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市場調査レポート

世界のプローブカード市場 2018年〜2022年

Global Probe Card Market 2018-2022

発行 TechNavio (Infiniti Research Ltd.) 商品コード 366880
出版日 ページ情報 英文 115 Pages
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本日の銀行送金レート: 1USD=114.54円で換算しております。
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世界のプローブカード市場 2018年〜2022年 Global Probe Card Market 2018-2022
出版日: 2018年07月17日 ページ情報: 英文 115 Pages
概要

プローブカードについて

プローブカードは、半導体デバイスの製造のウェーハ検査工程において、集積回路の電気的検査に使用されます。

Technavioのアナリストは、2018年から2022年にかけて、世界のプローブカード市場が4.58%のCAGRで成長すると予測しています。

当レポートでは、世界のプローブカード市場について調査し、市場の概要、エンドユーザー・製品・地域別の市場規模の推移と予測、市場動向、市場シェア、成長要因および課題の分析、競合情勢、主要企業のプロファイルなど、包括的な情報を提供しています。

目次

第1章 エグゼクティブサマリー

第2章 調査範囲

第3章 調査方法

第4章 市場状況

  • 市場のエコシステム
  • 市場特性
  • 市場セグメンテーション分析

第5章 市場規模

  • 市場の定義
  • 市場規模
  • 市場規模の予測

第6章 ファイブフォース分析

  • 買い手の交渉力
  • 供給企業の交渉力
  • 新規参入業者の脅威
  • 代替品の脅威
  • 競争企業間の敵対関係
  • 市場状況

第7章 市場セグメンテーション:エンドユーザー別

  • 市場区分:エンドユーザー別
  • 市場比較:エンドユーザー別
  • ファウンドリー & ロジック
  • メモリデバイス
  • 市場機会:エンドユーザー別

