味の素ビルドアップフィルム基板市場レポート：2030年までの動向、予測、競合分析

味の素ビルドアップフィルム基板の動向と予測

世界の味の素ビルドアップフィルム基板市場は、2024年から2030年までのCAGRが18.9%で、2030年までに推定37億米ドルに達すると予測されています。この市場の主な促進要因は、消費者の可処分所得の増加、技術の進歩、ノートPC、スマートフォン、タブレットPC、PC、ノートPCなどの家電製品に対する需要の拡大です。世界の味の素ビルドアップフィルム基板市場の将来は、PC、AIチップ、サーバーとスイッチ市場にビジネスチャンスがあり、有望視されています。

味の素ビルドアップフィルム基板市場洞察

Lucintelの予測によると、4～8層ABF基板は、モバイル機器、パソコン、サーバーシステム、スマートフォン、タブレット型パソコン、データセンターインフラなどの世界の普及により、予測期間中、より高いセグメントを示す見込みです。

北米は、米国における電子・半導体産業の増加により、予測期間中最大のセグメントになると予想されます。

本レポートでは、以下の11の主要な質問に回答しています：

• Q.1.市場セグメントのうち、最も有望かつ高成長な機会は何か？
• Q.2.どのセグメントがより速いペースで成長するのか、またその理由は？
• Q.3.今後成長が加速すると思われる地域とその理由は？
• Q.4.市場力学に影響を与える主な要因は何か？市場における主な課題とビジネスリスクは？
• Q.5.この市場におけるビジネスリスクと競合の脅威は？
• Q.6.この市場における新たな動向とその理由は？
• Q.7.市場における顧客の需要の変化にはどのようなものがありますか？
• Q.8.この市場における新たな開発と、その開発をリードしている企業は？
• Q.9.この市場における主要企業は？主要企業は事業成長のためにどのような戦略的取り組みを進めているのか？
• Q.10.この市場における競合製品にはどのようなものがあり、材料や製品の代替による市場シェア低下の脅威はどの程度ありますか？
• Q.11.過去5年間にどのようなM&Aが行われ、業界にどのような影響を与えましたか？

目次

第1章 エグゼクティブサマリー

第2章 世界の味の素ビルドアップフィルム基板市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2018～2030年の市場動向と予測分析

• マクロ経済動向（2018～2023年）と予測（2024～2030年）
• 味の素ビルドアップフィルム基板の世界市場動向（2018～2023年）と予測（2024～2030年）
• 味の素ビルドアップフィルム基板のタイプ別世界市場
  • 4～8層ABF基板
  • 8～16層ABF基板
• 味の素ビルドアップフィルム基板の用途別世界市場
  • パソコン
  • AIチップ
  • サーバーとスイッチ
  • その他

第4章 2018～2030年の地域別の市場動向と予測分析

• 世界の味の素ビルドアップフィルム基板市場（地域別）
• 北米の味の素ビルドアップフィルム基板市場
• 欧州の味の素ビルドアップフィルム基板市場
• アジア太平洋の味の素ビルドアップフィルム基板市場
• その他地域の味の素ビルドアップフィルム基板市場

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
  • タイプ別の世界の味の素ビルドアップフィルム基板市場の成長機会
  • 用途別の世界の味の素ビルドアップフィルム基板市場の成長機会
  • 地域別の世界の味の素ビルドアップフィルム基板市場の成長機会
• 世界の味の素ビルドアップフィルム基板市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 味の素ビルドアップフィルム基板の世界市場の能力拡大
  • 世界の味の素ビルドアップフィルム基板市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 有力企業の企業プロファイル

• Ajinomoto
• Unimicron Technology
• Nan Ya Printed Circuit Board
• AT & S
• Samsung Electro-Mechanics
• Kyocera
• TOPPAN
• ASE
• LG Inno Tek
• Shennan Circuit

Ajinomoto Build-Up Film Substrate Trends and Forecast

The future of the global ajinomoto build-up film substrate market looks promising with opportunities in the PCs, AI chip, server and switch markets. The global ajinomoto build-up film substrate market is expected to reach an estimated $3.7 billion by 2030 with a CAGR of 18.9% from 2024 to 2030. The major drivers for this market are rising disposable income of consumers, technological advancements, and growing demand for consumer electronics such as laptops, smartphones, and tablets, PCs, and notebooks.

A more than 150-page report is developed to help in your business decisions.

Ajinomoto Build-Up Film Substrate by Segment

The study includes a forecast for the global ajinomoto build-up film substrate by type, application, and region.

Ajinomoto Build-Up Film Substrate Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• 4-8 Layers ABF Substrate
• 8-16 ABF Substrate

Ajinomoto Build-Up Film Substrate Market by Application [Shipment Analysis by Value from 2018 to 2030]:

• PCs
• AI Chip
• Server and Switch
• Others

Ajinomoto Build-Up Film Substrate Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Ajinomoto Build-Up Film Substrate Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies ajinomoto build-up film substrate companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the ajinomoto build-up film substrate companies profiled in this report include-

• Ajinomoto
• Unimicron Technology
• Nan Ya Printed Circuit Board
• AT & S
• Samsung Electro-Mechanics
• Kyocera
• Toppan
• ASE
• LG Inno Tek
• Shennan Circuit

Ajinomoto Build-Up Film Substrate Market Insights

Lucintel forecasts that 4-8 layers ABF substrate is expected to witness higher segment over the forecast period due to expanding usage across mobile devices, personal computers, and server systems, as well as, global proliferation of smartphones, tablet computers, and data center infrastructure.

