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市場調査レポート

半導体製造装置の世界市場予測 2023年:リソグラフィー装置・ウェハー表面調整装置・洗浄工程

Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Cleaning Processes), Backend Equipment (Assembly & Packaging, Dicing, Bonding, Metrology), Fab Facility, & Geography - Global Forecast to 2023

発行 MarketsandMarkets 商品コード 517578
出版日 ページ情報 英文 161 Pages
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半導体製造装置の世界市場予測 2023年:リソグラフィー装置・ウェハー表面調整装置・洗浄工程 Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Cleaning Processes), Backend Equipment (Assembly & Packaging, Dicing, Bonding, Metrology), Fab Facility, & Geography - Global Forecast to 2023
出版日: 2017年06月13日 ページ情報: 英文 161 Pages
概要

世界の半導体製造装置市場規模は、2017年から2023年にかけて6.86%のCAGR (年間複合成長率) で推移し、2023年までに625億6,000万米ドルに成長すると予測されています。同市場の主要な成長促進要因は、R&D施設における進歩、電気自動車・ハイブリッド自動車の需要拡大、消費者エレクトロニクス市場の成長、および半導体製造工場数の増加です。しかし、装置のメンテナンスコストが高額であること、および製造プロセスにおけるパターンの複雑さと機能的欠陥は、同市場の成長を阻害しています。

当レポートでは、世界の半導体製造装置市場について調査し、市場の概要、市場成長への各種影響因子および市場機会の分析、各セグメント・地域/主要国別の動向と市場規模の推移と予測、競合環境、主要企業のプロファイルなどをまとめています。

第1章 イントロダクション

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 重要考察

  • 半導体製造装置市場における魅力的な成長機会
  • 半導体製造装置市場:フロントエンド
  • アジア太平洋における半導体製造装置市場
  • 半導体製造装置市場における主要諸国の成長率
  • 半導体製造装置市場:次元別

第5章 市場概要

  • バリューチェーン分析
  • 市場力学
    • 成長推進因子
    • 成長阻害因子
    • 機会
    • 課題

第6章 半導体製造装置市場:フロントエンド装置別

  • イントロダクション
  • リソグラフィー
    • DUV
    • EUV
  • ウェハー表面調整装置
    • エッチング
    • 化学機械研磨
  • 洗浄工程
    • シングルウェハー式スプレーシステム
    • シングルウェハー式極低温システム
    • バッチ式浸漬洗浄システム
    • バッチ式スプレー洗浄システム
    • 気体洗浄装置
  • その他
    • CVD

第7章 半導体製造装置市場:バックエンド別

  • イントロダクション
  • バックエンド工程
    • 組み立て・パッケージング
    • ダイシング装置
    • ボンディング用装置
    • 計測装置
    • 試験装置

第8章 半導体製造装置市場:工場設備別

  • イントロダクション
  • オートメーション
  • 化学物質制御装置
  • ガス制御装置
  • その他

第9章 半導体製造装置市場:次元別

  • イントロダクション
  • 2D
  • 2.5D
  • 3D

第10章 半導体製造装置市場:地域別

  • イントロダクション
  • 北米
  • 欧州
  • アジア太平洋
  • 南米
  • 中東・アフリカ

第11章 競合環境

  • 概要
  • 市場ランキング分析
  • 半導体製造装置市場DIVEチャート
  • 競合状況・動向

第12章 企業プロファイル

  • イントロダクション
  • 東京エレクトロン
  • LAM RESEARCH CORPORATION
  • ASML HOLDINGS N.V.
  • APPLIED MATERIALS INC.
  • KLA-TENCOR CORPORATION.
  • SCREEN HOLDINGS CO., LTD.
  • TERADYNE INC.
  • ADVANTEST CORPORATION
  • 日立ハイテクノロジーズ
  • PLASMA-THERM.
  • RUDOLPH TECHNOLOGIES, INC
  • STARTUP ECOSYSTEM

第13章 付録

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目次
Product Code: SE 5344

"Semiconductor manufacturing equipment market to exhibit a high growth between 2017 and 2023"

The semiconductor manufacturing equipment market is projected to reach USD 62.56 billion by 2023 and is likely to grow at a CAGR of 6.86% between 2017 and 2023. The key factors driving the growth of the market include progress in research and development (R&D) facilities, increasing demand for electrical and hybrid vehicles, growing consumer electronic market, and increase in the number of foundries. However, the high cost and maintenance of the equipment and complexity of pattern and functional defects in manufacturing processes are inhibiting the growth of this market.

