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市場調査レポート
商品コード
1353434
パワー半導体の世界市場規模、シェア、産業動向分析レポート:製品別、用途別、材料別、地域別展望と予測、2023年~2030年Global Power Semiconductor Market Size, Share & Industry Trends Analysis Report By Product (Power MOSFET, IGBT, Thyristor, Power Diode, and Others), By Application, By Material (SiC, GaN, and Others), By Regional Outlook and Forecast, 2023 - 2030 |
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パワー半導体の世界市場規模、シェア、産業動向分析レポート:製品別、用途別、材料別、地域別展望と予測、2023年~2030年 |
出版日: 2023年08月31日
発行: KBV Research
ページ情報: 英文 449 Pages
納期: 即納可能
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パワー半導体市場規模は、予測期間中にCAGR 4.6%で成長し、2030年には670億米ドルに達すると予測されます。2022年の市場規模は12億3,360万台、成長率は2.7%(2019-2022年)。
KBVカーディナルマトリックスに掲載された分析によると、テキサス・インスツルメンツ社が同市場の先行者です。2022年12月、テキサス・インスツルメンツはチコニー・パワーとパートナーシップを結び、チコニーのアダプターのサイズを50%縮小し、TIのゲート 促進要因内蔵ハーフブリッジGaN FETの助けを借りて効率を最大94%向上させました。オン・セミコンダクター・コーポレーション、ルネサスエレクトロニクス、インフィニオン・テクノロジーズAGなどの企業は、この市場における主要なイノベーターです。
市場成長要因
自動車産業では回路が重要
自動車部品、モーター、空調システム、電気自動車のシリコンベースのパワー金属-酸化膜-半導体電界効果トランジスタ(MOSFET)はすべて、パワー電子回路と半導体を必要とします。パワー半導体は、ステアリング、ブレーキ、燃料分配、安全システムなど、電気部品や集積チップを搭載した自動車機器に多く見られます。炭化ケイ素やその他の高広帯域半導体は、回路の温度部位に近いところで使用されます。これらの半導体は、回路面積を縮小し、耐圧が高く、高周波でのスイッチングを可能にします。さらに、自動車の軽量化、燃費向上、排ガス低減に役立つx-by-wireやdrive-by-wire技術の採用など、いくつかの技術開拓が市場の成長を後押ししています。
民生用電子機器と無線通信の需要が拡大
世界的な家庭用電化製品の消費量の増加により、市場は順調に成長しています。現在、通信機器(スマートフォン、タブレット、スマートウォッチ、その他のガジェットなど)、コンピューター(パーソナルコンピューターや企業向けコンピューターにはPCBが搭載されている)、エンターテインメントシステム、家電製品など、多くのコンシューマー製品が半導体を必要としています。スマートフォンは、この分野における半導体の主な消費者です。スマートフォン業界は近年、携帯電話利用の増加により激しい競争を経験しています。スマート・デバイスの需要とモノのインターネット(IoT)デバイスの利用拡大は、コネクテッド・ホーム技術によって大きく促進されると予想されます。パワー半導体は、スマートフォン、タブレット、スマートウォッチ、フィットネスバンド、通信機器など、ポータブルで軽量な消費者向けガジェットに広く使用されており、市場の拡大に寄与しています。
市場抑制要因
SiC半導体の生産ネットワークと計画サイクルの複雑さ
民生用電子機器や無線通信機器の需要増加などの要因により市場は拡大しているが、世界のシリコンウエハー不足などの要因とROI指標が相まって、市場拡大の脅威となることが予測されます。しかし、SiC半導体技術のサプライチェーンと生産プロセスの複雑さは、需要の増加に追いつくことを困難にしかねない制約となっています。DC-DC 促進要因の追加や、3つのコネクター(+、0V、-)を持つ特定のバッテリーが必要なため、携帯機器に使用することが難しくなる可能性があります。したがって、こうした制約が今後数年間の市場拡大を制限する可能性があります。
製品の展望
市場は製品別に、パワーMOSFET、IGBT、サイリスタ、パワーダイオード、その他に区分されます。2022年には、パワーMOSFETセグメントが市場で最大の収益シェアを占めました。パワーMOSFETは、ゲート駆動電力が低く、スイッチング速度が速く、帯域幅が広く、高度な並列接続が可能で、堅牢で、駆動が容易で、バイアスがかけやすく、応用が簡単で、修理が容易なため、世界で最も広く使用されているパワー半導体デバイスです。特に、低電圧スイッチ(200 V未満)として最も頻繁に使用されています。
アプリケーションの展望
アプリケーション別に見ると、市場はIT・通信、エレクトロニクス、産業、自動車、航空宇宙・防衛、ヘルスケア、エネルギー・電力、その他に分類されます。エネルギー・電力分野は、2022年の市場でかなりの収益シェアを占めています。エネルギー・電力分野では、パワー半導体デバイスには多くの利点があります。費用対効果を確実にするため、これらのデバイスは配電網、送電システム、再生可能エネルギーインフラなどの配電およびユーティリティシステムでの使用に最適です。これらの特徴には、ワイドバンドギャップ、エネルギー効率の向上、冷却要件の低減などがあります。
材料の展望
材料別に見ると、市場は炭化ケイ素(SiC)、窒化ガリウム(GaN)、その他に分類されます。2022年には、SiCセグメントが最大の収益シェアで市場を独占しました。このセグメントの成長は、電気自動車や太陽光発電インバータの普及に伴い、SiCパワーデバイスの使用が増加していることによる。優れた性能を持つ新しいパワーデバイスを作るには、炭化ケイ素の広いバンドギャップエネルギー(3.2eV)、高い耐圧、通常の臨界電界を利用するのが便利です。
地域別展望
地域別に見ると、市場は北米、欧州、アジア太平洋、LAMEAで分析されます。2022年には、アジア太平洋地域が市場で最も高い収益シェアを獲得しました。アジア太平洋地域は世界の半導体産業で優位を占めており、政府の法律も後押ししているため、市場は拡大すると思われます。ベトナム、タイ、マレーシア、シンガポールは、この地域の市場シェアにかなり貢献している国です。その結果、政府の現在のMake in Indiaイニシアチブは半導体産業への投資につながると予想されます。
