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ウエハーレベルパッケージング市場レポート:パッケージング技術、最終用途産業、地域別、2024~2032年

Wafer Level Packaging Market Report by Packaging Technology, End Use Industry, and Region 2024-2032

出版日: | 発行: IMARC | ページ情報: 英文 141 Pages | 納期: 2~3営業日

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価格
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本日の銀行送金レート: 1USD=160.56円
ウエハーレベルパッケージング市場レポート:パッケージング技術、最終用途産業、地域別、2024~2032年
出版日: 2024年04月08日
発行: IMARC
ページ情報: 英文 141 Pages
納期: 2~3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界のウエハーレベルパッケージング市場規模は2023年に57億米ドルに達しました。今後、IMARC Groupは、市場は2032年までに225億米ドルに達し、2024~2032年の間に16.1%の成長率(CAGR)を示すと予測しています。

ウエハーレベルパッケージング(WLP)は、電子接続や集積回路(IC)の保護層を追加するために使用されるパッケージングソリューションを指します。マイクロフォン、圧力センサー、加速度計、ジャイロスコープ、コンデンサー、抵抗器、トランジスタなどのデバイスに使用されます。一般的に使用されるWLPの集積タイプには、ファンアウト(FO)、ファンイン(FI)、フリップチップ、3D FOWLPなどがあります。これらのソリューションは、ウエハーを個々のダイにダイシングしてパッケージングするのではなく、デバイスのウエハーレベルで使用されます。これにより、ウエハーチップサイズの縮小、製造工程の合理化、チップ機能の向上など、さまざまな利点が得られます。また、極薄ウエハーは、放熱性と性能の向上、フォームファクターの縮小、消費電力の最小化も実現します。

世界中のエレクトロニクス産業の著しい成長は、市場成長に明るい展望をもたらす重要な要因のひとつです。さらに、よりコンパクトで高速な民生用電子機器への要求が高まっていることも、市場成長の原動力となっています。このため、機械的保護、構造的サポート、デバイスのバッテリー寿命延長を強化するための、コスト効率に優れた高性能パッケージングソリューションに対する需要も全体的に高まっています。さらに、コネクテッドデバイスとモノのインターネット(IoT)の統合など、さまざまな技術の進歩も成長を促す要因となっています。例えば、WLPは自動運転自動車のレーダーシステムの製造に広く使われています。また、医療セグメントでは、さまざまなウェアラブルデバイスの製造に使用されています。その他の要因としては、マイクロエレクトロニクスデバイスにおける回路の微細化の進展や、広範な研究開発(R&D)活動などがあり、市場をさらに牽引すると予想されます。

本レポートで扱う主要質問

  • ウエハーレベルパッケージングの世界市場規模は?
  • 2024~2032年のウエハーレベルパッケージング世界市場の予想成長率は?
  • ウエハーレベルパッケージングの世界市場を牽引する主要因は?
  • ウエハレベルパッケージングの世界市場におけるCOVID-19の影響は?
  • パッケージング技術別のウエハーレベルパッケージングの世界市場内訳は?
  • ウエハーレベルパッケージングの世界市場の最終用途産業別の区分は?
  • ウエハーレベルパッケージングの世界市場における主要地域は?
  • ウエハーレベルパッケージングの世界市場における主要参入企業は?

目次

第1章 序文

第2章 調査範囲と調査手法

  • 調査目的
  • 利害関係者
  • データソース
    • 一次情報
    • 二次情報
  • 市場推定
    • ボトムアップアプローチ
    • トップダウンアプローチ
  • 調査手法

第3章 エグゼクティブサマリー

第4章 イントロダクション

  • 概要
  • 主要産業動向

第5章 ウエハーレベルパッケージングの世界市場

  • 市場概要
  • 市場実績
  • COVID-19の影響
  • 市場予測

第6章 市場内訳:パッケージング技術別

  • 3D TSV WLP
    • 市場動向
    • 市場展望
  • 2.5D TSV WLP
  • WLCSP
  • ナノWLP
    • 市場動向
    • 市場展望
  • その他