"3D ICs market to grow at a high rate in the coming years"

The semiconductor industry is driven to develop more innovative and advanced and miniature technologies because of the growing demand for new and more advanced electronic products with a smaller form factor, higher functionality, and high performance with a lower cost. The need for improved electrical performance has introduced 3D technology, which can replace the long interconnects used in 2D by short vertical interconnects.

"Semiconductor manufacturing equipment market in APAC to grow at a high rate in the coming years"

The APAC region accounts for the largest share in the overall semiconductor manufacturing equipment market. The presence of local players such as Nikon (Japan) and Canon (Japan) are also contributing toward the growth of the market in the region. The semiconductor manufacturing equipment market in APAC held the largest share owing to low-cost labors in China, Taiwanese innovation and advancement in fabrication plants, and Japanese semiconductor equipment manufacturing capabilities, which are some of the cutting-edge advantages for the Asian semiconductor industry. Also, other factors such as increasing raw material suppliers, low labor cost, and increasing investment by global business giants are driving the market growth.

Breakdown of Profiles of Primary Participants:

  • By Company Type: Tier 1-40%, Tier 2-35%, and Tier 3-25%
  • By Designation: C-Level Executives-35%, Directors-25%, and Others-40%
  • By Region: North America-45%, Europe-30%, APAC-20%, and RoW-5%

The major key players operating in the semiconductor manufacturing equipment market includes Applied Material, Lam Research, ASML, Tokyo Electronics, KLA-Tencor, Screen Semiconductor Solutions, Nikon, Hitachi, and ASML International.

Research Coverage:

In this report, various segments such as front-end, backend, dimensions, fab facility, and geography of the semiconductor manufacturing equipment market have been covered. It also discusses the key drivers, restraints, opportunities, and challenges pertaining to the market. The report gives a detailed view of the market across 3 main regions: North America, Europe, and APAC.

Reasons to Buy the Report:

  • This report includes the market statistics pertaining to front-end, backend, dimensions, fab facility, and geography.
  • The major drivers, restraints, challenges, and opportunities for the semiconductor manufacturing equipment market have been detailed in this report.
  • Illustrative segmentation, analysis, and forecast for markets based on front-end, backend, dimensions, fab facility, and geography have been conducted to give an overall view of the market.
  • A detailed competitive landscape has been provided that includes key players, revenue of key players, and strategic developments, among others.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. OBJECTIVES OF THE STUDY
  • 1.2. MARKET DEFINITION
  • 1.3. SCOPE OF THE STUDY
    • 1.3.1. MARKETS COVERED
    • 1.3.2. YEARS CONSIDERED FOR THE STUDY
  • 1.4. CURRENCY
  • 1.5. PACKAGE AND SIZE
  • 1.6. LIMITATIONS
  • 1.7. STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Key data from secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Key data from primary sources
      • 2.1.2.2. Key industry insights
      • 2.1.2.3. Breakdown of primaries
  • 2.2. MARKET SIZE ESTIMATION
    • 2.2.1. BOTTOM-UP APPROACH
    • 2.2.2. TOP-DOWN APPROACH
  • 2.3. MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.4. RESEARCH ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. ATTRACTIVE GROWTH OPPORTUNITIES IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • 4.2. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END
  • 4.3. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN APAC
  • 4.4. GROWTH RATE OF THE LEADING COUNTRIES IN SEMICONDUCTOR MANUFACTURING EQUIPMENT, 2016
  • 4.5. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION

5. MARKET OVERVIEW

  • 5.1. VALUE CHAIN ANALYSIS
  • 5.2. MARKET DYNAMICS
    • 5.2.1. DRIVERS
      • 5.2.1.1. Progress in research and development facilities
      • 5.2.1.2. Increasing demand for electric and hybrid vehicles
      • 5.2.1.3. Growing consumer electronics market and increase in the number of foundries
    • 5.2.2. RESTRAINTS
      • 5.2.2.1. High costs and maintenance of the equipment
      • 5.2.2.2. Complexity of pattern and functional defects in manufacturing process
    • 5.2.3. OPPORTUNITIES
      • 5.2.3.1. Rise in demand for silicon-based sensors in IoT
      • 5.2.3.2. Expanding chip industry in China
      • 5.2.3.3. Growing number of data centers and servers
    • 5.2.4. CHALLENGES
      • 5.2.4.1. Technical problems faced during fabrication process
      • 5.2.4.2. Increased complexities related to miniaturized structures of circuit

