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固体照明市場と製造コスト削減動向

The LED Revolution: Market Analysis And Insight On Reducing Manufacturing Costs

発行 Information Network 商品コード 105450
出版日 ページ情報 英文
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固体照明市場と製造コスト削減動向 The LED Revolution: Market Analysis And Insight On Reducing Manufacturing Costs
出版日: 2016年07月01日 ページ情報: 英文
概要

高輝度発光ダイオード(HB-LED)市場は2009年から2012年にかけて出荷台数が倍増すると予測されています。

当レポートでは、高輝度LEDの技術動向と応用について検証し、設備と材料、パッケージングや組立て時の課題、有機EL市場の動向、国家的取組み、今後の見通しなどについてまとめ、概略下記の構成でお届けいたします。

第1章 イントロダクション

第2章 高輝度LED技術と応用における最新動向

  • LED:作動理論
  • 知的財産マップ
  • LED製造技術とコスト
  • LED市場の発光

第3章 加工設備

  • イントロダクション
  • 固体照明(SSL)用MOCVD:生産性の課題と解決策
  • 低温リモートプラズマ化学蒸着
  • 欠陥検査および試験
  • リソグラフィ

第4章 構造材料

  • イントロダクション
  • 発光用GaNベースのLED
  • LED蛍光物質製造上の課題

第5章 高輝度LEDのパッケージングと組立て上の課題

  • パッケージング
  • ウェハレベルパッケージング
  • 熱問題
  • 試験

第6章 革新的促進因子としての国家プログラム

  • DoEによる製造奨励策
  • プログラムミッションとゴール
  • LEDに関する研究プログラム
  • SSL製造が直面する課題

第7章 有機EL(OLED)照明

  • 照明メーカーにとっての機会
  • 有機EL市場成長のための重要な課題
  • 製造法と設備のニーズ
  • 主要材料の入手性
  • 有機ELのコスト

第8章 有機ELの製造

  • 有機ELのための蒸着設備と工程
  • 一般的有機EL製造コスト
  • Roll-to-Roll有機EL
  • リソグラフィ
  • 基板とカプセル化
  • 検査と品質管理

第9章 世界の有機EL市場の見通し

  • イントロダクション
  • パッシブマトリクス容量と需要
  • アクティブマトリクス容量と需要
  • 有機ELのコスト上の課題

第10章 世界の高輝度LED市場の今後の見通し

  • 技術動向:2000〜2009年
  • 2008年の市場概要と動向
    • 市場促進因子
    • ノート型パソコン用LEDバックライト
    • 液晶テレビ用LEDバックライト
    • その他のLEDバックライト
    • LED照明市場
    • LEDアクティブ屋外ディスプレイ
    • LEDシグナル
    • 自動車用LED
    • 携帯電話用LED

図表

目次

Light-emitting diodes (LEDs) are on the verge of revolutionizing the lighting market. As a general illumination lighting source, LED products surpass many conventional lighting technologies (including incandescent and fluorescent light sources) in energy efficiency, lifetime, and versatility and rival them in color and light quality. Having already significantly penetrated several colored light applications, such as traffic signals and exit signs, white-light LED products have recently been commercialized. LEDs can be found in directional lamp fittings such as downlights, display, accent, under-cabinet lighting, as well as in area light fittings such as parking, roadway, and troffer lighting applications.

This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.

Table of Contents

Chapter 1 - Introduction

Chapter 2 - Recent Progress in High Brightness LED Technology and Applications

  • 2.1. LED: Theory of Operation
  • 2.2. Intellectual Property Map
  • 2.3. LED Manufacturing Technologies & Costs
  • 2.4. LED Market General Illumination

Chapter 3 - Processing Equipment

  • 3.1. Introduction
  • 3.2. MOCVD for SSL - Productivity Challenges and Solutions
  • 3.3. Low temperature Remote Plasma Chemical Vapor Deposition (RPCVD)
    • 3.3.1. RPCVD Process Advantages
  • 3.4. Defect Inspection and Testing
  • 3.5. Lithography
    • 3.5.1. Steppers
    • 3.5.2. Nanoimprint
    • 3.5.3. Nanopatterning of LED Wafers

