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表紙：マイクロ集積回路の世界市場-2023年～2030年
市場調査レポート
商品コード
1360042

マイクロ集積回路の世界市場-2023年～2030年

Global Micro Integrated Circuits Market - 2023-2030

出版日
ページ情報
英文 203 Pages
納期
即日から翌営業日
カスタマイズ可能
適宜更新あり
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=146.96円
マイクロ集積回路の世界市場-2023年～2030年
出版日: 2023年10月11日
発行: DataM Intelligence
ページ情報: 英文 203 Pages
納期: 即日から翌営業日
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概要

概要

世界のマイクロ集積回路市場は、2022年に789億米ドルに達し、2023-2030年の予測期間中にCAGR 6.5%で成長し、2030年には876億米ドルに達すると予測されています。

マイクロICは、ますます複雑化する機能を統合しながら、より小型でコンパクトに設計されています。技術の発展に伴い、メーカーはより多くのトランジスタとコンポーネントを1つのチップに組み込み、電子機器の性能向上に繋げています。マイクロICのニーズは、スマートフォン、タブレット端末、ウェアラブル技術、スマート家電を含む民生用電子機器の人気上昇に後押しされています。

例えば、2023年8月7日、アルバカーキを拠点とするサンディア国立研究所は、様々な分野で有望な活用領域を提供する新しいシリコン集積型マイクロレーザーを開発しました。このマイクロレーザーは、他のマイクロスケールの光学デバイスと組み合わせると、自動運転車、データセンター、生化学センサー、防衛技術に利用価値があります。

北米は2022年に世界市場の約1/4を占めると予想されています。大手半導体企業や学術機関はすべて北米で発見されています。IC設計、製造技術、材料の継続的な改善により、より特許の高い効果的なマイクロICが生み出されています。スマートフォン、タブレット、ゲーム機、スマートホームデバイスなどの民生用電子機器の需要は高いです。これらの製品はすべてマイクロICを搭載する必要があり、その継続的な進化が成長を刺激しています。

ダイナミクス

5Gネットワーク需要の高まり

マイクロICは小型でコンパクトな設計が特徴です。5Gインフラでは小型セルとアンテナの高密度ネットワークが必要とされるため、ICを含むコンポーネントの小型化は、これらのコンパクトな設備に適合するために不可欠です。5Gネットワークでは、スモールセルやデバイスが効果的に動作できるよう、より高い電力効率が求められます。マイクロICは、消費電力を最小限に抑え、高性能アプリケーションを維持するために設計されています。

例えば、2023年2月23日、AMDの5G技術への戦略的注力と通信分野への投資は、データセンターおよびネットワーキング市場でのプレゼンス拡大を目的としています。同社は、これらの分野で高性能コンピューティングとコネクティビティに対する需要が高まっていることを認識しています。5Gネットワークが進化を続けるなか、通信サービスプロバイダーは自社のプラットフォームを最新化し、5Gサービスがもたらす機会を活用しようとしています。

コラボレーション・パートナーシップの増加による需要増大

最先端のマイクロICを開発するには、専門知識とリソースを組み合わせる必要があります。パートナーシップにより、補完的な技術や知識へのアクセスが可能になり、イノベーションが促進される共同作業により、開発コストの分担が可能になり、個々の企業の経済的負担が軽減されるため、マイクロICのより広範な研究開発が促進されます。パートナーシップは、企業が新しい市場に参入したり、既存の市場で存在感を拡大したりするのに役立ちます。パートナーの販売チャネルや顧客基盤を利用することで、市場浸透を加速させることができます。

例えば、2023年6月24日、インドと米国の技術提携は、マイクロチップ、宇宙、AIなど様々な重要分野を網羅します。このパートナーシップの重要性は、共同声明の中で、防衛、宇宙、地政学、貿易、経済といった他の側面よりも優先され、その重要性が強調されていることからも明らかです。チップの設計と製造能力の発展のために、ナレーンダー・モディ首相は半導体のサプライチェーンに関するMoUに署名しました。

技術進歩

技術の発展に伴い、より小型でコンパクトな集積回路の製造が容易になり、より高性能で省エネルギーなガジェットの製造が可能になっています。人工知能、データ分析、高度な計算などのアプリケーションに不可欠なマイクロアーキテクチャと製造技術の向上により、より処理能力の高いICが製造されます。ICのエネルギー効率が高まるにつれ、モバイル機器のバッテリーは長持ちし、さまざまなアプリケーションが必要とする電力も少なくなります。

