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薄型ウエハ加工・ダイシング装置市場：装置タイプ別、ウェーハサイズ別、アプリケーション別、世界の機会分析と産業予測、2021-2031年

Thin Wafer Processing and Dicing Equipment Market By Equipment Type, By Wafer Size, By Application : Global Opportunity Analysis and Industry Forecast, 2021-2031
出版日: | 発行: Allied Market Research | ページ情報: 英文 19 Pages | 納期: 2～3営業日

価格
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本日の銀行送金レート: 1USD=156.76円
薄型ウエハ加工・ダイシング装置市場：装置タイプ別、ウェーハサイズ別、アプリケーション別、世界の機会分析と産業予測、2021-2031年
出版日: 2023年01月01日
発行: Allied Market Research
ページ情報: 英文 19 Pages
納期: 2～3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

薄型ウエハ加工・ダイシング装置の世界市場は、2021年に6億4,378万米ドルとなり、2022年から2031年にかけて6.67%のCAGRで成長し、2031年には11億9,649万米ドルに達すると予測されます。

ウエハは半導体材料の薄片であり、ダイシングは半導体、ガラス結晶、その他多くの種類の材料を切断または溝を入れるために使用されるプロセスです。この工程で使用される装置がダイシング装置と呼ばれるものです。ウエハーダイシングは、半導体ウエハーを加工した後、そのウエハーからダイを分離する工程です。小型で高性能、かつ安価なデバイス構成に向けた微細化の必要性から、ウエハーの薄型化が求められています。メモリやパワーデバイスなどの用途では、そのほとんどが100μm、あるいは50μm以下に達しています。390μm以下のウエハーは薄型ウエハーと呼ばれています。これらの薄型ウエハーは、RFID（Radio Frequency Identification）、MEMS（Micro Electro Mechanical Systems）、パワーデバイスなどの用途で高い需要が見込まれます。

目次

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 市場概要

  • 市場の定義と範囲
  • 主な調査結果
    • 主な投資機会
  • ポーターのファイブフォース分析
  • 市場力学
    • 促進要因
      • 高性能集積回路の需要の高まりと半導体技術の発展
      • 無線周波数識別（RFID）タグの採用の増加
    • 抑制要因
      • 製造、保守、および製造プロセスに関連する高額な費用
    • 機会
      • ウエハー強化への投資は、収益機会を提供する可能性があります
  • 市場におけるCOVID-19影響分析

第4章 薄型ウエハ加工・ダイシング装置市場：装置タイプ別

  • 概要
    • 市場規模と予測
  • 間引き装置
    • 主要な市場動向、成長要因と機会
    • 市場規模と予測：地域別
    • 市場シェア分析： 国別
  • ダイシング装置
    • 主要な市場動向、成長要因と機会
    • 市場規模と予測：地域別
    • 市場シェア分析： 国別

第5章 薄型ウエハ加工・ダイシング装置市場：ウエハーサイズ別

  • 概要
    • 市場規模と予測
  • 4インチ未満
    • 主要な市場動向、成長要因と機会
    • 市場規模と予測：地域別
    • 市場シェア分析： 国別
  • 5インチと6インチ
    • 主要な市場動向、成長要因と機会
    • 市場規模と予測：地域別
    • 市場シェア分析： 国別
  • 8インチ
    • 主要な市場動向、成長要因と機会
    • 市場規模と予測：地域別
    • 市場シェア分析： 国別
  • 12インチ
    • 主要な市場動向、成長要因と機会
    • 市場規模と予測：地域別
    • 市場シェア分析： 国別

第6章 薄型ウエハ加工・ダイシング装置市場：用途別

  • 概要
    • 市場規模と予測
  • メモリとロジック
    • 主要な市場動向、成長要因と機会
    • 市場規模と予測：地域別
    • 市場シェア分析： 国別
  • MEMSデバイス
    • 主要な市場動向、成長要因と機会
    • 市場規模と予測：地域別
    • 市場シェア分析： 国別
  • CMOSイメージセンサー
    • 主要な市場動向、成長要因と機会
    • 市場規模と予測：地域別
    • 市場シェア分析： 国別
  • パワーデバイス
    • 主要な市場動向、成長要因と機会
    • 市場規模と予測：地域別
    • 市場シェア分析： 国別
  • RFID
    • 主要な市場動向、成長要因と機会
    • 市場規模と予測：地域別
    • 市場シェア分析： 国別

