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ダイアタッチマシン市場レポート：タイプ別、技術別、用途別、地域別、2025-2033年

Die Attach Machine Market Report by Type, Technique, Application, and Region 2025-2033

出版日
発行
IMARC
ページ情報
英文 137 Pages
納期
2～3営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=145.63円
ダイアタッチマシン市場レポート：タイプ別、技術別、用途別、地域別、2025-2033年
出版日: 2025年01月10日
発行: IMARC
ページ情報: 英文 137 Pages
納期: 2～3営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 図表
  • 目次
概要

ダイアタッチマシンの市場の世界市場規模は、2024年に11億7,040万米ドルに達しました。今後、IMARC Groupは、市場は2033年までに17億2,440万米ドルに達し、2025年から2033年にかけて4.18%の成長率（CAGR）を示すと予測しています。半導体の生産量の増加、再生可能エネルギー源の需要増、自律走行車、電気自動車、高級車の販売増などが市場を牽引する主な要因です。

ダイアタッチとは、半導体チップを基板やパッケージに取り付ける工程です。さまざまな種類のパッケージングの基本であり、エポキシ、ポリイミド、銀入りガラスなどさまざまな材料を使用します。ダイアタッチマシンは、高い精度と正確さでダイを基板やパッケージに配置するように設計されています。ダイアタッチマシンは、ダイマウントマシンやダイボンドマシンとしても知られ、ダイが適切に位置決めされ、加熱接着剤や熱圧着プロセスで接着されるよう、ビジョンシステムやその他のセンサーが装備されています。現在、コンシューマーエレクトロニクスの販売台数の増加が、ダイアタッチマシンの世界の需要拡大に拍車をかけています。

ダイアタッチマシンの市場動向：

マイクロプロセッサー、メモリチップ、その他の集積回路（IC）などの半導体デバイスの生産において、ダイアタッチマシンの利用が増加していることが、世界の市場成長の主な要因の1つとなっています。さらに、半導体デバイスのパッケージングにおいて、ダイアタッチマシンの使用が増加していることも、市場の成長を後押ししています。さらに、さまざまな電子機器の電子部品を接続するプリント回路基板（PCB）製造におけるダイアタッチマシンの用途拡大も、市場にプラスの影響を与えています。これとは別に、自動車産業では、センサー、エンジンとトランスミッションの制御モジュール、安全、ナビゲーション、オーディオシステム、ADAS（先進運転支援システム）、電気モーターコントローラーなど、自動車のさまざまな部品を製造するために、ダイアタッチマシンが採用されています。これに加え、所得水準の上昇を背景に電気自動車や高級車の販売が増加していることが、市場の成長に寄与しています。さらに、ペースメーカー、インスリンポンプ、埋め込み型機器、グルコースメーター、血圧モニターなどの医療機器へのダイアタッチマシンの採用が増加しています。これに加え、重篤な病状の急増が市場成長を後押ししています。さらに、スマートウォッチやフィットネストラッカーなどのウェアラブルデバイスの需要が増加していることも、市場に明るい見通しをもたらしています。このほか、風力タービンやソーラーパネルなどの再生可能エネルギー源に対する需要の高まりが、ダイアタッチマシンのニーズを後押ししています。

本レポートで扱う主な質問

  • 世界のダイアタッチマシンの市場はこれまでどのように推移してきたのか？
  • ダイアタッチマシンの市場の世界市場における促進要因、抑制要因、機会は何か？
  • 各駆動要因、抑制要因、機会が世界のダイアタッチマシンの市場に与える影響は？
  • 主要な地域市場とは？
  • 最も魅力的なダイアタッチマシン市場はどの国か？
  • タイプ別の市場内訳は？
  • ダイアタッチマシンの市場で最も魅力的なタイプは？
  • 技術別の市場内訳は？
  • ダイアタッチマシンの市場で最も魅力的な技術は？
  • 用途別の市場内訳は？
  • ダイアタッチマシンの市場で最も魅力的な用途は？
  • 世界のダイアタッチマシンの市場の競合構造は？
  • 世界のダイアタッチマシンの市場における主要プレイヤー/企業は？

目次

第1章 序文

第2章 調査範囲と調査手法

  • 調査の目的
  • ステークホルダー
  • データソース
    • 一次情報
    • 二次情報
  • 市場推定
    • ボトムアップアプローチ
    • トップダウンアプローチ
  • 調査手法