例えば、2023年6月24日、マイクロン・テクノロジーはインドのグジャラート州に新たな組立・テスト施設センターを建設する目標を発表しました。このセンターは、国内外の市場需要に対応することを目的としています。マイクロンはまた、世界中の顧客にサービスを提供するために、世界な製造ユニットの拡大を目指しており、この戦略は、市場全体のメモリストレージとの出会いにつながります。

過熱とチャネル攻撃による市場成長の阻害

小型化は利点でもありますが、課題もあります。ICが小型化し、製造エラーが発生しやすくなると、コンパクトな領域で発生する熱を放散させることがますます難しくなる可能性があります。高性能ICが発生する熱を効果的に分散させ、過熱を防ぐためには、ヒートシンクやファンなどの余分な部品が頻繁に必要になります。先進的なICの製造工程は非常に複雑で、多くの複雑な工程を含む高価なものであり、この複雑さが製造の遅れやコスト増につながる可能性があります。

ICは、サイド・チャネル攻撃やハードウェア・トロイの木馬など、検出や対策が困難なハードウェア・レベルの攻撃を受けやすい可能性があります。ICの製造には有害な化学物質や材料が使用され、環境問題の一因となります。自然災害や地政学的問題などの世界の事象は、ICのサプライ・チェーンを混乱させ、供給不足や価格上昇につながる可能性があります。

目次

第1章 調査手法と調査範囲

第2章 定義と概要

第3章 エグゼクティブサマリー

第4章 市場力学

  • 影響要因
    • 促進要因
      • 5Gネットワークに対する需要の高まり
      • コラボレーション・パートナーシップの増加による需要増大
      • 技術進歩
    • 抑制要因
      • 過熱とチャネル攻撃による市場成長の阻害
    • 影響分析

第5章 産業分析

  • ポーターのファイブフォース分析
  • サプライチェーン分析
  • 価格分析
  • 規制分析
  • ロシア・ウクライナ戦争の影響分析
  • DMIの見解

第6章 COVID-19分析

第7章 タイプ別

  • アナログIC
  • デジタルIC
  • ミックスシングルIC

第8章 用途別

  • クラウドコンピューティング
  • エンタープライズ
  • エッジコンピューティング
  • その他

第9章 エンドユーザー別

  • データセンター
  • 民生用電子機器
  • IT
  • その他

第10章 地域別

  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • ドイツ
    • 英国
    • フランス
    • イタリア
    • ロシア
    • その他欧州
  • 南米
    • ブラジル
    • アルゼンチン
    • その他南米
  • アジア太平洋
    • 中国
    • インド
    • 日本
    • オーストラリア
    • その他アジア太平洋
  • 中東・アフリカ

第11章 競合情勢

  • 競合シナリオ
  • 市況/シェア分析
  • M&A分析

第12章 企業プロファイル

  • Samsung
    • 企業概要
    • 製品ポートフォリオと説明
    • 財務概要
    • 主な動向
  • Qualcomm Technologies
  • Intel Corporation
  • Texas Instruments
  • Toshiba
  • NVIDIA Corporation
  • SK Hynix
  • Micron Technology
  • Fujitsu
  • Avago Technologies

第13章 付録

目次
Product Code: ICT7012

Overview:

Global Micro Integrated Circuits Market reached US$ 78.9 billion in 2022 and is expected to reach US$ 87.6 billion by 2030, growing with a CAGR of 6.5% during the forecast period 2023-2030.

Micro ICs are designed to be smaller and more compact while integrating increasingly complex functionality. As developments in technology manufacturers incorporate more transistors and components onto a single chip which leads to improved performance of electronic devices. The need for micro ICs is driven by the rise in popularity of consumer electronics including smartphones, tablets, wearable technology and smart appliances.

For instance, on 7 August 2023, Sandia National Laboratories, based in Albuquerque, developed a novel silicon-integrated micro-laser that offers promising applications in various fields and this micro-laser when combined with other micro-scale optical devices, which makes it valuable for self-driving cars, data centers, biochemical sensors and defense technologies.

North America is expected to hold about 1/4th of the global market in 2022. Leading semiconductor businesses and academic institutions are all discovered in North America. The creation of more patent and effective micro ICs is driven by ongoing improvements in IC design, fabrication techniques and materials. Consumer electronics, such as smartphones, tablets, gaming consoles and smart home devices are in high demand. All of these products must have micro ICs and their ongoing evolution stimulates growth.

Dynamics:

Rising Demand for 5G Networks

Micro ICs are characterized by their small size and compact design. As 5G infrastructure requires a dense network of small cells and antennas, the miniaturization of components including ICs, is essential to fit within these compact installations. 5G networks demand higher power efficiency to ensure that small cells and devices can operate effectively. Micro ICs are designed to minimize power consumption and for maintaining high-performance applications.

