Product Code: 4849
Global Wi-Fi Chipset Market is poised to depict exponential growth from 2023 to 2032, driven by the technological development of Wi-Fi 6 and Wi-Fi 5. Wi-Fi standards are becoming more innovative, resulting in faster transfer speeds, longer battery life, and improved performance in congestion when utilized in routers, home appliances, video game consoles, and other devices, which, in consequence, may push industry growth.
Connected vehicles are expected to be a crucial element of the future automotive industry, propelling the Wi-Fi chipset market forward. Integrating Wi-Fi chips into a connected car enables wireless charging of electric vehicles (EVs), display sharing, automatic parking, keyless entry, hands-free speech audio streaming, rear-seat entertainment, and multimedia distribution, among other things.
Moreover, the companies operating in the field are continuously innovating their Wi-Fi chipset offerings to accelerate their demand in the automotive, telecom, and consumer electronics manufacturing sectors. To cite an instance, in March 2022, Intel Corporation improved its brand presence by introducing the vPro platform with 12th Gen Intel Core processors with enhanced support for DDR5 and LPDDR5 memory. These new platforms will enable developers to integrate the Wi-Fi SoCs efficiently in multiple business application-supported device manufacturing.
The Wi-Fi chipset market is divided based on standard, band, applications, and region.
By standard, the Wi-Fi chipset market from the IEEE 802.11ax (Wi-Fi 6 & Wi-Fi 6E) segment is expected to witness significant growth due to its enhanced performance and efficiency with improved traffic management. Wi-Fi 6 standard provides channel-sharing capability, which allows multi-user communication on downlink & uplink. It also provides a power-saving mechanism to help improve the battery life of devices, which favors increasing product uptake.
As per band, the tri-band Wi-Fi chipsets market is projected to gain immense traction and expand at over 5% CAGR between 2023 and 2032. The tri-band chipsets connect to the devices based on the quickest and least busy network. It has three frequency bands, two of 5 GHz, and one of 2.4 GHz, allowing more gadgets to connect to a network at the same time with less interference, which is likely to favor their adoption through 2032.
The major players operating in the market are offering innovative tri-band Wi-Fi chipsets to support next-gen networking devices. To cite an instance, in December 2022, Taiwanese chipmaker, MediaTek, unveiled its new Dimensity 8200 chip which supports tri-band wi-fi 6E and will power premium 5G smartphones.
The Wi-Fi chipset market from the smartphone applications segment is estimated to be robust due to consistent technological breakthroughs, such as Wi-Fi 6 and Wi-Fi 6E chipsets. Additionally, establishing the IEEE 802.11 ax standard will likely encourage the development of advanced Wi-Fi chipsets.
Regarding the regional landscape, the Asia Pacific Wi-Fi chipset market is slated to hold over 40% revenue share by the end of 2032. The regional growth can be attributed to the rising government investments by countries including China, Taiwan, India, and South Korea to support chipset manufacturing in the region. Furthermore, the booming electronics sector and the widespread use of automated machinery across industries are set to boost the regional industry share.