第7章 薄型ウエハ加工・ダイシング装置市場：地域別

  • 概要
    • 市場規模と予測
  • 北米
    • 主な動向と機会
    • 北米の市場規模と予測：機器タイプ別
    • 北米の市場規模と予測：ウエハーサイズ別
    • 北米の市場規模と予測：用途別
    • 北米市場規模と予測：国別
      • 米国
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
      • カナダ
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
      • メキシコ
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
  • 欧州
    • 主な動向と機会
    • 欧州の市場規模と予測：装置タイプ別
    • 欧州の市場規模と予測：ウエハーサイズ別
    • 欧州の市場規模と予測：アプリケーション別
    • 欧州の市場規模と予測：国別
      • 英国
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
      • ドイツ
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
      • フランス
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
      • その他欧州
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
  • アジア太平洋
    • 主な動向と機会
    • アジア太平洋の市場規模と予測：機器タイプ別
    • アジア太平洋の市場規模と予測：ウエハーサイズ別
    • アジア太平洋の市場規模と予測：アプリケーション別
    • アジア太平洋の市場規模と予測：国別
      • 中国
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
      • 日本
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
      • インド
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
      • 韓国
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
      • その他アジア太平洋地域
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
  • ラテンアメリカ・中東・アフリカ
    • 主な動向と機会
    • LAMEAの市場規模と予測：装置タイプ別
    • LAMEAの市場規模と予測：ウエハーサイズ別
    • LAMEAの市場規模と予測：用途別
    • LAMEAの市場規模と予測：国別
      • ラテンアメリカ
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
      • 中東
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別
      • アフリカ
      • 主要な市場動向、成長要因と機会
      • 市場規模と予測：装置タイプ別
      • 市場規模と予測：ウエハーサイズ別
      • 市場規模と予測：用途別

第8章 競合情勢

  • イントロダクション
  • 主要成功戦略
  • 主要10社の製品マッピング
  • 競合ダッシュボード
  • 競合ヒートマップ
  • トップ企業のポジショニング、2021年

第9章 企業プロファイル

  • Synova SA
  • Plasma-Therm
  • Disco Corporation
  • Panasonic
  • EV Group（EVG）
  • SPTS Technologies Ltd.
  • UTAC Holding, Ltd
  • Neon Tech Co. Ltd.
  • Lam Research Corp.
  • Suzhou Delphi Laser Co., Ltd.
図表

