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市場調査レポート
商品コード
1609738

日本の半導体製造装置市場レポート：装置タイプ別、製品タイプ別、ディメンション別、サプライチェーン参入企業別、地域別、2024年～2032年

Japan Semiconductor Manufacturing Equipment Market Report by Equipment Type, Product Type, Dimension, Supply Chain Participant, and Region 2024-2032

出版日
発行
IMARC
ページ情報
英文 119 Pages
納期
5～7営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=143.57円
日本の半導体製造装置市場レポート：装置タイプ別、製品タイプ別、ディメンション別、サプライチェーン参入企業別、地域別、2024年～2032年
出版日: 2024年12月05日
発行: IMARC
ページ情報: 英文 119 Pages
納期: 5～7営業日
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  • 全表示
  • 概要
  • 目次
概要

日本の半導体製造装置市場の市場規模は2023年に59億米ドルに達しました。今後、IMARC Groupは、市場は2032年までに133億米ドルに達し、2024年から2032年の間に9.50%の成長率（CAGR）を示すと予測しています。コネクテッドデバイスの普及とともに、デバイスの小型化の人気が高まっていることが、主に市場成長の原動力となっています。

本レポートで扱う主な質問

  • 日本の半導体製造装置市場はこれまでどのように推移し、今後どのように推移するのか？
  • 日本の半導体製造装置市場にCOVID-19が与えた影響は？
  • 日本の半導体製造装置市場の装置タイプ別の内訳は？
  • 日本の半導体製造装置市場の製品タイプ別の内訳は？
  • 日本の半導体製造装置市場のディメンション別の内訳は？
  • 日本の半導体製造装置市場のサプライチェーン参入企業別の内訳は？
  • 日本の半導体製造装置市場のバリューチェーンにはどのような段階がありますか？
  • 日本の半導体製造装置の主な促進要因と課題は？
  • 日本の半導体製造装置市場の構造と主要プレーヤーは？
  • 日本の半導体製造装置市場における競合の程度は？

目次

第1章 序文

第2章 調査範囲と調査手法

  • 調査の目的
  • ステークホルダー
  • データソース
  • 市場推定
  • 調査手法

第3章 エグゼクティブサマリー

第4章 日本の半導体製造装置市場：イントロダクション

  • 概要
  • 市場力学
  • 業界動向
  • 競合情報

第5章 日本の半導体製造装置市場情勢

  • 過去および現在の市場動向（2018～2023年）
  • 市場予測（2024～2032年）

第6章 日本の半導体製造装置市場：装置タイプ別の内訳

  • フロントエンド
  • バックエンド
  • ファブ設備機器

第7章 日本の半導体製造装置市場：製品タイプ別の内訳

  • メモリ
  • ロジックコンポーネント
  • マイクロプロセッサ
  • アナログコンポーネント
  • 光電子部品
  • 個別コンポーネント
  • その他

第8章 日本の半導体製造装置市場：ディメンション別の内訳

  • 2D
  • 2.5D
  • 3D

第9章 日本の半導体製造装置市場：サプライチェーン参入企業別の内訳

  • IDM企業
  • OSAT企業
  • 鋳造

第10章 日本の半導体製造装置市場：競合情勢

  • 概要
  • 市場構造
  • 市場プレーヤーのポジショニング
  • 主要成功戦略
  • 競合ダッシュボード
  • 企業評価象限

第11章 主要企業のプロファイル

第12章 日本の半導体製造装置市場：業界分析

  • 促進要因・抑制要因・機会
  • ポーターのファイブフォース分析
  • バリューチェーン分析

第13章 付録

目次
Product Code: SR112024A18686

Japan semiconductor manufacturing equipment market size reached US$ 5.9 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 13.3 Billion by 2032, exhibiting a growth rate (CAGR) of 9.50% during 2024-2032. The rising popularity of device miniaturization, along with the widespread adoption of connected devices, is primarily driving the market growth.

Semiconductor manufacturing equipment encompass the machinery employed in the production of a wide range of electronic components and integrated circuits (ICs). Among the commonly utilized devices are the front-end and back-end equipment. In addition to this, the front-end category comprises machines used in silicon-wafer fabrication, photolithography, deposition, etching, ion implantation, and mechanical polishing. In contrast, the back-end category involves machinery used in the assembly, packaging, and testing of integrated circuits. These machines offer numerous advantages, including streamlined production processes, enhanced yield and reliability, reduction in design and manufacturing errors, and improved workplace safety. Consequently, they have found widespread applications in the manufacturing of various products across industries such as automotive, electronics, robotics, etc.

