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1332090

高密度相互接続（HDI）PCBの世界市場 - 予測（～2032年）

High Density Interconnect PCB Market Research Report - Forecast till 2032

出版日
ページ情報
英文 100 Pages
納期
即納可能 即納可能とは
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=146.82円
高密度相互接続（HDI）PCBの世界市場 - 予測（～2032年）
出版日: 2023年08月10日
発行: Market Research Future
ページ情報: 英文 100 Pages
納期: 即納可能 即納可能とは
GIIご利用のメリット
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界の高密度相互接続（HDI）PCBの市場規模は、調査期間の2023年～2032年にCAGRで17.3%の大幅な成長が予測されています。

地域の考察

アジア太平洋は予測期間中、市場で大きなシェアを占めると予測されます。

技術革新への関心の高まり、特に中国や日本のような国々による研究開発への注目の高まりと、政府の支援が、ビジネス部門の拡大の促進要因となっています。さまざまな最終用途分野における、将来の用途を検討するプリント基板の研究開発における着実な試みが、予測期間中に市場の発展を促進する見込みです。

当レポートでは、世界の高密度相互接続（HDI）PCB市場について調査分析し、市場力学、地域とセグメントの分析、企業プロファイルなどを提供しています。

目次

第1章 エグゼクティブサマリー

  • 市場の魅力分析
    • 世界の高密度相互接続（HDI）PCB市場：相互接続層別
    • 世界の高密度相互接続（HDI）PCB市場：用途別
    • 世界の高密度相互接続（HDI）PCB市場：地域別

第2章 市場のイントロダクション

第3章 調査手法

第4章 市場力学

  • イントロダクション
  • 促進要因
    • 高密度相互接続技術の恩恵の増大
    • 複雑な電子機器におけるHDI PCBの需要の高まり
    • 回路の微細化への需要の高まり
    • 促進要因の影響の分析
  • 課題
    • 宇宙用途向けのPCBへのHDI技術の導入
    • 5G技術に関連するPCB設計の課題
    • 大量生産においてALV HDIが直面する課題
    • 抑制要因の影響の分析
  • 機会
    • HDI PCBの技術の進歩
    • PCB設計者の成長機会としての5G技術
    • コンシューマーエレクトロニクスの需要の高まり
  • COVID-19の影響
    • 半導体産業に対する影響
    • 医療電子産業に対する影響
    • 世界のPCBサプライチェーンに対する影響
    • サプライチェーンのデジタル化のニーズの高まり

第5章 市場要因の分析

  • バリューチェーン分析/サプライチェーン分析
  • ポーターのファイブフォース分析モデル

第6章 世界の高密度相互接続（HDI）PCB市場：相互接続層別

  • イントロダクション
  • 1層（1+N+1）HDI
  • 2層以上の（2+N+2）HDI
  • 全層HDI

第7章 世界の高密度相互接続（HDI）PCB市場：用途別

  • イントロダクション
  • コンシューマーエレクトロニクス
  • 自動車
  • 軍事・防衛
  • 医療
  • 工業/製造
  • その他

第8章 世界の高密度相互接続（HDI）PCBの市場規模の推計と予測：地域別

  • イントロダクション
  • 北米
    • 市場の推計と予測：国別（2018年～2032年）
    • 市場の推計と予測：相互接続層別（2018年～2032年）
    • 市場の推計と予測：用途別（2018年～2032年）
    • 米国
    • 市場の推計と予測：相互接続層別（2018年～2032年）
    • 市場の推計と予測：用途別（2018年～2032年）
    • カナダ
    • 市場の推計と予測：相互接続層別（2018年～2032年）
    • 市場の推計と予測：用途別（2018年～2032年）
    • メキシコ
    • 市場の推計と予測：相互接続層別（2018年～2032年）
    • 市場の推計と予測：用途別（2018年～2032年）
  • 欧州
    • 市場の推計と予測：国別（2018年～2032年）
    • 市場の推計と予測：相互接続層別（2018年～2032年）
    • 市場の推計と予測：用途別（2018年～2032年）
    • 英国
    • ドイツ
    • フランス
    • その他の欧州
  • アジア太平洋
    • 市場の推計と予測：国別（2018年～2032年）
    • 市場の推計と予測：相互接続層別（2018年～2032年）
    • 市場の推計と予測：用途別（2018年～2032年）
    • 中国
    • 日本
    • インド
    • その他のアジア太平洋
  • 中東・アフリカ
    • 市場の推計と予測：相互接続層別（2018年～2032年）
    • 市場の推計と予測：用途別（2018年～2032年）
  • 南米
    • 市場の推計と予測：相互接続層別（2018年～2032年）
    • 市場の推計と予測：用途別（2018年～2032年）