Chapter 4 - Materials of Construction

  • 4.1. Introduction
  • 4.2. GaN-based LED for General Lighting
    • 4.2.1. Methods to Improve White LED Efficiency
    • 4.2.2. Time-to-Market for LED substrates
  • 4.3. LED Phosphor Manufacturing Issues
    • 4.3.1. Current LED Phosphor Manufacturing
    • 4.3.2. LED Phosphor Cost

Chapter 5 - Packaging and Assembly Issues for High Brightness LEDs

  • 5.1. Packaging for HB LEDs
    • 5.1.1. Bonding
    • 5.1.2. Die/Ball Bonding
    • 5.1.3. Scribing
  • 5.2. Wafer Level Packaging HB LEDs
  • 5.3. Thermal Issues
  • 5.4. Test and Inspection

Chapter 6 - National Programs As Innovation Drivers

  • 6.1. DOE Solid-State Lighting Manufacturing Initiative
  • 6.2. DOE Solid-State Lighting Program Mission and Goal
  • 6.3. Major National Research Programs Pertaining to LEDs
  • 6.4. Challenges Facing SSL Manufacturing
    • 6.4.1. Inconsistent Color
    • 6.4.2. Low Light Output
    • 6.4.3. Challenges Facing Market Introduction

Chapter 7 - OLED Lighting

  • 7.1. Opportunities for Luminaire Manufacturers
  • 7.2. Critical Issues for Continued OLED Market Growth
  • 7.3. Manufacturing Options and Equipment Needs
  • 7.4. Availability of Critical Materials
  • 7.5. OLED Lighting Costs

Chapter 8 - OLED Manufacturing

  • 8.1. Deposition Equipment and Processes for OLED Lighting
  • 8.2. General OLED Manufacturing Cost Considerations
  • 8.3. Roll-to-Roll OLEDs
  • 8.4. Lithography
  • 8.5. Substrates and Encapsulation
    • 8.5.1. Substrate and Encapsulation Material Selection
    • 8.5.2. Substrate Coatings
    • 8.5.3. Transparent Electrodes
    • 8.5.4. Encapsulation
  • 8.6. Inspection and Quality Control

Chapter 9 - Outlook for the Worldwide OLED Market

  • 9.1. Introduction
  • 9.2. Passive Matrix Capacity and Demand
  • 9.3. Active Matrix Capacity and Demand
  • 9.4. Cost Challenges for OLED Lighting

Chapter 10 - Outlook for the Worldwide High-Brightness LED Market

  • 10.1. HB LED Technology
  • 10.2. HB LED Market Overview and trends
    • 10.2.1. Market Drivers for SSL
    • 10.2.2. LED Backlights for Notebook PCs
    • 10.2.3. LED Backlights for LCD TVs
    • 10.2.4. LED Backlights for Other Applications
    • 10.2.5. LED Lighting Market
    • 10.2.6. LED Active Outdoor Display Market
    • 10.2.7. LED Signal Market
    • 10.2.8. LED Automotive Market
    • 10.2.9. LED Mobile Market

List of Tables

  • 2.1: Color, Wavelength Material Of LED
  • 2.2: Light Source Comparison
  • 2.3: Comparison of LED, HB-LED, UHB-LED Characteristics
  • 3.1: Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap
  • 3.2: Process Control Metrics
  • 4.1: Production Method for Various LEDs
  • 4.2: LED Cost Model: Impact of Substrate Choice
  • 4.3: Comparison of $/klm for LED Made on Various 2" Substrates
  • 5.1: Properties Of Die Bonding Processes
  • 7.1: Comparison Of Lighting Technologies
  • 7.2: OLED Displays vs OLED lighting
  • 8.1: Manufacturing Roadmap for Sheet Processing of OLED Lighting Panels
  • 8.2: Manufacturing Roadmap for Web Processing of OLED Lighting Panels
  • 8.3: Projected Costs of OLED Lighting Panels (Sheet Processed) Stage
  • 8.4: Projected Costs of OLED Lighting Panels (Web Processed) Stage
  • 10.1: Forecast Of LED Backlights For Notebook PCs
  • 10.2: Forecast Of LED Backlights For LCD TVs
  • 10.3: Forecast Of LED Backlights For Other Application
  • 10.4: Forecast Of LED Lighting Market
  • 10.5: Forecast Of LED Active Outdoor Display Market
  • 10.6: Forecast Of LED Signal Market
  • 10.7: Forecast Of LED Automotive Market
  • 10.8: Forecast Of LED Mobile Market
  • 10.9: Top 10 LED Vendors

