron、Mercury Systems、Supermicroなど
• Dell Technologies、HPE、IBM、Lenovo、Supermicroなど、組み込み/OEMシステムおよびサーバーの大手プロバイダー数社は、エンタープライズ/HPC領域からエッジコンピューティングソリューションに製品や技術の進歩をもたらし続けている
• VDCのVoice of the Engineer調査の結果によると、ソフトウェアサポート/互換性、製品の可用性、ネットワーク機能、プロセス技術の重要性は、エンジニアリングコミュニティやフォームファクターによって大きく異なることが示されている

目次

本レポートの技術サプライヤー

需要サイドの調査：概要

エグゼクティブサマリー

• 主な調査結果

世界市場の概要

• エッジコンピューティングがハードウェア需要を幅広く促進
• アプリケーションの最適化とサポートがさらに強化
• さまざまな組み込み業界で規制が拡大
• 開発者サポートへの期待はかつてないほど高まっている
• ワークロードアクセラレータがさらなる断片化を促進
• シリコン技術プロバイダーが影響力を拡大
• 最近のM&A

競合情勢

• 組み込みマザーボードとシングルボードコンピュータ
• 組み込みコンピューティングモジュール
• 組み込み統合コンピュータシステムとサーバー
• ベンダーの洞察

エンドユーザーの洞察

• 組み込みボードとモジュールの選択基準はプロセッサアーキテクチャによって大きく異なる
• 業界とプロジェクトタイプは、さまざまなシステム基準の重要性に大きな影響を与える
• 標準ハードウェアプラットフォームは多くの人に好まれている

ベンダープロファイル

著者について

VDC Researchについて

Inside this Report

The embedded hardware market is extremely fragmented in its composition of product form factors, customer profiles/demographics, end user industries/applications, and competitive landscape. Engineering organizations, including OEMs/ODMs, system integrators, service providers, and enterprise/industrial end users themselves, all have different requirements and preferences for embedded hardware platforms used for their product development. As a result, the embedded boards, modules, and integrated systems markets each feature distinct growth opportunities addressing the evolving nature of embedded and edge computing architectures as well as rosters of competing vendors vying for new designs and engineering projects.

This market research study examines the leading market trends impacting the total revenue opportunity as well as the competitive landscape for a wide variety of embedded component and system form factors, including computer- on-modules, system-on-modules, motherboards, single-board computers, integrated computing systems and servers, and others. This report delivers research-driven commentary on the biggest developments and players influencing the commercial embedded hardware market and its future supplier ecosystem. The report is accompanied by leading vendor market share data for each form factor under study and for the integrated computing systems and server market segmented by vertical market as well as Voice of the Engineer survey data.

What Questions are Addressed?

• How large is the total addressable market opportunity and outlook for merchant embedded boards, modules, integrated systems, and embedded/OEM servers?
• Who are the leading suppliers for different form factors of merchant embedded modules, motherboards, single-board computers, integrated systems, and embedded/OEM servers?
• What are the key product, service, and corporate differentiators of leading providers in the market and which will be most important for gaining share over the next five years?
• Which selection criteria are most important to engineering organizations of different types when sourcing different embedded hardware form factors?

Who Should Read this Report?

This report was written for those making critical decisions regarding product, market, channel, and competitive strategy and tactics. This report is intended for senior decision-makers who are developing, or are a part of the ecosystem of, IoT, embedded, and/or edge computing solutions, including:

Technology Suppliers in this Report:

... and many others.

Demand-side Research Overview

VDC launches numerous surveys of the IoT and embedded engineering ecosystem every year using an online survey platform. Our global Voice of the Engineer survey in 2024 captured insights from a total of 600 qualified respondents. To support this research, VDC leverages its in-house panel of over 30,000 individuals from various roles and industries across the world. This survey was used to inform our insight into key trends, preferences, and predictions within the engineering community.

Executive Summary

The embedded hardware market is hotly contested with a variety of established players and new organizations joining the fray to diversify their businesses via access to a healthy marketspace that features strong long-term growth prospects. Edge computing, the Internet of Things (IoT), computer vision, operational AI, and machine learning will remain critical market growth drivers over the next several years, enabling highly valuable solution capabilities and services for end users in operational environments. Although embedded hardware deployment lifetimes remain protracted and still extend beyond a decade (or even a few decades) in some safety-/mission- critical applications, the pace of innovation in the market has accelerated on the back of rapid advancements in processor technology, edge AI models, workload optimization, and cloud-native software development. Engineering organizations of various origins, types, sizes, and target markets will continue to demand a wide range of hardware platforms and development solutions that no single vendor can completely satisfy on their own.

Competition in the embedded boards, modules, and integrated systems market is multi-dimensional, with several different technical and business elements separating the market leaders from the rest. From a technical perspective, embedded hardware providers continue to compete on core metrics such as performance, power consumption, size/weight/area, pre-certification, and price. However, new considerations related to dedicated workload performance, accelerator integration/support, embedded security, connectivity enablement, and a growing list of other factors are changing the status quo. On the business/strategic side, a trusted supply chain extending from embedded hardware inception to deployment is crucial for preserving the integrity of the final deployed systems or infrastructure. Many engineering organizations also require the tier 1 business services commonly associated with leading enterprise/IT technology suppliers that are also serving the embedded/OEM market.

The embedded hardware space and its competitive landscape are changing at an unprecedented rate in response to the rapid evolution of developer/engineer requirements, device/system stacks, and the associated large and growing revenue opportunity enabling IoT, embedded, and edge computing solutions.