第9章 競合情勢

  • イントロダクション
  • 主な発展と成長戦略
  • 競合のベンチマーク
  • ベンダーシェア分析（2021年）

第10章 企業プロファイル

  • UNIMICRON, EPEC, LLC
  • TTM TECHNOLOGIES INC.
  • RAYMING TECHNOLOGY
  • HITECH CIRCUITS
  • NCAB GROUP CORPORATION
  • MILLENNIUM CIRCUITS LIMITED
  • TRIPOD TECHNOLOGY
  • ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED
  • AKM MEADVILLE
  • MEIKO ELECTRONICS CO., LTD.
  • SIERRA CIRCUITS INC.
  • COMPEQ MANUFACTURING CO., LTD.
  • AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT)
  • ADVANCED CIRCUITS
  • DAP CORPORATION
図表

LIST OF TABLES

  • TABLE 1 MARKET SYNOPSIS 17
  • TABLE 2 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 41
  • TABLE 3 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 43
  • TABLE 4 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY REGION, 2018-2032 (USD MILLION) 46
  • TABLE 5 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 48
  • TABLE 6 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 49
  • TABLE 7 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 49
  • TABLE 8 US HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 50
  • TABLE 9 US HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 50
  • TABLE 10 CANADA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 50
  • TABLE 11 CANADA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 51
  • TABLE 12 MEXICO HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 51
  • TABLE 13 MEXICO HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 51
  • TABLE 14 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 55
  • TABLE 15 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 55
  • TABLE 16 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 56
  • TABLE 17 GERMANY HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 57
  • TABLE 18 GERMANY HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 57
  • TABLE 19 FRANCE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 57
  • TABLE 20 FRANCE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 58
  • TABLE 21 UK HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 58
  • TABLE 22 UK HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 58
  • TABLE 23 REST OF EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 59
  • TABLE 24 REST OF EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 59
  • TABLE 25 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 61
  • TABLE 26 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 62
  • TABLE 27 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 62
  • TABLE 28 CHINA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 63
  • TABLE 29 CHINA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 63
  • TABLE 30 JAPAN HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 63
  • TABLE 31 JAPAN HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 64
  • TABLE 32 INDIA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 64
  • TABLE 33 INDIA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 64
  • TABLE 34 REST OF ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 65
  • TABLE 35 REST OF ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 65
  • TABLE 36 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 67
  • TABLE 37 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 67
  • TABLE 38 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 68
  • TABLE 39 MIDDLE EAST & AFRICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 69
  • TABLE 40 MIDDLE EAST & AFRICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 69
  • TABLE 41 SOUTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 69
  • TABLE 42 SOUTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 70
  • TABLE 43 BUSINESS EXPANSIONS/ACQUISITIONS 73
  • TABLE 44 UNIMICRON: PRODUCTS/SOLUTIONS/SERVICES OFFERED 77
  • TABLE 45 EPEC, LLC: PRODUCTS/SOLUTIONS/SERVICES OFFERED 78
  • TABLE 46 EPEC, LLC: KEY DEVELOPMENTS 78
  • TABLE 47 TTM TECHNOLOGIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 81
  • TABLE 48 RAYMING TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 83
  • TABLE 49 HITECH CIRCUITS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 84
  • TABLE 50 NCAB GROUP CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 86
  • TABLE 51 NCAB GROUP CORPORATION: KEY DEVELOPMENTS 86
  • TABLE 52 MILENNIUM CIRCUITS LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED 89
  • TABLE 53 TRIPOD TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 90
  • TABLE 54 ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED 93
  • TABLE 55 AKM MEADVILLE: PRODUCTS/SOLUTIONS/SERVICES OFFERED 96
  • TABLE 56 MEIKO ELECTRONICS CO., LTD: PRODUCTS/SOLUTIONS/SERVICES OFFERED 99
  • TABLE 57 MEIKO ELECTRONICS CO., LTD: KEY DEVELOPMENTS 100
  • TABLE 58 SIERRA CIRCUITS INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 102
  • TABLE 59 COMPEQ MANUFACTURING CO. LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 104
  • TABLE 60 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT: PRODUCTS/SOLUTIONS/SERVICES OFFERED 106
  • TABLE 61 ADVANCED CIRCUIT.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 108
  • TABLE 62 DAP CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 109 L