List of Figures

  • 2.1: Operation of LED
  • 2.2: Key Intellectual Property Relationships
  • 2.3: DOE Roadmap
  • 2.4: Relative Manufacturing Costs
  • 2.5: Pareto Analysis Of SSL Manufacturing Costs
  • 2.6: Market drivers for LED Biz and Applications
  • 2.7: SSL vs. Classical Technologies
  • 2.8: LED Performance vs. Traditional Light Sources
  • 2.9: Energy Production and Use Comparison
  • 2.10: White-LEDs for General Lighting Market estimates in $B to 2020
  • 2.11: Wafer Needs for General Lighting (2" wafer equivalents, million units to 2020)
  • 3.1: SSL - LED manufacturing with MOCVD: productivity and Cost Analysis
  • 3.2: Larger Wafer Size: GaN LEDs
  • 3.3: Global Shipments Of MOCVD Tools By Vendor
  • 3.4: Global Shipments Of MOCVD Tools By Region
  • 3.5: Diagram of RPCVD Reactor
  • 3.6: Comparison between MOCVD and RPCVD
  • 3.7: Nanoimprint Lithography System
  • 3.8: The Phlatlight Chip
  • 4.1: Regular LED (white) Front-End Steps
  • 4.2: Current Blocking Layer
  • 4.3: Regular LED (white) Production Costs for 100k wafers/year
  • 4.4: HB LED (white) Production Costs for 100k wafers/year
  • 4.5: Main Manufacturing Steps for GaN-based LED
  • 4.6: Regular LED (white) Back-End
  • 4.7: Methods to Improve White LED Efficiency
  • 4.8: Phosphor Coating - Four Approaches
  • 5.1: Hybrid Integration Approach to HD-LED Package
  • 5.2: Chain Wire Bond
  • 5.3: HB-LED with Silicon Carrier Submount
  • 5.4: Silicon interposer for MEMS / LED Applications
  • 5.5: High Brightness LED
  • 5.6: SMD Package Cost Structure
  • 5.7: Packaging Changes Result in Optical Improvements
  • 5.8: Substrate Solutions for HB/HP LEDs
  • 6.1: DOE Solid-State Lighting Program Strategy
  • 6.2: DOE Efficacy Targets
  • 6.3: Congressional Appropriations
  • 6.4: SSL R&D Project Funding
  • 6.5: Price Targets
  • 7.1: Status of Technology Towards Lighting Targets
  • 7.2: Maximizing Internal Quantum Efficiency
  • 7.3: Manufacturing Options
  • 7.4: Kodak VIST Deposition Source
  • 7.5: OLED Lighting Costs - VTE process
  • 7.6: OLED Lighting Costs: Glass Substrate
  • 8.1: Steps of OLED Production
  • 8.2: Industrial Coater Design Approaches
  • 8.3: Comparison Cluster vs. In-Line - Gen 2
  • 8.4: Comparison Cluster vs. In-Line - Gen 4/5
  • 8.5: Process Flow for OLED stack
  • 8.6: Comparison of Deposition Sources
  • 8.7: Roll-to-Roll OLED Fabrication
  • 9.1: Schematic of PMOLED
  • 9.2: PMOLED Stack/Driving Architecture
  • 9.3: Schematic of AMOLED
  • 9.4: Passive Matrix OLED Capacity and Demand
  • 9.5: Active Matrix OLED Capacity and Demand
  • 10.1: LED Market by Sector
  • 10.2: Worldwide LED Market Forecast
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