6. SEMICONDUCTOR MANUFACTURING MARKET, BY FRONT-END EQUIPMENT

  • 6.1. INTRODUCTION
  • 6.2. LITHOGRAPHY
    • 6.2.1. DUV
    • 6.2.2. EUV
  • 6.3. WAFER SURFACE CONDITIONING EQUIPMENT
    • 6.3.1. ETCHING
    • 6.3.2. CHEMICAL MECHANICAL PLANARIZATION
  • 6.4. CLEANING PROCESS
    • 6.4.1. SINGLE-WAFER SPRAY SYSTEM
    • 6.4.2. SINGLE-WAFER CRYOGENIC SYSTEM
    • 6.4.3. BATCH IMMERSION CLEANING SYSTEM
    • 6.4.4. BATCH SPRAY CLEANING SYSTEM
    • 6.4.5. SCRUBBER
  • 6.5. OTHERS
    • 6.5.1. CVD

7. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END

  • 7.1. INTRODUCTION
  • 7.2. BACK-END PROCESSES
    • 7.2.1. ASSEMBLY AND PACKAGING
      • 7.2.1.1. Assembly
      • 7.2.1.2. Packaging equipment
    • 7.2.2. DICING EQUIPMENT
    • 7.2.3. BONDING EQUIPMENT
    • 7.2.4. METROLOGY EQUIPMENT
    • 7.2.5. TEST EQUIPMENT

8. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FAB FACILITY

  • 8.1. INTRODUCTION
  • 8.2. AUTOMATION
  • 8.3. CHEMICAL CONTROL EQUIPMENT
  • 8.4. GAS CONTROL EQUIPMENT
  • 8.5. OTHERS

9. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION

  • 9.1. INTRODUCTION
  • 9.2. 2D
  • 9.3. 2.5D
  • 9.4. 3D

10. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY GEOGRAPHY

  • 10.1. INTRODUCTION
  • 10.2. NORTH AMERICA
    • 10.2.1. US
      • 10.2.1.1. Some of the major semiconductor device manufacturers belong to the US
    • 10.2.2. CANADA
    • 10.2.3. MEXICO
  • 10.3. EUROPE
    • 10.3.1. UK
      • 10.3.1.1. Effort to increase the growth of semiconductor manufacturing equipment
    • 10.3.2. ITALY
      • 10.3.2.1. One of the leading countries of Europe
    • 10.3.3. IRELAND
      • 10.3.3.1. High experience in semiconductor market
    • 10.3.4. FRANCE
      • 10.3.4.1. One of the largest electronic market in Europe
    • 10.3.5. REST OF EUROPE
  • 10.4. ASIA PACIFIC
    • 10.4.1. CHINA
      • 10.4.1.1. Semiconductor manufacturing equipment market for China in APAC is expected to grow at a high rate
    • 10.4.2. JAPAN
      • 10.4.2.1. Presence of major players in Japan
    • 10.4.3. TAIWAN
      • 10.4.3.1. Taiwan being a major semiconductor manufacturer hub is expected to boost the demand for semiconductor manufacturing equipment
    • 10.4.4. SOUTH KOREA
      • 10.4.4.1. Second largest semiconductor industry in the world
    • 10.4.5. REST OF APAC

11. COMPETITIVE LANDSCAPE

  • 11.1. OVERVIEW
  • 11.2. MARKET RANKING ANALYSIS FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • 11.3. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET DIVE CHART
    • 11.3.1. VANGUARDS
    • 11.3.2. DYNAMIC
    • 11.3.3. INNOVATORS
    • 11.3.4. EMERGING
    • 11.3.5. MICRO QUADRANT
      • 11.3.5.1. Product offering parameters
      • 11.3.5.2. Business strategy parameters
  • 11.4. COMPETITIVE SITUATIONS AND TRENDS
    • 11.4.1. PRODUCT LAUNCHES
    • 11.4.2. CONTRACTS, PARTNERSHIP, AGREEMENTS, AND COLLABORATIONS
    • 11.4.3. MERGER & ACQUISITION
    • 11.4.4. EXPANSIONS AND AWARDS

