エッジゲートウェイ・産業用PC・組み込み/OEM OTサーバー：最新のエッジコンピューティングの基盤

プロセッサ技術、高速接続性、SDA (ソフトウェア定義アーキテクチャ) の急速な進歩により、運用技術 (OT) システムとその市場はかつてない速さで進化しています。現場における洗練されたエッジコンピューティングソリューションとサービスに対する需要の高まりが、さまざまなタイプのシステム市場の拡大に拍車をかけています。小さなフットプリントのエッジゲートウェイから、リアルタイムの産業用PCや高性能サーバーに至るまで、OEM、インテグレーター、サービスプロバイダー、およびエンドユーザーは、それぞれの競争に打ち勝つために、いくつかの異なるハードウェアソリューションを必要としています。その結果、組み込みシステムとエッジシステムは現在、さまざまな市場区分で力強い成長を遂げています。

インフォグラフィックス

本レポートでは、世界のエッジゲートウェイ、産業用PC (IPC) 、組み込み/OEM OTサーバーの市場を調査し、市場動向、市場規模の推移・予測、垂直区分・地域別の詳細分析、競合情勢、エンドユーザーに関する分析などをまとめています。

調査課題：

• エッジAI、サイバーセキュリティ、産業用IoT、ワークロード高速化などの動向は、エッジシステム市場とその予測にどのような影響を与えているか？
• さまざまなエッジシステムのフォームファクターで、今後最大の成長機会はどこにあるか？
• エッジゲートウェイ、IPC、組み込み/OEM OTサーバーの主要サプライヤーは？
• エッジコンピューティングのエコシステムにおいて、シリコンプロバイダー、OSベンダーなどはどのような役割を果たしているか？
• エッジシステムアーキテクチャは、導入要件をより良くサポートし、拡張するためにどのように進化しているか？
• 組み込みおよびエッジコンピューティングシステムを調達するOEMやその他の企業にとって、どのような選択基準と考慮事項がもっとも重要か？

掲載組織

目次

本レポートの内容

掲載課題

読むべき人

掲載組織

エグゼクティブサマリー

• 主要調査結果

世界市場の概要

• エッジコンピューティング
• エッジAI：市場全体で勢いを増している
• エンジニアリング組織による検討：購入 vs 構築
• エッジコンピューティング：堅牢なソフトウェアフレームワークが必要
• シリコンの進歩によるエッジハードウェア市場の発展
• チャネルパートナー：市場への重要な経路であり続ける
• ワイヤレスの進化：エッジハードウェアの需要を促進

地域予測

• 南北アメリカ
• 欧州・中東・アフリカ
• アジア太平洋

垂直市場予測

• 航空宇宙・防衛
• 自動車/フリート・公共安全
• 通信・ネットワーキング
• 産業オートメーション・制御
• 輸送

競合情勢

• ADLINK
• Advantech
• Beckhoff Automation
• Cisco
• Dell Technologies
• Digi
• Eurotech
• HPE
• OnLogic
• Siemens
• Semtech
• Supermicro

エンドユーザーの洞察

• エッジシステムの強化が進む
• エッジゲートウェイハードウェアプラットフォーム：顧客タイプに合わせてカスタマイズする必要がある
• IPCフォームファクター：各種ベンダー選択基準の重要性に大きく影響
• OTサーバー：ハイエンドなセキュリティ機能が求められる

著者について

VDC Researchについて

レポート図表リスト (一部)

市場データ図表リスト (一部)

エッジゲートウェイ

産業用PC

組み込み/OEM OTサーバー

IoT&組み込みエンジニアリング調査

Inside this Report :

Driven by rapid advances in processor technology, high-speed connectivity, and software-defined architectures, operational technology (OT) systems and markets are evolving faster than ever before. Ramping demand for sophisticated edge computing solutions and services in the field are fueling market expansion for a variety of system types. Ranging from small-footprint edge gateways to real-time industrial PCs and high-performance servers, several distinct hardware solutions are needed by OEMs, integrators, service providers, and end users to keep pace with their own competition. As a result, embedded and edge systems are currently riding strong growth across a variety of different market segments.

INFOGRAPHICS

This report examines the global market for edge gateways, industrial PCs (IPCs), and embedded/OEM OT servers, including extensive market sizing and a deep dive into key regional and vertical market trends, competitive landscape analysis, and demand-side findings.

What Questions are Addressed?

• How are trends like edge AI, cybersecurity, industrial IoT, and workload acceleration impacting edge system markets and their forecasts?
• Where are the largest future growth opportunities for different edge system form factors?
• Who are the leading suppliers of edge gateways, IPCs, and embedded/OEM OT servers?
• What roles do silicon providers, OS vendors, and others play in the edge computing ecosystem?
• How are edge system architectures evolving to better support and scale with deployment requirements?
• Which selection criteria and considerations are most important to OEMs and others sourcing embedded and edge computing systems?

Who Should Read this Report?

