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市場調査レポート

放射線耐性強化電子部品および半導体の世界市場 - コンポーネント(プロセッサーおよびコントローラー、ロジック、メモリー、電力管理、特定用途向け集積回路[ASIC]、フィールドプログラマブルゲートアレイ[FPGA])、製造法(製造技術での対策[RHBP]、設計技術での対策[RHBD])、用途(航空・防衛、宇宙)、地域別予測

Radiation Hardened Electronics & Semiconductors Market by Component, Manufacturing Technique, Application, & Geography - Global Forecasts to 2013 - 2020

発行 MarketsandMarkets 商品コード 321228
出版日 ページ情報 英文 157 Pages
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放射線耐性強化電子部品および半導体の世界市場 - コンポーネント(プロセッサーおよびコントローラー、ロジック、メモリー、電力管理、特定用途向け集積回路[ASIC]、フィールドプログラマブルゲートアレイ[FPGA])、製造法(製造技術での対策[RHBP]、設計技術での対策[RHBD])、用途(航空・防衛、宇宙)、地域別予測 Radiation Hardened Electronics & Semiconductors Market by Component, Manufacturing Technique, Application, & Geography - Global Forecasts to 2013 - 2020
出版日: 2014年11月25日 ページ情報: 英文 157 Pages
概要

高空や宇宙の航行では物質が通常値を超える大量のイオン化放射線に露出され、これが半導体電子システムにトータルドーズ(TID)効果、 変位損傷(DD)、シングルイベント効果(SEE)など性能・機能を低下させる悪影響を与えます。放射線耐性強化処理はこうした問題から電子システムを保護する上で重要な役割を担うもの。近年、放射線耐性強化電子部品および半導体の市場は停滞気味も、さまざまな先進国・開発途上国による商業あるいは軍事目的宇宙計画の増加から需要は拡大傾向にあり、3.01%の複合年間成長率から2020年には14億5000万ドル規模に達する見込みです。

当レポートでは、放射線耐性強化電子部品および半導体の世界市場に注目し、コンポーネント、製造法、サービス、用途、地域の別にその推移を予測するほか、市場の現況、発展への影響要因、競合環境、有力企業などについて最新の調査・分析情報をまとめています。

第1章 イントロダクション

  • 調査目的
  • レポート解説
  • 調査対象市場
  • レポートの推奨利用者層
  • 市場の範囲

第2章 調査方法

  • 放射線耐性強化電子部品および半導体市場の需要側分析
    • 世界規模による宇宙計画の数的増加
    • 通信衛星:放射線耐性強化電子部品市場の主要収入源
  • 市場規模の試算
  • 市場の徹底分析およびデータの三角法評価
  • 市場シェアの推定
    • 二次情報源から得られた重要データ
    • 一次情報源から得られた重要データ
      • 産業についての重要考察
    • 前提

第3章 エグゼクティブサマリー

第4章 特記すべき考察点

  • 商業衛星プログラムで加速する放射線耐性強化電子部品および半導体市場
  • 市場成長率 - 用途別
  • 米国:放射線耐性強化電子部品の最大市場
  • 中国 - 航空宇宙および商業宇宙用途の新興市場
  • 放射線耐性強化電子部品市場 - 製造法:2013年
  • 放射線耐性強化電子部品および半導体市場:北米 vs. アジア太平洋地域
  • 放射線耐性強化電子部品の需要成長率 - 用途別

第5章 市場概要

  • イントロダクション
  • 放射線耐性強化電子部品の発展史
  • 市場セグメンテーション
    • コンポーネント別市場
    • 製造法別市場
    • 用途別市場
    • サービス別市場
    • 地域別市場
  • 市場動態
    • 推進要因
      • 通信衛星セグメントにおける放射線耐性強化電子部品の需要増
      • 各国宇宙計画の数的拡大
      • 今後の放射線耐性強化電子部品設計を形成する技術進歩
    • 抑制要因
      • 現実的な試験環境を設定することの難しさ
      • 少量市場性
      • 高難度の製造及び設計
    • 機会
      • 世界中のさまざまな宇宙開発機関で拡大する研究開発活動
      • 宇宙技術の商業および軍事利用分野における需要増
      • 機能としての自動再構成システムや高速インターフェースに向けた需要の拡大
    • 課題
      • 高度に専門化した最上層顧客の要求
      • 従来型電子部品とは比較にならない先進的試験法の必要性
    • 緊急課題
      • 未だ継続使用されている老朽システム

