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市場調査レポート

システム・イン・パッケージ(SiP)技術

System-in-Package (SiP) Technology

発行 Global Industry Analysts, Inc. 商品コード 252334
出版日 ページ情報 英文 564 Pages
納期: 即日から翌営業日
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システム・イン・パッケージ(SiP)技術 System-in-Package (SiP) Technology
出版日: 2012年08月01日 ページ情報: 英文 564 Pages
概要

当レポートはシステム・イン・パッケージ(SiP)技術の世界市場を精査分析したもので、地域別分析として米国、カナダ、日本、欧州、アジア太平洋、ならびにその他の地域に分けた総合的な市場分析を行っています。また、今後の市場見積ならびに市場予測を行っており、加えて過去6年間の市場分析データも示しています。また世界の主要企業およびニッチ企業の企業プロファイルも提供しており、概略下記の構成でお届けいたします。

第1章 序論、調査方法および製品定義

  • 調査報告信頼度および制限事項
  • データ解釈および調査報告レベル
  • 製品の定義および調査報告範囲

第2章 エグゼクティブ・サマリー

業界概要

  • 半導体およびIC産業: 基本的概論
  • SiP技術: 序論
  • 市場概要
  • SoCが持つ欠点により、SiPにスポットライトが当たる
  • 2007〜2009年における景気後退の影響
  • 主要な市場動向および市場成長促進要因
  • 中小企業がSiP技術の採用を推進
  • バッテリーによる動作を要しない用途への広がりが成長に拍車をかける
  • 小型化と高速化に対してますます高まる要求が市場成長を促進
  • ムーアの法則以上を求める指向により市場が恩恵を受ける
  • SiPおよびSoC技術の巧みな組み合わせ
  • 市場見通し
  • 新興諸国が世界市場の牽引役を果たす

技術概要

  • システム・イン・パッケージ(SiP): 定義
  • SiPのパッケージング
  • パッケージ・オン・パッケージ型SiP
  • PQFN(パワー・クワッド・ノーリード) SiP
  • スタック・ダイ SiP
  • SiPランド・グリッド・アレイ
  • SiP市場
  • SiPの発展
  • SiPの利点
  • エレクトロニクスにおけるSiP技術の重要性

最近の業界動向

新製品

世界の主要企業プロファイル

世界市場展望

第3章 地域市場状況

  • 米国
  • カナダ
  • 日本
  • 欧州
    • フランス
    • ドイツ
    • イタリア
    • 英国
    • 他の欧州諸国
  • アジア太平洋
  • その他の地域市場

第4章 市場競争状況

目次
Product Code: MCP-7592

This report analyzes the worldwide markets for System-in-Package (SiP) Technology in Million Units. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2010 through 2018. Also, a six-year historic analysis is provided for these markets. The report profiles 47 companies including many key and niche players such as Amkor Technology, Atmel Corporation, ChipSiP Technology Co., Ltd., CyberTAN Technology Inc., Fujitsu Limited, Freescale Semiconductor Inc., Insight SiP, Orient Semiconductor Electronics Ltd., OriginGPS Ltd., Qualcomm Atheros, Inc., Renesas Electronics Corporation, Sequans Communications, STATS ChipPAC Ltd., Si2 Microsystems Ltd., SiPCUBE, Texas Instruments, and Wi2Wi, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based upon search engine sources in the public domain.

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

  • Study Reliability and Reporting Limitations
  • Disclaimers
  • Data Interpretation & Reporting Level
    • Quantitative Techniques & Analytics
  • Product Definitions and Scope of Study

II. EXECUTIVE SUMMARY

1. INDUSTRY OVERVIEW

  • Semiconductor and IC Industry: A Rudimentary Overview
  • SiP Technology: A Prelude
  • Market Overview
  • Shortfalls of SoC Throw the Spotlight on SiP
  • Impact of the 2007-2009 Recession: In Retrospect
  • Key Market Trends & Drivers
  • SMBs Drive Adoption of the SiP Technology
  • Expansion Towards Non- Battery Operated Applications Spur Growth
  • Increasing Need for Compactness and High Speed Performance Drives Growth
  • Shift in Direction Towards "More Than Moore's Law" Benefits the Market
  • Adroit Combination SiP & SoC Technology
  • Outlook
  • Developing Regions to Lend Traction to Global Market

