インターポーザとファンアウトウエハーレベルパッケージング市場の2030年までの予測： 世界のパッケージングタイプ、デバイスタイプ、技術、エンドユーザー、地域別

Stratistics MRCによると、世界のインターポーザとファンアウトウエハーレベルパッケージング市場は、2023年に311億米ドルを占め、予測期間中のCAGRは14.3％で成長し、2030年には793億米ドルに達すると予測されています。

インターポーザとファンアウトウエハーレベルパッケージング（FOWLP）は、先進の半導体パッケージング技術です。インターポーザ技術は、集積回路間にシリコンまたはガラス基板を配置するもので、高密度接続と異種集積を可能にします。一方、FOWLPは接続をチップの周辺からパッケージ表面に再配分し、性能と小型化を向上させる。FOWLPは、複数のチップを1つのパッケージに統合することを容易にし、スマートフォン、ウェアラブル端末、IoT端末など、より小型で高性能な電子機器の開発を可能にし、半導体業界の技術革新を促進します。

先進パッケージング技術への需要の高まり

インターポーザとFOWLPは半導体部品の小型化と集積化を可能にし、フォームファクタの小型化とデバイス密度の向上につながります。これは、ウェアラブル、IoTデバイス、モバイルデバイスなど、スペースが重視されるアプリケーションにとって極めて重要です。これらのパッケージング技術は、従来のパッケージング方法と比較して、電気的および熱的性能を向上させます。相互接続が短くなり、寄生が減少し、放熱性が向上するため、デバイスの性能、電力効率、信頼性が向上し、市場の成長を後押しします。

複雑なウエハーレベル・プロセス

複雑なウエハーレベルのプロセスでは、特殊な装置やインフラに多額の投資を必要とすることが多いです。メーカーは、再配線層（RDL）、シリコン貫通ビア（TSV）、ファインピッチ相互接続などの複雑なプロセスを処理するために、高度な製造設備やツールに投資する必要があるかもしれないです。こうした初期コストは、特に小規模な企業や資金力の乏しい企業にとっては法外なものであり、市場成長の妨げとなる可能性があります。

ヘテロジニアス集積の採用拡大

ヘテロジニアス・インテグレーションにより、半導体企業は独自の機能と性能を備えた革新的な製品を開発することができます。多様な機能を1つのパッケージに統合することで、メーカーは家電、自動車、ヘルスケア、IoTなど、さまざまな業界の幅広いアプリケーションに対応できます。この市場機会の拡大は、異種集積の要件に合わせたインターポーザーとFOWLP技術の需要を促進しています。

限られたエコシステム

エコシステムが狭いと、重要な部品、材料、製造装置を限られた数のサプライヤーに依存することになります。単一の供給元からの供給不足や品質問題などのサプライチェーンの混乱は、生産スケジュールや製品の可用性に大きな影響を与える可能性があります。半導体企業は、代替サプライヤの確保やサプライ・チェーン・リスクの軽減において課題に直面し、市場の需要や顧客の期待に応える能力に影響を及ぼす可能性があります。

COVID-19の影響

封鎖措置や渡航制限が製造業務に影響を及ぼし、供給不足や出荷遅延につながった。民生用電子機器や自動車などの主要産業からの需要の不確実性は市場成長にさらに影響を与えたが、パンデミックはデジタルトランスフォーメーションを加速し、リモートワーク、オンライン教育、ヘルスケアアプリケーション向けの半導体デバイスの需要を増加させました。

予測期間中、MEMS/センサー分野が最大になる見込み

MEMS/センサセグメントは、半導体パッケージ内のMEMSセンサの統合が小型化を推進し、フォームファクタの小型化と機能強化を可能にするため、有利な成長を遂げると推定されます。インターポーザとFOWLP技術は、MEMSデバイスと他の半導体コンポーネントの統合を容易にし、異種統合とシステムレベルの最適化を可能にします。この統合により、自動車、家電、IoT、ヘルスケア分野におけるMEMSベース・アプリケーションの性能、信頼性、コスト効率が向上します。

予測期間中、民生用エレクトロニクス分野のCAGRが最も高くなる見込み

民生用電子機器分野は、予測期間中にCAGRが最も高くなると予測されます。消費者の小型・軽量・高性能デバイスに対する要求が高まるにつれ、半導体メーカーはこれらの要求を満たすためにインターポーザやFOWLPのような先進パッケージングソリューションに目を向けるようになります。これらの技術は、スマートフォン、タブレット、ウェアラブル、スマートホームデバイスなどの民生用電子機器に不可欠な、より高いレベルの集積化、熱管理の改善、電気性能の向上を可能にします。