Key Findings:

• The total addressable market for merchant embedded boards, modules, and system/servers worldwide amounted to more than $36B in 2023.
• The embedded hardware market for all form factors is highly fragmented with a long tail of smaller suppliers focused on supporting the development of specific target system types or OT applications.
• Only a few organizations have established leadership across multiple embedded hardware market form factors, such as Advantech, ADLINK, Kontron, Mercury Systems, and Supermicro.
• Several leading embedded/OEM system and server providers, such as Dell Technologies, HPE, IBM, Lenovo, and Supermicro, continue to bring product and technology advancements from the enterprise/HPC domains to their edge computing solutions.
• VDC's Voice of the Engineer survey results indicate that the importance of software support/compatibility, product availability, networking capabilities, and process technology vary considerably between different engineering communities and form factors.

Table of Contents

Technology Suppliers in this Report

Demand-side Research Overview

Executive Summary

• Key Findings

Global Market Overview

• Edge Computing Drives Widespread Hardware Demand
• Application Optimization and Support Gets Deeper
• Regulations are Expanding in Different Embedded Industries
• Expectations for Developer Support are Higher than Ever
• Workload Accelerators Drive Further Fragmentation
• Silicon Technology Providers are Expanding Their Influence
• Recent Acquisitions & Mergers

Competitive Landscape

• Embedded Motherboards & Single-board Computers
• Embedded Computing Modules
• Embedded Integrated Computer Systems & Servers
• Vendor Insights

End-user Insights

• Embedded Board & Modules Selection Criteria Vary Considerably by Processor Architecture
• Industry & Project Type Have a Major Impact on the Importance of Different Systems Criteria
• Standard Hardware Platforms are Preferred by Many

Vendor Profiles

About the Authors

About VDC Research

List of Report Exhibits*

• Exhibit 1: Global Market for Embedded Boards and Modules Segmented by Form Factor, 2023-2028 Exhibit 2 Global Market for Embedded Systems & Servers Segmented by Form Factor, 2023-2028
• Exhibit 3: Leading Embedded Motherboard Vendor Shares Segmented by Form Factor, 2023
• Exhibit 4: Leading Embedded Computing Module & Card Vendor Shares Segmented by Form Factor, 2023
• Exhibit 5: Leading Embedded Integrated Computer System & Server Vendor Shares Segmented by Vertical Market, 2023
• Exhibit 6: Most Important Selection Criteria for Embedded Computing Modules, Motherboards, and Single-board Computers Exhibit 7 Most Important Selection Criteria for Embedded Integrated Computer Systems & Servers
• Exhibit 8: Primary Configuration of the Embedded Systems/Subsystems Purchased/Sourced

List of Market Data Exhibits*

• Exhibit 1: Desktop Class Motherboards, Vendor Shares, Revenue, 2023 Exhibit 2 ITX Class Motherboards, Vendor Shares, Revenue, 2023
• Exhibit 3: Embedded/Stackable Class Motherboards, Vendor Shares, Revenue, 2023 Exhibit 4 Slot Single Board Computers & CPU Blades, Vendor Shares, Revenue, 2023 Exhibit 5 PC/104 Family Modules, Vendor Shares, Revenue, 2023
• Exhibit 6: Mezzanine Cards, Vendor Shares, Revenue, 2023
• Exhibit 7: Computer-on-Modules, Vendor Shares, Revenue, 2023 Exhibit 8 System-on-Modules, Vendor Shares, Revenue, 2023
• Exhibit 9: Embedded Integrated Computer Systems & Servers (EICSS), Vendor Shares, Revenue, 2023 Exhibit 10 EICSS in Aerospace & Defense, Vendor Shares, Revenue, 2023
• Exhibit 11: EICSS in Communications & Networking, Vendor Shares, Revenue, 2023 Exhibit 12 EICSS in Digital Security & Surveillance, Vendor Shares, Revenue, 2023 Exhibit 13 EICSS in Digital Signage, Vendor Shares, Revenue, 2023
• Exhibit 14: EICSS in Energy & Power, Vendor Shares, Revenue, 2023 Exhibit 15 EICSS in Gaming, Vendor Shares, Revenue, 2023
• Exhibit 16: EICSS in Industrial Automation & Control, Vendor Shares, Revenue, 2023 Exhibit 17 EICSS in Instrumentation, Vendor Shares, Revenue, 2023
• Exhibit 18: EICSS in Medical, Vendor Shares, Revenue, 2023 Exhibit 19 EICSS in Retail, Vendor Shares, Revenue, 2023
• Exhibit 20: EICSS in Transportation, Vendor Shares, Revenue, 2023

IoT & Embedded Engineering Survey*

• Exhibit 1: Primary Role Within Company/Organization Exhibit 2 Respondent's Organization's Primary Industry
• Exhibit 3: Total Number of Employees at Respondent's Organization Exhibit 4 Primary Region of Residence
• Exhibit 5: Primary Country of Residence
• Exhibit 6: Type of Most Current or Recent Project Exhibit 7 Involvement with Engineering
• Exhibit 8: Type of Purchase by Respondent's Organization Exhibit 9 Primary Industry Classification of Project
• Exhibit 10: Type of Aerospace & Defense Application for Most Recent Project Exhibit 11 Type of Automotive In-Vehicle Application for Most Recent Project
• Exhibit 12: Type of Communications & Networking Application for Most Recent Project Exhibit 13 Type of Consumer Electronics Application for Most Recent Project
• Exhibit 14: Type of Digital Security Application for Most Recent Project

* Partial list of the 416 IoT & Embedded Technology Voice of the Engineer Survey Exhibits.