The Global Power Semiconductor Market size is expected to reach $67 billion by 2030, rising at a market growth of 4.6% CAGR during the forecast period. In the year 2022, the market attained a volume of 1,233.6 million units, experiencing a growth of 2.7% (2019-2022).
Power semiconductors are often found in automotive equipment, including steering, braking, fuel distribution, and safety systems with electrical components and integrated chips. Thus, the Automotive segment captured $1,709.7 million revenue in the year 2022. Power semiconductors aid in the need for high-efficiency power conversion, the development of advanced lighting systems, and the implementation of stricter emission regulations. The rapid adoption of electric and hybrid vehicles, improvements in autonomous driving technology, and rising demand for vehicle connectivity and V2X communication are propelling the growth of this segment. Additionally, power semiconductors aid in the need for high-efficiency power conversion, the development of advanced lighting systems, and the implementation of stricter emission regulations.
The major strategies followed by the market participants are Partnerships as the key developmental strategy to keep pace with the changing demands of end users. For instance, In July, 2023, Onsemi joined hands with BorgWarner Inc., to enhance the performance of electric vehicles. Additionally, In February, 2023, Infineon Technologies teamed up with Infinitum, to bring enhanced energy-efficient motor controls with silicon carbide and other materials to the market.
Based on the Analysis presented in the KBV Cardinal matrix; Texas Instruments Inc. is the forerunners in the Market. In December, 2022, Texas Instruments signed a partnership with Chicony Power, to decrease the size of the chicony's adapter by 50% and enhance efficiency by up to 94% with the help of TI's half-bridge GaN FET with an integrated gate driver. Companies such as ON Semiconductor Corporation, Renesas Electronics Corporation, and Infineon Technologies AG are some of the key innovators in the Market.
Market Growth Factors
Circuits are crucial in the automotive industry
Automobile components, motors, air conditioning systems, and silicon-based power metal-oxide-semiconductor field-effect transistors (MOSFETs) in electric vehicles all require power electronic circuits and semiconductors. Power semiconductors are often found in automotive equipment, including steering, braking, fuel distribution, and safety systems with electrical components and integrated chips. Silicon carbide and other high wideband semiconductors are used close to temperature sites in circuits. They reduce the circuit area, have high breakdown voltage, and allow switching at higher frequencies. Additionally, several technological developments are boosting market growth, such as using x-by-wire or drive-by-wire technologies that help reduce vehicle weight, fuel efficiency, and emissions.