最大のシェアを占める地域：

アジア太平洋地域は、中国、日本、韓国、インドを含む世界最大級のコンシューマー・エレクトロニクス市場の本拠地であるため、予測期間中に最大の市場シェアを占めると予測されます。スマートフォン、タブレット、ウェアラブル、その他のコンシューマーエレクトロニクスに対する需要の高まりは、フォームファクターの小型化、高性能化、エネルギー効率の改善といった要件を満たすために、インターポーザーやFOWLPといった先進パッケージング技術の採用を後押ししています。

CAGRが最も高い地域：

北米には半導体パッケージングと関連技術を専門とする世界の研究機関、大学、研究開発センターがあるため、予測期間中のCAGRは北米が最も高いと予測されます。これらの機関は、業界パートナーと協力して最先端の研究を行い、革新的なソリューションを開発し、次世代の半導体専門家を育成しています。学術界と産業界の相乗効果により、技術の進歩が促進され、北米におけるインターポーザーとFOWLP技術の商業化が加速されます。

無料カスタマイズサービス：

本レポートをご購読のお客様には、以下の無料カスタマイズオプションのいずれかをご利用いただけます：

• 企業プロファイル
  • 追加市場プレーヤーの包括的プロファイリング（3社まで）
  • 主要企業のSWOT分析（3社まで）
• 地域セグメンテーション
  • 顧客の関心に応じた主要国の市場推計・予測・CAGR（注：フィージビリティチェックによる）
• 競合ベンチマーキング
  • 製品ポートフォリオ、地理的プレゼンス、戦略的提携に基づく主要企業のベンチマーキング

目次

第1章 エグゼクティブサマリー

第2章 序文

• 概要
• ステークホルダー
• 調査範囲
• 調査手法
  • データマイニング
  • データ分析
  • データ検証
  • 調査アプローチ
• 調査情報源
  • 1次調査情報源
  • 2次調査情報源
  • 前提条件

第3章 市場動向分析

• 促進要因
• 抑制要因
• 機会
• 脅威
• 技術分析
• エンドユーザー分析
• 新興市場
• COVID-19の影響

第4章 ポーターのファイブフォース分析

• 供給企業の交渉力
• 買い手の交渉力
• 代替品の脅威
• 新規参入業者の脅威
• 競争企業間の敵対関係

第5章 世界のインターポーザとファンアウトウエハーレベルパッケージング市場：パッケージタイプ別

• 2.5D
• 3D

第6章 世界のインターポーザとファンアウトウエハーレベルパッケージング市場：デバイスタイプ別

• イメージングとオプトエレクトロニクス
• LEDについて
• ロジックIC
• MEMS/センサー
• メモリデバイス
• その他のデバイスタイプ

第7章 世界のインターポーザとファンアウトウエハーレベルパッケージング市場：技術別

• インターポーザー
• ファンアウトウェーハレベルパッケージング（FOWLP）
• シリコン貫通ビア

第8章 世界のインターポーザとファンアウトウエハーレベルパッケージング市場：エンドユーザー別

• 家電
• 通信
• 自動車
• 軍事および航空宇宙
• スマートテクノロジー
• 医療機器
• その他のエンドユーザー

第9章 世界のインターポーザとファンアウトウエハーレベルパッケージング市場：地域別

• 北米
  • 米国
  • カナダ
  • メキシコ
• 欧州
  • ドイツ
  • 英国
  • イタリア
  • フランス
  • スペイン
  • その他欧州
• アジア太平洋地域
  • 日本
  • 中国
  • インド
  • オーストラリア
  • ニュージーランド
  • 韓国
  • その他アジア太平洋地域
• 南米
  • アルゼンチン
  • ブラジル
  • チリ
  • その他南米
• 中東・アフリカ
  • サウジアラビア
  • アラブ首長国連邦
  • カタール
  • 南アフリカ
  • その他中東とアフリカ