Top 25 companies analyzed for this study are -ASML Holdings N.V., Nikon, Canon, JEOL, Nuflare Technology, Ultratech, Rudolph Technology, EV Group, SCREEN Semiconductor Solutions Co., Ltd, Toshiba, TOKYO OHKA KOGYO CO., LTD, Adams Lithographing , AM Lithography Corporation, Vistec Electron Beam GmbH, Qoniac GmbH, S-Cubed, Inc., Inpria, Zeiss, Mapper Lithography, Raith GmbH, Gigaphoton Inc, Energetiq Technology, Inc, SuSS Microtech AG, NIL Technology

12. COMPANY PROFILE (Overview, Strength of Product Portfolio, Business Strategy Excellence, Recent Developments, Key relationships)*

  • 12.1. INTRODUCTION
  • 12.2. TOKYO ELECTRON LIMITED
  • 12.3. LAM RESEARCH CORPORATION
  • 12.4. ASML HOLDINGS N.V.
  • 12.5. APPLIED MATERIALS INC.
  • 12.6. KLA-TENCOR CORPORATION.
  • 12.7. SCREEN HOLDINGS CO., LTD.
  • 12.8. TERADYNE INC.
  • 12.9. ADVANTEST CORPORATION
  • 12.10. HITACHI HIGH-TECHNOLOGIES CORPORATION.
  • 12.11. PLASMA-THERM.
  • 12.12. RUDOLPH TECHNOLOGIES, INC
  • 12.13. STARTUP ECOSYSTEM

*Details on Overview, Strength of Product Portfolio, Business Strategy Excellence, Recent Developments, Key relationships might not be captured in case of unlisted companies.

13. APPENDIX

  • 13.1. INSIGHTS OF INDUSTRY EXPERTS
  • 13.2. DISCUSSION GUIDE:
  • 13.3. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 13.4. INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE
  • 13.5. AVAILABLE CUSTOMIZATION
  • 13.6. RELATED REPORTS
  • 13.7. AUTHOR DETAILS