第8章 市場セグメンテーション:製品別

  • 市場区分:製品別
  • 市場比較:製品別
  • 先進プローブカード
  • 標準プローブカード
  • 市場機会:製品別

第9章 顧客情勢

第10章 地域情勢

  • 市場区分:地域別
  • 市場比較:地域別
  • アジア太平洋
  • 南北アメリカ
  • 欧州・中東・アフリカ
  • 市場牽引国
  • 市場機会

第11章 意思決定の枠組み

第12章 成長要因と課題

  • 市場の成長要因
  • 市場の課題

第13章 市場動向

  • ウェーハサイズの大型化
  • 3D NANDの採用拡大
  • M&Aの増加

第14章 ベンダー情勢

  • 概要
  • 創造的破壊の状況
  • 競合シナリオ

第15章 ベンダー分析

  • 対象ベンダー
  • ベンダー分類
  • ベンダーの市場ポジショニング
  • FormFactor
  • 日本電子材料
  • 日本マイクロニクス
  • MPI
  • Technoprobe
  • 略語リスト
図表
  • Exhibit 01: Parent market
  • Exhibit 02: Global semiconductor market
  • Exhibit 03: Market characteristics
  • Exhibit 04: Market segments
  • Exhibit 05: Market definition - Inclusions and exclusions checklist
  • Exhibit 06: Market size 2017
  • Exhibit 07: Validation techniques employed for market sizing 2017
  • Exhibit 08: Global probe card market - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 09: Global probe card market - Year-over-year growth 2018-2022 (%)
  • Exhibit 10: Five forces analysis 2017
  • Exhibit 11: Five forces analysis 2022
  • Exhibit 12: Bargaining power of buyers
  • Exhibit 13: Bargaining power of suppliers
  • Exhibit 14: Threat of new entrants
  • Exhibit 15: Threat of substitutes
  • Exhibit 16: Threat of rivalry
  • Exhibit 17: Market condition - Five forces 2017
  • Exhibit 18: End-user - Market share 2017-2022 (%)
  • Exhibit 19: Comparison by end-user
  • Exhibit 20: Foundry and logic - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 21: Foundry and logic - Year-over-year growth 2018-2022 (%)
  • Exhibit 22: Memory device - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 23: Memory device - Year-over-year growth 2018-2022 (%)
  • Exhibit 24: Market opportunity by end-user
  • Exhibit 25: Product - Market share 2017-2022 (%)
  • Exhibit 26: Comparison by product
  • Exhibit 27: Advanced probe card - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 28: Advanced probe card - Year-over-year growth 2018-2022 (%)
  • Exhibit 29: Standard probe card - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 30: Standard probe card - Year-over-year growth 2018-2022 (%)
  • Exhibit 31: Market opportunity by product
  • Exhibit 32: Customer landscape
  • Exhibit 33: Global probe card market - Market share by geography 2017-2022 (%)
  • Exhibit 34: Regional comparison
  • Exhibit 35: APAC - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 36: Major foundries in APAC
  • Exhibit 37: APAC - Year-over-year growth 2018-2022 (%)
  • Exhibit 38: Americas - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 39: Americas - Year-over-year growth 2018-2022 (%)
  • Exhibit 40: EMEA - Market size and forecast 2017-2022 ($ mn)
  • Exhibit 41: List of foundries in EMEA
  • Exhibit 42: EMEA - Year-over-year growth 2018-2022 (%)
  • Exhibit 43: Key leading countries
  • Exhibit 44: Market opportunity
  • Exhibit 45: Increasing wafer size
  • Exhibit 46: Vendor landscape
  • Exhibit 47: Landscape disruption
  • Exhibit 48: Vendor share in the global probe card market 2017
  • Exhibit 49: Vendors covered
  • Exhibit 50: Vendor classification
  • Exhibit 51: Market Positioning of Vendors
  • Exhibit 52: FormFactor: Overview
  • Exhibit 53: FormFactor - Business segments
  • Exhibit 54: FormFactor - Organizational developments
  • Exhibit 55: FormFactor - Geographic focus
  • Exhibit 56: FormFactor - Segment focus
  • Exhibit 57: FormFactor - Key offerings
  • Exhibit 58: JAPAN ELECTRONIC MATERIALS: Overview
  • Exhibit 59: JAPAN ELECTRONIC MATERIALS - Business segments
  • Exhibit 60: JAPAN ELECTRONIC MATERIALS- Key offerings
  • Exhibit 61: MICRONICS JAPAN: Overview
  • Exhibit 62: MICRONICS JAPAN - Business segments
  • Exhibit 63: MICRONICS JAPAN - Geographic focus
  • Exhibit 64: MICRONICS JAPAN - Segment focus
  • Exhibit 65: MICRONICS JAPAN - Key offerings
  • Exhibit 66: MPI: Overview
  • Exhibit 67: MPI- Business segments
  • Exhibit 68: MPI - Geographic focus
  • Exhibit 69: MPI - Segment focus
  • Exhibit 70: MPI- Key offerings
  • Exhibit 71: Technoprobe: Overview
  • Exhibit 72: Technoprobe - Organizational developments
  • Exhibit 73: Technoprobe - Key offerings
目次
Product Code: IRTNTR22662

About Probe Card

Probe card is used for electrical testing of individual integrated circuits (ICs), which are present on a wafer, during the production of semiconductor devices. A wafer probe carries out the testing to identify functional defects in the wafer.

Technavio's analysts forecast the global probe card market to grow at a CAGR of 4.58% during the period 2018-2022.

Covered in this report

The report covers the present scenario and the growth prospects of the global probe card market for 2018-2022. To calculate the market size, the report considers the revenue generated from use of probe cards across several end-user industries.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Probe Card Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • FormFactor
  • JAPAN ELECTRONIC MATERIALS
  • MICRONICS JAPAN
  • MPI
  • Technoprobe

Market driver

  • Miniaturization of electronic products
  • For a full, detailed list, view our report

Market challenge

  • Rapid technological changes in semiconductor industry
  • For a full, detailed list, view our report

Market trend

  • Growing adoption of 3-D NAND
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 05: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 07: MARKET SEGMENTATION BY END-USER

  • Segmentation by end-user
  • Comparison by end-user
  • Foundry and logic - Market size and forecast 2017-2022
  • Memory device - Market size and forecast 2017-2022
  • Market opportunity by end-user

PART 08: MARKET SEGMENTATION BY PRODUCT

  • Segmentation by product
  • Comparison by product
  • Advanced probe card - Market size and forecast 2017-2022
  • Standard probe card - Market size and forecast 2017-2022
  • Market opportunity by product

PART 09: CUSTOMER LANDSCAPE

PART 10: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • APAC - Market size and forecast 2017-2022
  • Americas - Market size and forecast 2017-2022
  • EMEA - Market size and forecast 2017-2022
  • Key leading countries
  • Market opportunity

PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 13: MARKET TRENDS

  • Increasing wafer size
  • Growing adoption of 3-D NAND
  • Rise in M&A

PART 14: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption
  • Competitive scenario

PART 15: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • FormFactor
  • JAPAN ELECTRONIC MATERIALS
  • MICRONICS JAPAN
  • MPI
  • Technoprobe
  • List of abbreviations
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