Japan Semiconductor Manufacturing Equipment Market Trends:

The Japan market for semiconductor manufacturing equipment is primarily being propelled by the burgeoning electronics sector, given the widespread use of semiconductors in consumer electronics like smartphones, tablets, and laptops. Furthermore, the increasing demand for hybrid and electric vehicles (H/EVs) stands as another significant driver of growth. Besides this, these manufacturing equipment is instrumental in the assembly of multiple semiconductors onto a single chip, reducing electronic interference and enhancing the protection of electronic devices, which is positively influencing the regional market. Additionally, several key market players are introducing advanced product variations in a bid to broaden their customer base. This, combined with various technological advancements, such as the integration of artificial intelligence (AI) solutions and the incorporation of connected devices into the Internet of Things (IoT), is exerting a positive impact on market growth. Apart from this, manufacturers are employing silicon-based sensors in their manufacturing equipment. These sensors provide the ability to remotely monitor intricate circuit boards. Moreover, the emerging trend of device miniaturization and extensive research and development (R&D) activities are among the other factors expected to drive market growth in the forthcoming years in Japan.

Japan Semiconductor Manufacturing Equipment Market Segmentation:

Equipment Type Insights:

  • Front-End
  • Lithography
  • Deposition
  • Cleaning
  • Wafer Surface Conditioning
  • Others
  • Back-End
  • Testing
  • Assembly and Packaging
  • Dicing
  • Bonding
  • Metrology
  • Others
  • Fab Facility Equipment
  • Automation
  • Chemical Control
  • Gas Control
  • Others

Product Type Insights:

  • Memory
  • Logic Components
  • Microprocessor
  • Analog Components
  • Optoelectronic Components
  • Discrete Components
  • Others

Dimension Insights:

  • 2D
  • 2.5D
  • 3D

Supply Chain Participant Insights:

  • IDM Firms
  • OSAT Companies
  • Foundries

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape in the market. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.

Key Questions Answered in This Report:

  • How has the Japan semiconductor manufacturing equipment market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the Japan semiconductor manufacturing equipment market?
  • What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of equipment type?
  • What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of product type?
  • What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of dimension?
  • What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of supply chain participant?
  • What are the various stages in the value chain of the Japan semiconductor manufacturing equipment market?
  • What are the key driving factors and challenges in the Japan semiconductor manufacturing equipment?
  • What is the structure of the Japan semiconductor manufacturing equipment market and who are the key players?
  • What is the degree of competition in the Japan semiconductor manufacturing equipment market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Japan Semiconductor Manufacturing Equipment Market - Introduction

  • 4.1 Overview
  • 4.2 Market Dynamics
  • 4.3 Industry Trends
  • 4.4 Competitive Intelligence

5 Japan Semiconductor Manufacturing Equipment Market Landscape

  • 5.1 Historical and Current Market Trends (2018-2023)
  • 5.2 Market Forecast (2024-2032)

6 Japan Semiconductor Manufacturing Equipment Market - Breakup by Equipment Type

  • 6.1 Front-End
    • 6.1.1 Overview
    • 6.1.2 Historical and Current Market Trends (2018-2023)
    • 6.1.3 Market Segmentation
      • 6.1.3.1 Lithography
      • 6.1.3.2 Deposition
      • 6.1.3.3 Cleaning
      • 6.1.3.4 Wafer Surface Conditioning
      • 6.1.3.5 Others
    • 6.1.4 Market Forecast (2024-2032)
  • 6.2 Back-End
    • 6.2.1 Overview
    • 6.2.2 Historical and Current Market Trends (2018-2023)
    • 6.2.3 Market Segmentation
      • 6.2.3.1 Testing
      • 6.2.3.2 Assembly and Packaging
      • 6.2.3.3 Dicing
      • 6.2.3.4 Bonding
      • 6.2.3.3 Metrology
      • 6.2.3.4 Others
    • 6.2.4 Market Forecast (2024-2032)
  • 6.3 Fab Facility Equipment
    • 6.3.1 Overview
    • 6.3.2 Historical and Current Market Trends (2018-2023)
    • 6.3.3 Market Segmentation
      • 6.3.3.1 Automation
      • 6.3.3.2 Chemical Control
      • 6.3.3.3 Gas Control
      • 6.3.3.4 Others
    • 6.3.4 Market Forecast (2024-2032)