For instance, on 23 February 2023, AMD's strategic focus on 5G technology and investments in the telecommunications sector are aimed at expanding its presence in the data center and networking markets. The company recognizes the increasing demand for high-performance computing and connectivity in these sectors. As 5G networks continue to evolve, communication service providers are seeking to modernize their platforms and leverage the opportunities presented by 5G services.

Rising Collaboration and Partnerships Increase Demand

Collaborations often involve combining expertise and resources to develop cutting-edge micro ICs. Partnerships allow access to complementary technologies and knowledge, fostering innovation Collaborative efforts enable the sharing of development costs, reducing the financial burden on individual companies and this encourages more extensive research and development in micro ICs. Partnerships can help companies enter new markets or expand their presence in existing ones. Access to a partner's distribution channels and customer base can accelerate market penetration.

For instance, on 24 June 2023, India-US tech partnership encompasses various crucial areas such as micro-chips, space and AI. The significance of this partnership is evident as it takes precedence in the joint statement, highlighting its importance above other aspects like defense, space, geopolitics, trade and the economy. For the development in the design of chips and fabrication capabilities Prime Minister Narender Modi signed MoU for the supply chain of the semiconductors.

Advancement in Technology

As there is development in technology, it becomes easier to make smaller and compact integrated circuits, which enables the creation of more potent, energy-saving gadgets. Higher processing power ICs are produced via improvements in microarchitecture and manufacturing techniques, which is essential for applications like artificial intelligence, data analytics and sophisticated computations. As ICs become more energy-efficient, mobile device batteries last longer and varied applications need less power.

For instance, on 24 June 2023, Micron Technology announced its objectives to construct a new assembly and test facility center in Gujarat, India. As this center aims to handle both domestic and international market demands. Micron also aims to expand its global manufacturing units to serve there base customers worldwide and this strategy leads to meet with memory storage across the market.

Overheating and Channel Attacks Hinder the Growth of the Market

While miniaturization is an advantage, it also poses challenges. The heat generated in a compact area may be increasingly difficult to dissipate as ICs get smaller and more prone to manufacturing errors. In order to effectively disperse the heat that high-performance ICs produce and prevent overheating extra parts like heat sinks and fans are frequently needed. The manufacturing process for advanced ICs is highly complex and expensive involving numerous intricate steps and this complexity can result in production delays and increased costs.

ICs may be susceptible to difficult-to-detect and-mitigate hardware-level attacks including side-channel attacks and hardware Trojans. The manufacturing of ICs involves the use of hazardous chemicals and materials, contributing to environmental concerns. Global events, such as natural disasters or geopolitical issues, can disrupt the supply chain for ICs, leading to shortages and increased prices.

Segment Analysis:

The global micro integrated circuits market is segmented based on type, application, end-user and region.

Growing Innovative Solutions in Analog Integrated Circuits

In 2022, analog ICs are expected to be the dominant segment in the global market covering around 1/3rd of the market. The ongoing trend of miniaturization enables the development of smaller, more power-efficient and higher-performance analog ICs and this appeals to various industries where space constraints are a concern. The proliferation of smartphones, wearable devices, IoT gadgets and other portable electronics drives the demand for analog.

For instance, on 7 June 2023, X-FAB Silicon Foundries SE, a leading analog/mixed-signal and MEMS foundry group, announced ambitious revenue and margin targets to achieve by 2026. By setting the objective of generating US$ 1.5 billion in sales by 2026, X-FAB demonstrates both its ambitious growth aspirations and dedication to growing its market share.

For different usage of microintegrated circuit, which include automotive, industrial, consumer electronics, medical devices and more, X-FAB specializes in producing silicon wafers. The company is known for its high-quality standards and innovative solutions in analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems.

Geographical Penetration:

Development in the Semiconductor Industries in Asia-Pacific

In 2022, Asia-Pacific is expected to be the dominant region in the global micro integrated circuits market covering more than 1/3rd of the market. Asia-Pacific countires, i.e., China, South Korea, Japan and Taiwan, have made the way in technological developments in the semiconductor industry, including the creation of advanced micro ICs for use various industries. The demand for micro ICs utilized in the fabrication of these gadgets has increased as a result of these countries having significant consumer electronics manufacturing hubs.

According to latest official data by ETV Bharat in 2023, there is increment in import of semiconductor in recent years. The value of the nation's imports of monolithic integrated circuits or microchips climbed from INR 37,354 crore in FY 2020-21 to more than 60,000 crore the next year and more than 82,000 crore in FY 2022-23. At the same time micro-chips rise from INR 14,484 to INR 31,000 crores.

