再配線層材料の2030年までの市場予測：タイプ別、材料タイプ別、用途別、地域別の世界分析

Stratistics MRCによると、再配線層材料の世界市場は2023年に2億1,836万米ドルを占め、予測期間中のCAGRは13.5%で、2030年には5億2,985万米ドルに達する見込みです。

再配線層材料（RLM）は、電子デバイスにおいて重要なコンポーネントであり、エネルギーや信号の効率的な分配を促進します。RLMはチップの異なる層間の橋渡しの役割を果たし、効率的な相互接続と信号分配を可能にします。RDL材料は多くの場合、フリップチップボンディングやTSV（スルーシリコン・ビア）技術などの先進パッケージングプロセスに適合する必要があります。RDL材料は、動作中に発生する熱を放散させ、半導体デバイスの信頼性と寿命を確保するために、特に半導体業界の新技術や小型化動向の中で、良好な熱伝導特性を有しています。

ISEAS-Yusof Ishak Instituteによると、東南アジアは重要な自動車生産拠点であり、世界第7位の自動車生産拠点であり、2021年には350万台の自動車を生産します。

集積回路の複雑化

集積回路はより複雑になり、限られたスペースに多くの部品や機能を組み込むようになっています。これらの材料は、効率的な相互接続ソリューションを提供し、信号損失を最小限に抑え、先端半導体デバイスの限られたスペース内での熱管理を強化します。さらに、RDL材料は集積回路の信頼性と性能の向上にも貢献し、市場の成長を後押ししています。

高コスト

高い電気伝導性や熱伝導性など、精密な特性を持つRDL材料の開発は複雑で、コスト面での課題も多いです。こうした高度なプロセスは製造コストの上昇につながり、半導体デバイスの全体的な値ごろ感に影響を与えます。さらに、競合市場において費用対効果の高いソリューションが求められているため、メーカーには生産費用の最適化というプレッシャーが強まっています。材料費の高騰は最終製品の価格上昇につながり、市場へのアクセスや採用を制限することになります。

先進パッケージング技術

電子機器の高機能化に伴い、コンパクトで高性能なパッケージング・ソリューションへの需要が高まっています。これらのパッケージング革新は、モバイル機器から複雑なコンピューティングシステムに至るまで、現代の電子アプリケーションの要求を満たすために極めて重要です。さらに、単一チップ上に複数の機能を統合することを容易にし、性能を向上させ、より小型で高性能なデバイスの作成を可能にすることが、この市場拡大の原動力となっています。

限られた標準化

標準化された試験方法とベンチマークがないため、利害関係者が異なるRDL材料の性能を正確に評価し比較することは困難です。この共通基盤の欠如が相互運用性と互換性の妨げとなり、多様な半導体デバイスへのRDL材料の統合を複雑なものにしています。また、メーカーにとってはサプライチェーン管理の複雑さが増し、市場規模拡大の妨げとなっています。

COVID-19の影響

COVID-19の流行は市場に大きな影響を与え、サプライチェーンの混乱を引き起こし、市場力学に影響を与えました。多くのメーカーが原材料の調達難に直面し、価格の上昇と利益率の圧迫につながった。さらに、リモートワークへのシフトや、不要不急の電子機器への消費支出の減少が、市場の業績をさらに悪化させました。

予測期間中、5D/3D集積回路（IC）パッケージングセグメントが最大になる見込み

5D/3D集積回路（IC）パッケージングセグメントは、ICの多層を3次元に統合し、性能と機能を強化するため、最大のシェアを占めると推定されます。熱伝導性、電気的性能、信頼性を向上させる材料へのパラダイムシフト。さらに、5D/3D ICパッケージは複数の半導体層の積層を可能にするため、RDL材料はこれらの複雑な構造内の相互接続と信号分配を容易にする上で重要な役割を果たし、このセグメントの成長を牽引しています。