2. TECHNOLOGY OVERVIEW

  • System in Package (SiP): A Definition
  • SiP Packaging
  • Package-on-Package SiP
  • Power Quad Flat No-Lead SiP
  • Stacked Die SiP
  • System-in-Package Land Grid Array
  • Markets for SiP
  • Development of SiP
  • SiP Benefits
  • Importance of SiP Technology in Electronics

3. RECENT INDUSTRY ACTIVITY

  • Avnet Memec Inks Distribution Agreement with apm Communications
  • Qualcomm Acquires Atheros Communications
  • Quik-Pak Signs Agreement with Ultra Communications
  • Freescale Semiconductor Inks Licensing Agreement with Nepes
  • ON Semiconductor Takes Over Sound Design Technologies
  • Avnet Extends Partnership with Wi2Wi
  • ChipSiP Technology Enters into Partnership with Zoran

4. PRODUCT LAUNCHES/INTRODUCTIONS

  • Qualcomm Atheros Launches AR4100P
  • Qualcomm Atheros Introduces AR4100 SIP
  • Silex Technology America Unveils SX-SDMGN Wireless Radio Module and SX-SPGN System-in-Package
  • Atheros Communications Introduces AR6233 Flexible Wi-Fi™ and Bluetooth Solution
  • AzureWave Unveils Range of 3G Products and Android Software Development for Mobile Internet
  • Avnet Electronics Marketing Americas Launches Endicott Interconnect Technologies Products
  • NXP Semiconductors Introduces Integrated CAN Transceiver Microcontroller Solution
  • Koninklijke Philips Electronics Develops SiP Platform for Electronic-Micro Fluidic Devices
  • Caiway Installs New VoIP Platform
  • INSIDE Contactless Introduces SecuRead SiP NFC Solution
  • Linear Technology Rolls Out LTM4609MP Buck-Boost DC/DC Regulator
  • Smart Mixed-Signal Connectivity Launches High Speed Interconnect USB4640
  • ON Semiconductor Unveils IPD2 Process Technology
  • AT&S Introduces ECP Technology
  • Renesas Electronics Launches System on Chips for Audio Visual Devices
  • Intel Introduces Atom Based CPU Series
  • Wi2Wi Introduces Industrial Temperature Miniature GPS Module
  • Wi2Wi Introduces W2CBW009Di WLAN-Bluetooth Module
  • Atmel® Rolls out System in Package Device ATA 6614
  • Freescale Semiconductor Rolls out LL18UHV Technology
  • Freescale Semiconductor Rolls out New Integrated Automobile Technology
  • Agilent Technologies Rolls out ADS 2011
  • Electro Scientific Industries Launches the 9900 System
  • TSMC Launches AMS Reference Flow 1.0 and Reference Flow 11.0
  • ATP Electronics Introduces Internal USB SSD
  • Renesas Technology America Introduces RX Flash of MCU Group
  • Wi2Wi Unveils W2SW0001 System-in-Package
  • Sequans Communications Introduces New SQN1280 WiMAX SIP

5. FOCUS ON SELECT PLAYERS

  • Amkor Technology (USA)
  • Atmel Corporation (USA)
  • ChipSiP Technology Co., Ltd. (Taiwan)
  • CyberTAN Technology Inc. (Taiwan)
  • Fujitsu Limited (Japan)
  • Freescale Semiconductor Inc (USA)
  • Insight SiP (France)
  • Orient Semiconductor Electronics Ltd (Taiwan) II-26 OriginGPS Ltd (Israel)
  • Qualcomm Atheros, Inc. (USA)
  • Renesas Electronics Corporation (Japan)
  • Sequans Communications (France)
  • STATS ChipPAC Ltd (Singapore)
  • Si2 Microsystems Ltd (India)
  • SiPCUBE (France)
  • Texas Instruments (USA)
  • Wi2Wi, Inc. (USA)