This report was written for those making critical decisions regarding product, market, channel, and competitive strategy and tactics. This report is intended for senior decision-makers who are developing embedded and edge computing solutions, including:

• CEO or other C-level executives
• Corporate development and M&A teams
• Marketing executives
• Business development and sales leaders
• Product development/strategy leaders
• Channel management/strategy leaders

Organizations Mentioned in this Report:

Table of Contents

Inside this Report

What Questions are Addressed?

Who Should Read this Report?

Organizations Mentioned in this Report

Executive Summary

• Key Findings

Global Market Overview

• Edge Computing
• Edge AI is Gathering Momentum Across Markets
• Engineering Organizations are Leaning Further into Buy vs. Build
• Edge Computing Requires a Robust Software Framework
• Advances in Silicon are Opening Up the Edge Hardware Market
• Channel Partners Remain Critical Paths to Market
• Wireless Evolution Pushes Edge Hardware Demand

Regional Forecasts

• Americas
• Europe, Middle East, Africa
• Asia-Pacific

Vertical Market Forecasts

• Aerospace & Defense
• Automotive/Fleet & Public Safety
• Communications & Networking
• Industrial Automation & Control
• Transportation

Competitive Landscape

• ADLINK
• Advantech
• Beckhoff Automation
• Cisco
• Dell Technologies
• Digi
• Eurotech
• HPE
• OnLogic
• Siemens
• Semtech
• Supermicro

End-User Insights

• Edge Systems Becoming More Hardened
• Edge Gateway Hardware Platforms Need to be Tailored for Different Customer Types
• IPC Form Factor Greatly Influences the Importance of Different Vendor Selection Criteria
• OT Servers Demand High-end Security Capabilities

About the Authors

About VDC Research

List of Report Exhibits(Partial)

• Exhibit 1: Forecasted Global Shipments of Edge Gateways, Industrial PCs & Embedded/OEM OT Servers, 2023-2028
• Exhibit 2: Global Shipments of Intelligent and M2M Gateways, 2023-2028
• Exhibit 3: Global Shipments of IPCs Segmented by Form Factor, 2023-2028
• Exhibit 4: Global Shipments of Embedded/OEM OT Servers Segmented by Form Factor, 2023-2028
• Exhibit 5: Global Shipments of Edge Systems Segmented by Embedded CPU Architecture, 2023
• Exhibit 6: Global Shipments of Edge Systems Segmented by Embedded Operating System, 2023
• Exhibit 7: Global Shipments of Edge Systems Segmented by Distribution Channel, 2023
• Exhibit 8: Global Shipments of Edge Gateways Segmented by Connectivity Support, 2023 & 2028
• Exhibit 9: Global Shipments of Embedded & Edge Systems Segmented by Geography, 2023
• Exhibit 10: Global Shipments of Edge Gateways Segmented by Vertical Market, 2023
• Exhibit 11: Global Shipments of Industrial PCs Segmented by Vertical Market, 2023
• Exhibit 12: Global Shipments of Embedded/OEM OT Servers Segmented by Vertical Market, 2023
• Exhibit 13: Global Shipments of Embedded & Edge Hardware Segmented by Leading Vendors, 2023
• Exhibit 14: Rugged Form Factor Requirements for Current Projects & Expected for Similar Projects Three Years from Now
• Exhibit 15: Most Important Product Requirements in Selecting Edge Gateway Hardware
• Exhibit 16: Most Important Selection Criteria When Considering Suppliers for Embedded and Edge Hardware
• Exhibit 17: Factors Driving OT Server Users/Developers to Adopt Virtualization/Hypervisor and Container Technology
• Exhibit 18: Actions OT Server Users/Developers Have Taken in Response to Security Requirements

List of Market Data Exhibits(Partial)

Edge Gateway

• Exhibit 1: Edge Gateway, Device Type, Dollar Volume Shipments, 2023-2028
• Exhibit 2: Edge Gateway, Device Type, Unit Shipments, 2023-2028
• Exhibit 3: Edge Gateway, Device Type, Average Selling Prices, 2023-2028
• Exhibit 4: Edge Gateway, Vertical Market, Dollar Volume Shipments, 2023-2028
• Exhibit 5: Edge Gateway, Geographic Region, Dollar Volume Shipments, 2023-2028
• Exhibit 6: Edge Gateway, Customer Class, Dollar Volume Shipments, 2023-2028
• Exhibit 7: Edge Gateway, Ruggedization, Dollar Volume Shipments, 2023-2028
• Exhibit 8: Edge Gateway, Connectivity Support, Unit Shipments, 2023-2028
• Exhibit 9: Edge Gateway, Embedded Processor Architecture, Dollar Volume Shipments, 2023-2028
• Exhibit 10: Edge Gateway, Embedded Operating System, Dollar Volume Shipments, 2023-2028
• Exhibit 11: Edge Gateway, Global Vendor Share, Dollar Volume Shipments, 2023
• Exhibit 12: Intelligent Gateway, Global Vendor Share, Dollar Volume Shipments, 2023
• Exhibit 13: M2M Gateway, Global Vendor Share, Dollar Volume Shipments, 2023