第6章 産業動向

  • イントロダクション
  • バリューチェーン分析
  • 産業動向
  • Porterのファイブフォース分析

第7章 放射線耐性強化電子部品市場 - コンポーネント別

  • イントロダクション
  • プロセッサーおよびコントローラー
  • メモリーデバイス
  • 電力管理
  • フィールドプログラマブルゲートアレイ(FPGA)および特定用途向け集積回路(ASIC)
  • ロジック
  • その他

第8章 放射線耐性強化電子部品および半導体市場 - 製造法別

  • イントロダクション
  • 放射線耐性強化 - 加工法(製造技術での対策RHBP)別
  • 放射線耐性強化 - 設計(設計技術での対策RHBD)別

第9章 放射線耐性強化電子部品および半導体市場 - 用途別

  • イントロダクション
  • 航空宇宙・防衛用途
    • 市場規模および予測 - コンポーネント別
    • 市場規模および予測 - 地域別
    • 航空宇宙
    • 防衛
  • 宇宙(衛星)用途
    • 市場規模および予測 - コンポーネント別
    • 市場規模および予測 - 地域別
      • 商業
      • 軍事
      • その他

第10章 地域分析

  • イントロダクション
  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • ロシア
    • 英国
    • ドイツ
    • フランス
    • その他欧州諸国
  • アジア太平洋地域
    • 中国
    • 日本
    • インド
    • その他

第11章 競合環境

  • 概要
  • 市場シェア分析
  • 競合状況および動向
    • 協定、事業進出、提携
    • 新製品発売
    • 合弁事業ほかの展開

第12章 企業プロフィール(事業概要、製品・サービス、主要戦略、最新展開、SWOT分析、M&M評など)

  • イントロダクション
  • BAE Systems
  • Honeywell Aerospace
  • Microsemi Corporation
  • Xilinx Incorporation
  • Atmel Corporation
  • Maxwell Technologies
  • Intersil Corp.
  • Texas Instruments Inc
  • Linear Technology Corp.
  • St Microelectronics

第13章 付録

  • 産業エキスパートの考察
  • ディスカッションガイド
  • RTについて: Real Time Market Intelligence
  • ご利用いただけるカスタマイズプラン
  • 関連レポート
目次
Product Code: SE 2934

Most of the semiconductor electronic components are vulnerable to radiation damage; radiation-hardened components with some design and manufacturing variations are developed to reduce the susceptibility to radiation damage. Such rad-hard components are highly reliable and can withstand harmful space radiations. Radiation hardening is the act of making electronic components and systems resistant to damage or malfunctions caused by ionizing radiation such as those encountered in outer space, high-altitude flights, around nuclear reactors, particle accelerators, during nuclear accidents or nuclear warfare. The various components used are Processors, Memory Device, Power Device, Communication Device, Microprocessors, FPGAs & ASICs, and Interface Components.

The global Radiation Hardened Electronics and Semiconductors Market is anticipated to experience growth, due to increase in space missions carried out by various developed and developing countries.

The report includes the geographic segmentation of the Radiation Hardened Electronics and Semiconductors Market into four major regions: North America, Europe, Asia-Pacific, and Rest of the World. The report talks about Porter's five force analysis of this market along with, its value chain analysis. It also includes the recent developments in the market and describes the drivers and restraining factors for the same.

The report also segments the radiation hardened electronics & semiconductors market by components such as processors & controllers, memory devices, power management, FPGAs & ASICs, and other components.

The major players in the automated test equipment market include: Honeywell Aerospace (U.S.), BAE Systems (U.K.), Microsemi Corporation (U.S.), Xilinx Incorporation (U.S.) and Texas Instruments (U.S.).