予測期間中、ベンゾシロブテンセグメントのCAGRが最も高くなる見込み

ベンゾシロブテン分野は、特に先進マイクロエレクトロニクスと半導体パッケージングの領域で、予測期間中のCAGRが最も高くなると予想されます。高性能ポリマーであるBCBは、集積回路のRDL製造に不可欠な材料です。さらに、優れた熱安定性、低誘電率、優れた平坦化能力などのユニークな特性により、RDL用途に理想的な選択肢となっており、このセグメントの成長を後押ししています。

最大シェアの地域

アジア太平洋地域は、民生用電子機器、通信、自動車用電子機器の急速な拡大により、予測期間中に最大の市場シェアを占めました。中国、日本、韓国、台湾などの国々がこの市場の最前線にあり、主要な半導体メーカーや組立施設を擁しています。さらに、電子機器の高機能化と小型化に伴い、高性能集積回路を確保するために効率的なRDL材料が不可欠となり、この地域の市場規模を押し上げています。

CAGRが最も高い地域：

欧州は、半導体パッケージングとマイクロエレクトロニクスの先進化により、予測期間中に最も高いCAGRを示すと予想されます。この地域には、Infineon Technologies、日立化成、DuPont MicroSystems L.L.C.、Amkor Technologyなどの主要企業があり、主要な製造・研究施設を擁しています。さらに、技術革新を促進する政府の取り組みと、品質と精密工学の重視が、この地域の拡大を後押ししています。

無料カスタマイズサービス：

本レポートをご購読のお客様には、以下の無料カスタマイズオプションのいずれかをご利用いただけます：

• 企業プロファイル
  • 追加市場プレーヤーの包括的プロファイリング（3社まで）
  • 主要企業のSWOT分析（3社まで）
• 地域セグメンテーション
  • 顧客の関心に応じた主要国の市場推計・予測・CAGR（注：フィージビリティチェックによる）
• 競合ベンチマーキング
  • 製品ポートフォリオ、地理的プレゼンス、戦略的提携に基づく主要企業のベンチマーキング

目次

第1章 エグゼクティブサマリー

第2章 序文

• 概要
• ステークホルダー
• 調査範囲
• 調査手法
  • データマイニング
  • データ分析
  • データ検証
  • 調査アプローチ
• 調査ソース
  • 1次調査ソース
  • 2次調査ソース
  • 前提条件

第3章 市場動向分析

• 促進要因
• 抑制要因
• 機会
• 脅威
• アプリケーション分析
• 新興市場
• 新型コロナウイルス感染症（COVID-19）の影響

第4章 ポーターのファイブフォース分析

• 供給企業の交渉力
• 買い手の交渉力
• 代替品の脅威
• 新規参入業者の脅威
• 競合企業間の敵対関係

第5章 世界の再配線層材料市場：タイプ別

• ファンアウト・ウェーハレベル・パッケージング（FOWLP）
• 5D/3D集積回路（IC）パッケージング
• その他のタイプ

第6章 世界の再配線層材料市場：材料タイプ別

• ベンゾシロブテン
• ポリイミド
• ポリベンゾオキサゾール
• 他の材質タイプ

第7章 世界の再配線層材料市場：用途別

• 化学工業
• 電子機器
• その他の用途

第8章 世界の再配線層材料市場：地域別

• 北米
  • 米国
  • カナダ
  • メキシコ
• 欧州
  • ドイツ
  • 英国
  • イタリア
  • フランス
  • スペイン
  • その他欧州
• アジア太平洋地域
  • 日本
  • 中国
  • インド
  • オーストラリア
  • ニュージーランド
  • 韓国
  • その他アジア太平洋地域
• 南米
  • アルゼンチン
  • ブラジル
  • チリ
  • その他南米
• 中東とアフリカ
  • サウジアラビア
  • アラブ首長国連邦
  • カタール
  • 南アフリカ
  • その他中東とアフリカ

第9章 主な発展

• 契約、パートナーシップ、コラボレーション、合弁事業
• 買収と合併
• 新製品の発売
• 事業拡大
• その他の主要戦略

第10章 企業プロファイル

• Fujifilm Corporation
• HD MicroSystems LLC
• NXP Semiconductors.
• A/SE Group
• Infineon Technologies
• Samsung Electronics Co., Ltd.
• Amkor Technology
• SK Hynix Inc.
• Shin-Etsu Chemical Co., Ltd
• Jiangsu Changjiang Electronics Technology Co., Ltd.

