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表紙：中国の半導体パッケージングおよび検査装置市場：2023年
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中国の半導体パッケージングおよび検査装置市場：2023年

2023 China Semiconductor Packaging and Testing Equipment Market Research Report
出版日: | 発行: MIR Co., Ltd | ページ情報: 英文 63 Pages | 納期: 7営業日

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中国の半導体パッケージングおよび検査装置市場：2023年
出版日: 2023年05月31日
発行: MIR Co., Ltd
ページ情報: 英文 63 Pages
納期: 7営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

当レポートでは、中国の半導体パッケージングおよび検査装置の市場を調査し、総市場の概要、市場規模の推移・予測、装置タイプ別の詳細分析、技術動向、製造業者のシェア、プロファイルなどをまとめています。

目次

第1章 プロジェクトの背景・定義

  • プロジェクトの背景
  • プロジェクトの定義

第2章 中国のパッケージングおよび検査装置市場：総市場の分析

  • 中国のIC産業：全体および部門別の市場規模・成長分析
  • 中国のパッケージングおよび検査産業：全体および部門別の市場規模・成長分析

第3章 中国のパッケージングおよび検査市場における装置の分析

  • 中国のパッケージング装置・検査装置の市場規模と推移
  • 中国のパッケージングおよび検査装置の現地化率と将来動向の分析：モデル別
  • 中国のダイシングマシン市場の分析
    • 市場規模の分析・予測
    • 主要製造業者の市場シェア
    • 中国現地の製造業者による技術の進歩
    • 今後の技術動向
  • 中国のチップローダー市場の分析
    • 市場規模の分析・予測
    • 主要製造業者の市場シェア
    • 中国現地の製造業者による技術の進歩
    • 今後の技術動向
  • 中国のワイヤーボンディングマシン市場の分析
    • 市場規模の分析・予測
    • 主要製造業者の市場シェア
    • 中国現地の製造業者による技術の進歩
    • 今後の技術動向
  • 中国の検査装置市場の分析
    • 市場規模の分析・予測
    • 主要製造業者の市場シェア
    • 中国現地の製造業者による技術の進歩
    • 今後の技術動向
  • 中国の選別機市場の分析
    • 市場規模の分析・予測
    • 主要製造業者の市場シェア
    • 中国現地の製造業者による技術の進歩
    • 今後の技術動向
  • 中国のプローブステーション市場の分析
    • 市場規模の分析・予測
    • 主要製造業者の市場シェア
    • 中国現地の製造業者による技術の進歩
    • 今後の技術動向

第4章 中国の主要パッケージング・検査企業による投資・工場建設計画

  • JCET
  • Tongfu Microelectronics
  • HT-Tech
  • China Wafer Level CSP
  • その他

第5章 中国の主要パッケージングおよび検査装置製造業者の分析

  • Changchuan Technology
  • ACCOTEST
  • ACCURATE
  • JinHaiTong
  • Jafeng
  • Shenzhen HSMOS
図表