第10章 主な発展

• 契約、パートナーシップ、コラボレーション、合弁事業
• 買収と合併
• 新製品発売
• 事業拡大
• その他の主要戦略

第11章 企業プロファイリング

• Advanced MICRO DEVICES, Inc
• Amkor Technology
• ASE Technology Holding Co., Ltd.
• DAI Nippon Printing CO., LTD.
• DECA Technologies
• Dupont
• Global Foundries Inc
• JCET Group LTD.
• Nexlogic Technologies INC.
• Powertech Technology Inc.
• RENA Technologies GMBH
• Samsung
• SAMTEC
• SK Hynix Inc.
• SPTS Technologies Ltd.
• Teledyne Digital Imaging Inc.
• Toshiba Electronic Devices & Storage Corporation
• United Microelectronics Corporation

List of Tables

• Table 1 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Region (2021-2030) ($MN)
• Table 2 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
• Table 3 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
• Table 4 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
• Table 5 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
• Table 6 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
• Table 7 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
• Table 8 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
• Table 9 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
• Table 10 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
• Table 11 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
• Table 12 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
• Table 13 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
• Table 14 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
• Table 15 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
• Table 16 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
• Table 17 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
• Table 18 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
• Table 19 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
• Table 20 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
• Table 21 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
• Table 22 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
• Table 23 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
• Table 24 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
• Table 25 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
• Table 26 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
• Table 27 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
• Table 28 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
• Table 29 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
• Table 30 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
• Table 31 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
• Table 32 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
• Table 33 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
• Table 34 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
• Table 35 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
• Table 36 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
• Table 37 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
• Table 38 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
• Table 39 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
• Table 40 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
• Table 41 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
• Table 42 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
• Table 43 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
• Table 44 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
• Table 45 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
• Table 46 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
• Table 47 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
• Table 48 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
• Table 49 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
• Table 50 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
• Table 51 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
• Table 52 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
• Table 53 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
• Table 54 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
• Table 55 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
• Table 56 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
• Table 57 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
• Table 58 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
• Table 59 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
• Table 60 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
• Table 61 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
• Table 62 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
• Table 63 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
• Table 64 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
• Table 65 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
• Table 66 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
• Table 67 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
• Table 68 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
• Table 69 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
• Table 70 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
• Table 71 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
• Table 72 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
• Table 73 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
• Table 74 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
• Table 75 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
• Table 76 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
• Table 77 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
• Table 78 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
• Table 79 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
• Table 80 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
• Table 81 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
• Table 82 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
• Table 83 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
• Table 84 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
• Table 85 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
• Table 86 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
• Table 87 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
• Table 88 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
• Table 89 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
• Table 90 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
• Table 91 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
• Table 92 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
• Table 93 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
• Table 94 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
• Table 95 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
• Table 96 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
• Table 97 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
• Table 98 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
• Table 99 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
• Table 100 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
• Table 101 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
• Table 102 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
• Table 103 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
• Table 104 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
• Table 105 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
• Table 106 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
• Table 107 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
• Table 108 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
• Table 109 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
• Table 110 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
• Table 111 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
• Table 112 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
• Table 113 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
• Table 114 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
• Table 115 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
• Table 116 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
• Table 117 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
• Table 118 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
• Table 119 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
• Table 120 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
• Table 121 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
• Table 122 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
• Table 123 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
• Table 124 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
• Table 125 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
• Table 126 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
• Table 127 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
• Table 128 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
• Table 129 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
• Table 130 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
• Table 131 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
• Table 132 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
• Table 133 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
• Table 134 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
• Table 135 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
• Table 136 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
• Table 137 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
• Table 138 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)

According to Stratistics MRC, the Global Interposer and Fan-out Wafer Level Packaging Market is accounted for $31.1 billion in 2023 and is expected to reach $79.3 billion by 2030 growing at a CAGR of 14.3% during the forecast period. Interposer and Fan-out Wafer Level Packaging (FOWLP) are advanced semiconductor packaging techniques. Interposer technology involves placing a silicon or glass substrate between integrated circuits, enabling high-density connections and heterogeneous integration. FOWLP, on the other hand, redistributes connections from the chip's periphery to the package's surface, enhancing performance and miniaturization. They facilitate the integration of multiple chips into a single package, enabling the development of smaller, more powerful electronic devices such as smartphones, wearables, and IoT devices, driving innovation in the semiconductor industry.