第3章 エグゼクティブサマリー

第4章 イントロダクション

  • 概要
  • 主要業界動向

第5章 世界のダイアタッチマシン市場

  • 市場概要
  • 市場実績
  • COVID-19の影響
  • 市場予測

第6章 市場内訳：タイプ別

  • フリップチップボンダー
    • 市場動向
    • 市場予測
  • ダイボンダー
    • 市場動向
    • 市場予測

第7章 市場内訳：技術別

  • エポキシ
    • 市場動向
    • 市場予測
  • ソフトはんだ
    • 市場動向
    • 市場予測
  • 焼結
    • 市場動向
    • 市場予測
  • 共晶
    • 市場動向
    • 市場予測
  • その他
    • 市場動向
    • 市場予測

第8章 市場内訳：用途別

  • RFとMEMS
    • 市場動向
    • 市場予測
  • オプトエレクトロニクス
    • 市場動向
    • 市場予測
  • ロジック
    • 市場動向
    • 市場予測
  • メモリ
    • 市場動向
    • 市場予測
  • CMOSイメージセンサー
    • 市場動向
    • 市場予測
  • LED
    • 市場動向
    • 市場予測
  • その他
    • 市場動向
    • 市場予測

第9章 市場内訳：地域別

  • 北米
    • 米国
    • カナダ
  • アジア太平洋地域
    • 中国
    • 日本
    • インド
    • 韓国
    • オーストラリア
    • インドネシア
    • その他
  • 欧州
    • ドイツ
    • フランス
    • 英国
    • イタリア
    • スペイン
    • ロシア
    • その他
  • ラテンアメリカ
    • ブラジル
    • メキシコ
    • その他
  • 中東・アフリカ

第10章 促進要因・抑制要因・機会

  • 概要
  • 促進要因
  • 抑制要因
  • 機会

第11章 バリューチェーン分析

第12章 ポーターのファイブフォース分析

  • 概要
  • 買い手の交渉力
  • 供給企業の交渉力
  • 競合の程度
  • 新規参入業者の脅威
  • 代替品の脅威

第13章 価格分析

第14章 競合情勢

  • 市場構造
  • 主要企業
  • 主要企業のプロファイル
    • Anza Technology Inc.
    • ASM Pacific Technology Limited
    • Be Semiconductor Industries N.V.
    • Dr. Tresky AG
    • Fasford Technology Co Ltd.（Fuji Machinery Co., Ltd）
    • Hybond Inc.
    • Inseto UK Limited
    • Kulicke and Soffa Industries Inc.
    • MicroAssembly Technologies Ltd.
    • MRSI Systems（Mycronic AB（Publ））
    • Palomar Technologies Inc.
    • Shinkawa Ltd.（Yamaha Motor Co. Ltd.）
図表