6. GLOBAL MARKET PERSPECTIVE

    • Table 1: World Recent Past, Current and Future Analysis for System-in-Package Technology by Geographic Region/Country - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 2: World Historic Review for System-in-Package Technology by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)
    • Table 3: World 15-Year Perspective for System-in- Package Technology by Geographic Region/Country - Percentage Breakdown of Unit Sales for US, Canada, Japan. Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2004, 2011, and 2018 (includes corresponding Graph/Chart)
    • Table 4: World Recent Past, Current and Future Analysis for System-in-Package Technology by End-Use Sector - Consumer Electronics, Communications Industry and Others Independently Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 5: World Historic Review for System-in-Package Technology by End-use Sector - Consumer Electronics, Communications Industry and Others Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)
    • Table 6: World 15-Year Perspective for System-in- Package Technology by End-use Sector - Percentage Breakdown of Unit Sales for Consumer Electronics, Communications Industry and Others for Years 2004, 2011, and 2018 (includes corresponding Graph/Chart)

III. MARKET

1. THE UNITED STATES

  • A. Market Analysis
    • Outlook
    • Recent Industry Activity
    • Product Launches/Introductions
    • Key Players
  • B. Market Analytics
    • Table 7: US Recent Past, Current and Future Analysis for System-in-Package Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 8: US Historic Review for System-in-Package Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)

2. CANADA

  • A. Market Analysis
    • Outlook
    • Strategic Corporate Development
  • B. Market Analytics
    • Table 9: Canadian Recent Past, Current and Future Analysis for System-in-Package Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 10: Canadian Historic Review for System-in-Package Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)

3. JAPAN

  • A. Market Analysis
    • Outlook
    • Key Players
    • Product Launch/Introduction
  • B. Market Analytics
    • Table 11: Japanese Recent Past, Current and Future Analysis for System-in-Package Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 12: Japanese Historic Review for System-in-Package Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)

4. EUROPE

  • A. Market Analysis
    • Outlook
  • B. Market Analytics
    • Table 13: European Recent Past, Current and Future Analysis for System-in-Package by Country/Region - France, Germany, Italy, UK, and Rest of Europe Independently Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 14: European Historic Review for System-in-Package by Country/Region - France, Germany, Italy, UK, and Rest of Europe Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)
    • Table 15: European 15-Year Perspective for System-in-Package by Country/Region - Percentage Breakdown of Unit Sales for France, Germany, Italy, UK, and Rest of Europe Markets for Years 2004, 2011 and 2018 (includes corresponding Graph/Chart)

4a. FRANCE

  • A. Market Analysis
    • Outlook
    • Product Launches/Introductions
    • Key Players
  • B. Market Analytics
    • Table 16: French Recent Past, Current and Future Analysis for System-in-Package Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 17: French Historic Review for System-in-Package Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)

4b. GERMANY

  • A. Market Analysis
    • Outlook
    • Recent Industry Activity
  • B. Market Analytics
    • Table 18: German Recent Past, Current and Future Analysis for System-in-Package Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 19: German Historic Review for System-in-Package Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)

4c. ITALY

  • A. Market Analysis
    • Outlook
  • B. Market Analytics
    • Table 20: Italian Recent Past, Current and Future Analysis for System-in-Package Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 21: Italian Historic Review for System-in-Package Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)

4d. THE UNITED KINGDOM

  • A. Market Analysis
    • Outlook
  • B. Market Analytics
    • Table 22: UK Recent Past, Current and Future Analysis for System-in-Package Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 23: UK Historic Review for System-in- Package Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)

4e. REST OF EUROPE

  • A. Market Analysis
    • Outlook
    • Product Launches/Introductions
    • Key Player
  • B. Market Analytics
    • Table 24: Rest of Europe Recent Past, Current and Future Analysis for System-in-Package Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 25: Rest of Europe Historic Review for System-in-Package Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)

5. ASIA-PACIFIC

  • A. Market Analysis
    • Outlook
    • Strategic Corporate Development
    • Product Launches/Introductions
    • Key Players
  • B. Market Analytics
    • Table 26: Asia-Pacific Recent Past, Current and Future Analysis for System-in-Package Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 27: Asia-Pacific Historic Review for System- in-Package Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)

6. REST OF WORLD

  • A. Market Analysis
    • Outlook
  • B. Market Analytics
    • Table 28: Rest of World Recent Past, Current and Future Analysis for System-in-Package Analyzed with Annual Sales Figures in Million Units for Years 2010 through 2018 (includes corresponding Graph/Chart)
    • Table 29: Rest of World Historic Review for System- in-Package Independently Analyzed with Annual Sales Figures in Million Units for Years 2004 through 2009 (includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE

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