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市場調査レポート

システム・イン・パッケージ(SiP)技術

System-in-Package (SiP) Technology

発行 Global Industry Analysts, Inc. 商品コード 252334
出版日 ページ情報 英文 173 Pages
納期: 即日から翌営業日
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システム・イン・パッケージ(SiP)技術 System-in-Package (SiP) Technology
出版日: 2017年04月01日 ページ情報: 英文 173 Pages
概要

当レポートでは、システムインパッケージ(SiP)の世界市場に注目し、2015-2022年の期間を対象に取引価額の推移を配線技術(ワイヤボンディング、フリップチップ)、末端利用業種(家庭用電子製品、通信、航空宇宙・防衛、自動車ほか)、地域(米国、カナダ、日本、欧州、アジア太平洋地域、その他)の別に分析するほか、過去6年にわたる市場動態データや大小参入企業51社のプロファイルなど現在の競合環境に関する調査情報をまとめています。

第1章 イントロダクション、調査方法、製品の定義

  • 調査の信頼性とレポートの限界
  • 免責事項
  • データの解釈とレポート作成レベル
    • 定量技法と分析
  • 製品の定義と調査範囲
    • 配線技術
    • 末端利用業種

第2章 エグゼクティブサマリー

  • 産業概要
    • 電子機器産業の小型形状ファクターおよび高性能・エネルギー効率ニーズで高まるシステムインパッケージ(SiP)技術への需要
    • 小型高性能電子機器・システムに対する需要の高まりで加速するシステムインパッケージ市場
    • 開発途上国がもたらす成長見通し
    • システムインパッケージ技術市場の先端を行くフリップチップ型配線技術
    • システムインパッケージ市場の収益成長を支える家庭用電子機器分野
    • フラットパッケージングの需要を喚起する携帯電子機器
    • システムインパッケージ市場の主流を占める2.5D ICパッケージング技術
    • システムインパッケージ市場が向き合う課題
  • 市場の動向と成長推進要因
    • 電子工学におけるシステムインパッケージ技術の意義
    • 高性能小型家庭用電子機器需要の高まりで弾みを増す市場
    • 主な接続機器用システムインパッケージソリューション一覧
    • 小型・高エネルギー効率電子機器に対する需要増によるシステムインパッケージの投資対効果検証例
    • システムインパッケージ市場の吉兆となるスマートフォンの販売増
    • タブレットパソコンへの需要増 - 重要成長要因
    • セットトップボックスへの導入で加速するシステムインパッケージ技術需要
    • コンピューティングデバイス - 重要成長要因
    • システムインパッケージ発展に道を開く「物のインターネット」
    • ダイ間およびダイ・パッケージ基板間コミュニケーション用シリコン貫通電極
    • 斬新なパッケージ技術を要する最新型ノード(ネットワーク接点)
    • 「物のインターネット」におけるシステムインパッケージ利用に欠かせないプリント回線基板の考案
    • 小型形状ファクターに対応するウエハーレベルチップサイズパッケージ(WLCSP)
    • スマートホームへの潮流からもたらされる成長機会
    • 電子機器の小型化
    • 市場成長に拍車をかける小型・高速度性能製品ニーズ
    • システムインパッケージ市場にプラス影響を与えるムーアの法則凌駕に向けての方向転換
    • システムインパッケージ採用を推進する中小企業
    • 非電池駆動システムへの用途拡大で加速する市場成長
    • SoC(システムオンチップ)設計の複雑性がもたらすシステムインパッケージへの重点移行
    • 需要を増すSoC/SiP複合技術
    • 集積回路(IC)の機能あたりコスト削減ニーズで急増する市場需要
    • システムレベルの集積環境を変容させる最新のシステムインパッケージ設計
    • ウエハーベースの最新システムインパッケージ
    • 積層ベースの最新システムインパッケージ
    • ファン内蔵回路設計プラットフォームに影響を与えるシステムインパッケージ技術
    • システムインパッケージを含むターンキーサービス提供に注力する設計製造元
    • システムインパッケージ設計に向けて最新機能を提供する供給企業
  • 技術概要
    • システムインパッケージ(SiP) - 定義
    • システムインパッケージの構成、機能、ターゲット用途
    • システムインパッケージの開発
    • SiPパッケージング
    • パッケージオンパッケージSiP
    • パワークワッドフラットノーリードパッケージ
    • 積重ねダイ式システムインパッケージ
    • システムインパッケージランドグリッドアレイ(LGA)
    • システムインパッケージの利点
  • 最新産業動向
  • 世界の主要参入企業
  • 世界市場見通し