LIST OF FIGURES

  • FIGURE 1 MARKET ATTRACTIVENESS ANALYSIS: GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET 18
  • FIGURE 2 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET: MARKET STRUCTURE 20
  • FIGURE 3 BOTTOM-UP AND TOP-DOWN APPROACHES 25
  • FIGURE 4 MARKET DYNAMIC ANALYSIS OF THE GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET 28
  • FIGURE 5 DRIVER IMPACT ANALYSIS 30
  • FIGURE 6 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET: SUPPLY CHAIN ANALYSIS 36
  • FIGURE 7 PORTER'S FIVE FORCES ANALYSIS OF THE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET 38
  • FIGURE 8 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2022 (% SHARE) 40
  • FIGURE 9 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2022 VS 2032 (USD MILLION) 40
  • FIGURE 10 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2022 (% SHARE) 42
  • FIGURE 11 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2022 VS 2032 (USD MILLION) 42
  • FIGURE 12 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY REGION, 2022 (% SHARE) 45
  • FIGURE 13 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY REGION, 2022 VS 2032 (USD MILLION) 45
  • FIGURE 14 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 (% SHARE) 47
  • FIGURE 15 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 VS 2032 (USD MILLION) 48
  • FIGURE 16 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 48
  • FIGURE 17 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 49
  • FIGURE 18 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 (% SHARE) 53
  • FIGURE 19 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 VS 2032 (USD MILLION) 53
  • FIGURE 20 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 55
  • FIGURE 21 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 56
  • FIGURE 22 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 (% SHARE) 60
  • FIGURE 23 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 VS 2032 (USD MILLION) 61
  • FIGURE 24 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 61
  • FIGURE 25 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 62
  • FIGURE 26 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 (% SHARE) 66
  • FIGURE 27 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 VS 2032 (USD MILLION) 66
  • FIGURE 28 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 67
  • FIGURE 29 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 68
  • FIGURE 30 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET: COMPETITIVE BENCHMARKING 72
  • FIGURE 31 VENDOR SHARE ANALYSIS, 2021 (%) 73
  • FIGURE 32 UNIMICRON: FINANCIAL OVERVIEW SNAPSHOT 76
  • FIGURE 33 UNIMICRON: SWOT ANALYSIS 77
  • FIGURE 34 EPEC, LLC: SWOT ANALYSIS 79
  • FIGURE 35 TTM TECHNOLOGIES INC.: FINANCIAL OVERVIEW SNAPSHOT 81
  • FIGURE 36 TTM TECHNOLOGIES INC.: SWOT ANALYSIS 82
  • FIGURE 37 NCAB GROUP CORPORATION: FINANCIAL OVERVIEW SNAPSHOT 85
  • FIGURE 38 NCAB GROUP CORPORATION: SWOT ANALYSIS 88
  • FIGURE 39 TRIPOD TECHNOLOGY: FINANCIAL OVERVIEW SNAPSHOT 90
  • FIGURE 40 TRIPOD TECHNOLOGY: SWOT ANALYSIS 91
  • FIGURE 41 ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED: FINANCIAL OVERVIEW SNAPSHOT 92
  • FIGURE 42 ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED: SWOT ANALYSIS 93
  • FIGURE 43 AKM MEADVILLE (AKM INDUSTRIAL COMPANY LIMITED): FINANCIAL OVERVIEW SNAPSHOT 95
  • FIGURE 44 AKM MEADVILLE: SWOT ANALYSIS 97
  • FIGURE 45 MEIKO ELECTRONICS CO., LTD.: FINANCIAL OVERVIEW SNAPSHOT 99
  • FIGURE 46 MEIKO ELECTRONICS CO., LTD: SWOT ANALYSIS 100
  • FIGURE 47 COMPEQ MANUFACTURING CO., LTD: FINANCIAL OVERVIEW SNAPSHOT 103
  • FIGURE 48 COMPEQ MANUFACTURING CO. LTD.: SWOT ANALYSIS 104
  • FIGURE 49 AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT): FINANCIAL OVERVIEW SNAPSHOT 105
  • FIGURE 50 AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT): SWOT ANALYSIS 107
目次
Product Code: MRFR/SEM/5821-CR