Table of Contents
Chapter 1 Methodology and Scope
- 1.1 Market scope & definitions
- 1.2 Base estimates and calculations
- 1.3 Forecast calculations
- 1.4 Data Sources
- 1.4.1 Primary
- 1.4.2 Secondary
- 1.4.2.1 Paid sources
- 1.4.2.2 Public sources
- 1.5 Industry Glossary
Chapter 2 Executive Summary
- 2.1 Wi-Fi chipset industry 360 degree synopsis, 2018-2032
- 2.2 Business trends
- 2.2.1 Total Addressable Market (TAM), 2023-2032
- 2.3 Regional trends
- 2.4 Standard trends
- 2.5 Band trends
- 2.6 MIMO configuration trends
- 2.7 Application trends
Chapter 3 Wi-Fi Chipset Market Industry Insights
- 3.1 Impact of COVID-19
- 3.1.1 North America
- 3.1.2 Europe
- 3.1.3 Asia Pacific
- 3.1.4 Latin America
- 3.1.5 MEA
- 3.2 Russia- Ukraine war impact
- 3.3 U.S.-China trade war
- 3.4 Industry ecosystem
- 3.4.1 Raw material & component provider
- 3.4.2 Manufacturers
- 3.4.3 Distributor
- 3.4.4 End-user
- 3.4.5 Vendor Matrix
- 3.5 Profit margin analysis
- 3.6 Technology & innovation landscape
- 3.6.1 Evolution and milestone
- 3.6.2 Major recent developments
- 3.6.2.1. Wi-Fi 6 & Wi-Fi 6 E chipsets
- 3.6.2.2. Wi-Fi chips with 802 11 ay standard
- 3.7 Patent analysis
- 3.8 Key initiative and news
- 3.9 Regulatory landscape
- 3.9.1 International
- 3.9.2 North America
- 3.9.3 Europe
- 3.9.4 Asia Pacific
- 3.9.5 Latin America
- 3.9.6 MEA
- 3.10 Industry impact forces
- 3.10.1 Growth drivers
- 3.10.1.1 Increasing public wi-fi hotspots in developing nations
- 3.10.1.2 Rising trend towards smart home devices
- 3.10.1.3 Technological development for Wi-Fi 6 and Wi-Fi 5
- 3.10.1.4 Rising initiatives towards 5G technology in developing nations
- 3.10.1.5 Growing demand for wi-fi in business and enterprises
- 3.10.1.6 Emphasis towards connected vehicle technology
- 3.10.2 Industry pitfalls & challenges
- 3.10.2.1 Regulation and security associated with Wi-Fi technology
- 3.11 Growth potential analysis
- 3.12 Porter's analysis
- 3.13 PESTEL analysis
Chapter 4 Competitive Landscape, 2022
- 4.1 Introduction
- 4.2 Company market share, 2022
- 4.3 Competitive analysis of major market players, 2022
- 4.3.1 Qualcomm Technologies, Inc.
- 4.3.2 Broadcom
- 4.3.3 Intel Corporation
- 4.3.4 MediaTek, Inc.
- 4.3.5 Infineon Technologies
- 4.3.6 NXP Semiconductors
- 4.3.7 Realtek Semiconductor Corp.
- 4.4 Competitive positioning matrix
- 4.5 Strategic outlook matrix
Chapter 5 Wi-Fi Chipset Market, By Standard
- 5.1 Key trends, by standard
- 5.2 IEEE 802.11ay
- 5.2.1 Market estimates and forecast, 2018-2032
- 5.3 IEEE 802.11ad
- 5.3.1 Market estimates and forecast, 2018-2032
- 5.4 IEEE 802.11ax (Wi-Fi 6 & Wi-Fi 6E)
- 5.4.1 Market estimates and forecast, 2018-2032
- 5.5 IEEE 802.11ac
- 5.5.1 Market estimates and forecast, 2018-2032
- 5.6 IEEE 802.11n (SB and DB)
- 5.6.1 Market estimates and forecast, 2018-2032
- 5.7 IEEE 802.11b/G
- 5.7.1 Market estimates and forecast, 2018-2032
Chapter 6 Wi-Fi Chipset Market, By Band
- 6.1 Key trends, by band
- 6.2 Single
- 6.2.1 Market estimates and forecast, 2018-2032
- 6.3 Dual
- 6.3.1 Market estimates and forecast, 2018-2032
- 6.4 Triband
- 6.4.1 Market estimates and forecast, 2018-2032
Chapter 7 Wi-Fi Chipset Market, By MIMO Configuration
- 7.1 Key trends, by MIMO configuration
- 7.2 SU-MIMO
- 7.2.1 Market estimates and forecast, 2018-2032
- 7.3 MU-MIMO
- 7.3.1 Market estimates and forecast, 2018-2032
- 7.3.2 1x1 MU-MIMO
- 7.3.2.1 Market estimates and forecast, 2018-2032
- 7.3.3 2x2 MU-MIMO
- 7.3.3.1 Market estimates and forecast, 2018-2032
- 7.3.4 3x3 MU-MIMO
- 7.3.4.1 Market estimates and forecast, 2018-20328
- 7.3.5 4x4 MU-MIMO
- 7.3.5.1 Market estimates and forecast, 2018-2032
- 7.3.6 8x8 MU-MIMO
- 7.3.6.1 Market estimates and forecast, 2018-2032
Chapter 8 Wi-Fi Chipset Market, By Application
- 8.1 Key trends, by application
- 8.2 Smartphones
- 8.2.1 Market estimates and forecast, 2018-2032
- 8.3 Tablet
- 8.3.1 Market estimates and forecast, 2018-2032
- 8.4 Desktop PC
- 8.4.1 Market estimates and forecast, 2018-2032
- 8.5 Laptop
- 8.5.1 Market estimates and forecast, 2018-2032
- 8.6 Connected home devices
- 8.6.1 Market estimates and forecast, 2018-2032
- 8.7 Others
- 8.7.1 Market estimates and forecast, 2018-2032
Chapter 9 Wi-Fi Chipset Market, By Region
- 9.1 Key trends, by region
- 9.2 North America
- 9.2.1 Market estimates and forecast, 2018-2032
- 9.2.2 Market estimates and forecast, by standard, 2018-2032
- 9.2.3 Market estimates and forecast, by band, 2018-2032
- 9.2.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.2.5 Market estimates and forecast, by application, 2018-2032
- 9.2.6 U.S.