第3章 市場

  • 米国
  • カナダ
  • 日本
  • 欧州
    • フランス
    • ドイツ
    • イタリア
    • 英国スペイン
    • ロシア
    • その他欧州諸国
  • アジア太平洋地域
    • 中国
    • その他アジア太平洋地域諸国
  • その他の地域

このページに掲載されている内容は最新版と異なる場合があります。詳細はお問い合わせください。

目次
Product Code: MCP-7592

This report analyzes the worldwide markets for System-in-Package (SiP) Technology in US$ Million. The Global market is further analyzed by: Interconnection Technology - Wire Bonding, and Flip-Chip; and End-Use Sector - Consumer Electronics, Communications, Aerospace & Defense, Automotive, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022. Also, a six-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 51 companies including many key and niche players such as -

Amkor Technology, Inc.
ASE Group
ChipMOS Technologies Inc.
Fujitsu Limited
GS Nanotech

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

  • Study Reliability and Reporting Limitations
  • Disclaimers
  • Data Interpretation & Reporting Level
    • Quantitative Techniques & Analytics
  • Product Definitions and Scope of Study
    • Interconnection Technology
    • End-Use Sector

II. EXECUTIVE SUMMARY

1. INDUSTRY OVERVIEW

  • Small Form Factor, High Performance & Energy Efficiency Needs of Electronics Industry Bolster Demand for System-in-Package (SiP) Technology
  • Growing Demand for Miniature and High Performance Electronic Devices & Systems Drive SiP Market
  • Developing Countries Offer Growth Prospects
  • Flip Chip Type of Interconnection Technology Leads SiP Technology Market
  • Consumer Electronics Sector Fuels Revenue Growth in SiP Market
  • Portable Electronic Devices Stir Demand for Flat Packaging
  • 2.5D IC Packaging Technology Dominates SiP Market
  • Challenges Confronting the SiP Market

2. MARKET TRENDS & GROWTH DRIVERS

  • Importance of SiP Technology in Electronics
  • Rising Demand for High Performance and Compact Consumer Electronics Drive Growth
  • List of Select SiP Solutions for Connected Devices
  • Growing Demand for Smart, Energy Efficient Electronics Provides Business Case for SiP
  • Growing Sales of Smartphones Bode Well for SiP Market
    • Table 1: World Smartphones Market (2015 & 2020): Annual Unit Shipments in Thousands by Region/ Country (includes corresponding Graph/Chart)
  • Growing Demand for Tablet PCs - A Key Growth Driver
    • Table 2: Global Tablet Shipments in '000 Units for 2016, 2018 & 2020 (includes corresponding Graph/Chart)
  • Applications in Set Top Boxes Boosts Demand for SiP Technology
  • Computing Devices - A Key Growth Driver
  • IoT Opens New Growth Avenues for SiP
    • Table 3: Rapid Growth of Internet of Things (IoT) Market to Fuel Demand for Advanced System-in-Packaging (SiP) Technology - IoT Installed Base in Billions for the Years 2016, 2018 & 2020 (includes corresponding Graph/Chart)
  • TSVs for Die-to-Die/Die-to-Package Substrate Communication
  • Advanced Nodes Demand Innovative Package Technologies
  • PCB Considerations Vital for Using SiP in IoT Systems
  • WLCSP for Compact Form Factors
  • Trend Towards Smart Homes Offers Growth Opportunities
    • Table 4: Growing Number of Smart Homes Catalyzes Semiconductor Companies to Adopt Advanced SiP Technology: Number of Smart Homes Worldwide (In 000 Households) by Select Country for the Years 2015 & 2020 (includes corresponding Graph/Chart)
  • Miniaturization of Electronics - A Major Growth Driver for SiP
  • Need for Compact and High Speed Performance Products Spurs Market Growth
  • Shift in Direction towards "More Than Moore's Law" Benefits the SiP Market
  • SMBs Spur the Adoption of SiP
  • Expanding Applications in Non- Battery Operated Systems Spur Market Growth
  • SoC Design Complexities Bring Focus onto SiP
  • Combined SoC and SiP Technology Gains Increased Demand
  • Need to Reduce Cost Per Function of ICs Boosts Market Demand
  • Advanced SiP Packaging Transforming System-Level Integration Landscape
  • Wafer-Based Advanced SiP
  • Laminate-based Advanced SiP
  • SiP Technology to Impact Fan-In Packaging Platform
  • Foundries Focus on Offering Turnkey Services with System-in-Package
  • Vendors Offer Advanced Capabilities for SiP Design