Consumer electronics and wireless communications are in greater demand
The market is growing favourably due to the rising consumption of consumer electronics products worldwide. Today, many consumer products, including communication devices (such as smartphones, tablets, smartwatches, and other gadgets), computers (personal and corporate computers feature PCBs), entertainment systems, and home appliances, require semiconductors. The smartphone is the main consumer of semiconductors in this sector. The smartphone industry has experienced intense competition in recent years due to increased mobile phone usage. The demand for smart devices and the growing use of Internet of Things (IoT) devices are expected to be significantly fuelled by connected home technology. The power semiconductor's widespread use in portable, lightweight consumer gadgets, including smartphones, tablets, smartwatches, fitness bands, and communication devices, contributes to the market's expansion.
Market Restraining Factors
Complexity of the SiC semiconductor production network and planning cycle
While the market is expanding as a result of factors like increased consumer electronics and wireless communication devices' demand, factors such as the global silicon wafer shortage combined with ROI metrics, are predicted to pose a threat to that expansion. However, the intricacy of the SiC semiconductor technology's supply chain and production process is a constraint that could make it difficult to keep up with the rising demand. Due to the requirement for additional DC-DC drivers or specific batteries with three connectors (+, 0V, and -) could make it difficult for them to be used in portable equipment. Therefore, these constraints may limit market expansion in the coming years.
Product Outlook
Based on product, the market is segmented into power MOSFET, IGBT, thyristor, power diode, and others. In 2022, the power MOSFET segment witnessed the largest revenue share in the market. The power MOSFET is the world's most widely used power semiconductor device because of its low gate drive power, quick switching speed, wide bandwidth, simple advanced paralleling capability, robustness, easy drive, easy biasing, simplicity of application, and ease of repair. It is particularly the most often used low-voltage switch (less than 200 V).
Application Outlook
On the basis of application, the market is classified into IT & telecom, electronics, industrial, automotive, aerospace & defence, healthcare, energy & power, and others. The energy & power segment covered a considerable revenue share in the market in 2022. In the energy & power sector, power semiconductor devices have many advantages. To ensure cost-effectiveness, these devices are ideal for use in power distribution and utility systems, such as distribution grids, transmission systems, and renewable energy infrastructure. These features include a wide band gap, enhanced energy efficiency, and reduced cooling requirements.
Material Outlook
Based on material, the market is classified into silicon carbide (SiC), gallium nitride (GaN), and others. In 2022, the SiC segment dominated the market with the maximum revenue share. The growth of the segment is owed to the increasing usage of SiC power devices along with the increased popularity of electric vehicles and photovoltaic inverters. In order to create novel power devices with excellent performance, it is convenient to take advantage of silicon carbide's wider bandgap energy (3.2eV), high breakdown voltage, and usual critical electric field.
Regional Outlook
Region wise, the market is analysed across North America, Europe, Asia Pacific, and LAMEA. In 2022, the Asia Pacific region generated the highest revenue share in the market. The market will expand in the Asia Pacific region due to the region's dominance in the global semiconductor industry and the support of government laws. Vietnam, Thailand, Malaysia, and Singapore are some nations that considerably contribute to the region's market share. As a result, the government's present Make in India initiative is anticipated to lead to investments in the semiconductor industry.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Infineon Technologies AG. Texas Instruments Inc., STMicroelectronics N.V., NXP Semiconductors N.V., ON Semiconductor Corporation, Mitsubishi Electric Corporation, Renesas Electronics Corporation, Toshiba Corporation, Fuji Electric Co., Ltd. and Hitachi, Ltd.
Recent Strategies Deployed in Power Semiconductor Market
Partnerships, Collaborations and Agreements:
Jul-2023: onsemi joined hands with BorgWarner Inc., a global company engaged in offering advanced sustainable mobility solutions. Through this collaboration, BorgWarner would combine onsemi EliteSiC 1200 V and 750 V power devices into its VIPER power modules for solutions of its traction inverter to enhance the performance of electric vehicles.
Jun-2023: Renesas Electronics Corporation collaborated with Nidec Corporation, a Japanese manufacturer and distributor of electric motors. This collaboration aims to develop the semiconductor solutions for E-Axle (X-in-1 system) that combines power electronics and an EV drive motor for electric vehicles (EVs).
Feb-2023: Infineon Technologies teamed up with Infinitum, a creator of the breakthrough, sustainable air core motor. The collaboration aims to bring enhanced energy-efficient motor controls with silicon carbide and other materials to the market.