Table of Contents

1. Introduction

  • 1.1. Objectives of the Study
  • 1.2. Report Description
  • 1.3. Markets Covered
  • 1.4. Stakeholders
  • 1.5. Market Scope

2. Research Methodology

  • 2.1. Demand Side Analysis of the Radiation Hardened Electronics and Semiconductor Market
    • 2.1.1. Increase in Number of Space Missions Globally
    • 2.1.2. Communication Satellites: A Key Revenue Pocket for the Rad-Hard Electronics Market
  • 2.2. Market Size Estimation
  • 2.3. Market Crackdown and Data Triangulation
  • 2.4. Market Share Estimation
    • 2.4.1. Key Data From Secondary Sources
    • 2.4.2. Key Data From Primary Sources
      • 2.4.2.1. Key Industry Insights
    • 2.4.3. Assumptions

3. Executive Summary

4. Premium Insights

  • 4.1. Commercial Satellites Programs Driving the Radiation Hardened Electronics and Semiconductors Market
  • 4.2. Radiation Hardened Electronics and Semiconductors Market Growth By Application
  • 4.3. U.S : the Leader in Rad-Hard Electronics Market
  • 4.4. China - An Emerging Market for Aerospace & Commercial Space Applications
  • 4.5. Rad-Hard Market: Manufacturing Methods (2013)
  • 4.6. Radiation Hardened Electronics and Semiconductors Market: North America vs Asia Pasific
  • 4.7. Demand Growth for Rad-Hard Electronic Components, By Applications

5. Market Overview

  • 5.1. Introduction
  • 5.2. Evolution of Radiation-Hardened Electronics
  • 5.3. Market Segmentation
    • 5.3.1. Radiation Hardened Electronics Market By Component
    • 5.3.2. Radiation Hardened Electronics Market By Manufacturing Method
    • 5.3.3. Radiation Hardened Electronics Market Segmentation: By Application
    • 5.3.4. Radiation Hardened Electronics Market Segmentation: By Services
    • 5.3.5. Radiation Hardened Electronics Market Segmentation: By Geography
  • 5.4. Market Dynamics
    • 5.4.1. Drivers
      • 5.4.1.1. Increasing Demand for Rad-Hard Electronics From the Communication Satellites Segment
      • 5.4.1.2. Increasing Number of Space Missions in Various Countries
      • 5.4.1.3. Technological Advancements Shaping the Future Rad-Hard Electronics Designs
    • 5.4.2. Restraints
      • 5.4.2.1. Challenge to Create Actual Testing Environment
      • 5.4.2.2. Low Volume Nature of Market
      • 5.4.2.3. Manufacturing and Design Challenges
    • 5.4.3. Opportunities
      • 5.4.3.1. Growing R&D Activities at the Various Space Associations Around the Globe
      • 5.4.3.2. Rising Demand From the Commercial and Military Space Applications Sector
      • 5.4.3.3. Increasing Requirement for Self-Reconfiguration Systems and High-Speed Interface as A Feature
    • 5.4.4. Challenges
      • 5.4.4.1. Highly Customized Requirements of the High-End Consumers
      • 5.4.4.2. Need for Advanced Testing Methods, as Compared to Classical Electronics Components
    • 5.4.5. Burning Issue
      • 5.4.5.1. Keeping Legacy, Aging Systems Alive

6. Industry Trends

  • 6.1. Introduction
  • 6.2. Value Chain Analysis
  • 6.3. Industry Trends
  • 6.4. Porter's Five forces Analysis
    • 6.4.1. Degree of Competition
    • 6.4.2. Threats From New Entrants
    • 6.4.3. Threats From Substitutes
    • 6.4.4. Bargaining Power of Buyers
    • 6.4.5. Bargaining Power of Suppliers

7. Radiation Hardened Electronics Market, By Component

  • 7.2. Introduction
  • 7.3. Processors and Controllers
  • 7.4. Memory Devices
  • 7.5. Power Management
  • 7.6. Field Programmable Gate Arrays (FPGA) and Application Specific Integrated Circuits (ASIC)
  • 7.7. Logic
  • 7.8. Others

8. Radiation Hardened Electronics & Semiconductors Market, By Manufacturing Techniques

  • 8.1. Introduction
  • 8.2. Radiation Hardening By Process (RHBP)
  • 8.3. Radiation Hardening By Design (RHBD)