3. TECHNOLOGY OVERVIEW

  • System in Package (SiP): A Definition
  • SiP Configurations, Features and Target Applications
  • Development of SiP
  • SiP Packaging
  • Package-on-Package SiP
  • Power Quad Flat No-Lead SiP
  • Stacked Die SiP
  • System-in-Package Land Grid Array
  • SiP Benefits

4. RECENT INDUSTRY ACTIVITY

  • Amkor Announces Product Qualification for SWIFT(tm) Packaging
  • 3D Glass Solutions Collaborates with TE Connectivity
  • Silicon Labs Introduces New Bluetooth SiP Module
  • MediaTek Unveils SoCs for Fitness and Healthcare Devices
  • Intel Launches Intel(r) Curie(tm) Module SiP
  • Octavo Systems Launches OSD3358 SiP Device
  • UTAC Collaborates with AT & S
  • MediaTek Unveils New SiP Chipsets
  • JCET Receives Order to Assemble SiP Modules for Apple

5. FOCUS ON SELECT GLOBAL PLAYERS

  • Amkor Technology, Inc. (USA)
  • ASE Group (Taiwan)
  • ChipMOS Technologies Inc. (Taiwan)
  • Fujitsu Limited (Japan)
  • GS Nanotech (Russia)
  • Insight SiP (France)
  • Intel Corporation (USA)
  • Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
  • Kulicke & Soffa Pte Ltd. (Singapore)
  • Nanium S.A. (Portugal)
  • O.C.E. Technology Ltd. (Ireland)
  • Powertech Technologies, Inc. (Taiwan)
  • Renesas Electronics Corporation (Japan)
  • Samsung Electronics Co., Ltd. (South Korea)
  • ShunSin Technology (Zhongshan) Limited (China)
  • Si2 Microsystems Private Limited (India)
  • Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
  • STATS ChipPAC Ltd. (Singapore)
  • Unimicron Corporation (Taiwan)