List of Tables

• Table 1 Global Redistribution Layer Material Market Outlook, By Region (2021-2030) ($MN)
• Table 2 Global Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
• Table 3 Global Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
• Table 4 Global Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
• Table 5 Global Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
• Table 6 Global Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
• Table 7 Global Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
• Table 8 Global Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
• Table 9 Global Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
• Table 10 Global Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
• Table 11 Global Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
• Table 12 Global Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
• Table 13 Global Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
• Table 14 Global Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
• Table 15 North America Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
• Table 16 North America Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
• Table 17 North America Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
• Table 18 North America Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
• Table 19 North America Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
• Table 20 North America Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
• Table 21 North America Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
• Table 22 North America Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
• Table 23 North America Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
• Table 24 North America Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
• Table 25 North America Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
• Table 26 North America Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
• Table 27 North America Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
• Table 28 North America Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
• Table 29 Europe Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
• Table 30 Europe Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
• Table 31 Europe Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
• Table 32 Europe Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
• Table 33 Europe Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
• Table 34 Europe Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
• Table 35 Europe Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
• Table 36 Europe Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
• Table 37 Europe Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
• Table 38 Europe Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
• Table 39 Europe Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
• Table 40 Europe Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
• Table 41 Europe Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
• Table 42 Europe Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
• Table 43 Asia Pacific Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
• Table 44 Asia Pacific Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
• Table 45 Asia Pacific Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
• Table 46 Asia Pacific Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
• Table 47 Asia Pacific Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
• Table 48 Asia Pacific Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
• Table 49 Asia Pacific Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
• Table 50 Asia Pacific Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
• Table 51 Asia Pacific Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
• Table 52 Asia Pacific Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
• Table 53 Asia Pacific Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
• Table 54 Asia Pacific Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
• Table 55 Asia Pacific Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
• Table 56 Asia Pacific Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
• Table 57 South America Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
• Table 58 South America Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
• Table 59 South America Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
• Table 60 South America Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
• Table 61 South America Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
• Table 62 South America Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
• Table 63 South America Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
• Table 64 South America Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
• Table 65 South America Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
• Table 66 South America Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
• Table 67 South America Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
• Table 68 South America Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
• Table 69 South America Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
• Table 70 South America Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
• Table 71 Middle East & Africa Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
• Table 72 Middle East & Africa Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
• Table 73 Middle East & Africa Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
• Table 74 Middle East & Africa Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
• Table 75 Middle East & Africa Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
• Table 76 Middle East & Africa Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
• Table 77 Middle East & Africa Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
• Table 78 Middle East & Africa Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
• Table 79 Middle East & Africa Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
• Table 80 Middle East & Africa Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
• Table 81 Middle East & Africa Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
• Table 82 Middle East & Africa Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
• Table 83 Middle East & Africa Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
• Table 84 Middle East & Africa Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)

According to Stratistics MRC, the Global Redistribution Layer Material Market is accounted for $218.36 million in 2023 and is expected to reach $529.85 million by 2030 growing at a CAGR of 13.5% during the forecast period. A redistribution layer material (RLM) is a crucial component in electronic devices, facilitating efficient energy or signal distribution. It serves as a bridge between different layers of a chip, enabling efficient interconnection and signal distribution. RDL materials often need to be compatible with advanced packaging processes, such as flip-chip bonding or through-silicon via (TSV) technology. RDL materials possess favorable thermal conductivity characteristics to dissipate heat generated during operation, ensuring the reliability and longevity of the semiconductor device, particularly in the context of emerging technologies and miniaturization trends in the semiconductor industry.

According to the ISEAS-Yusof Ishak Institute, Southeast Asia is an important automobile production base and seventh largest automotive manufacturing hub worldwide and produced 3.5 million vehicles in 2021.