LIST OF TABLES

  • TABLE 1: FRONT-END EQUIPMENT SHIPMENT UNIT, 2014-2023
  • TABLE 2: PRESENCE OF DOMESTIC COMPANIES IN DIFFERENT SEMICONDUCTOR MANUFACTURING EQUIPMENT
  • TABLE 3: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY TYPE, 2014-2023 (USD BILLION)
  • TABLE 4: FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY GEOGRAPHY 2014-2023 (USD BILLION)
  • TABLE 5: FRONT-END LITHOGRAPHY EQUIPMENT MARKET, BY GEOGRAPHY, 2014-2023 (USD BILLION)
  • TABLE 6: FRONT-END WAFER SURFACE CONDITIONING EQUIPMENT MARKET, BY TYPE, 2014-2023 (USD BILLION)
  • TABLE 7: FRONT-END WAFER CONDITIONING EQUIPMENT MARKET, BY GEOGRAPHY, 2014-2023 (USD BILLION)
  • TABLE 8: ETCHING WAFER CONDITIONING EQUIPMENT MARKET, BY GEOGRAPHY, 2014-2023 (USD BILLION)
  • TABLE 9: CMP WAFER CONDITIONING EQUIPMENT MARKET, BY GEOGRAPHY, 2014-2023 (USD BILLION)
  • TABLE 10: WAFER CLEANING EQUIPMENT MARKET, BY GEOGRAPHY, 2014-2023 (USD BILLION)
  • TABLE 11: OTHER WAFER PROCESSING EQUIPMENT MARKET, BY GEOGRAPHY, 2014-2023 (USD BILLION)
  • TABLE 12: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY TYPE, 2014-2023 (USD BILLION)
  • TABLE 13: BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY GEOGRAPHY, 2014-2023 (USD BILLION)
  • TABLE 14: BACK-END ASSEMBLY AND PACKAGING EQUIPMENT MARKET, BY GEOGRAPHY, 2014-2023 (USD BILLION)
  • TABLE 15: BACK-END DICING EQUIPMENT MARKET, BY GEOGRAPHY, 2014-2023 (USD BILLION)
  • TABLE 16: BACK-END BONDING EQUIPMENT MARKET, BY GEOGRAPHY, 2014-2023 (USD BILLION)
  • TABLE 17: BACK-END METROLOGY EQUIPMENT MARKET, BY GEOGRAPHY, 2014-2023 (USD BILLION)
  • TABLE 18: BACK-END WAFER TESTING EQUIPMENT MARKET, BY GEOGRAPHY, 2014-2023 (USD BILLION)
  • TABLE 19: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FAB FACILITY, 2014-2023 (USD BILLION)
  • TABLE 20: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION, 2014-2023 (USD BILLION)
  • TABLE 21: COMPARISON BETWEEN 2D, 2.5D, AND 3D IC TECHNOLOGY
  • TABLE 22: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY GEOGRAPHY 2014-2023 (USD BILLION)
  • TABLE 23: NORTH AMERICA SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 24: NORTH AMERICA SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY TYPE, 2014-2023 (USD BILLION)
  • TABLE 25: LITHOGRAPHY EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 26: ETCHING EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 27: CMP EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 28: WAFER CLEANING EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 29: OTHER WAFER PROCESSING EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 30: ASSEMBLY AND PACKAGING EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 31: DICING EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 32: BONDING EQUIPMENT MARKET IN NORTH AMERICA BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 33: METROLOGY EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 34: WAFER TESTING EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 35: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN NORTH AMERICA, BY DIMENSION, 2014-2023 (USD BILLION)
  • TABLE 36: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EUROPE, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 37: EUROPE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY TYPE, 2014-2023 (USD BILLION)
  • TABLE 38: LITHOGRAPHY EQUIPMENT MARKET IN EUROPE, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 39: ETCHING EQUIPMENT MARKET IN EUROPE, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 40: EUROPE: CMP EQUIPMENT MARKET IN EUROPE, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 41: WAFER CLEANING EQUIPMENT MARKET IN EUROPE, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 42: EUROPE: OTHER WAFER PROCESSING EQUIPMENT MARKET IN EUROPE, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 43: ASSEMBLY AND PACKAGING EQUIPMENT MARKET IN EUROPE, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 44: WAFER DICING EQUIPMENT MARKET IN EUROPE, BY COUNTRY, 2014-2023 (USD MILLION)
  • TABLE 45: BONDING EQUIPMENT MARKET IN EUROPE, BY COUNTRY, 2014-2023 (USD MILLION)
  • TABLE 46: METROLOGY EQUIPMENT MARKET IN EUROPE, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 47: WAFER TESTING EQUIPMENT MARKET IN EUROPE, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 48: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EUROPE, BY DIMENSION, 2014-2023 (USD BILLION)
  • TABLE 49: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 50: APAC SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY TYPE, 2014-2023 (USD BILLION)
  • TABLE 51: LITHOGRAPHY EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 52: ETCHING EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 53: CMP EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 54: WAFER CLEANING EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 55: OTHER WAFER PROCESSING EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 56: ASSEMBLY AND PACKAGING EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 57: WAFER DICING EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 58: WAFER BONDING EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 59: METROLOGY EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 60: WAFER TESTING EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014-2023 (USD BILLION)
  • TABLE 61: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN APAC, BY DIMENSION, 2014-2023 (USD BILLION)
  • TABLE 62: RANKING OF TOP 5 PLAYERS: POWER BANK MARKET, 2016
  • TABLE 63: PRODUCT LAUNCHES, 2015-2017
  • TABLE 64: CONTRACTS, AGREEMENTS, AND COLLABORATIONS, 2015-2017
  • TABLE 65: MERGER AND ACQUISITION, 2015-2017
  • TABLE 66: EXPANSIONS AND AWARDS, 2015-2017