- 9.2.6.1 Market estimates and forecast, 2018-2032
- 9.2.6.2 Market estimates and forecast, by standard, 2018-2032
- 9.2.6.3 Market estimates and forecast, by band, 2018-2032
- 9.2.6.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.2.6.5 Market estimates and forecast, by application, 2018-2032
- 9.2.7 Canada
- 9.2.7.1 Market estimates and forecast, 2018-2032
- 9.2.7.2 Market estimates and forecast, by standard, 2018-2032
- 9.2.7.3 Market estimates and forecast, by band, 2018-2032
- 9.2.7.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.2.7.5 Market estimates and forecast, by application, 2018-2032
- 9.3 Europe
- 9.3.1 Market estimates and forecast, 2018-2032
- 9.3.2 Market estimates and forecast, by standard, 2018-2032
- 9.3.3 Market estimates and forecast, by band, 2018-2032
- 9.3.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.3.5 Market estimates and forecast, by application, 2018-2032
- 9.3.6 UK
- 9.3.6.1 Market estimates and forecast, 2018-2032
- 9.3.6.2 Market estimates and forecast, by standard, 2018-2032
- 9.3.6.3 Market estimates and forecast, by band, 2018-2032
- 9.3.6.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.3.6.5 Market estimates and forecast, by application, 2018-2032
- 9.3.7 Germany
- 9.3.7.1 Market estimates and forecast, 2018-2032
- 9.3.7.2 Market estimates and forecast, by standard, 2018-2032
- 9.3.7.3 Market estimates and forecast, by band, 2018-2032
- 9.3.7.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.3.7.5 Market estimates and forecast, by application, 2018-2032
- 9.3.8 France
- 9.3.8.1 Market estimates and forecast, 2018-2032
- 9.3.8.2 Market estimates and forecast, by standard, 2018-2032
- 9.3.8.3 Market estimates and forecast, by band, 2018-2032
- 9.3.8.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.3.8.5 Market estimates and forecast, by application, 2018-2032
- 9.3.9 Italy
- 9.3.9.1 Market estimates and forecast, 2018-2032
- 9.3.9.2 Market estimates and forecast, by standard, 2018-2032
- 9.3.9.3 Market estimates and forecast, by band, 2018-2032
- 9.3.9.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.3.9.5 Market estimates and forecast, by application, 2018-2032
- 9.3.10 Spain
- 9.3.10.1 Market estimates and forecast, 2018-2032
- 9.3.10.2 Market estimates and forecast, by standard, 2018-2032
- 9.3.10.3 Market estimates and forecast, by band, 2018-2032
- 9.3.10.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.3.10.5 Market estimates and forecast, by application, 2018-2032
- 9.3.11 Russia
- 9.3.11.1 Market estimates and forecast, 2018-2032
- 9.3.11.2 Market estimates and forecast, by standard, 2018-2032
- 9.3.11.3 Market estimates and forecast, by band, 2018-2032
- 9.3.11.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.3.11.5 Market estimates and forecast, by application, 2018-2032
- 9.4 Asia Pacific
- 9.4.1 Market estimates and forecast, 2018-2032
- 9.4.2 Market estimates and forecast, by standard, 2018-2032
- 9.4.3 Market estimates and forecast, by band, 2018-2032
- 9.4.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.4.5 Market estimates and forecast, by application, 2018-2032
- 9.4.6 China
- 9.4.6.1 Market estimates and forecast, 2018-2032
- 9.4.6.2 Market estimates and forecast, by standard, 2018-2032
- 9.4.6.3 Market estimates and forecast, by band, 2018-2032
- 9.4.6.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.4.6.5 Market estimates and forecast, by application, 2018-2032
- 9.4.7 India
- 9.4.7.1 Market estimates and forecast, 2018-2032
- 9.4.7.2 Market estimates and forecast, by standard, 2018-2032
- 9.4.7.3 Market estimates and forecast, by band, 2018-2032
- 9.4.7.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.4.7.5 Market estimates and forecast, by application, 2018-2032
- 9.4.8 Japan
- 9.4.8.1 Market estimates and forecast, 2018-2032