Market Overview

High-Density Interconnect PCB Market is projected to exhibit a significant CAGR of 17.3% during the review period 2023 - 2032. HDI is a truncation for High Density Interconnector, which is a circuit board with a moderately high line circulation density that utilizes miniature visually impaired and covered opening innovation. It is vital in improving electrical execution and bringing down the weight and size of hardware. HDI PCB plans push the limits of innovation, and key market organizations are at the very front of the development, meeting the most tough particulars. The interest for HDI PCB fabricating has been growing because of innovative leap forwards and the various benefits HDI PCBs accommodate high-tech applications. Squeezing more innovation into less space with less layers limits numerous PCB makers who need particular gear and the capacity for cutting edge highlights, better lines, and tighter resiliences. HDI printed circuit board plans utilize complex elements, for example, miniature vias, blind vias, through in-cushion, and stacked and staggered vias to expand board region while upgrading execution and convenience.

Market Segment Insights

By Interconnection Layers, the High Density Interconnect (HDI) PCB market has been categorized as 1 Layer (1+N+1) HDI, 2 or more layers (2+N+2) HDI, and All Layers HDI. During the projected period, the demand for All Layers HDI segment is expected to grow rapidly.

Based on Application, the High Density Interconnect (HDI) PCB market has been segmented into Consumer Electronics, Automotive, Military and Defense, Healthcare, Industrial/ Manufacturing, and Others. During the projected period, the automotive segment is expected to rise rapidly.

Regional Insights

Asia Pacific is expected to have a significant share of the High Density Interconnect PCB Market during the projected period.

The rising utilization of printed circuit sheets in the hardware, aviation, IT, and telecom, modern, and auto businesses is driving business sector extension regarding esteem deals. Developing interest for innovation, more noteworthy interest in Research and development by undertakings in nations like China and Japan, and government backing are a portion of the drivers driving business sector extension. Consistent endeavors in printed circuit board Research and development to examine forthcoming applications in various end-use areas are supposed to drive market development during the projected period. Developing interest for printed circuit sheets in view of the expanded utilization of modern gadgets is supposed to drive market extension during the gauge time frame. China, for instance, has a muddled modern chain that incorporates copper foil, glass fiber, tar, copper-clad covers, and PCBs as its last part. The market has extended significantly more as Western nations' longing for Asian purchaser hardware has taken off.