6. GLOBAL MARKET PERSPECTIVE

    • Table 5: World Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 6: World Historic Review for System-in-Package (SiP) Technology by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)
    • Table 7: World 14-Year Perspective for System-in-Package (SiP) Technology by Geographic Region - Percentage Breakdown of Revenues for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2009, 2017 and 2022 (includes corresponding Graph/Chart)
    • Table 8: World Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology by Interconnection Technology - Wire Bonding and Flip-Chip Markets Independently Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 9: World Historic Review for System-in-Package (SiP) Technology by Interconnection Technology - Wire Bonding and Flip-Chip Markets Independently Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)
    • Table 10: World 14-Year Perspective for System-in-Package (SiP) Technology by Interconnection Technology - Percentage Breakdown of Revenues for Wire Bonding and Flip-Chip Markets for Years 2009, 2017 and 2022 (includes corresponding Graph/Chart)
    • Table 11: World Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology by End-Use Sector - Consumer Electronics, Communications, Aerospace & Defense, Automotive and Others Markets Independently Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 12: World Historic Review for System-in-Package (SiP) Technology by End-Use Sector - Consumer Electronics, Communications, Aerospace & Defense, Automotive and Others Markets Independently Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)
    • Table 13: World 14-Year Perspective for System-in-Package (SiP) Technology by End-Use Sector - Percentage Breakdown of Revenues for Consumer Electronics, Communications, Aerospace & Defense, Automotive and Others Markets for Years 2009, 2017 and 2022 (includes corresponding Graph/Chart)

III. MARKET

1. THE UNITED STATES

  • A. Market Analysis
    • Outlook
    • Strategic Corporate Developments
    • Select Key Players
  • B. Market Analytics
    • Table 14: US Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 15: US Historic Review for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)

2. CANADA

  • Market Analysis
    • Table 16: Canadian Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 17: Canadian Historic Review for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)

3. JAPAN

  • A. Market Analysis
    • Outlook
    • Select Key Players
  • B. Market Analytics
    • Table 18: Japanese Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 19: Japanese Historic Review for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)

4. EUROPE

  • Market Analysis
    • Table 20: European Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets Independently Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 21: European Historic Review for System-in-Package (SiP) Technology by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets Independently Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)
    • Table 22: European 14-Year Perspective for System-in-Package (SiP) Technology by Geographic Region - Percentage Breakdown of Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2009, 2017 and 2022 (includes corresponding Graph/Chart)

4a. FRANCE

  • A. Market Analysis
    • Outlook
    • Insight SiP - A Key French Market Player
  • B. Market Analytics
    • Table 23: French Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 24: French Historic Review for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)

4b. GERMANY

  • Market Analysis
    • Table 25: German Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 26: German Historic Review for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)

4c. ITALY

  • Market Analysis
    • Table 27: Italian Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 28: Italian Historic Review for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)

4d. THE UNITED KINGDOM

  • Market Analysis
    • Table 29: UK Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 30: UK Historic Review for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)

4e. REST OF EUROPE

  • A. Market Analysis
    • Outlook
    • Strategic Corporate Developments
    • Select Key Players
  • B. Market Analytics
    • Table 31: Rest of Europe Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 32: Rest of Europe Historic Review for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)

5. ASIA-PACIFIC

  • Market Analysis
    • Table 33: Asia-Pacific Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology by Geographic Region - China and Rest of Asia-Pacific Markets Independently Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 34: Asia-Pacific Historic Review for System-in-Package (SiP) Technology by Geographic Region - China and Rest of Asia-Pacific Markets Independently Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)
    • Table 35: Asia-Pacific 14-Year Perspective for System-in-Package (SiP) Technology by Geographic Region - Percentage Breakdown of Revenues for China and Rest of Asia-Pacific Markets for Years 2009, 2017 and 2022 (includes corresponding Graph/Chart)

5a. CHINA

  • A. Market Analysis
    • Market Overview
    • Corporate Development
    • Select Key Players
  • B. Market Analytics
    • Table 36: Chinese Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 37: Chinese Historic Review for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)

5b. REST OF ASIA-PACIFIC

  • A. Market Analysis
    • Outlook
    • Strategic Corporate Development
    • Select Key Players
  • B. Market Analytics
    • Table 38: Rest of Asia-Pacific Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 39: Rest of Asia-Pacific Historic Review for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)

6. REST OF WORLD

  • Market Analysis
    • Table 40: Rest of World Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2015 through 2022 (includes corresponding Graph/Chart)
    • Table 41: Rest of World Historic Review for System-in-Package (SiP) Technology Market Analyzed with Annual Revenue Figures in US$ Million for Years 2009 through 2014 (includes corresponding Graph/Chart)

COMPETITIVE LANDSCAPE

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