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メモリパッケージ基板市場レポート：2030年までの動向、予測、競合分析

Memory Package Substrate Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日: | 発行: Lucintel | ページ情報: 英文 150 - page report | 納期: 3営業日

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メモリパッケージ基板市場レポート：2030年までの動向、予測、競合分析
出版日: 2024年01月29日
発行: Lucintel
ページ情報: 英文 150 - page report
納期: 3営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 目次
概要

メモリパッケージ基板の動向と予測

世界のメモリパッケージ基板市場は、2024年から2030年にかけてCAGR 5.6％で成長すると予測されます。この市場の主な促進要因は、データ消費の増加とクラウドコンピューティングの採用、人工知能と高性能コンピューティングの拡大、半導体技術とメモリパッケージングの先進化です。世界のメモリパッケージ基板市場の将来性は有望で、不揮発性メモリと揮発性メモリの分野に市場機会があります。

メモリパッケージ基板市場の洞察

Lucintelの予測では、ワイヤーボンドボールグリッドアレイは低コストで製造が容易なため、予測期間中に最も高い成長が見込まれます。

この市場の中では、不揮発性メモリが、その手頃な価格と幅広い用途により、高い成長が見込まれています。

アジア太平洋は、中国、台湾、韓国などにエレクトロニクスの大手製造拠点があるため、予測期間中に最も高い成長が見込まれます。

よくある質問

Q1.市場の成長予測は？

A1.世界のメモリパッケージ基板市場は、2024年から2030年にかけてCAGR 5.6%で成長する見込みです。

Q2.市場の成長に影響を与える主な促進要因は？

A2.この市場の主な促進要因は、データ消費の増加とクラウドコンピューティングの採用、人工知能と高性能コンピューティングの拡大、半導体技術とメモリパッケージの先進化です。

Q3.市場の主要セグメントは？

A3.メモリパッケージ基板市場の将来性は有望で、不揮発性メモリと揮発性メモリの分野に市場機会が存在します。

Q4.市場の主要企業は？

A4.メモリパッケージ基板の主要企業は以下の通りです。

  • Nanya
  • Daeduck
  • Ibiden
  • Shinko
  • Toppan Printing
  • Kyocera
  • Kinsus
  • Doosan Electronic
  • Fujitsu Global
  • Korea Circuit

Q5.今後、最大となる市場セグメントは？

A5.Lucintelは、ワイヤーボンドボールグリッドアレイは低コストで製造が容易なため、予測期間中に最も高い成長が見込まれると予測しています。

Q6.市場において、今後5年間に最大になると予想される地域は？

A6.アジア太平洋は、中国、台湾、韓国などにレクトロニクスの大手製造拠点があるため、予測期間中に最も高い成長が見込まれます。

Q7.レポートのカスタマイズは可能？

A7.はい、Lucintelは追加費用なしで10％のカスタマイズを提供します。

目次

第1章 エグゼクティブサマリー

第2章 世界のメモリパッケージ基板市場：市場力学

  • イントロダクション、背景、分類
  • サプライチェーン
  • 業界の促進要因と課題

第3章 2018年から2030年までの市場動向と予測分析

  • マクロ経済の動向（2018～2023年）と予測（2024～2030年）
  • 世界のメモリパッケージ基板市場の動向（2018～2023年）と予測（2024～2030年）
  • タイプ別の世界のメモリパッケージ基板市場
    • ワイヤーボンドボールグリッドアレイ
    • フリップチップボールグリッドアレイ
    • 三次元集積回路
    • ウエハーレベルチップスケールパッケージ
  • 用途別の世界のメモリパッケージ基板市場
    • 不揮発性メモリ
    • 揮発性メモリ

第4章 2018年から2030年までの地域別の市場動向と予測分析

  • 地域別の世界のメモリパッケージ基板市場
  • 北米のメモリパッケージ基板市場
  • 欧州のメモリパッケージ基板市場
  • アジア太平洋のメモリパッケージ基板市場
  • その他の地域 (ROW) のメモリパッケージ基板市場

第5章 競合の分析

  • 製品ポートフォリオ分析
  • 運用上の統合
  • ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

  • 成長機会の分析
    • タイプ別の世界のメモリパッケージ基板市場の成長機会
    • 用途別の世界のメモリパッケージ基板市場の成長機会
    • 地域別の世界のメモリパッケージ基板市場の成長機会
  • 世界のメモリパッケージ基板市場の新たな動向
  • 戦略的分析
    • 新製品の開発
    • 世界のメモリパッケージ基板市場の生産能力拡大
    • 世界のメモリパッケージ基板市場における合併、買収、合弁事業
    • 認証とライセンシング

第7章 有力企業の企業プロファイル

  • Nanya
  • Daeduck
  • Ibiden
  • Shinko
  • Toppan Printing
  • Kyocera
  • Kinsus
  • Doosan Electronic
  • Fujitsu Global
  • Korea Circuit
目次

Memory Package Substrate Trends and Forecast

The future of the global memory package substrate market looks promising with opportunities in the non-volatile memory and volatile memory markets. The global memory package substrate market is expected to grow with a CAGR of 5.6% from 2024 to 2030. The major drivers for this market are rising data consumption and adoption of cloud computing, expansion of artificial intelligence and high-performance computing, and advancements in semiconductor technology and memory packaging.