Market Dynamics:

Driver:

Increasing demand for advanced packaging technologies

Interposer and FOWLP enable the miniaturization and integration of semiconductor components, leading to smaller form factors and higher device density. This is crucial for applications where space is a premium, such as wearables, IoT devices, and mobile devices. These packaging technologies provide enhanced electrical and thermal performance compared to traditional packaging methods. They offer shorter interconnects reduced parasitics, and better heat dissipation, resulting in improved device performance, power efficiency, and reliability boosting the growth of the market.

Restraint:

Complex wafer-level processes

Complex wafer-level processes often require significant investment in specialized equipment and infrastructure. Manufacturers may need to invest in advanced fabrication facilities and tools to handle intricate processes such as redistribution layers (RDLs), through-silicon vias (TSVs), and fine pitch interconnects. These upfront costs can be prohibitive for some companies, particularly smaller players or those with limited financial resources, thus hindering market growth.

Opportunity:

Growing adoption of heterogeneous integration

Heterogeneous integration allows semiconductor companies to develop innovative products with unique features and capabilities. By integrating diverse functionalities into a single package, manufacturers can address a broader range of applications across various industries, including consumer electronics, automotive, healthcare, and IoT. This expanded market opportunity fuels the demand for interposer and FOWLP technologies tailored to heterogeneous integration requirements.

Threat:

Limited ecosystem

A narrow ecosystem may result in dependencies on a limited number of suppliers for critical components, materials, and manufacturing equipment. Supply chain disruptions, such as shortages or quality issues from a single source, can significantly impact production schedules and product availability. Semiconductor companies may face challenges in securing alternative suppliers or mitigating supply chain risks, affecting their ability to meet market demand and customer expectations.

Covid-19 Impact

Lockdown measures and travel restrictions affected manufacturing operations, leading to supply shortages and shipment delays. Uncertainty in demand from key industries like consumer electronics and automotive further impacted market growth, however, the pandemic also accelerated digital transformation, increasing demand for semiconductor devices for remote work, online education, and healthcare applications.

The MEMS/sensors segment is expected to be the largest during the forecast period

The MEMS/sensors segment is estimated to have a lucrative growth, due to integration of MEMS sensors within semiconductor packages drives miniaturization, enabling smaller form factors and enhanced functionality. Interposer and FOWLP technologies facilitate the integration of MEMS devices with other semiconductor components, enabling heterogeneous integration and system-level optimization. This integration enhances the performance, reliability, and cost-effectiveness of MEMS-based applications in automotive, consumer electronics, IoT, and healthcare sectors.

The consumer electronics segment is expected to have the highest CAGR during the forecast period

The consumer electronics segment is anticipated to witness the highest CAGR growth during the forecast period, as consumer demand for smaller, lighter, and more powerful devices increases, semiconductor manufacturers turn to advanced packaging solutions like interposer and FOWLP to meet these requirements. These technologies enable higher levels of integration, improved thermal management, and enhanced electrical performance, crucial for consumer electronics such as smartphones, tablets, wearables, and smart home devices.

Region with largest share:

Asia Pacific is projected to hold the largest market share during the forecast period owing to the Asia Pacific region which is home to some of the world's largest consumer electronics markets, including China, Japan, South Korea, and India. The increasing demand for smartphones, tablets, wearables, and other consumer electronics drives the adoption of advanced packaging technologies like interposer and FOWLP to meet the requirements of smaller form factors, higher performance, and improved energy efficiency.

Region with highest CAGR:

North America is projected to have the highest CAGR over the forecast period, as North America hosts world-class research institutions, universities, and R&D centers specializing in semiconductor packaging and related technologies. These institutions collaborate with industry partners to conduct cutting-edge research, develop innovative solutions, and train the next generation of semiconductor professionals. The synergy between academia and industry fosters technological advancements and accelerates the commercialization of interposer and FOWLP technologies in North America.

Key players in the market

Some of the key players in the Interposer and Fan-out Wafer Level Packaging Market include Advanced MICRO DEVICES, Inc, Amkor Technology, ASE Technology Holding Co., Ltd., DAI Nippon Printing CO., LTD., DECA Technologies, Dupont, Global Foundries Inc, JCET Group LTD., Nexlogic Technologies INC., Powertech Technology Inc., RENA Technologies GMBH, Samsung, SAMTEC, SK Hynix Inc., SPTS Technologies Ltd., Teledyne Digital Imaging Inc., Toshiba Electronic Devices & Storage Corporation and United Microelectronics Corporation

Key Developments:

In April 2024, Infineon and Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions. Both companies have agreed on operating a dedicated packaging and test center at Amkor's manufacturing site in Porto.