第7章 市場内訳:最終用途産業別

  • 航空宇宙・防衛
  • コンシューマーエレクトロニクス
  • IT・通信
  • 医療
  • 自動車
  • その他

第8章 市場内訳:地域別

  • 北米
    • 米国
    • カナダ
  • アジア太平洋
    • 中国
    • 日本
    • インド
    • 韓国
    • オーストラリア
    • インドネシア
    • その他
  • 欧州
    • ドイツ
    • フランス
    • 英国
    • イタリア
    • スペイン
    • ロシア
    • その他
  • ラテンアメリカ
    • ブラジル
    • メキシコ
    • その他
  • 中東・アフリカ
    • 市場動向
    • 市場内訳:国別
    • 市場予測

第9章 SWOT分析

  • 概要
  • 強み
  • 弱み
  • 機会
  • 脅威

第10章 バリューチェーン分析

第11章 ポーターのファイブフォース分析

  • 概要
  • 買い手の交渉力
  • 供給企業の交渉力
  • 競合の程度
  • 新規参入業者の脅威
  • 代替品の脅威

第12章 価格分析

第13章 競合情勢

  • 市場構造
  • 主要企業
  • 主要企業のプロファイル
    • Amkor Technology Inc.
    • China Wafer Level CSP Co. Ltd.
    • Chipbond Technology Corporation
    • Deca Technologies Inc.(Infineon Technologies AG)
    • Fujitsu Limited
    • IQE PLC
    • JCET Group Co. Ltd.
    • Siliconware Precision Industries Co. Ltd.(Advanced Semiconductor Engineering Inc.)
    • Tokyo Electron Ltd.
    • Toshiba Corporation
図表

List of Figures

  • Figure 1: Global: Wafer Level Packaging Market: Major Drivers and Challenges
  • Figure 2: Global: Wafer Level Packaging Market: Sales Value (in Billion US$), 2018-2023
  • Figure 3: Global: Wafer Level Packaging Market Forecast: Sales Value (in Billion US$), 2024-2032
  • Figure 4: Global: Wafer Level Packaging Market: Breakup by Packaging Technology (in %), 2023
  • Figure 5: Global: Wafer Level Packaging Market: Breakup by End Use Industry (in %), 2023
  • Figure 6: Global: Wafer Level Packaging Market: Breakup by Region (in %), 2023
  • Figure 7: Global: Wafer Level Packaging (3D TSV WLP) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 8: Global: Wafer Level Packaging (3D TSV WLP) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 9: Global: Wafer Level Packaging (2.5D TSV WLP) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: Wafer Level Packaging (2.5D TSV WLP) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: Wafer Level Packaging (WLCSP) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: Wafer Level Packaging (WLCSP) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: Wafer Level Packaging (Nano WLP) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: Wafer Level Packaging (Nano WLP) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: Wafer Level Packaging (Others) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: Wafer Level Packaging (Others) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: Wafer Level Packaging (Aerospace and Defense) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: Wafer Level Packaging (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: Global: Wafer Level Packaging (Consumer Electronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: Global: Wafer Level Packaging (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: Global: Wafer Level Packaging (IT & Telecommunication) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: Global: Wafer Level Packaging (IT & Telecommunication) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Global: Wafer Level Packaging (Healthcare) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Global: Wafer Level Packaging (Healthcare) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Global: Wafer Level Packaging (Automotive) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Global: Wafer Level Packaging (Automotive) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: Global: Wafer Level Packaging (Others) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: Global: Wafer Level Packaging (Others) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: North America: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: United States: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 31: United States: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 32: Canada: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 33: Canada: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 34: North America: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Asia-Pacific: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: China: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 37: China: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 38: Japan: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 39: Japan: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 40: India: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 41: India: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 42: South Korea: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 43: South Korea: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 44: Australia: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 45: Australia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 46: Indonesia: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 47: Indonesia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 48: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 49: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 50: Asia-Pacific: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: Europe: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: Germany: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 53: Germany: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 54: France: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 55: France: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 56: United Kingdom: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 57: United Kingdom: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 58: Italy: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 59: Italy: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 60: Spain: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 61: Spain: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 62: Russia: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 63: Russia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 64: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 65: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 66: Europe: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 67: Latin America: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 68: Brazil: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 69: Brazil: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 70: Mexico: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 71: Mexico: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 72: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 73: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 74: Latin America: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 75: Middle East and Africa: Wafer Level Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 76: Middle East and Africa: Wafer Level Packaging Market: Breakup by Country (in %), 2023
  • Figure 77: Middle East and Africa: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 78: Global: Wafer Level Packaging Industry: SWOT Analysis
  • Figure 79: Global: Wafer Level Packaging Industry: Value Chain Analysis
  • Figure 80: Global: Wafer Level Packaging Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Wafer Level Packaging Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: Wafer Level Packaging Market Forecast: Breakup by Packaging Technology (in Million US$), 2024-2032
  • Table 3: Global: Wafer Level Packaging Market Forecast: Breakup by End Use Industry (in Million US$), 2024-2032
  • Table 4: Global: Wafer Level Packaging Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 5: Global: Wafer Level Packaging Market: Competitive Structure
  • Table 6: Global: Wafer Level Packaging Market: Key Players
目次
Product Code: SR112024A3283