List of Figures

  • Figure 1: Global: Die Attach Machine Market: Major Drivers and Challenges
  • Figure 2: Global: Die Attach Machine Market: Sales Value (in Million USD), 2019-2024
  • Figure 3: Global: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 4: Global: Die Attach Machine Market: Breakup by Type (in %), 2024
  • Figure 5: Global: Die Attach Machine Market: Breakup by Technique (in %), 2024
  • Figure 6: Global: Die Attach Machine Market: Breakup by Application (in %), 2024
  • Figure 7: Global: Die Attach Machine Market: Breakup by Region (in %), 2024
  • Figure 8: Global: Die Attach Machine (Flip Chip Bonder) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 9: Global: Die Attach Machine (Flip Chip Bonder) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 10: Global: Die Attach Machine (Die Bonder) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 11: Global: Die Attach Machine (Die Bonder) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 12: Global: Die Attach Machine (Epoxy) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 13: Global: Die Attach Machine (Epoxy) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 14: Global: Die Attach Machine (Soft Solder) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 15: Global: Die Attach Machine (Soft Solder) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 16: Global: Die Attach Machine (Sintering) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 17: Global: Die Attach Machine (Sintering) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 18: Global: Die Attach Machine (Eutectic) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 19: Global: Die Attach Machine (Eutectic) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 20: Global: Die Attach Machine (Other Techniques) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 21: Global: Die Attach Machine (Other Techniques) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 22: Global: Die Attach Machine (RF and MEMS) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 23: Global: Die Attach Machine (RF and MEMS) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 24: Global: Die Attach Machine (Optoelectronics) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 25: Global: Die Attach Machine (Optoelectronics) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 26: Global: Die Attach Machine (Logic) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 27: Global: Die Attach Machine (Logic) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 28: Global: Die Attach Machine (Memory) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 29: Global: Die Attach Machine (Memory) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 30: Global: Die Attach Machine (CMOS Image Sensors) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 31: Global: Die Attach Machine (CMOS Image Sensors) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 32: Global: Die Attach Machine (LED) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 33: Global: Die Attach Machine (LED) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 34: Global: Die Attach Machine (Other Applications) Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 35: Global: Die Attach Machine (Other Applications) Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 36: North America: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 37: North America: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 38: United States: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 39: United States: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 40: Canada: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 41: Canada: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 42: Asia-Pacific: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 43: Asia-Pacific: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 44: China: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 45: China: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 46: Japan: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 47: Japan: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 48: India: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 49: India: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 50: South Korea: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 51: South Korea: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 52: Australia: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 53: Australia: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 54: Indonesia: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 55: Indonesia: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 56: Others: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 57: Others: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 58: Europe: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 59: Europe: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 60: Germany: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 61: Germany: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 62: France: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 63: France: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 64: United Kingdom: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 65: United Kingdom: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 66: Italy: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 67: Italy: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 68: Spain: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 69: Spain: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 70: Russia: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 71: Russia: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 72: Others: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 73: Others: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 74: Latin America: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 75: Latin America: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 76: Brazil: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 77: Brazil: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 78: Mexico: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 79: Mexico: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 80: Others: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 81: Others: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 82: Middle East and Africa: Die Attach Machine Market: Sales Value (in Million USD), 2019 & 2024
  • Figure 83: Middle East and Africa: Die Attach Machine Market: Breakup by Country (in %), 2024
  • Figure 84: Middle East and Africa: Die Attach Machine Market Forecast: Sales Value (in Million USD), 2025-2033
  • Figure 85: Global: Die Attach Machine Industry: Drivers, Restraints, and Opportunities
  • Figure 86: Global: Die Attach Machine Industry: Value Chain Analysis
  • Figure 87: Global: Die Attach Machine Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Die Attach Machine Market: Key Industry Highlights, 2024 & 2033
  • Table 2: Global: Die Attach Machine Market Forecast: Breakup by Type (in Million USD), 2025-2033
  • Table 3: Global: Die Attach Machine Market Forecast: Breakup by Technique (in Million USD), 2025-2033
  • Table 4: Global: Die Attach Machine Market Forecast: Breakup by Application (in Million USD), 2025-2033
  • Table 5: Global: Die Attach Machine Market Forecast: Breakup by Region (in Million USD), 2025-2033
  • Table 6: Global: Die Attach Machine Market: Competitive Structure
  • Table 7: Global: Die Attach Machine Market: Key Players
目次
Product Code: SR112025A7423

The global die attach machine market size reached USD 1,170.4 Million in 2024. Looking forward, IMARC Group expects the market to reach USD 1,724.4 Million by 2033, exhibiting a growth rate (CAGR) of 4.18% during 2025-2033. The increasing production of semiconductors, rising demand for renewable energy sources and the growing sales of autonomous, electric, and luxury vehicles represent some of the key factors driving the market.

Die attach is the process wherein a semiconductor chip is attached to a substrate or package. It is considered fundamental to different types of packaging and uses various materials, such as epoxy, polyimide, and silver-filled glass. It is operated using a die attach machine that is designed to handle and place the die onto the substrate or package with high accuracy and precision. A die attach machine, also known as a die mount or die bond machine, is equipped with vision systems and other sensors to ensure that the die is adequately positioned and bonded using a heated adhesive or a thermocompression bonding process. At present, rising sales of consumer electronic devices are catalyzing the demand for die attach machine across the globe.

Die Attach Machine Market Trends:

The increasing utilization of die attach machines in the production of semiconductor devices, such as microprocessors, memory chips, and other integrated circuits (ICs), represents one of the major factors strengthening the market growth around the world. Moreover, the rising use of die attach machines in the packaging of semiconductor devices is favoring the market growth. In addition, the growing usage of die attach machines in the manufacturing of printed circuit boards (PCBs) to connect electronic components in different electronic devices is influencing the market positively. Apart from this, die attach machines are employed in the automotive industry to manufacture various parts of vehicles, including sensors, engine and transmission control modules, safety, navigation, and audio systems, advanced driver assistance systems (ADAS), and electric motor controllers. This, coupled with the increasing sales of electric and luxury vehicles on account of inflating income levels, is contributing to the market growth. Furthermore, there is a rise in the adoption of die attach machines in medical devices like pacemakers, insulin pumps, implantable devices, glucose meters, and blood pressure monitors. This, along with the surging prevalence of severe medical conditions, is fueling the market growth. Additionally, the increasing demand for wearable devices, such as smartwatches and fitness trackers, is creating a positive outlook for the market. Besides this, the growing demand for renewable energy sources, such as wind turbines and solar panels, is driving the need for die attach machines.