- 9.4.8.2 Market estimates and forecast, by standard, 2018-2032
- 9.4.8.3 Market estimates and forecast, by band, 2018-2032
- 9.4.8.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.4.8.5 Market estimates and forecast, by application, 2018-2032
- 9.4.9 South Kora
- 9.4.9.1 Market estimates and forecast, 2018-2032
- 9.4.9.2 Market estimates and forecast, by standard, 2018-2032
- 9.4.9.3 Market estimates and forecast, by band, 2018-2032
- 9.4.9.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.4.9.5 Market estimates and forecast, by application, 2018-2032
- 9.4.10 Taiwan
- 9.4.10.1 Market estimates and forecast, 2018-2032
- 9.4.10.2 Market estimates and forecast, by standard, 2018-2032
- 9.4.10.3 Market estimates and forecast, by band, 2018-2032
- 9.4.10.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.4.10.5 Market estimates and forecast, by application, 2018-2032
- 9.5 Latin America
- 9.5.1 Market estimates and forecast, 2018-2032
- 9.5.2 Market estimates and forecast, by standard, 2018-2032
- 9.5.3 Market estimates and forecast, by band, 2018-2032
- 9.5.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.5.5 Market estimates and forecast, by application, 2018-2032
- 9.5.6 Brazil
- 9.5.6.1 Market estimates and forecast, 2018-2032
- 9.5.6.2 Market estimates and forecast, by standard, 2018-2032
- 9.5.6.3 Market estimates and forecast, by band, 2018-2032
- 9.5.6.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.5.6.5 Market estimates and forecast, by application, 2018-2032
- 9.5.7 Mexico
- 9.5.7.1 Market estimates and forecast, 2018-2032
- 9.5.7.2 Market estimates and forecast, by standard, 2018-2032
- 9.5.7.3 Market estimates and forecast, by band, 2018-2032
- 9.5.7.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.5.7.5 Market estimates and forecast, by application, 2018-2032
- 9.6 MEA
- 9.6.1 Market estimates and forecast, 2018-2032
- 9.6.2 Market estimates and forecast, by standard, 2018-2032
- 9.6.3 Market estimates and forecast, by band, 2018-2032
- 9.6.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.6.5 Market estimates and forecast, by application, 2018-2032
- 9.6.6 GCC
- 9.6.6.1 Market estimates and forecast, 2018-2032
- 9.6.6.2 Market estimates and forecast, by standard, 2018-2032
- 9.6.6.3 Market estimates and forecast, by band, 2018-2032
- 9.6.6.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.6.6.5 Market estimates and forecast, by application, 2018-2032
- 9.6.7 South Africa
- 9.6.7.1 Market estimates and forecast, 2018-2032
- 9.6.7.2 Market estimates and forecast, by standard, 2018-2032
- 9.6.7.3 Market estimates and forecast, by band, 2018-2032
- 9.6.7.4 Market estimates and forecast, by MIMO configuration, 2018-2032
- 9.6.7.5 Market estimates and forecast, by application, 2018-2032
Chapter 10 Company Profiles
- 10.1 Broadcom
- 10.1.1 Business Overview
- 10.1.2 Financial Data
- 10.1.3 Product Landscape
- 10.1.4 Strategic Outlook
- 10.1.5 SWOT Analysis
- 10.2 ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD
- 10.2.1 Business Overview
- 10.2.2 Financial Data
- 10.2.3 Product Landscape
- 10.2.4 Strategic Outlook
- 10.2.5 SWOT Analysis
- 10.3 HiSilicon
- 10.3.1 Business Overview
- 10.3.2 Financial Data
- 10.3.3 Product Landscape
- 10.3.4 Strategic Outlook
- 10.3.5 SWOT Analysis
- 10.4 I&C Technology
- 10.4.1 Business Overview
- 10.4.2 Financial Data
- 10.4.3 Product Landscape
- 10.4.4 Strategic Outlook
- 10.4.5 SWOT Analysis
- 10.5 Infineon Technologies
- 10.5.1 Business Overview
- 10.5.2 Financial Data
- 10.5.3 Product Landscape
- 10.5.4 Strategic Outlook
- 10.5.5 SWOT Analysis
- 10.6 Intel Corporation
- 10.6.1 Business Overview
- 10.6.2 Financial Data
- 10.6.3 Product Landscape
- 10.6.4 Strategic Outlook
- 10.6.5 SWOT Analysis
- 10.7 MediaTek, Inc.