9. Radiation Hardened Electronics & Semiconductors Market, By Application

  • 9.1. Introduction
  • 9.2. Aerospace & Defense Application
    • 9.2.1. Aeospace and Defence Application Market Estimation & forecasting, By Component
    • 9.2.2. Aeospace and Defence Application Market Estimation & forecasting, By Geography
    • 9.2.3. Aerospace
    • 9.2.4. Defense
  • 9.3. Space (Satellites) Application
    • 9.3.1. Space Application Market Estimation & forecasting , By Component
    • 9.3.2. Space Application Market Estimation & forecasting, By Geography
      • 9.3.2.1. Commercial
        • 9.3.2.1.1. Commercial Space Application Market Estimation & forecasting, By Component
        • 9.3.2.1.2. Commercial Space Application Market Estimation & forecasting, By Geography
      • 9.3.2.2. Military
        • 9.3.2.2.1. Military Space Application Market Estimation & forecasting, By Component
        • 9.3.2.2.2. Military Space Application Market Estimation & forecasting, By Geography
      • 9.3.2.3. Others
        • 9.3.2.3.1. Others Space Application Market Estimation & forecasting, By Component
        • 9.3.2.3.2. Others Space Application Market Estimation & forecasting, By Geography

10. Geographic Analysis

  • 10.1. Introduction
  • 10.2. North America
    • 10.2.1. U.S.
    • 10.2.2. Canada
    • 10.2.3. Mexico
  • 10.3. Europe
    • 10.3.1. Russia
    • 10.3.2. U.K.
    • 10.3.3. Germany
    • 10.3.4. France
    • 10.3.5. Rest of Europe
  • 10.4. Asia-Pacific
    • 10.4.1. China
    • 10.4.2. Japan
    • 10.4.3. India
    • 10.4.4. Others

11. Competitive Landscape

  • 11.1. Overview
  • 11.2. Market Share Analysis
  • 11.3. Competitive Situation and Trends
    • 11.3.1. Agreements, Expansions, and Partnerships, 2011-2014
    • 11.3.2. New Product Launches
    • 11.3.3. Joint Venture and Other Developments

12. Company Profiles

  • 12.1. Introduction
  • 12.2. BAE Systems
    • 12.2.1. Business Overview
    • 12.2.2. Products & Services
    • 12.2.3. Key Strategy
    • 12.2.4. Recent Developments
    • 12.2.5. SWOT Analysis
    • 12.2.6. MNM View
  • 12.3. Honeywell Aerospace
    • 12.3.1. Business Overview
    • 12.3.2. Products & Services
    • 12.3.3. Recent Developments
    • 12.3.4. SWOT Analysis
    • 12.3.5. MNM View
  • 12.4. Microsemi Corporation
    • 12.4.1. Business Overview
    • 12.4.2. Products & Services
    • 12.4.3. Key Strategy
    • 12.4.4. Recent Developments
    • 12.4.5. SWOT Analysis
    • 12.4.6. MNM View
  • 12.5. Xilinx Incorporation
    • 12.5.1. Business Overview
    • 12.5.2. Products & Services
    • 12.5.3. Key Strategy
    • 12.5.4. Recent Developments
    • 12.5.5. SWOT Analysis
    • 12.5.6. MNM View
  • 12.6. Atmel Corporation
    • 12.6.1. Business Overview
    • 12.6.2. Products & Services
    • 12.6.3. Key Strategy
    • 12.6.4. Recent Developments
    • 12.6.5. SWOT Analysis
    • 12.6.6. MNM View
  • 12.7. Maxwell Technologies
    • 12.7.1. Business Overview
    • 12.7.2. Products & Services
    • 12.7.3. Key Strategy
    • 12.7.4. Recent Developments
    • 12.7.5. MNM View
  • 12.8. Intersil Corp.
    • 12.8.1. Business Overview
    • 12.8.2. Business Overview
    • 12.8.3. Products & Services
    • 12.8.4. Key Strategy
    • 12.8.5. Recent Developments
    • 12.8.6. MNM View
  • 12.9. Texas Instruments Inc
    • 12.9.1. Business Overview
    • 12.9.2. Business Overview
    • 12.9.3. Products & Services
    • 12.9.4. Key Strategy
    • 12.9.5. Recent Developments
    • 12.9.6. SWOT Analysis
    • 12.9.7. MNM View
  • 12.10. Linear Technology Corp.
    • 12.10.1. Business Overview
    • 12.10.2. Business Overview
    • 12.10.3. Products & Services
    • 12.10.4. Key Strategy
    • 12.10.5. Recent Developments
    • 12.10.6. MNM View
  • 12.11. St Microelectronics
    • 12.11.1. Business Overview
    • 12.11.2. Business Overview
    • 12.11.3. Products & Services
    • 12.11.4. Key Strategy
    • 12.11.5. Recent Developments
    • 12.11.6. MNM View