Key Market Segmentation:

Type Insights:

  • Flip Chip Bonder
  • Die Bonder

Technique Insights:

  • Epoxy
  • Soft Solder
  • Sintering
  • Eutectic
  • Others

Application Insights:

  • RF and MEMS
  • Optoelectronics
  • Logic
  • Memory
  • CMOS Image Sensors
  • LED
  • Others

Regional Insights:

  • North America
  • United States
  • Canada
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
  • Latin America
  • Brazil
  • Mexico
  • Others
  • Middle East and Africa
  • The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for die attach machines. Some of the factors driving the Asia Pacific die attach machine market included the increasing demand for semiconductor devices, advancements in packaging technology, and rising adoption of automation in the semiconductor industry.

Competitive Landscape:

  • The report has also provided a comprehensive analysis of the competitive landscape in the global die attach machine market. Competitive analysis such as market structure, market share by key players, player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided. Some of the companies covered Anza Technology Inc., ASM Pacific Technology Limited, Be Semiconductor Industries N.V., Dr. Tresky AG, Fasford Technology Co Ltd. (Fuji Machinery Co., Ltd), Hybond Inc., Inseto UK Limited, Kulicke and Soffa Industries Inc., MicroAssembly Technologies Ltd., MRSI Systems (Mycronic AB (Publ)), Palomar Technologies Inc., Shinkawa Ltd. (Yamaha Motor Co. Ltd.), etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report:

  • How has the global die attach machine market performed so far, and how will it perform in the coming years?
  • What are the drivers, restraints, and opportunities in the global die attach machine market?
  • What is the impact of each driver, restraint, and opportunity on the global die attach machine market?
  • What are the key regional markets?
  • Which countries represent the most attractive die attach machine markets?
  • What is the breakup of the market based on the type?
  • Which is the most attractive type in the die attach machine market?
  • What is the breakup of the market based on the technique?
  • Which is the most attractive technique in the die attach machine market?
  • What is the breakup of the market based on the application?
  • Which is the most attractive application in the die attach machine market?
  • What is the competitive structure of the global die attach machine market?
  • Who are the key players/companies in the global die attach machine market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Die Attach Machine Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Flip Chip Bonder
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Die Bonder
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by Technique

  • 7.1 Epoxy
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Soft Solder
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Sintering
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Eutectic
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Others
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast

8 Market Breakup by Application

  • 8.1 RF and MEMS
    • 8.1.1 Market Trends
    • 8.1.2 Market Forecast
  • 8.2 Optoelectronics
    • 8.2.1 Market Trends
    • 8.2.2 Market Forecast
  • 8.3 Logic
    • 8.3.1 Market Trends
    • 8.3.2 Market Forecast
  • 8.4 Memory
    • 8.4.1 Market Trends
    • 8.4.2 Market Forecast
  • 8.5 CMOS Image Sensors
    • 8.5.1 Market Trends
    • 8.5.2 Market Forecast
  • 8.6 LED
    • 8.6.1 Market Trends
    • 8.6.2 Market Forecast
  • 8.7 Others
    • 8.7.1 Market Trends
    • 8.7.2 Market Forecast