In March 2024, DuPont and Menatek Defense Technologies announced that they have entered into an agreement related to the global bearing market. This collaboration between the two companies involves NAZ Bearings(R), an innovative bearing that is self-lubricating and maintenance free.

In April 2024, Teledyne DALSA, a Teledyne Technologies company announced a radiometric version of its MicroCalibir(TM) Long Wave Infrared (LWIR) compact camera platform that delivers accurate temperature measurements of +/-2°C or +/-2%.

Packaging Types Covered:

• 2.5D
• 3D

Device Types Covered:

• Imaging & Optoelectronics
• LEDs
• Logic Ics
• MEMS/Sensors
• Memory Devices
• Other Device Types

Technologies Covered:

• Interposer
• Fan-Out Wafer-Level Packaging (FOWLP)
• Through Silicon Vias

End Users Covered:

• Consumer Electronics
• Telecommunication
• Automotive
• Military and Aerospace
• Smart Technologies
• Medical devices
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Technology Analysis
• 3.7 End User Analysis
• 3.8 Emerging Markets
• 3.9 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Interposer and Fan-out Wafer Level Packaging Market, By Packaging Type

• 5.1 Introduction
• 5.2 2.5D
• 5.3 3D

6 Global Interposer and Fan-out Wafer Level Packaging Market, By Device Type

• 6.1 Introduction
• 6.2 Imaging & Optoelectronics
• 6.3 LEDs
• 6.4 Logic Ics
• 6.5 MEMS/Sensors
• 6.6 Memory Devices
• 6.7 Other Device Types

7 Global Interposer and Fan-out Wafer Level Packaging Market, By Technology

• 7.1 Introduction
• 7.2 Interposer
• 7.3 Fan-Out Wafer-Level Packaging (FOWLP)
• 7.4 Through Silicon Vias

8 Global Interposer and Fan-out Wafer Level Packaging Market, By End User

• 8.1 Introduction
• 8.2 Consumer Electronics
• 8.3 Telecommunication
• 8.4 Automotive
• 8.5 Military and Aerospace
• 8.6 Smart Technologies
• 8.7 Medical devices
• 8.8 Other End Users

9 Global Interposer and Fan-out Wafer Level Packaging Market, By Geography

• 9.1 Introduction
• 9.2 North America
  • 9.2.1 US
  • 9.2.2 Canada
  • 9.2.3 Mexico
• 9.3 Europe
  • 9.3.1 Germany
  • 9.3.2 UK
  • 9.3.3 Italy
  • 9.3.4 France
  • 9.3.5 Spain
  • 9.3.6 Rest of Europe
• 9.4 Asia Pacific
  • 9.4.1 Japan
  • 9.4.2 China
  • 9.4.3 India
  • 9.4.4 Australia
  • 9.4.5 New Zealand
  • 9.4.6 South Korea
  • 9.4.7 Rest of Asia Pacific
• 9.5 South America
  • 9.5.1 Argentina
  • 9.5.2 Brazil
  • 9.5.3 Chile
  • 9.5.4 Rest of South America
• 9.6 Middle East & Africa
  • 9.6.1 Saudi Arabia
  • 9.6.2 UAE
  • 9.6.3 Qatar
  • 9.6.4 South Africa
  • 9.6.5 Rest of Middle East & Africa

10 Key Developments

• 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 10.2 Acquisitions & Mergers
• 10.3 New Product Launch
• 10.4 Expansions
• 10.5 Other Key Strategies

11 Company Profiling

• 11.1 Advanced MICRO DEVICES, Inc
• 11.2 Amkor Technology
• 11.3 ASE Technology Holding Co., Ltd.
• 11.4 DAI Nippon Printing CO., LTD.
• 11.5 DECA Technologies
• 11.6 Dupont
• 11.7 Global Foundries Inc
• 11.8 JCET Group LTD.
• 11.9 Nexlogic Technologies INC.
• 11.10 Powertech Technology Inc.
• 11.11 RENA Technologies GMBH
• 11.12 Samsung
• 11.13 SAMTEC
• 11.14 SK Hynix Inc.
• 11.15 SPTS Technologies Ltd.
• 11.16 Teledyne Digital Imaging Inc.
• 11.17 Toshiba Electronic Devices & Storage Corporation
• 11.18 United Microelectronics Corporation