13. Appendix

  • 13.1. Insights of Industry Experts
  • 13.2. Discussion Guide
  • 13.3. Introducing RT: Real Time Market Intelligence
  • 13.4. Available Customizations
  • 13.5. Related Reports

List of Tables

  • Table 1: Growing Demand From the Commercial Satellites Segments is Propelling the Growth of Rad-Hard Electronics System Market
  • Table 2: Challenges in Creating Actual Test Environment Conditions Hindering the Growth of Rad-Hard Electronics and Semiconductor Electronics SystemsMarket
  • Table 3: Growing Demand From Commercial and Military Space Applications is A Prominent Opportunity for the Rad-Hard Electronics and Semiconductor SystemMarket
  • Table 4: Manufacturing Highly Customized Rad-Hard Electronics Components is A Major Challenge for Companies
  • Table 5: Radiation Hardened Requirement
  • Table 6: Global Radiation Hardened Electronics & Semiconductors Market Size, By Component, 2013-2020 ($Million)
  • Table 7: Global Radiation Hardened Electronics & Semiconductors Market Size, for Processors & Controllers, By Application, 2013-2020 ($Million)
  • Table 8: Global Radiation Hardened Electronics & Semiconductors Market Size, for Memory Devices, By Application 2013-2020 ($Million)
  • Table 9: Global Radiation Hardened Electronics & Semiconductors Market Size, for Power Management, By Application 2013-2020 ($Million)
  • Table 10: Global Radiation Hardened Electronics & Semiconductors Market Size, for ASIC and FPGA, By Application 2013-2020 ($Million)
  • Table 11: Global Radiation Hardened Electronics & Semiconductors Market Size, for Logic, By Application 2013-2020 ($Million)
  • Table 12: Global Radiation Hardened Electronics & Semiconductors Market Size, for Others, By Application 2013-2020 ($Million)
  • Table 13: Global Radiation Hardened Electronics and Semiconductors Market Size, By Manufacturing Technique, 2013-2020 ($Million)
  • Table 14: Global RHBP Market Size, By Region, 2013-2020 ($Million)
  • Table 15: Global RHBD Market Size, By Region, 2013-2020 ($Million)
  • Table 16: Global Radiation Hardened Electronics and Semiconductors Market Size By Application, 2013-2020 ($Million)
  • Table 17: Global Radiation Hardened Electronics and Semiconductors Market Size for Aeospace and Defence Application, By Component, 2013-2020 ($Million)
  • Table 18: Global Radiation Hardened Electronics and Semiconductors Market Size for Aeospace and Defence, By Region, 2013-2020 ($Million)
  • Table 19: North America: Radiation Hardened Electronics and Semiconductors Market Size for Aeospace and Defence, By Country, 2013-2020 ($Million)
  • Table 20: Europe: Radiation Hardened Electronics and Semiconductors Market Size for Aeospace and Defence, By Country, 2013-2020 ($Million)
  • Table 21: APAC: Radiation Hardened Electronics and Semiconductors Market Size for Aeospace and Defence, By Country, 2013-2020 ($Million)
  • Table 22: Global Radiation Hardened Electronics and Semiconductors Market Size, By Space Application, 2013-2020 ($Million)
  • Table 23: Global Radiation Hardened Electronics and Semiconductors Market Size for Space Application, By Component, 2013-2020 ($Million)
  • Table 24: Global Radiation Hardened Electronics and Semiconductors Market Size By Country, 2013-2020 ($Million)
  • Table 25: North America: Radiation Hardened Electronics and Semiconductors Market Size By Country, 2013-2020 ($Million)
  • Table 26: Europe: Radiation Hardened Electronics and Semiconductors Market Size By Country, 2013-2020 ($Million)
  • Table 27: APAC: Radiation Hardened Electronics and Semiconductors Market Size By Country, 2013-2020 ($Million)