Competitive Landscape

The major global players in the market include: Samsung, Qualcomm Technologies, Intel Corporation, Texas Instruments, Toshiba, NVIDIA Corporation, SK Hynix, Micron Technology, Fujitsu and Avago Technologies.

COVID-19 Impact Analysis:

The pandemic disrupted global supply chains, causing shortages of critical components and materials needed for IC manufacturing and this led to delays in production and increased costs. Many semiconductor manufacturing facilities temporarily shut down or reduced production capacity to comply with lockdowns and social distancing measures, this affected the supply of ICs, especially in industries with high demand, such as consumer electronics and healthcare.

The pandemic drove increased demand for certain ICs. For example, the shift to remote work and online activities led to higher demand for laptops, tablets and networking equipment, which rely on microchips. The pandemic disrupted the workforce in semiconductor manufacturing. Some employees fell ill, while others faced restrictions on travel and work and this impacted the ability to maintain and operate manufacturing facilities.

Research and development activities related to new microchip technologies and processes were delayed due to the pandemic. Collaborative research and innovation efforts also faced challenges. The pandemic accelerated the adoption of remote work and collaboration tools within the semiconductor industry. Engineers and designers needed to collaborate virtually on IC design, which presented both challenges and opportunities.

AI Impact

AI algorithms assist in the design and optimization of ICs and also, they can analyze vast datasets and simulations to identify the most efficient circuit layouts, helping engineers create ICs that are smaller, faster and more power-efficient. AI-driven design tools can automate the process of creating IC layouts and these tools can generate and evaluate thousands of design options in a fraction of the time it would take a human designer, leading to faster development cycles.

AI can enhance the testing and quality control of ICs. Machine learning algorithms can identify defects in manufactured ICs by analyzing patterns in test data, improving yield rates and reducing waste. AI-powered predictive maintenance can be used to monitor the health of semiconductor manufacturing equipment. By analyzing sensor data, AI can predict when equipment is likely to fail, reducing downtime and improving production efficiency.

Russia- Ukraine War Impact

Ukraine is hub for manufacture of several semiconductors and suppliers of electronic components. The war and its associated disruptions, including transportation and logistics challenges, can lead to disruptions in the semiconductor supply chain. The conflict between Russia and Ukraine has led to increased geopolitical tensions may result in shortages of critical components and materials needed for IC manufacturing.

Any disruptions in the supply chain can affect the global pricing and availability of ICs. If certain manufacturers or suppliers in the region are unable to operate or export their products, it may lead to price fluctuations and limited availability of specific ICs. Given the geopolitical uncertainties in the region, semiconductor companies may consider diversifying their manufacturing locations to reduce risk and this could lead to a shift in production away from Ukraine and Russia to other countries, potentially impacting the local economies.

By Type

  • Analog IC
  • Digital IC
  • Mixed Single IC

By Application

  • Cloud Computing
  • Enterprise
  • Edge Computing
  • Others

By End-User

  • Data Centers
  • Consumers Electronics
  • IT
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Russia
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa

Key Developments

  • In September 2023, Rebellions Inc., a South Korean artificial intelligence chip design startup, partnered with IBM to collaborate on generative AI technology development. As part of this partnership, Rebellions will conduct testing of its AI chip, ATOM, using IBM's systems at its data center in Albany, New York, to verify the chip's quality and performance at the server level.
  • In August 2022, Toshiba Electronic Devices & Storage Corporation introduced a new stepping motor driver IC, the "TB67S549FTG," designed for industrial equipment such as office automation and financial equipment. The IC is compact and features built-in constant-current control without the need for external components, helping save space on circuit boards.
  • In March 2023, Power Integrations, a Silicon Valley-based supplier of high-performance electronic components for high-voltage power-conversion systems, unveiled a new 900-volt gallium-nitride (GaN) extension to its InnoSwitch3™ family of flyback switcher ICs and these ICs, incorporating PowiGaN technology, provide up to 100 watts with over 93 percent efficiency, eliminating the need for heat sinks and simplifying designs for space-constrained applications.

Why Purchase the Report?

  • To visualize the global micro integrated circuits market segmentation based on type, application, end-user and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities by analyzing trends and co-development.
  • Excel data sheet with numerous data points of micro integrated circuits market-level with all segments.
  • PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
  • Product mapping available as excel consisting of key products of all the major players.

The global micro integrated circuits market report would provide approximately 61 tables, 59 figures and 203 pages.