A more than 150-page report is developed to help in your business decisions.

Memory Package Substrate by Segment

The study includes a forecast for the global memory package substrate by type, application, and region.

Memory Package Substrate Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Wire Bond Ball-Grid Arrays
  • Flip Chip Ball Grid Arrays
  • Three-Dimensional Integrated Circuit
  • Wafer Level Chip Scale Package

Memory Package Substrate Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Non-Volatile Memory
  • Volatile Memory

Memory Package Substrate Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Memory Package Substrate Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies memory package substrate companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the memory package substrate companies profiled in this report include-

  • Nanya
  • Daeduck
  • Ibiden
  • Shinko
  • Toppan Printing
  • Kyocera
  • Kinsus
  • Doosan Electronic
  • Fujitsu Global
  • Korea Circuit

Memory Package Substrate Market Insights

Lucintel forecasts that wire bond ball-grid arrays is expected to witness the highest growth over the forecast period due to its lower cost and ease of manufacturing.

Within this market, non-volatile memory is expected to witness the higher growth due to its affordability and wider range of applications.

APAC is expected to witness highest growth over the forecast period due to presence of major electronics manufacturing hubs in countries like China, Taiwan, and South Korea.

Features of the Global Memory Package Substrate Market

Market Size Estimates: Memory package substrate market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Memory package substrate market size by type, application, and region in terms of value ($B).

Regional Analysis: Memory package substrate market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the memory package substrate market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the memory package substrate market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for memory package substrate market?

Answer: The global memory package substrate market is expected to grow with a CAGR of 5.6% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the memory package substrate market?

Answer: The major drivers for this market are rising data consumption and adoption of cloud computing, expansion of artificial intelligence and high-performance computing and advancements in semiconductor technology and memory packaging.

Q3. What are the major segments for memory package substrate market?

Answer: The future of the memory package substrate market looks promising with opportunities in the non-volatile memory and volatile memory markets.

Q4. Who are the key memory package substrate market companies?

Answer: Some of the key memory package substrate companies are as follows.

  • Nanya
  • Daeduck
  • Ibiden
  • Shinko
  • Toppan Printing
  • Kyocera
  • Kinsus
  • Doosan Electronic
  • Fujitsu Global
  • Korea Circuit

Q5. Which memory package substrate market segment will be the largest in future?

Answer: Lucintel forecasts that wire bond ball-grid arrays is expected to witness the highest growth over the forecast period due to its lower cost and ease of manufacturing.

Q6. In memory package substrate market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to presence of major electronics manufacturing hubs in countries like China, Taiwan, and South Korea.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the memory package substrate market by type (wire bond ball-grid arrays, flip chip ball grid arrays, three-dimensional integrated circuit, and wafer level chip scale package), application (non-volatile memory and volatile memory), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Memory Package Substrate Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Memory Package Substrate Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Memory Package Substrate Market by Type
    • 3.3.1: Wire Bond Ball-Grid Arrays
    • 3.3.2: Flip Chip Ball Grid Arrays
    • 3.3.3: Three-Dimensional Integrated Circuit
    • 3.3.4: Wafer Level Chip Scale Package
  • 3.4: Global Memory Package Substrate Market by Application
    • 3.4.1: Non-Volatile Memory
    • 3.4.2: Volatile Memory

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Memory Package Substrate Market by Region
  • 4.2: North American Memory Package Substrate Market
    • 4.2.2: North American Memory Package Substrate Market by Application: Non-Volatile Memory and Volatile Memory
  • 4.3: European Memory Package Substrate Market
    • 4.3.1: European Memory Package Substrate Market by Type: Wire Bond Ball-Grid Arrays, Flip Chip Ball Grid Arrays, Three-Dimensional Integrated Circuit, and Wafer Level Chip Scale Package
    • 4.3.2: European Memory Package Substrate Market by Application: Non-Volatile Memory and Volatile Memory
  • 4.4: APAC Memory Package Substrate Market
    • 4.4.1: APAC Memory Package Substrate Market by Type: Wire Bond Ball-Grid Arrays, Flip Chip Ball Grid Arrays, Three-Dimensional Integrated Circuit, and Wafer Level Chip Scale Package
    • 4.4.2: APAC Memory Package Substrate Market by Application: Non-Volatile Memory and Volatile Memory
  • 4.5: ROW Memory Package Substrate Market
    • 4.5.1: ROW Memory Package Substrate Market by Type: Wire Bond Ball-Grid Arrays, Flip Chip Ball Grid Arrays, Three-Dimensional Integrated Circuit, and Wafer Level Chip Scale Package
    • 4.5.2: ROW Memory Package Substrate Market by Application: Non-Volatile Memory and Volatile Memory

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Memory Package Substrate Market by Type
    • 6.1.2: Growth Opportunities for the Global Memory Package Substrate Market by Application
    • 6.1.3: Growth Opportunities for the Global Memory Package Substrate Market by Region
  • 6.2: Emerging Trends in the Global Memory Package Substrate Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Memory Package Substrate Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Memory Package Substrate Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Nanya
  • 7.2: Daeduck
  • 7.3: Ibiden
  • 7.4: Shinko
  • 7.5: Toppan Printing
  • 7.6: Kyocera
  • 7.7: Kinsus
  • 7.8: Doosan Electronic
  • 7.9: Fujitsu Global
  • 7.10: Korea Circuit