  • Table 28: Global Radiation Hardened Electronics and Semiconductors Market Size for Commercial Space Application, By Component, 2013-2020 ($Million)
  • Table 29: Global Radiation Hardened Electronics and Semiconductors Market Size By Region, 2013-2020 ($Million)
  • Table 30: North America: Radiation Hardened Electronics and Semiconductors Market Size for Space, By Country, 2013-2020 ($Million)
  • Table 31: Europe: Radiation Hardened Electronics and Semiconductors Market Size for Space, By Country, 2013-2020 ($Million)
  • Table 32: APAC: Radiation Hardened Electronics and Semiconductors Market Size for Space By Country, 2013-2020($Million)
  • Table 33: Global Radiation Hardened Electronics and Semiconductors Market Size for Military Space Application, By Component, 2013-2020 ($Million)
  • Table 34: Global Radiation Hardened Electronics and Semiconductors Market Size, By Region, 2013-2020 ($Million)
  • Table 35: North America: Radiation Hardened Electronics and Semiconductors Market Size for Military Space Application, By Country, 2013-2020 ($Million)
  • Table 36: Europe: Radiation Hardened Electronics and Semiconductors Market Size for Military Space Application, By Country, 2013-2020 ($Million)
  • Table 37: APAC: Radiation Hardened Electronics and Semiconductors Market Size for Military Space Application, By Country, 2013-2020 ($Million)
  • Table 38: Global Radiation Hardened Electronics and Semiconductors Market Size for Other Space Application, By Component, 2013-2020 ($Million)
  • Table 39: Global Radiation Hardened Electronics and Semiconductors Market Size By Region, 2013-2020 ($Million)
  • Table 40: North America: Radiation Hardened Electronics and Semiconductors Market Size for Other Space Application, By Country, 2013-2020 $Million)
  • Table 41: Europe: Radiation Hardened Electronics and Semiconductors Market Size for Other Space Application By Country, 2013-2020($Million)
  • Table 42: APAC: Radiation Hardened Electronics and Semiconductors Market Size for Other Space Application By Country, 2013-2020($Million)
  • Table 43: Radiation Hardened Electronics and Semiconductors Market Size, By Geography, 2013-2020 ($Million)
  • Table 44: North America: Radiation Hardened Electronics and Semiconductors Market Size, By Country, 2013 - 2020 ($Million)
  • Table 45: North America: Radiation Hardened Electronics and Semiconductors Market Size, By Application, 2013 - 2020 ($Million)
  • Table 46: North America: Radiation Hardened Electronics & Semiconductors Market Size, By Manufacturing Technique, 2013-2020 ($Million)
  • Table 47: Europe: Radiation Hardened Electronics and Semiconductors Market Size, By Country, 2013 - 2020 ($Million)
  • Table 48: Europe: Radiation Hardened Electronics and Semiconductors Market Size, By Application, 2013 - 2020 ($Million)
  • Table 49: Europe: Radiation Hardened Electronics and Semiconductors Market Size, By Manufacturing Technique, 2013-2020 ($Million)
  • Table 50: Asia Pacific: Radiation Hardened Electronics and Semiconductors Market Size, By Country, 2013 - 2020 ($Million)
  • Table 51: APAC: Radiation Hardened Electronics and Semiconductors Market Size, By Application, 2013 - 2020 ($Million)
  • Table 52: APAC: Radiation Hardened Electronics and Semiconductors Market Size, By Manufacturing Technique, 2013-2020 ($Million)
  • Table 53: Agreements, Expansions, and Partnerships, 20011-2014
  • Table 54: New Product Launches, 2011-2014
  • Table 55: Joint Venture and Other Developments, 2011-2014