7 Japan Semiconductor Manufacturing Equipment Market - Breakup by Product Type

  • 7.1 Memory
    • 7.1.1 Overview
    • 7.1.2 Historical and Current Market Trends (2018-2023)
    • 7.1.3 Market Forecast (2024-2032)
  • 7.2 Logic Components
    • 7.2.1 Overview
    • 7.2.2 Historical and Current Market Trends (2018-2023)
    • 7.2.3 Market Forecast (2024-2032)
  • 7.3 Microprocessor
    • 7.3.1 Overview
    • 7.3.2 Historical and Current Market Trends (2018-2023)
    • 7.3.3 Market Forecast (2024-2032)
  • 7.4 Analog Components
    • 7.4.1 Overview
    • 7.4.2 Historical and Current Market Trends (2018-2023)
    • 7.4.3 Market Forecast (2024-2032)
  • 7.5 Optoelectronic Components
    • 7.5.1 Overview
    • 7.5.2 Historical and Current Market Trends (2018-2023)
    • 7.5.3 Market Forecast (2024-2032)
  • 7.6 Discrete Components
    • 7.6.1 Overview
    • 7.6.2 Historical and Current Market Trends (2018-2023)
    • 7.6.3 Market Forecast (2024-2032)
  • 7.7 Others
    • 7.7.1 Historical and Current Market Trends (2018-2023)
    • 7.7.2 Market Forecast (2024-2032)

8 Japan Semiconductor Manufacturing Equipment Market - Breakup by Dimension

  • 8.1 2D
    • 8.1.1 Overview
    • 8.1.2 Historical and Current Market Trends (2018-2023)
    • 8.1.3 Market Forecast (2024-2032)
  • 8.2 2.5D
    • 8.2.1 Overview
    • 8.2.2 Historical and Current Market Trends (2018-2023)
    • 8.2.3 Market Forecast (2024-2032)
  • 8.3 3D
    • 8.3.1 Overview
    • 8.3.2 Historical and Current Market Trends (2018-2023)
    • 8.3.3 Market Forecast (2024-2032)

9 Japan Semiconductor Manufacturing Equipment Market - Breakup by Supply Chain Participant

  • 9.1 IDM Firms
    • 9.1.1 Overview
    • 9.1.2 Historical and Current Market Trends (2018-2023)
    • 9.1.3 Market Forecast (2024-2032)
  • 9.2 OSAT Companies
    • 9.2.1 Overview
    • 9.2.2 Historical and Current Market Trends (2018-2023)
    • 9.2.3 Market Forecast (2024-2032)
  • 9.3 Foundries
    • 9.3.1 Overview
    • 9.3.2 Historical and Current Market Trends (2018-2023)
    • 9.3.3 Market Forecast (2024-2032)

10 Japan Semiconductor Manufacturing Equipment Market - Competitive Landscape

  • 10.1 Overview
  • 10.2 Market Structure
  • 10.3 Market Player Positioning
  • 10.4 Top Winning Strategies
  • 10.5 Competitive Dashboard
  • 10.6 Company Evaluation Quadrant

11 Profiles of Key Players

  • 11.1 Company A
    • 11.1.1 Business Overview
    • 11.1.2 Product Portfolio
    • 11.1.3 Business Strategies
    • 11.1.4 SWOT Analysis
    • 11.1.5 Major News and Events
  • 11.2 Company B
    • 11.2.1 Business Overview
    • 11.2.2 Product Portfolio
    • 11.2.3 Business Strategies
    • 11.2.4 SWOT Analysis
    • 11.2.5 Major News and Events
  • 11.3 Company C
    • 11.3.1 Business Overview
    • 11.3.2 Product Portfolio
    • 11.3.3 Business Strategies
    • 11.3.4 SWOT Analysis
    • 11.3.5 Major News and Events
  • 11.4 Company D
    • 11.4.1 Business Overview
    • 11.4.2 Product Portfolio
    • 11.4.3 Business Strategies
    • 11.4.4 SWOT Analysis
    • 11.4.5 Major News and Events
  • 11.5 Company E
    • 11.5.1 Business Overview
    • 11.5.2 Product Portfolio
    • 11.5.3 Business Strategies
    • 11.5.4 SWOT Analysis
    • 11.5.5 Major News and Events

12 Japan Semiconductor Manufacturing Equipment Market - Industry Analysis

  • 12.1 Drivers, Restraints, and Opportunities
    • 12.1.1 Overview
    • 12.1.2 Drivers
    • 12.1.3 Restraints
    • 12.1.4 Opportunities
  • 12.2 Porters Five Forces Analysis
    • 12.2.1 Overview
    • 12.2.2 Bargaining Power of Buyers
    • 12.2.3 Bargaining Power of Suppliers
    • 12.2.4 Degree of Competition
    • 12.2.5 Threat of New Entrants
    • 12.2.6 Threat of Substitutes
  • 12.3 Value Chain Analysis

13 Appendix