List of Tables

  • Table 1: Sales of China's IC Industry from 2019 to 2025E
  • Table 2: China's IC Packaging and Testing Market Scale from 2019 to 2025E
  • Table 3: Market Size of Packaging and Testing Equipment in China from 2019 to 2025E
  • Table 4: Localization Ratio of Packaging and Testing Equipment in China from 2019 to 2025E
  • Table 5: Market Size of Various Packaging Equipment in 2022
  • Table 6: Market Size of Various Test Equipment in 2022
  • Table 7: China's Dicing Machine Market Size from 2019 to 2025E
  • Table 8: China's Dicing Machine Market Size in 2022
  • Table 9: China's Film Loader Market Size from 2019 to 2025E
  • Table 10: China's Placement Machine Market Size in 2022
  • Table 11: China's Wire Bonding Machine Market Size from 2019 to 2025E
  • Table 12: China's Wire Bonding Machine Market Size in 2022
  • Table 13: China's Testing Machine Market Size from 2019 to 2025E
  • Table 14: China's Testing Machine Market Size in 2022
  • Table 15: China's Sorting Machine Market Size from 2019 to 2025E
  • Table 16: China's Sorting Machine Market Size in 2022
  • Table 17: China's Probe Station Market Size from 2019 to 2025
  • Table 18: China's Probe Station Market Size in 2022
  • Table 19: JCET Investment Plan - Ten Billion High-End Manufacturing Projects
  • Table 20: JCET Investment Plan-Annual Output of 10 Billion Communication High-Density Hybrid Integrated Circuits and Module Packaging Projects
  • Table 21: Tongfu Microelectronics Investment Plan - Memory Chip Packaging and Testing Production Line Construction Project
  • Table 22: Tongfu Microelectronics Investment Plan - High Performance Computing Product Packaging and Testing Industrialization Project
  • Table 23: Tongfu Microelectronics Investment Plan - 5G and Other New Generation Communication Product Packaging and Testing Projects
  • Table 24: Tongfu Microelectronics Investment Plan - Expansion Project of Wafer Level Packaging Products
  • Table 25: Tongfu Microelectronics Investment Planning - Power Device Packaging and Testing Production Expansion Project
  • Table 26: HT-Tech Investment Plan - HT-Tech Baoji Phase II Project
  • Table 27: HT-Tech Investment Plan - Integrated Circuit Multi-Chip Packaging Scale-Up Project
  • Table 28: HT-Tech Investment Plan - High-Density System-Level Integrated Circuit Packaging and Testing Scale-Up Project
  • Table 29: HT-Tech Investment Plan - Storage and RF Integrated Circuit Packaging and Testing Industrialization Projects
  • Table 30: HT-Tech Investment Plan - TSV and FC IC Packaging and Testing Industrialization Projects
  • Table 31: Investment Plan of China Wafer Level CSP - Integrated Circuit 12-Inch TSV and Heterogeneous Integrated Smart Sensor Module Project
  • Table 32: Chengdu UNISEM Investment Plan - Chengdu Phase III Project
  • Table 33: Forehope Electronic Investment Plan - High-Density Sip RF Module Packaging and Testing Project
  • Table 34: Investment Plan of Forehope Electronic-Industrialization Project of IC Advanced Packaging Wafer Bumps
  • Table 35: CHIPMORE Investment Plan - Advanced Packaging and Testing Production Base Project
  • Table 36: Sales of Changchuan Technology's Testing Equipment (Testing Machines, Sorting Machines, Probe Stations) from 2019 to 2022
  • Table 37: Changchuan Technology Test Equipment (Testing Machine, Sorting Machine) Customer Group
  • Table 38: Sales of ACCOTEST Testing Machines from 2019 to 2022
  • Table 39: Customer Group of ACCOTEST Testing Machine
  • Table 40: Sales of ACCURATE Packaging and Testing Equipment (Loader, Sorter) from 2021 to 2022
  • Table 41: Customer Groups of ACCURATE Packaging and Testing Equipment (Chip Loader, Sorter, Etc.)
  • Table 42: Sales of JinHaiTong Sorting Machines from 2019 to 2022
  • Table 43: Customer Group of JinHaiTong Sorting Machine
  • Table 44: Sales of Jafeng Film Loading Machines from 2019 to 2022
  • Table 45: Jafeng Film Loading Machine Customer Group
  • Table 46: Sales of Shenzhen HSMOS Probe Stations from 2019 to 2022
  • Table 47: Customer Group of Shenzhen HSMOS Probe Station