List of Figures

  • Figure 1: Global Radiation Hardened Electronics and Semiconductors Market:Research Methodology
  • Figure 2: Statastics of Number of Spacecraft Launches in Last Five Years
  • Figure 3: Radiation Hardened Electronics and Semiconductor Market Size Estimation Methodology: Bottom-Up Approach
  • Figure 4: Radiation Hardened Electronics and Semiconductor Market Size Estimation Methodology: top-Down Approach
  • Figure 5: Breakdown of Primary Interviews: By Company Type, Designation, and Region
  • Figure 6: Radiation Hardened Electronics & Semiconductors Market Snapshot, By Applications (2013 vs. 2020)
  • Figure 7: Global Radiation Hardened Electronics & Semiconductors Market, By Region,2013
  • Figure 8: Trend Towards Commercial Space Programs Driving Radiation Hardened Electronics and Semiconductors Market
  • Figure 9: Space Applications Dominating the Overall Rad-Hard Market
  • Figure 10: U.S. Capture the Lion's Share in the North America
  • Figure 11: China - A High Growth Market for Radiation Hardened Electronic Components
  • Figure 12: RHBD Most Preffered Manufacturing Method for Rad-Hard Electronics
  • Figure 13: APAC Has A Larger Growth Rate as Compared to North America
  • Figure 14: Components: Logic, Memory, and ASICS & FPGAS Have A Promising Future in Rad-Hard Electronic Components Market
  • Figure 15: Road Map for the Development of Radiation-Hardened Electronics in Satellite Industry
  • Figure 16: Radiation Hardened Electronics Market Segmentation: By Component
  • Figure 17: Radiation Hardened Electronics Market Segmentation: By Manufacturing Method
  • Figure 18: Radiation Hardened Electronics Market Segmentation: By Application
  • Figure 19: Radiation Hardened Electronics Market Segmentation: By Services
  • Figure 20: Radiation Hardened Electronics Market Segmentation: By Geography
  • Figure 21: Communication Satellites Segment Would Propel the Demand of Radiation Hardened Electronics Market
  • Figure 22: Radiation Hardened Electronics Market Value Chain Analysis (2013)
  • Figure 23: Shift Towards A Design and Testing Service Industry Based Model, is A Leading Trend in the Radiation Hardened Electronics and SemiconductorMarket
  • Figure 24: Porter's Five forces Analysis
  • Figure 25: Porter's Five forces Analysis (2013): High Capital Requirement is Restricting the Entry of New Rad-Hard Component Manufacturers
  • Figure 26: Degree of Competition in the Radiation Hardened Electronics Market
  • Figure 27: Threats From New Entrants in the Radiation Hardened Electronics Market
  • Figure 28: Threats From Substitutes in the Radiation Hardened Electronics Market
  • Figure 29: Bargaining Power of Buyers in the Radiation Hardened Electronics Market
  • Figure 30: Bargaining Power of Suppliers in the Radiation Hardened Electronics Market
  • Figure 31: Radiation Hardened Electronics and Semiconductors Market: By Components
  • Figure 32: Power Management Components to Witness A High Growth Rate in the Radiation Hardened Electronics & Semiconductors Market
  • Figure 33: Radiation Hardened Electronics and Semiconductors Market: By Manufacturing Techniques
  • Figure 34: RHBD - Most Preffered Manufacturing Technique for Rad-Hard Electronics Systems
  • Figure 35: RHBD Manufacturing Technique
  • Figure 36: Radiation Hardened Electronics Market: By Application
  • Figure 37: Radiation Hardened Electronics & Semiconductors: Geographic Snapshot (2013)
  • Figure 38: Radiation Hardened Electronics and Semiconductors Market Snapshot (2013)
  • Figure 39: North American Market Snapshot: Demand Expected to Be Driven By High Spending in Research and Development By the U.S. Government
  • Figure 40: Europe Market Snapshot
  • Figure 41: Asia-Pacific Market Snapshot
  • Figure 42: Companies Adopted Acquisitions and Product innovation as the Key Growth Strategies, Over the Last Four Years
  • Figure 43: Honeywell Grew at the Fastest Rate Between 2008 - 2013
  • Figure 44: Global Radiation Hardened Electronics and Semiconductorsmarket Share, By Key Player, 2013
  • Figure 45: Market Evolution Framework-Significant Private Equity investments
  • Figure 46: Competition for Market Share: New Product Launches Comprised the Key Strategy
  • Figure 47: Geographic Revenue Mix of Top 5 Market Players - Reference
  • Figure 48: BAE Systems: Business Overview
  • Figure 49: Honeywell Aerosapace: Business Overview
  • Figure 50: Microsemi Corporation: Business Overview
  • Figure 51: Xilinx Incorporation : Business Overview
  • Figure 52: Atmel Corporation: Business Overview
  • Figure 53: Maxwell Technologies : Business Overview
  • Figure 54: Intersil Corp. : Business Overview
  • Figure 55: Texas Instruments. : Business Overview
  • Figure 56: Linear Technology Corp: Business Overview
  • Figure 57: ST. Microelectronics. : Business Overview
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