Target Audience 2023

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies

Table of Contents

1. Methodology and Scope

  • 1.1. Research Methodology
  • 1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

  • 3.1. Snippet by Type
  • 3.2. Snippet by Application
  • 3.3. Snippet by End-User
  • 3.4. Snippet by Region

4. Dynamics

  • 4.1. Impacting Factors
    • 4.1.1. Drivers
      • 4.1.1.1. Rising Demand for 5G Networks
      • 4.1.1.2. Rising Collaboration and Partnerships Increase Demand
      • 4.1.1.3. Advancement in Technology
    • 4.1.2. Restraints
      • 4.1.2.1. Overheating and Channel Attacks Hinder the Growth of the Market
    • 4.1.3. Impact Analysis

5. Industry Analysis

  • 5.1. Porter's Five Force Analysis
  • 5.2. Supply Chain Analysis
  • 5.3. Pricing Analysis
  • 5.4. Regulatory Analysis
  • 5.5. Russia-Ukraine War Impact Analysis
  • 5.6. DMI Opinion

6. COVID-19 Analysis

  • 6.1. Analysis of COVID-19
    • 6.1.1. Scenario Before COVID
    • 6.1.2. Scenario During COVID
    • 6.1.3. Scenario Post COVID
  • 6.2. Pricing Dynamics Amid COVID-19
  • 6.3. Demand-Supply Spectrum
  • 6.4. Government Initiatives Related to the Market During Pandemic
  • 6.5. Manufacturers Strategic Initiatives
  • 6.6. Conclusion

7. By Type

  • 7.1. Introduction
    • 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 7.1.2. Market Attractiveness Index, By Type
  • 7.2. Analog IC*
    • 7.2.1. Introduction
    • 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3. Digital IC
  • 7.4. Mixed Single IC

8. By Application

  • 8.1. Introduction
    • 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 8.1.2. Market Attractiveness Index, By Application
  • 8.2. Cloud Computing*
    • 8.2.1. Introduction
    • 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3. Enterprise
  • 8.4. Edge Computing
  • 8.5. Others

9. By End-User

  • 9.1. Introduction
    • 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 9.1.2. Market Attractiveness Index, By End-User
  • 9.2. Data Centers*
    • 9.2.1. Introduction
    • 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 9.3. Consumers Electronics
  • 9.4. IT
  • 9.5. Others

10. By Region

  • 10.1. Introduction
    • 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 10.1.2. Market Attractiveness Index, By Region
  • 10.2. North America
    • 10.2.1. Introduction
    • 10.2.2. Key Region-Specific Dynamics
    • 10.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.2.6.1. U.S.
      • 10.2.6.2. Canada
      • 10.2.6.3. Mexico
  • 10.3. Europe
    • 10.3.1. Introduction
    • 10.3.2. Key Region-Specific Dynamics
    • 10.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.3.6.1. Germany
      • 10.3.6.2. UK
      • 10.3.6.3. France
      • 10.3.6.4. Italy
      • 10.3.6.5. Russia
      • 10.3.6.6. Rest of Europe
  • 10.4. South America
    • 10.4.1. Introduction
    • 10.4.2. Key Region-Specific Dynamics
    • 10.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.4.6.1. Brazil
      • 10.4.6.2. Argentina
      • 10.4.6.3. Rest of South America
  • 10.5. Asia-Pacific
    • 10.5.1. Introduction
    • 10.5.2. Key Region-Specific Dynamics
    • 10.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.5.6.1. China
      • 10.5.6.2. India
      • 10.5.6.3. Japan
      • 10.5.6.4. Australia
      • 10.5.6.5. Rest of Asia-Pacific
  • 10.6. Middle East and Africa
    • 10.6.1. Introduction
    • 10.6.2. Key Region-Specific Dynamics
    • 10.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

11. Competitive Landscape

  • 11.1. Competitive Scenario
  • 11.2. Market Positioning/Share Analysis
  • 11.3. Mergers and Acquisitions Analysis

12. Company Profiles

  • 12.1. Samsung*
    • 12.1.1. Company Overview
    • 12.1.2. Product Portfolio and Description
    • 12.1.3. Financial Overview
    • 12.1.4. Key Developments
  • 12.2. Qualcomm Technologies
  • 12.3. Intel Corporation
  • 12.4. Texas Instruments
  • 12.5. Toshiba
  • 12.6. NVIDIA Corporation
  • 12.7. SK Hynix
  • 12.8. Micron Technology
  • 12.9. Fujitsu
  • 12.10. Avago Technologies

LIST NOT EXHAUSTIVE

13. Appendix

  • 13.1. About Us and Services
  • 13.2. Contact Us