Major Players

The major players in the global High Density Interconnect (HDI) PCB are Compeq Manufacturing Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unimicron, Tripod Technology, and Zhen Ding Tech. Unimicron, Epec, LLC, TTM Technologies Inc., RayMing Technology, HiTech Circuits, NCAB Group Corporation, Millennium Circuits Limited, Tripod Technology, AKM Meadville, Meiko Electronics Co., Ltd., Sierra Circuits Inc., Compeq Manufacturing Co., Ltd., Advanced Circuits, and DAP Corporation.

TABLE OF CONTENTS

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. MARKET ATTRACTIVENESS ANALYSIS
    • 1.1.1. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY INTERCONNECTION LAYERS
    • 1.1.2. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY APPLICATION
    • 1.1.3. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY REGION

2. MARKET INTRODUCTION

  • 2.1. DEFINITION
  • 2.2. SCOPE OF THE STUDY
  • 2.3. MARKET STRUCTURE
  • 2.4. KEY BUYING CRITERIA
  • 2.5. MACRO FACTOR INDICATOR ANALYSIS

3. RESEARCH METHODOLOGY

  • 3.1. RESEARCH PROCESS
  • 3.2. PRIMARY RESEARCH
  • 3.3. SECONDARY RESEARCH
  • 3.4. MARKET SIZE ESTIMATION
  • 3.5. FORECAST MODEL
  • 3.6. LIST OF ASSUMPTIONS

4. MARKET DYNAMICS

  • 4.1. INTRODUCTION
  • 4.2. DRIVERS
    • 4.2.1. INCREASING BENEFITS OF HIGH DENSITY INTERCONNECT TECHNOLOGY
    • 4.2.2. RISING DEMAND OF HDI PCBS IN COMPLEX ELECTRONIC DEVICES
    • 4.2.3. GROWING DEMAND FOR CIRCUIT MINIATURIZATION
    • 4.2.4. DRIVERS IMPACT ANALYSIS
  • 4.3. CHALLENGES
    • 4.3.1. INTRODUCING HDI TECHNOLOGY IN PCB FOR SPACE APPLICATION
    • 4.3.2. 5G TECHNOLOGY RELATED PCB DESIGN CHALLENGES
    • 4.3.3. CHALLENGES FACED IN ANY-LAYER INTERCONNECTION HIGH DENSITY (ALV HDI) IN MASS PRODUCTIONS
    • 4.3.4. RESTRAINTS IMPACT ANALYSIS
  • 4.4. OPPORTUNITIES
    • 4.4.1. TECHNOLOGICAL ADVANCEMENT IN HDI PCB
    • 4.4.2. 5G TECHNOLOGY AS A GROWTH OPPORTUNITY FOR PCB DESIGNERS
    • 4.4.3. RISING DEMAND FOR CONSUMER ELECTRONICS
  • 4.5. IMPACT OF COVID-19
    • 4.5.1. IMPACT ON SEMICONDUCTOR INDUSTRY
    • 4.5.2. IMPACT ON THE MEDICAL ELECTRONIC INDUSTRY
    • 4.5.3. IMPACT ON GLOBAL PCB SUPPLY CHAIN
    • 4.5.4. RISING NEED FOR DIGITALIZATION OF THE SUPPLY CHAIN

5. MARKET FACTOR ANALYSIS

  • 5.1. VALUE CHAIN ANALYSIS/SUPPLY CHAIN ANALYSIS
  • 5.2. PORTER'S FIVE FORCES MODEL
  • 5.3. BARGAINING POWER OF SUPPLIERS
  • 5.4. BARGAINING POWER OF BUYERS
  • 5.5. THREAT OF NEW ENTRANTS
  • 5.6. THREAT OF SUBSTITUTES
  • 5.7. INTENSITY OF RIVALRY

6. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY INTERCONNECTION LAYERS

  • 6.1. INTRODUCTION
  • 6.2. 1 LAYER (1+N+1) HDI
  • 6.3. 2 OR MORE LAYERS (2+N+2) HDI
  • 6.4. ALL LAYERS HDI

7. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY APPLICATION

  • 7.1. INTRODUCTION
  • 7.2. CONSUMER ELECTRONICS
  • 7.3. AUTOMOTIVE
  • 7.4. MILITARY AND DEFENSE
  • 7.5. HEALTHCARE
  • 7.6. INDUSTRIAL/ MANUFACTURING
  • 7.7. OTHERS

8. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET SIZE ESTIMATION & FORECAST, BY REGION

  • 8.1. INTRODUCTION
  • 8.2. NORTH AMERICA
    • 8.2.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032
    • 8.2.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.2.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.2.4. US
    • 8.2.5. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.2.6. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.2.7. CANADA
    • 8.2.8. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.2.9. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.2.10. MEXICO
    • 8.2.11. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.2.12. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
  • 8.3. EUROPE
    • 8.3.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032
    • 8.3.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.3.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.3.4. UK
      • 8.3.4.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.3.4.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.3.5. GERMANY
      • 8.3.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.3.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.3.6. FRANCE
      • 8.3.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.3.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.3.7. REST OF EUROPE
      • 8.3.7.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.3.7.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
  • 8.4. ASIA-PACIFIC
    • 8.4.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032
    • 8.4.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.4.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.4.4. CHINA
      • 8.4.4.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.4.4.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.4.5. JAPAN
      • 8.4.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.4.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.4.6. INDIA
      • 8.4.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.4.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.4.7. REST OF ASIA-PACIFIC
      • 8.4.7.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.4.7.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
  • 8.5. MIDDLE EAST & AFRICA
    • 8.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
  • 8.6. SOUTH AMERICA
    • 8.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

9. COMPETITIVE LANDSCAPE

  • 9.1. INTRODUCTION
  • 9.2. KEY DEVELOPMENTS & GROWTH STRATEGIES
  • 9.3. COMPETITOR BENCHMARKING
  • 9.4. VENDOR SHARE ANALYSIS, 2021(% SHARE)