The global wafer level packaging market size reached US$ 5.7 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 22.5 Billion by 2032, exhibiting a growth rate (CAGR) of 16.1% during 2024-2032.

The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs). It is used for devices, such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them. This offers various benefits, such as a reduction in the size of the wafer chips, streamlining of the manufacturing processes and improvements in chip functionalities. The ultrathin wafers also provide improved heat dissipation and performance, form factor reduction and minimal power consumption.

Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors. For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global wafer level packaging market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on packaging technology and end use industry.

Breakup by Packaging Technology:

3D TSV WLP

2.5D TSV WLP

WLCSP

Nano WLP

Others

Breakup by End Use Industry:

Aerospace and Defense

Consumer Electronics

IT & Telecommunication

Healthcare

Automotive

Others

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation.

Key Questions Answered in This Report

  • 1. How big is the global wafer level packaging market?
  • 2. What is the expected growth rate of the global wafer level packaging market during 2024-2032?
  • 3. What are the key factors driving the global wafer level packaging market?
  • 4. What has been the impact of COVID-19 on the global wafer level packaging market?
  • 5. What is the breakup of the global wafer level packaging market based on the packaging technology?
  • 6. What is the breakup of the global wafer level packaging market based on the end use industry?
  • 7. What are the key regions in the global wafer level packaging market?
  • 8. Who are the key players/companies in the global wafer level packaging market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Wafer Level Packaging Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Packaging Technology

  • 6.1 3D TSV WLP
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 2.5D TSV WLP
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 WLCSP
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast
  • 6.4 Nano WLP
    • 6.4.1 Market Trends
    • 6.4.2 Market Forecast
  • 6.5 Others
    • 6.5.1 Market Trends
    • 6.5.2 Market Forecast

7 Market Breakup by End Use Industry

  • 7.1 Aerospace and Defense
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Consumer Electronics
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 IT & Telecommunication
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Healthcare
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Automotive
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast
  • 7.6 Others
    • 7.6.1 Market Trends
    • 7.6.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 Amkor Technology Inc.
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
      • 13.3.1.3 Financials
      • 13.3.1.4 SWOT Analysis
    • 13.3.2 China Wafer Level CSP Co. Ltd.
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
      • 13.3.2.3 SWOT Analysis
    • 13.3.3 Chipbond Technology Corporation
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
      • 13.3.3.3 SWOT Analysis
    • 13.3.4 Deca Technologies Inc. (Infineon Technologies AG)
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
    • 13.3.5 Fujitsu Limited
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
      • 13.3.5.3 Financials
      • 13.3.5.4 SWOT Analysis
    • 13.3.6 IQE PLC
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
      • 13.3.6.3 SWOT Analysis
    • 13.3.7 JCET Group Co. Ltd.
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 SWOT Analysis
    • 13.3.8 Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
      • 13.3.8.3 Financials
    • 13.3.9 Tokyo Electron Ltd.
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
      • 13.3.9.3 Financials
      • 13.3.9.4 SWOT Analysis
    • 13.3.10 Toshiba Corporation
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
      • 13.3.10.3 Financials
      • 13.3.10.4 SWOT Analysis