Jan-2023: Infineon Technologies AG came into partnership with Resonac Corporation, a Japan-based chemical company. Under this partnership, companies would go on with the supply of SiC materials for power semiconductors to Infineon and together develop technologies related to SiC materials.
Dec-2022: NXP Semiconductors came into an agreement with Delta Electronics, Inc., a provider of power and thermal management solutions globally. Under this collaboration, both companies would develop traction inverter and power conversion platforms for next-generation electric vehicles.
Dec-2022: Texas Instruments signed a partnership with Chicony Power, a manufacturer, and marketer of power supplies and LED lighting products. Following this partnership, companies would design 65-W laptop power adapters. Furthermore, both companies would decrease the size of the chicony's adapter by 50% and enhance efficiency by up to 94% with the help of TI's half-bridge GaN FET with an integrated gate driver.
Sep-2022: Renesas Electronics Corporation signed an agreement with VinFast, a Vietnam-based global EV maker. This agreement would include the development of automotive technology for electric vehicles (EVs) and delivery of system components. Moreover, Renesas would offer a wide range of products to VinFast, which consists of SoCs, microcontrollers, analog and power semiconductors.
Jul-2022: STMicroelectronics N.V. partnered with GlobalFoundries Inc., a global semiconductor contract manufacturing and design company. Under this partnership, companies would aim to open a brand new, high-volume semiconductor manufacturing facility in Crolles (France). This partnership helped STMicroelectronics to expand its feet in the French market. Additionally, it will reinforce the European and French FD-SOI ecosystem.
Jun-2022: Renesas Electronics Corporation partnered with Tata Motors Ltd. (TML) and Tejas Networks Ltd., both subsidiaries of Tata Group, an India-based global company. Under this partnership, both companies aim to enhance semiconductor solutions across electronic systems for Indian and growing markets. Additionally, both companies accelerated the growth in advanced electronics and its multitudes of applications for the market.
Mar-2022: NXP teamed up with Hitachi Energy, a global technology company engaged in advancing a sustainable energy future. Following this collaboration, both companies would integrate NXP's GD3160 isolated gate driver and Hitachi Energy's RoadPak SiC power modules to bring reliable, functionally safe, and efficient ePowertrains to commercialize more rapidly.
Product Launches and Product Expansion:
Dec-2022: Toshiba introduced TK055U60Z1, the first MOSFET of the 600V DTMOSVI series. The launched product provides a 13 percent RDS (on) advancement over similar devices released in its earlier DTMOSIV-H series.
May-2022: Hitachi Energy released RoadPak, a leading power semiconductor module for electric vehicles. The RoadPak module utilizes advanced silicon carbide (SiC) technology to achieve outstanding levels of power density for reliability, faster charging, over the vehicle's lifetime, and the minimum possible power losses for the highest potential driving range.
Acquisitions and Mergers:
Feb-2023: Mitsubishi Electric Corporation completed the acquisition of Scibreak AB, a Sweden-based company engaged in commercializing new technology for interrupting electric current. Through this acquisition, both companies would work together on developing DCCB technologies for high-voltage direct current (HVDC) systems, and Mitsubishi Electric utilizing Scibreak's technology.
Nov-2021: onsemi acquired GT Advanced Technologies, a company engaged in providing silicon carbide (SiC). This acquisition strengthens onsemi's capability to secure and grow the supply of SiC. Moreover, the acquisition empowers onsemi's ability to propel innovation and invest in dynamic, high-growth technologies.
Jun-2021: Texas Instruments Incorporated signed an agreement to acquire the 300-mm semiconductor factory of Micron Technology, a company specializing in innovative memory and storage solutions. This acquisition strengthens competitive advantage in manufacturing and technology and is part of long-term capacity planning.
Geographical Expansions:
Sep-2021: Infineon opened a new facility in Villach, Austria. The high-tech chip factory for power electronics on 300-millimeter thin wafers aims to fulfil the growing demand for power semiconductors. Moreover, the additional capacity would help Infineon to serve its customers globally.
Market Segments covered in the Report:
By Product (Volume, Million Units, USD Million, 2019-2030)
By Application (Volume, Million Units, USD Million, 2019-2030)
By Material (Volume, Million Units, USD Million, 2019-2030)
By Geography (Volume, Million Units, USD Million, 2019-2030)
Companies Profiled
Unique Offerings from KBV Research