10. COMPANY PROFILES

  • 10.1. UNIMICRON, EPEC, LLC
    • 10.1.1. COMPANY OVERVIEW
    • 10.1.2. FINANCIAL OVERVIEW
    • 10.1.3. SOLUTION/SERVICES OFFERED
    • 10.1.4. KEY DEVELOPMENTS
    • 10.1.5. SWOT ANALYSIS
    • 10.1.6. KEY STRATEGIES
  • 10.2. TTM TECHNOLOGIES INC.
    • 10.2.1. COMPANY OVERVIEW
    • 10.2.2. FINANCIAL OVERVIEW
    • 10.2.3. SOLUTION/SERVICES OFFERED
    • 10.2.4. KEY DEVELOPMENTS
    • 10.2.5. SWOT ANALYSIS
    • 10.2.6. KEY STRATEGIES
  • 10.3. RAYMING TECHNOLOGY
    • 10.3.1. COMPANY OVERVIEW
    • 10.3.2. FINANCIAL OVERVIEW
    • 10.3.3. SOLUTION/SERVICES OFFERED
    • 10.3.4. KEY DEVELOPMENTS
    • 10.3.5. SWOT ANALYSIS
    • 10.3.6. KEY STRATEGIES
  • 10.4. HITECH CIRCUITS
    • 10.4.1. COMPANY OVERVIEW
    • 10.4.2. FINANCIAL OVERVIEW
    • 10.4.3. SOLUTION/SERVICES OFFERED
    • 10.4.4. KEY DEVELOPMENTS
    • 10.4.5. SWOT ANALYSIS
    • 10.4.6. KEY STRATEGIES
  • 10.5. NCAB GROUP CORPORATION
    • 10.5.1. COMPANY OVERVIEW
    • 10.5.2. FINANCIAL OVERVIEW
    • 10.5.3. SOLUTION/SERVICES OFFERED
    • 10.5.4. KEY DEVELOPMENTS
    • 10.5.5. SWOT ANALYSIS
    • 10.5.6. KEY STRATEGIES
  • 10.6. MILLENNIUM CIRCUITS LIMITED
    • 10.6.1. COMPANY OVERVIEW
    • 10.6.2. FINANCIAL OVERVIEW
    • 10.6.3. SOLUTION/SERVICES OFFERED
    • 10.6.4. KEY DEVELOPMENTS
    • 10.6.5. SWOT ANALYSIS
    • 10.6.6. KEY STRATEGIES
  • 10.7. TRIPOD TECHNOLOGY
    • 10.7.1. COMPANY OVERVIEW
    • 10.7.2. FINANCIAL OVERVIEW
    • 10.7.3. SOLUTION/SERVICES OFFERED
    • 10.7.4. KEY DEVELOPMENTS
    • 10.7.5. SWOT ANALYSIS
    • 10.7.6. KEY STRATEGIES
  • 10.8. ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED
    • 10.8.1. COMPANY OVERVIEW
    • 10.8.2. FINANCIAL OVERVIEW
    • 10.8.3. SOLUTION/SERVICES OFFERED
    • 10.8.4. KEY DEVELOPMENTS
    • 10.8.5. SWOT ANALYSIS
    • 10.8.6. KEY STRATEGIES
  • 10.9. AKM MEADVILLE
    • 10.9.1. COMPANY OVERVIEW
    • 10.9.2. FINANCIAL OVERVIEW
    • 10.9.3. SOLUTION/SERVICES OFFERED
    • 10.9.4. KEY DEVELOPMENTS
    • 10.9.5. SWOT ANALYSIS
    • 10.9.6. KEY STRATEGIES
  • 10.10. MEIKO ELECTRONICS CO., LTD.
    • 10.10.1. COMPANY OVERVIEW
    • 10.10.2. FINANCIAL OVERVIEW
    • 10.10.3. SOLUTION/SERVICES OFFERED
    • 10.10.4. KEY DEVELOPMENTS
    • 10.10.5. SWOT ANALYSIS
    • 10.10.6. KEY STRATEGIES
  • 10.11. SIERRA CIRCUITS INC.
    • 10.11.1. COMPANY OVERVIEW
    • 10.11.2. FINANCIAL OVERVIEW
    • 10.11.3. SOLUTION/SERVICES OFFERED
    • 10.11.4. KEY DEVELOPMENTS
    • 10.11.5. SWOT ANALYSIS
    • 10.11.6. KEY STRATEGIES
  • 10.12. COMPEQ MANUFACTURING CO., LTD.
    • 10.12.1. COMPANY OVERVIEW
    • 10.12.2. FINANCIAL OVERVIEW
    • 10.12.3. SOLUTION/SERVICES OFFERED
    • 10.12.4. KEY DEVELOPMENTS
    • 10.12.5. SWOT ANALYSIS
    • 10.12.6. KEY STRATEGIES
  • 10.13. AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT)
    • 10.13.1. COMPANY OVERVIEW
    • 10.13.2. FINANCIAL OVERVIEW
    • 10.13.3. SOLUTION/SERVICES OFFERED
    • 10.13.4. KEY DEVELOPMENTS
    • 10.13.5. SWOT ANALYSIS
    • 10.13.6. KEY STRATEGIES
  • 10.14. ADVANCED CIRCUITS
    • 10.14.1. COMPANY OVERVIEW
    • 10.14.2. FINANCIAL OVERVIEW
    • 10.14.3. SOLUTION/SERVICES OFFERED
    • 10.14.4. KEY DEVELOPMENTS
    • 10.14.5. SWOT ANALYSIS
    • 10.14.6. KEY STRATEGIES
  • 10.15. DAP CORPORATION
    • 10.15.1. COMPANY OVERVIEW
    • 10.15.2. FINANCIAL OVERVIEW
    • 10.15.3. SOLUTION/SERVICES OFFERED
    • 10.15.4. KEY DEVELOPMENTS
    • 10.15.5. SWOT ANALYSIS
    • 10.15.6. KEY STRATEGIES