- 10.7.1 Business Overview
- 10.7.2 Financial Data
- 10.7.3 Product Landscape
- 10.7.4 Strategic Outlook
- 10.7.5 SWOT Analysis
- 10.8 Microchip Technology Inc.
- 10.8.1 Business Overview
- 10.8.2 Financial Data
- 10.8.3 Product Landscape
- 10.8.4 Strategic Outlook
- 10.8.5 SWOT Analysis
- 10.9 MORSE MICRO
- 10.9.1 Business Overview
- 10.9.2 Financial Data
- 10.9.3 Product Landscape
- 10.9.4 Strategic Outlook
- 10.9.5 SWOT Analysis
- 10.10 Newracom
- 10.10.1 Business Overview
- 10.10.2 Financial Data
- 10.10.3 Product Landscape
- 10.10.4 Strategic Outlook
- 10.10.5 SWOT Analysis
- 10.11 NXP Semiconductors
- 10.11.1 Business Overview
- 10.11.2 Financial Data
- 10.11.3 Product Landscape
- 10.11.4 Strategic Outlook
- 10.11.5 SWOT Analysis
- 10.12 ON Semiconductors
- 10.12.1 Business Overview
- 10.12.2 Financial Data
- 10.12.3 Product Landscape
- 10.12.4 Strategic Outlook
- 10.12.5 SWOT Analysis
- 10.13 PERASO TECHNOLOGIES INC.
- 10.13.1 Business Overview
- 10.13.2 Financial Data
- 10.13.3 Product Landscape
- 10.13.4 Strategic Outlook
- 10.13.5 SWOT Analysis
- 10.14 Qualcomm Technologies, Inc.
- 10.14.1 Business Overview
- 10.14.2 Financial Data
- 10.14.3 Product Landscape
- 10.14.4 Strategic Outlook
- 10.14.5 SWOT Analysis
- 10.15 Realtek Semiconductor Corp.
- 10.15.1 Business Overview
- 10.15.2 Financial Data
- 10.15.3 Product Landscape
- 10.15.4 Strategic Outlook
- 10.15.5 SWOT Analysis
- 10.16 Renesas Electronics Corporation
- 10.16.1 Business Overview
- 10.16.2 Financial Data
- 10.16.3 Product Landscape
- 10.16.4 Strategic Outlook
- 10.16.5 SWOT Analysis
- 10.17 Samsung Electronics Co., Ltd.
- 10.17.1 Business Overview
- 10.17.2 Financial Data
- 10.17.3 Product Landscape
- 10.17.4 Strategic Outlook
- 10.17.5 SWOT Analysis
- 10.18 Silicon Laboratories
- 10.18.1 Business Overview
- 10.18.2 Financial Data
- 10.18.3 Product Landscape
- 10.18.4 Strategic Outlook
- 10.18.5 SWOT Analysis
- 10.19 STMicroelectronics N.V.
- 10.19.1 Business Overview
- 10.19.2 Financial Data
- 10.19.3 Product Landscape
- 10.19.4 Strategic Outlook
- 10.19.5 SWOT Analysis
- 10.20 Telit
- 10.20.1 Business Overview
- 10.20.2 Financial Data
- 10.20.3 Product Landscape
- 10.20.4 Strategic Outlook
- 10.20.5 SWOT Analysis
- 10.21 Texas Instruments Incorporated
- 10.21.1 Business Overview
- 10.21.2 Financial Data
- 10.21.3 Product Landscape
- 10.21.4 Strategic Outlook
- 10.21.5 SWOT Analysis