List of Figures

  • Figure 1: Sales of China's IC Industry from 2019 to 2025E
  • Figure 2: Segmentation of China's IC Industry in 2022
  • Figure 3: China's IC Packaging and Testing Market Scale from 2019 to 2025E
  • Figure 4: Changes in the Market Share of Advanced Packaging and Traditional Packaging in China from 2019 to 2025E
  • Figure 5: China's Packaging and Testing Equipment Market Size from 2019 to 2025E
  • Figure 6: 2019~2025E China's Packaging Equipment Equipment and Testing Equipment Market Size
  • Figure 7: China's Packaging and Testing Equipment Market Size from 2019 to 2025E
  • Figure 8: Market Size of Various Packaging and Testing Equipment In 2022
  • Figure 9: Market Size of Various Packaging and Testing Equipment In 2022
  • Figure 10: China's Dicing Machine Market Size from 2019 to 2025
  • Figure 11: Market Size of China's Dicing Machine Market in 2022
  • Figure 12: Market Size of Film Loading Machines in China from 2019 to 2025
  • Figure 13: Market Size of Film Loading Machines in China In 2022
  • Figure 14: China's Wire Bonding Machine Market Size from 2019 to 2025
  • Figure 15: China's Wire Bonding Machine Market Size in 2022
  • Figure 16: China's Testing Machine Market Size from 2019 to 2025
  • Figure 17: China's Testing Machine Market Size in 2022
  • Figure 18: China's Sorting Machine Market Size from 2019 to 2025
  • Figure 19: China's Sorting Machine Market Size in 2022
  • Figure 20: China's Probe Station Market Size from 2019 to 2025
  • Figure 21: China's Probe Station Market Size In 2022
  • Figure 22: Sales of Changchuan Technology's Testing Equipment (Testing Machines, Sorting Machines) from 2019 to 2022
  • Figure 23: Sales of ACCOTEST Testing Machines from 2019 to 2022
  • Figure 24: 2021~2022 Sales of ACCURATE Packaging and Testing Equipment (Loader, Sorter)
  • Figure 25: Sales of JinHaiTong Sorting Machines from 2019 to 2022
  • Figure 26: Sales of Dalian Jafeng Film Loading Machines from 2019 to 2022
  • Figure 27: Sales of Shenzhen HSMOS Probe Stations from 2019 to 2022
目次
Product Code: MIR-2023-0531-0048

MIR's "2023 China Semiconductor Packaging and Testing Equipment Market Research Report" provides a comprehensive overview of China's semiconductor packaging and testing market. The report delves into market dynamics, segmentation, equipment specifics like dicing machines and wire bonding machines, and profiles major industry players and manufacturers. Enhanced by tables and visuals, it offers insights into sales, market size trends, and company strategies. An essential tool for stakeholders and investors, it captures the industry's evolution and future prospects.

Expanded Report Description

MIR's "2023 China Semiconductor Packaging and Testing Equipment Market Research Report" offers an extensive examination of the rapid advancements in China's semiconductor packaging and testing equipment market. Anchored in meticulous research and fortified with expansive data, this report is a crucial tool for stakeholders, investors, and industry participants seeking to gain insights into the trends, challenges, and opportunities of this market.

In Part I, the report begins by setting the context, diving deep into the project's background, highlighting the driving forces behind this study. It further elaborates on the specifics through detailed definitions - from the products and industries under scrutiny to the geographical areas, timeframes, and units in focus.

Part II addresses the overall market analysis, focusing on both the Integrated Circuit industry and the Packaging and Testing segments. Here, readers will gain an understanding of the market's breadth and the segmentation nuances. This part provides an overview of market sizes, growth trajectories, and the potential for future expansion.

The heart of the report lies in Part III, which delves into the individual equipment segments in China's packaging and testing market. The section is exhaustive, addressing the market dynamics of various equipment ranging from dicing machines, chip loaders, to wire bonding machines, testing machines, sorting machines, and probe stations. Each equipment type is meticulously dissected, covering their market size evolution, manufacturer market shares, technological progressions, and anticipated technology trends.

In Part IV, the focus shifts to the investment and factory construction plans of major packaging and testing companies in China. This segment provides an illuminating look into the strategic endeavors of industry giants such as JCET, Tongfu Microelectronics, HT-Tech, China Wafer Level CSP, and more.