LIST OF FIGURES

  • FIGURE 1: MARKETS COVERED
  • FIGURE 2: RESEARCH DESIGN
  • FIGURE 3: MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
  • FIGURE 4: MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
  • FIGURE 5: DATA TRIANGULATION
  • FIGURE 6: ASSUMPTIONS OF THE RESEARCH STUDY
  • FIGURE 7: IN NORTH AMERICA 3D SEGMENT IS EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 8: APAC TO GROW AT THE HIGHEST RATE IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET DURING THE FORECAST PERIOD
  • FIGURE 9: LITHOGRAPHY EQUIPMENT TO HOLD LARGE DEMAND IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET DURING THE FORECAST PERIOD
  • FIGURE 10: BONDING EQUIPMENT IS EXPECTED TO WITNESS THE HIGHEST GROWTH BETWEEN 2017 AND 2023
  • FIGURE 11: APAC HELD THE LARGEST MARKET SHARE IN 2016
  • FIGURE 12: GROWING CONSUMER ELECTRONICS MARKET AND INCREASE IN THE NUMBER OF FOUNDRIES ARE DRIVING THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • FIGURE 13: LITHOGRAPHY EQUIPMENT IS EXPECTED TO HOLD THE LARGEST MARKET SHARE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT DURING THE FORECAST PERIOD
  • FIGURE 14: TAIWAN HELD THE LARGEST SHARE OF THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN APAC IN 2016
  • FIGURE 15: APAC IS EXPECTED TO GROW AT A HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 16: 3D IS EXPECTED TO HOLD THE HIGHEST SHARE BETWEEN 2017 AND 2023
  • FIGURE 17: VALUE CHAIN ANALYSIS: SEMICONDUCTOR MANUFACTURING EQUIPMENT
  • FIGURE 18: VALUE CHAIN ANALYSIS (FRONT-END MANUFACTURING EQUIPMENT)
  • FIGURE 19: VALUE CHAIN ANALYSIS (BACK-END MANUFACTURING EQUIPMENT)
  • FIGURE 20: GROWING DEMAND FOR CONSUMER ELECTRONICS AND ELECTRIC-BASED AUTOMOBILES ARE THE MAJOR DRIVERS FOR THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
  • FIGURE 21: INCREASING SALES OF ELECTRIC VEHICLES BETWEEN 2011 AND 2014
  • FIGURE 22: LITHOGRAPHY EQUIPMENT ACCOUNTS FOR THE LARGEST MARKET SHARE AMONG ALL EQUIPMENT TYPES IN 2017
  • FIGURE 23: CMP MARKET IS EXPECTED TO GROW WITH THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 24: APAC MARKET IS EXPECTED TO GROW WITH THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 25: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY GEOGRAPHY
  • FIGURE 26: CHINA EXPECTED TO REGISTER THE HIGHEST GROWTH RATE IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET DURING THE FORECAST PERIOD
  • FIGURE 27: APAC HOLDS THE LARGEST MARKET IN SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN 2017
  • FIGURE 28: NORTH AMERICA, GEOGRAPHIC SNAPSHOT, 2016
  • FIGURE 29: SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN THE US IS EXPECTED TO GROW WITH THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 30: 3D MARKET IN NORTH AMERICA IS EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 31: GERMANY IS EXPECTED TO GROW WITH THE HIGHEST CAGR BETWEEN 2017 AND 2023
  • FIGURE 32: GERMANY ACCOUNTS FOR LARGEST MARKET IN ASSEMBLY AND PACKAGING MARKET IN 2017
  • FIGURE 33: AMONG ALL DIMENSIONS 3D MARKET IN EUROPE IS EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 34: APAC, GEOGRAPHIC SNAPSHOT, 2016
  • FIGURE 35: TAIWAN HOLDS LARGEST MARKET SHARE AMONG ALL APAC COUNTRIES IN 2017
  • FIGURE 36: TAIWAN HOLDS LARGEST MARKET FOR APAC WAFER CLEANING EQUIPMENT MARKET
  • FIGURE 37: 3D MARKET IN APAC IS EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 38: COMPANIES ADOPTED PRODUCT LAUNCHES AS KEY GROWTH STRATEGY BETWEEN 2014 AND 2017
  • FIGURE 39: DIVE CHART
  • FIGURE 40: BATTLE FOR MARKET SHARE: PRODUCT LAUNCHES WAS THE KEY STRATEGY BETWEEN 2014 AND 2017
  • FIGURE 41: TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT
  • FIGURE 42: LAM RESEARCH CORPORATION: COMPANY SNAPSHOT
  • FIGURE 43: ASML HOLDINGS N.V.: COMPANY SNAPSHOT
  • FIGURE 44: APPLIED MATERIALS INC.: COMPANY SNAPSHOT
  • FIGURE 45: KLA-TENCORE CORPORATION: COMPANY SNAPSHOT
  • FIGURE 46: SCREEN HOLDINGS CO., LTD.: COMPANY SNAPSHOT
  • FIGURE 47: TERADYNE INC.: COMPANY SNAPSHOT
  • FIGURE 48: ADVANTEST CORPORATION: COMPANY SNAPSHOT
  • FIGURE 49: HITACHI HIGH-TECHNOLOGIES CORPORATION: COMPANY SNAPSHOT
  • FIGURE 50: RUDOLPH TECHNOLOGIES, INC: COMPANY SNAPSHOT
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