9 Market Breakup by Region

  • 9.1 North America
    • 9.1.1 United States
      • 9.1.1.1 Market Trends
      • 9.1.1.2 Market Forecast
    • 9.1.2 Canada
      • 9.1.2.1 Market Trends
      • 9.1.2.2 Market Forecast
  • 9.2 Asia-Pacific
    • 9.2.1 China
      • 9.2.1.1 Market Trends
      • 9.2.1.2 Market Forecast
    • 9.2.2 Japan
      • 9.2.2.1 Market Trends
      • 9.2.2.2 Market Forecast
    • 9.2.3 India
      • 9.2.3.1 Market Trends
      • 9.2.3.2 Market Forecast
    • 9.2.4 South Korea
      • 9.2.4.1 Market Trends
      • 9.2.4.2 Market Forecast
    • 9.2.5 Australia
      • 9.2.5.1 Market Trends
      • 9.2.5.2 Market Forecast
    • 9.2.6 Indonesia
      • 9.2.6.1 Market Trends
      • 9.2.6.2 Market Forecast
    • 9.2.7 Others
      • 9.2.7.1 Market Trends
      • 9.2.7.2 Market Forecast
  • 9.3 Europe
    • 9.3.1 Germany
      • 9.3.1.1 Market Trends
      • 9.3.1.2 Market Forecast
    • 9.3.2 France
      • 9.3.2.1 Market Trends
      • 9.3.2.2 Market Forecast
    • 9.3.3 United Kingdom
      • 9.3.3.1 Market Trends
      • 9.3.3.2 Market Forecast
    • 9.3.4 Italy
      • 9.3.4.1 Market Trends
      • 9.3.4.2 Market Forecast
    • 9.3.5 Spain
      • 9.3.5.1 Market Trends
      • 9.3.5.2 Market Forecast
    • 9.3.6 Russia
      • 9.3.6.1 Market Trends
      • 9.3.6.2 Market Forecast
    • 9.3.7 Others
      • 9.3.7.1 Market Trends
      • 9.3.7.2 Market Forecast
  • 9.4 Latin America
    • 9.4.1 Brazil
      • 9.4.1.1 Market Trends
      • 9.4.1.2 Market Forecast
    • 9.4.2 Mexico
      • 9.4.2.1 Market Trends
      • 9.4.2.2 Market Forecast
    • 9.4.3 Others
      • 9.4.3.1 Market Trends
      • 9.4.3.2 Market Forecast
  • 9.5 Middle East and Africa
    • 9.5.1 Market Trends
    • 9.5.2 Market Breakup by Country
    • 9.5.3 Market Forecast

10 Drivers, Restraints, and Opportunities

  • 10.1 Overview
  • 10.2 Drivers
  • 10.3 Restraints
  • 10.4 Opportunities

11 Value Chain Analysis

12 Porters Five Forces Analysis

  • 12.1 Overview
  • 12.2 Bargaining Power of Buyers
  • 12.3 Bargaining Power of Suppliers
  • 12.4 Degree of Competition
  • 12.5 Threat of New Entrants
  • 12.6 Threat of Substitutes

13 Price Analysis

14 Competitive Landscape

  • 14.1 Market Structure
  • 14.2 Key Players
  • 14.3 Profiles of Key Players
    • 14.3.1 Anza Technology Inc.
      • 14.3.1.1 Company Overview
      • 14.3.1.2 Product Portfolio
    • 14.3.2 ASM Pacific Technology Limited
      • 14.3.2.1 Company Overview
      • 14.3.2.2 Product Portfolio
    • 14.3.3 Be Semiconductor Industries N.V.
      • 14.3.3.1 Company Overview
      • 14.3.3.2 Product Portfolio
      • 14.3.3.3 Financials
      • 14.3.3.4 SWOT Analysis
    • 14.3.4 Dr. Tresky AG
      • 14.3.4.1 Company Overview
      • 14.3.4.2 Product Portfolio
    • 14.3.5 Fasford Technology Co Ltd. (Fuji Machinery Co., Ltd)
      • 14.3.5.1 Company Overview
      • 14.3.5.2 Product Portfolio
    • 14.3.6 Hybond Inc.
      • 14.3.6.1 Company Overview
      • 14.3.6.2 Product Portfolio
    • 14.3.7 Inseto UK Limited
      • 14.3.7.1 Company Overview
      • 14.3.7.2 Product Portfolio
    • 14.3.8 Kulicke and Soffa Industries Inc.
      • 14.3.8.1 Company Overview
      • 14.3.8.2 Product Portfolio
      • 14.3.8.3 Financials
    • 14.3.9 MicroAssembly Technologies Ltd.
      • 14.3.9.1 Company Overview
      • 14.3.9.2 Product Portfolio
    • 14.3.10 MRSI Systems (Mycronic AB (Publ))
      • 14.3.10.1 Company Overview
      • 14.3.10.2 Product Portfolio
    • 14.3.11 Palomar Technologies Inc.
      • 14.3.11.1 Company Overview
      • 14.3.11.2 Product Portfolio
    • 14.3.12 Shinkawa Ltd. (Yamaha Motor Co. Ltd.)
      • 14.3.12.1 Company Overview
      • 14.3.12.2 Product Portfolio

Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.