Part V zeroes in on key local Chinese packaging and testing equipment manufacturers, providing readers with a comprehensive view of their profiles, sales data, major customer groups, and their unique competitive advantages. The likes of Changchuan Technology, ACCOTEST, ACCURATE, JinHaiTong, Jafeng, and Shenzhen HSMOS are covered, giving insights into their strategic market positions.

Complementing the written analysis, the report is punctuated with a series of tables and figures. The tables enumerate everything from sales of the IC industry, the various market sizes of equipment, to specific investment plans of leading companies. The figures, on the other hand, visually capture market size evolutions, segmentations, and sales data, aiding in the visual representation of the market's dynamics.

In summation, the "2023 China Semiconductor Packaging and Testing Equipment Market Research Report" is an indispensable resource. Its depth and breadth make it an invaluable tool for anyone seeking to understand or operate within this evolving market landscape. Whether you're an investor, a market player, or simply curious about the industry, this report promises to enlighten and inform.

Table of Content

Part I Project Background and Project Definition

  • A. Project Background
  • B. Project Definition
    • B-1. Product Definition
    • B-2. Industry Definition
    • B-3. Area Definition
    • B-4. Time definition
    • B-5. Unit Definition

Part II Overall Market Analysis of Packaging and Testing in China

  • A. Analysis of the Overall and Segmented Market Size and Growth of China's Integrated Circuit Industry
  • B. Analysis of the Overall and Segmented Market Size and Growth of China's Packaging and Testing Industry

Part III Analysis of Equipment in China's Packaging and Testing Market

  • A. Market Size and Changes of Packaging Equipment and Testing Equipment in China
  • B. Localization Ratio and Future Trend Analysis of Packaging and Testing Equipment in China - by Model
  • C. Analysis of China's Dicing Machine Market
    • C-1. Analysis and Forecast of Overall Market Size Growth
    • C-2. Market Share of Major Manufacturers
    • C-3. Technology Progress of Chinese Local Equipment Manufacturers
    • C-4. Future Technology Trends
  • D. Analysis of China's Chip Loader Market
    • D-1. Overall Market Growth Analysis and Forecast
    • D-2. Market Share of Major Manufacturers
    • D-3. Technology Progress of Chinese Local Equipment Manufacturers
    • D-4. Future Technology Trends
  • E. Market Analysis of Wire Bonding Machines in China
    • E-1. Overall Market Growth Analysis and Forecast
    • E-2. Market Share of Major Manufacturers
    • E-3. Technology Progress of Chinese Local Equipment Manufacturers
    • E-4. Future Technology Trends
  • F. Analysis of China's Testing Machine Market
    • F-1. Overall Market Growth Analysis and Forecast
    • F-2. Market Share of Major Manufacturers
    • F-3. Technology Progress of Chinese Local Equipment Manufacturers
    • F-4. Future Technology Trends
  • G. Analysis of China's Sorting Machine Market
    • G-1. Overall Market Growth Analysis and Forecast
    • G-2. Market Share of Major Manufacturers
    • G-3. Technology Progress of Chinese Local Equipment Manufacturers
    • G-4. Future Technology Trends
  • H. Analysis of China's Probe Station Market
    • H-1. Overall Market Growth Analysis and Forecast
    • H-2. Market Share of Major Manufacturers
    • H-3. Technology Progress of Chinese Local Equipment Manufacturers
    • H-4. Future Technology Trends

Part IV Investment and Factory Construction Plan of Main Packaging and Testing Companies in China

  • A. JCET
  • B. Tongfu Microelectronics
  • C. HT-Tech
  • D. China Wafer Level CSP
  • E. Others

Part V Analysis of Key Chinese Local Packaging and Testing Equipment Manufacturers

  • A. Changchuan Technology
    • A-1. Company Profile
    • A-2. Sales and Growth Rate of Major Packaging and Testing Equipment
    • A-3. Main Customer Groups
    • A-4. Competitive Advantage of the Company
  • B. ACCOTEST
  • C. ACCURATE
  • D. JinHaiTong
  • E. Jafeng
  • F. Shenzhen HSMOS