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市場調査レポート
商品コード
1467791
銅箔市場レポート:製品タイプ、用途、最終用途産業、地域別、2024~2032年Copper Foil Market Report by Product Type, Application, End Use Industry, and Region 2024-2032 |
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銅箔市場レポート:製品タイプ、用途、最終用途産業、地域別、2024~2032年 |
出版日: 2024年04月08日
発行: IMARC
ページ情報: 英文 137 Pages
納期: 2~3営業日
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世界の銅箔市場規模は2023年に61億米ドルに達しました。今後、IMARC Groupは、2024~2032年の間に6.2%の成長率(CAGR)を示し、市場は2032年までに105億米ドルに達すると予測しています。
銅箔は、電気メッキや圧延によって作られる厚さ数ミクロンの銅の薄板です。電気と熱を通す万能材料です。そのため、回路基板や電池、太陽エネルギー機器などに広く使われています。このほか、パソコン(PC)や携帯電話などの通信機器に組み込まれるプリント基板(PCB)、リチウムイオン二次電池の集電体、プラズマディスプレイ(PDP)の電磁波シールド材などにも利用されています。
世界中でスマートフォン、ノートパソコン、パソコン、タブなどの電子機器の販売が伸びていることが、市場を牽引する重要な要因の一つとなっています。さらに、より良い接続ソリューションへのニーズの高まりによる5Gインフラの改善が、市場の成長を刺激しています。さらに、内燃機関車(ICE)からの温室効果ガス(GHG)排出量の増加や個人の環境意識の高まりを背景に、電気自動車(EV)の需要が増加しています。これに加えて、修道院、金看板、タイルモザイク、手工芸品などの装飾材料に銅箔の用途が増え、エンドユーザーや投資家に有利な成長機会を提供しています。これに加えて、世界中で変圧器やグリッドレベルのエネルギー貯蔵に銅箔が使われるようになってきていることも、市場にプラスの影響を与えています。さらに主要市場参入企業は、銅箔の表面特性を改善し、新しい表面処理コーティングを開拓し、多くの用途でより小さな厚みと重量を実現することで、製品の差別化を高めています。これらの参入企業はまた、全体的な売上と収益性を高めるために、合併買収(M&A)などの戦略を採用しています。
The global copper foil market size reached US$ 6.1 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 10.5 Billion by 2032, exhibiting a growth rate (CAGR) of 6.2% during 2024-2032.
Copper foil is a thin sheet of copper with a thickness of a few microns made by electroplating or rolling the copper sheet. It is a versatile material that conducts electricity and heat. As a result, it is widely used in circuit boards, batteries, and solar energy appliances. Besides this, it is utilized in the printed circuit boards (PCBs) that are incorporated into telecommunications equipment, such as personal computers (PCs), mobile phones, current collectors of lithium-ion secondary batteries, and the electromagnetic wave shield material of plasma displays (PDPs).
The growing sales of electronic devices, such as smartphones, laptops, computers, and tabs across the globe, represent one of the key factors driving the market. Moreover, the improving 5G infrastructure due to the rising need for better connecting solutions is stimulating the growth of the market. In addition, there is a rise in the demand for electric vehicles (EVs) on account of the increasing greenhouse gas (GHG) emissions from internal combustion engine (ICE) vehicles and the growing environmental awareness among individuals. This, along with the increasing applications of copper foils in decorative materials, such as monasteries, gold signs, tile mosaic, and handicrafts, is offering lucrative growth opportunities to the end-users and investors. Besides this, the rising application of copper foils in transformers and grid-level energy storage around the world is positively influencing the market. Furthermore, key market players are increasing product differentiation by improving the surface properties of the copper foil, developing new surface treatment coatings, and achieving smaller thickness and weight for numerous applications. These players are also adopting strategies, such as mergers and acquisitions (M&A), to increase their overall sales and profitability.
IMARC Group provides an analysis of the key trends in each sub-segment of the global copper foil market report, along with forecasts at the global, regional and country levels from 2024-2032. Our report has categorized the market based on product type, application, and end use industry.
Rolled Copper Foil
Electrodeposited Copper Foil
Printed Circuit Boards
Batteries
Electromagnetic Shielding
Others
Aerospace and Defense
Automotive
Building and Construction
Electrical and Electronics
Industrial Equipment
Medical
Others
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being Carl Schlenk AG, Chang Chun Group, Furukawa Electric Co. Ltd., ILJIN Materials Co. Ltd., JX Nippon Mining & Metals Corporation (ENEOS Holdings Inc.), LS Mtron Co. Ltd., Mitsui Mining & Smelting Co. Ltd., Nippon Denkai Ltd., Rogers Corporation, SKC Co. Ltd., Sumitomo Metal Mining Co. Ltd., Targray Technology International Inc. and UACJ Corporation.