Industrial PC

• Exhibit 1: Industrial PC, Form Factor, Dollar Volume Shipments, 2023-2028
• Exhibit 2: Industrial PC, Form Factor, Unit Shipments, 2023-2028
• Exhibit 3: Industrial PC, Form Factor, Average Selling Prices, 2023-2028
• Exhibit 4: Industrial PC, Vertical Market, Dollar Volume Shipments, 2023-2028
• Exhibit 5: Industrial PC, Geographic Region, Dollar Volume Shipments, 2023-2028
• Exhibit 6: Industrial PC, Customer Class, Dollar Volume Shipments, 2023-2028
• Exhibit 7: Industrial PC, Embedded Processor Architecture, Dollar Volume Shipments, 2023-2028
• Exhibit 8: Industrial PC, Embedded Operating System, Dollar Volume Shipments, 2023-2028
• Exhibit 9: Industrial PC, Global Vendor Share, Dollar Volume Shipments, 2023
• Exhibit 10: Box Industrial PC, Global Vendor Share, Dollar Volume Shipments, 2023
• Exhibit 11: DIN Rail Industrial PC, Global Vendor Share, Dollar Volume Shipments, 2023
• Exhibit 12: Rackmount Industrial PC, Global Vendor Share, Dollar Volume Shipments, 2023
• Exhibit 13: Panel Industrial PC, Global Vendor Share, Dollar Volume Shipments, 2023

Embedded/OEM OT Server

• Exhibit 1: Embedded/OEM OT Server, Form Factor, Dollar Volume Shipments, 2023-2028
• Exhibit 2: Embedded/OEM OT Server, Form Factor, Unit Shipments, 2023-2028
• Exhibit 3: Embedded/OEM OT Server, Form Factor, Average Selling Prices, 2023-2028
• Exhibit 4: Embedded/OEM OT Server, Vertical Market, Dollar Volume Shipments, 2023-2028
• Exhibit 5: Embedded/OEM OT Server, Geographic Region, Dollar Volume Shipments, 2023-2028
• Exhibit 6: Embedded/OEM OT Server, Customer Class, Dollar Volume Shipments, 2023-2028
• Exhibit 7: Embedded/OEM OT Server, Embedded Processor Architecture, Dollar Volume Shipments, 2023-2028
• Exhibit 8: Embedded/OEM OT Server, Embedded Operating System, Dollar Volume Shipments, 2023-2028
• Exhibit 9: Embedded/OEM OT Server, Global Vendor Share, Dollar Volume Shipments, 2023

IoT & Embedded Engineering Survey

• Exhibit 1: Primary Role Within Company/Organization
• Exhibit 2: Respondent's Organization's Primary Industry
• Exhibit 3: Total Number of Employees at Respondent's Organization
• Exhibit 4: Primary Region of Residence
• Exhibit 5: Primary Country of Residence
• Exhibit 6: Type of Most Current or Recent Project
• Exhibit 7: Involvement with Engineering of Embedded/Edge, Enterprise/IT, HPC, AI/ML, or Mobile/System Device or Solution
• Exhibit 8: Type of Purchase by Respondent's Organization
• Exhibit 9: Primary Industry Classification of Project
• Exhibit 10: Type of Aerospace & Defense Application for Most Recent Project
• Exhibit 11: Type of Automotive In-Vehicle Application for Most Recent Project
• Exhibit 12: Type of Communications & Networking Application for Most Recent Project
• Exhibit 13: Type of Consumer Electronics Application for Most Recent Project
• Exhibit 14: Type of Digital Security Application for Most Recent Project
• Exhibit 15: Type of Digital Signage Application for Most Recent Project
• Exhibit 16: Type of Energy and Utilities Application for Most Recent Project
• Exhibit 17: Type of Gaming Application for Most Recent Project
• Exhibit 18: Type of Industrial Automation Application for Most Recent Project
• Exhibit 19: Type of Media & Broadcasting Application for Most Recent Project
• Exhibit 20: Type of Medical Device Application for Most Current Project
• Exhibit 21: Type of Mobile Phone
• Exhibit 22: Type of Office/Business Automation Application for Most Recent Project
• Exhibit 23: Type of Transportation Application for Most Recent Project
• Exhibit 24: Type of Retail Automation Application for Most Recent Project
• Exhibit 25: Type of Non-Manufacturing/Services Application for Most Recent Project
• Exhibit 26: Certification/Approval Standards Required for Current Project
• Exhibit 27: Highest Design/Development Assurance Levels (DAL) Required for Project Software (Aerospace)
• Exhibit 28: Highest Software Integrity Levels (SIL) Certification Required for Project Software
• Exhibit 29: Highest Automotive Software Integrity Levels Required for Project Software
• Exhibit 30: Capabilities/Features of Current Project
• Exhibit 31: Capabilities/Features Expected in a Project Three Years From Now
• Exhibit 32: Type of Real-Time Deadlines for Current Project
• Exhibit 33: Application's Shortest Response Deadline to a Time-Critical Input or Event
• Exhibit 34: Consideration of Key Trends: Electrification of Combustion Fuel Sources
• Exhibit 35: Consideration of Key Trends: Software-defined Functionality
• Exhibit 36: Consideration of Key Trends: Bill-of-Material/Sub-System Consolidation
• Exhibit 37: Estimated Length for Current Project (In Months)