Market Dynamics:

Driver:

Rising complexity in integrated circuits

Integrated circuits are becoming more intricate, incorporating a greater number of components and functionalities within a limited space. These materials provide efficient interconnection solutions, minimize signal losses, and enhance thermal management within the confined spaces of advanced semiconductor devices. In addition, RDL materials contribute to the reliability and performance of integrated circuits, thereby boosting market growth.

Restraint:

High costs

The complexity of developing RDL materials with precise properties, such as high electrical and thermal conductivity, adds to the cost challenge. These sophisticated processes contribute to elevated production costs, impacting the overall affordability of semiconductor devices. Furthermore, the demand for cost-effective solutions in a competitive market intensifies the pressure on manufacturers to optimize production expenses. High material costs can lead to increased end-product prices, limiting market accessibility and adoption.

Opportunity:

Advanced packaging technologies

The demand for compact and high-performance packaging solutions has intensified as electronic devices become increasingly sophisticated. These packaging innovations are crucial for meeting the demands of modern electronic applications, ranging from mobile devices to complex computing systems. Moreover, it facilitates the integration of multiple functions on a single chip, enhances performance, and enables the creation of smaller, more powerful devices, which is driving this market expansion.

Threat:

Limited standardization

The absence of standardized testing methods and benchmarks makes it challenging for stakeholders to assess and compare the performance of different RDL materials accurately. This lack of common ground hinders interoperability and interchangeability, leading to complications in the integration of RDL materials into diverse semiconductor devices. It also increases the complexity of supply chain management for manufacturers, which is impeding this market size.

Covid-19 Impact

The COVID-19 pandemic has significantly impacted the market, causing disruptions in the supply chain and influencing market dynamics. Many manufacturers faced difficulties in sourcing raw materials, leading to increased prices and a strain on profit margins. Moreover, the shift towards remote working and reduced consumer spending on non-essential electronics further dampened the market's performance.

The 5D/3D integrated circuit (IC) Packaging segment is expected to be the largest during the forecast period

The 5D/3D integrated circuit (IC) Packaging segment is estimated to hold the largest share, due to the integration of multiple layers of ICs in three dimensions, enhancing performance and functionality. A paradigm shift towards materials offer improved thermal conductivity, electrical performance, and reliability. Moreover, as 5D/3D IC packaging enables the stacking of multiple semiconductor layers, RDL materials play a critical role in facilitating interconnects and signal distribution within these complex structures which is driving this segment growth.

The benzocylobutene segment is expected to have the highest CAGR during the forecast period

The benzocylobutene segment is anticipated to have highest CAGR during the forecast period, particularly in the realm of advanced microelectronics and semiconductor packaging. BCB, a high-performance polymer, serves as a crucial material for the fabrication of RDLs in integrated circuits. Furthermore, unique properties, including excellent thermal stability, a low dielectric constant, and superior planarization capabilities, make it an ideal choice for RDL applications, which are boosting this segment's growth.

Region with largest share:

Asia Pacific commanded the largest market share during the extrapolated period, owing to a rapidly expanding consumer electronics, telecommunications, and automotive electronics. Countries such as China, Japan, South Korea, and Taiwan are at the forefront of this market, hosting major semiconductor manufacturers and assembly facilities. In addition, as electronic devices become more sophisticated and compact, the need for efficient RDL materials becomes critical for ensuring high-performance integrated circuits, driving the size of this region.

Region with highest CAGR:

Europe is expected to witness highest CAGR over the projection period, owing to advancements in semiconductor packaging and microelectronics. The region is home to several key players, including Infineon Technologies, Hitachi Chemical, DuPont MicroSystems L.L.C., and Amkor Technology, which host major manufacturing and research facilities. Moreover, government initiatives promoting innovation, coupled with a strong emphasis on quality and precision engineering, are propelling this region's expansion.