North America is expected to witness largest segment over the forecast period due to increasing electronic and semiconductor industry in US.

Features of the Global Ajinomoto Build-Up Film Substrate Market

Market Size Estimates: Ajinomoto build-up film substrate market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Ajinomoto build-up film substrate market size by type, application, and region in terms of value ($B).

Regional Analysis: Ajinomoto build-up film substrate market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the ajinomoto build-up film substrate market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the ajinomoto build-up film substrate market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the ajinomoto build-up film substrate market size?

Answer: The global ajinomoto build-up film substrate market is expected to reach an estimated $3.7 billion by 2030.

Q.2 What is the growth forecast for ajinomoto build-up film substrate market?

Answer: The global ajinomoto build-up film substrate market is expected to grow with a CAGR of 18.9% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the ajinomoto build-up film substrate market?

Answer: The major drivers for this market are rising disposable income of consumers, technological advancements, and growing demand for consumer electronics such as laptops, smartphones, and tablets, PCs, and notebooks.

Q4. What are the major segments for ajinomoto build-up film substrate market?

Answer: The future of the global ajinomoto build-up film substrate market looks promising with opportunities in the PCs, AI chip, server and switch markets.

Q5. Who are the key ajinomoto build-up film substrate market companies?

Answer: Some of the key ajinomoto build-up film substrate companies are as follows:

• Ajinomoto
• Unimicron Technology
• Nan Ya Printed Circuit Board
• AT & S
• Samsung Electro-Mechanics
• Kyocera
• Toppan
• ASE
• LG Inno Tek
• Shennan Circuit

Q6. Which ajinomoto build-up film substrate market segment will be the largest in future?

Answer: Lucintel forecasts that 4-8 layers ABF substrate is expected to witness higher segment over the forecast period due to expanding usage across mobile devices, personal computers, and server systems, as well as, global proliferation of smartphones, tablet computers, and data center infrastructure.

Q7. In ajinomoto build-up film substrate market, which region is expected to be the largest in next 5 years?

Answer: North America is expected to witness largest segment over the forecast period due to increasing electronic and semiconductor industry in US.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the ajinomoto build-up film substrate market by type (4-8 layers ABF substrate and 8-16 ABF substrate), application (PCs, AI chip, server and switch, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Ajinomoto Build-Up Film Substrate Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global Ajinomoto Build-Up Film Substrate Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global Ajinomoto Build-Up Film Substrate Market by Type
  • 3.3.1: 4-8 Layers ABF Substrate
  • 3.3.2: 8-16 ABF Substrate
• 3.4: Global Ajinomoto Build-Up Film Substrate Market by Application
  • 3.4.1: PCs
  • 3.4.2: AI Chip
  • 3.4.3: Server And Switch
  • 3.4.4: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global Ajinomoto Build-Up Film Substrate Market by Region
• 4.2: North American Ajinomoto Build-Up Film Substrate Market
  • 4.2.2: North American Ajinomoto Build-Up Film Substrate Market by Application: PCs, AI Chip, Server And Switch, and Others
• 4.3: European Ajinomoto Build-Up Film Substrate Market
  • 4.3.1: European Ajinomoto Build-Up Film Substrate Market by Type: 4-8 Layers ABF Substrate and 8-16 ABF Substrate
  • 4.3.2: European Ajinomoto Build-Up Film Substrate Market by Application: PCs, AI Chip, Server And Switch, and Others
• 4.4: APAC Ajinomoto Build-Up Film Substrate Market
  • 4.4.1: APAC Ajinomoto Build-Up Film Substrate Market by Type: 4-8 Layers ABF Substrate and 8-16 ABF Substrate
  • 4.4.2: APAC Ajinomoto Build-Up Film Substrate Market by Application: PCs, AI Chip, Server And Switch, and Others
• 4.5: ROW Ajinomoto Build-Up Film Substrate Market
  • 4.5.1: ROW Ajinomoto Build-Up Film Substrate Market by Type: 4-8 Layers ABF Substrate and 8-16 ABF Substrate
  • 4.5.2: ROW Ajinomoto Build-Up Film Substrate Market by Application: PCs, AI Chip, Server And Switch, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Ajinomoto Build-Up Film Substrate Market by Type
  • 6.1.2: Growth Opportunities for the Global Ajinomoto Build-Up Film Substrate Market by Application
  • 6.1.3: Growth Opportunities for the Global Ajinomoto Build-Up Film Substrate Market by Region
• 6.2: Emerging Trends in the Global Ajinomoto Build-Up Film Substrate Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Ajinomoto Build-Up Film Substrate Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Ajinomoto Build-Up Film Substrate Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Ajinomoto
• 7.2: Unimicron Technology
• 7.3: Nan Ya Printed Circuit Board
• 7.4: AT & S
• 7.5: Samsung Electro-Mechanics
• 7.6: Kyocera
• 7.7: TOPPAN
• 7.8: ASE
• 7.9: LG Inno Tek
• 7.10: Shennan Circuit