Key players in the market

Some of the key players in the Redistribution Layer Material Market include Fujifilm Corporation, HD MicroSystems LLC, NXP Semiconductors, ASE Group, Infineon Technologies, Samsung Electronics Co., Ltd., Amkor Technology, SK Hynix Inc., Shin-Etsu Chemical Co., Ltd and Jiangsu Changjiang Electronics Technology Co., Ltd.

Key Developments:

In November 2023, Amkor Technology, Inc. announced that it has committed to setting targets to reduce greenhouse gas emissions in alignment with the Science Based Targets initiative (SBTi).

In June 2023, FUJIFILM Cellular Dynamics, announces the global commercial launch of its human iPSC-derived iCell® Blood-Brain Barrier Isogenic Kit for scientists engaged in neuroscience research and drug discovery for neuroactive drugs.

In January 2023, FUJIFILM Cellular Dynamics, Inc., announced that it has entered an agreement to grant global healthcare company Novo Nordisk A/S a non-exclusive right to use FUJIFILM Cellular Dynamics' iPSC platform for the development and commercialization of iPSC-derived cell therapies with a focus on addressing serious chronic diseases

Types Covered:

• Fan-out wafer-level packaging (FOWLP)
• 5D/3D Integrated Circuit (IC) Packaging
• Other Types

Material Types Covered:

• Benzocylobutene
• Polyimide
• Polybenzoxazole
• Other Material Types

Applications Covered:

• Chemical Industry
• Electronic Appliances
• Other Applications

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Application Analysis
• 3.7 Emerging Markets
• 3.8 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Redistribution Layer Material Market, By Type

• 5.1 Introduction
• 5.2 Fan-out wafer-level packaging (FOWLP)
• 5.3 5D/3D Integrated Circuit (IC) Packaging
• 5.4 Other Types

6 Global Redistribution Layer Material Market, By Material Type

• 6.1 Introduction
• 6.2 Benzocylobutene
• 6.3 Polyimide
• 6.4 Polybenzoxazole
• 6.5 Other Material Types

7 Global Redistribution Layer Material Market, By Application

• 7.1 Introduction
• 7.2 Chemical Industry
• 7.3 Electronic Appliances
• 7.4 Other Applications

8 Global Redistribution Layer Material Market, By Geography

• 8.1 Introduction
• 8.2 North America
  • 8.2.1 US
  • 8.2.2 Canada
  • 8.2.3 Mexico
• 8.3 Europe
  • 8.3.1 Germany
  • 8.3.2 UK
  • 8.3.3 Italy
  • 8.3.4 France
  • 8.3.5 Spain
  • 8.3.6 Rest of Europe
• 8.4 Asia Pacific
  • 8.4.1 Japan
  • 8.4.2 China
  • 8.4.3 India
  • 8.4.4 Australia
  • 8.4.5 New Zealand
  • 8.4.6 South Korea
  • 8.4.7 Rest of Asia Pacific
• 8.5 South America
  • 8.5.1 Argentina
  • 8.5.2 Brazil
  • 8.5.3 Chile
  • 8.5.4 Rest of South America
• 8.6 Middle East & Africa
  • 8.6.1 Saudi Arabia
  • 8.6.2 UAE
  • 8.6.3 Qatar
  • 8.6.4 South Africa
  • 8.6.5 Rest of Middle East & Africa

9 Key Developments

• 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 9.2 Acquisitions & Mergers
• 9.3 New Product Launch
• 9.4 Expansions
• 9.5 Other Key Strategies

10 Company Profiling

• 10.1 Fujifilm Corporation
• 10.2 HD MicroSystems LLC
• 10.3 NXP Semiconductors.
• 10.4 A/SE Group
• 10.5 Infineon Technologies
• 10.6 Samsung Electronics Co., Ltd.
• 10.7 Amkor Technology
• 10.8 SK Hynix Inc.
• 10.9 Shin-Etsu Chemical Co., Ltd
• 10.10 Jiangsu Changjiang Electronics Technology Co., Ltd.