LIST OF TABLES

  • TABLE 1. GLOBAL THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 2. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET FOR THINNING EQUIPMENT, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 3. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET FOR DICING EQUIPMENT, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 4. GLOBAL THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 5. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET FOR LESS THAN 4 INCH, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 6. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET FOR 5 INCH AND 6 INCH, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 7. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET FOR 8 INCH, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 8. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET FOR 12 INCH, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 9. GLOBAL THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 10. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET FOR MEMORY AND LOGIC, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 11. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET FOR MEMS DEVICES, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 12. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET FOR CMOS IMAGE SENSORS, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 13. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET FOR POWER DEVICES, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 14. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET FOR RFID, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 15. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY REGION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 16. NORTH AMERICA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 17. NORTH AMERICA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 18. NORTH AMERICA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 19. NORTH AMERICA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
  • TABLE 20. U.S. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 21. U.S. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 22. U.S. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 23. CANADA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 24. CANADA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 25. CANADA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 26. MEXICO THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 27. MEXICO THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 28. MEXICO THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 29. EUROPE THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 30. EUROPE THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 31. EUROPE THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 32. EUROPE THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
  • TABLE 33. UK THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 34. UK THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 35. UK THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 36. GERMANY THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 37. GERMANY THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 38. GERMANY THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 39. FRANCE THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 40. FRANCE THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 41. FRANCE THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 42. REST OF EUROPE THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 43. REST OF EUROPE THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 44. REST OF EUROPE THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 45. ASIA-PACIFIC THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 46. ASIA-PACIFIC THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 47. ASIA-PACIFIC THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 48. ASIA-PACIFIC THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
  • TABLE 49. CHINA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 50. CHINA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 51. CHINA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 52. JAPAN THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 53. JAPAN THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 54. JAPAN THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 55. INDIA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 56. INDIA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 57. INDIA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 58. SOUTH KOREA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 59. SOUTH KOREA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 60. SOUTH KOREA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 61. REST OF ASIA-PACIFIC THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 62. REST OF ASIA-PACIFIC THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 63. REST OF ASIA-PACIFIC THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 64. LAMEA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 65. LAMEA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 66. LAMEA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 67. LAMEA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
  • TABLE 68. LATIN AMERICA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 69. LATIN AMERICA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 70. LATIN AMERICA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 71. MIDDLE EAST THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 72. MIDDLE EAST THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 73. MIDDLE EAST THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 74. AFRICA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 75. AFRICA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE, 2021-2031 (REVENUE, $MILLION)
  • TABLE 76. AFRICA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
  • TABLE 77. SYNOVA SA: KEY EXECUTIVES
  • TABLE 78. SYNOVA SA: COMPANY SNAPSHOT
  • TABLE 79. SYNOVA SA: OPERATING SEGMENTS
  • TABLE 80. SYNOVA SA: PRODUCT PORTFOLIO
  • TABLE 81. SYNOVA SA: NET SALES
  • TABLE 82. SYNOVA SA: KEY STRATERGIES
  • TABLE 83. PLASMA-THERM: KEY EXECUTIVES
  • TABLE 84. PLASMA-THERM: COMPANY SNAPSHOT
  • TABLE 85. PLASMA-THERM: OPERATING SEGMENTS
  • TABLE 86. PLASMA-THERM: PRODUCT PORTFOLIO
  • TABLE 87. PLASMA-THERM: NET SALES
  • TABLE 88. PLASMA-THERM: KEY STRATERGIES
  • TABLE 89. DISCO CORPORATION: KEY EXECUTIVES
  • TABLE 90. DISCO CORPORATION: COMPANY SNAPSHOT
  • TABLE 91. DISCO CORPORATION: OPERATING SEGMENTS
  • TABLE 92. DISCO CORPORATION: PRODUCT PORTFOLIO
  • TABLE 93. DISCO CORPORATION: NET SALES
  • TABLE 94. DISCO CORPORATION: KEY STRATERGIES
  • TABLE 95. PANASONIC: KEY EXECUTIVES
  • TABLE 96. PANASONIC: COMPANY SNAPSHOT
  • TABLE 97. PANASONIC: OPERATING SEGMENTS
  • TABLE 98. PANASONIC: PRODUCT PORTFOLIO
  • TABLE 99. PANASONIC: NET SALES
  • TABLE 100. PANASONIC: KEY STRATERGIES
  • TABLE 101. EV GROUP (EVG): KEY EXECUTIVES
  • TABLE 102. EV GROUP (EVG): COMPANY SNAPSHOT
  • TABLE 103. EV GROUP (EVG): OPERATING SEGMENTS
  • TABLE 104. EV GROUP (EVG): PRODUCT PORTFOLIO
  • TABLE 105. EV GROUP (EVG): NET SALES
  • TABLE 106. EV GROUP (EVG): KEY STRATERGIES
  • TABLE 107. SPTS TECHNOLOGIES LTD.: KEY EXECUTIVES
  • TABLE 108. SPTS TECHNOLOGIES LTD.: COMPANY SNAPSHOT
  • TABLE 109. SPTS TECHNOLOGIES LTD.: OPERATING SEGMENTS
  • TABLE 110. SPTS TECHNOLOGIES LTD.: PRODUCT PORTFOLIO
  • TABLE 111. SPTS TECHNOLOGIES LTD.: NET SALES
  • TABLE 112. SPTS TECHNOLOGIES LTD.: KEY STRATERGIES
  • TABLE 113. UTAC HOLDING, LTD: KEY EXECUTIVES
  • TABLE 114. UTAC HOLDING, LTD: COMPANY SNAPSHOT
  • TABLE 115. UTAC HOLDING, LTD: OPERATING SEGMENTS
  • TABLE 116. UTAC HOLDING, LTD: PRODUCT PORTFOLIO
  • TABLE 117. UTAC HOLDING, LTD: NET SALES
  • TABLE 118. UTAC HOLDING, LTD: KEY STRATERGIES
  • TABLE 119. NEON TECH CO. LTD.: KEY EXECUTIVES
  • TABLE 120. NEON TECH CO. LTD.: COMPANY SNAPSHOT
  • TABLE 121. NEON TECH CO. LTD.: OPERATING SEGMENTS
  • TABLE 122. NEON TECH CO. LTD.: PRODUCT PORTFOLIO
  • TABLE 123. NEON TECH CO. LTD.: NET SALES
  • TABLE 124. NEON TECH CO. LTD.: KEY STRATERGIES
  • TABLE 125. LAM RESEARCH CORP.: KEY EXECUTIVES
  • TABLE 126. LAM RESEARCH CORP.: COMPANY SNAPSHOT
  • TABLE 127. LAM RESEARCH CORP.: OPERATING SEGMENTS
  • TABLE 128. LAM RESEARCH CORP.: PRODUCT PORTFOLIO
  • TABLE 129. LAM RESEARCH CORP.: NET SALES
  • TABLE 130. LAM RESEARCH CORP.: KEY STRATERGIES
  • TABLE 131. SUZHOU DELPHI LASER CO., LTD.: KEY EXECUTIVES
  • TABLE 132. SUZHOU DELPHI LASER CO., LTD.: COMPANY SNAPSHOT
  • TABLE 133. SUZHOU DELPHI LASER CO., LTD.: OPERATING SEGMENTS
  • TABLE 134. SUZHOU DELPHI LASER CO., LTD.: PRODUCT PORTFOLIO
  • TABLE 135. SUZHOU DELPHI LASER CO., LTD.: NET SALES
  • TABLE 136. SUZHOU DELPHI LASER CO., LTD.: KEY STRATERGIES

LIST OF FIGURES

  • FIGURE 1. SEGMENTATION OF THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031
  • FIGURE 2. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031
  • FIGURE 3. TOP INVESTMENT POCKETS, BY REGION
  • FIGURE 4. PORTER FIVE-1
  • FIGURE 5. PORTER FIVE-2
  • FIGURE 6. PORTER FIVE-3
  • FIGURE 7. PORTER FIVE-4
  • FIGURE 8. PORTER FIVE-5
  • FIGURE 9. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET:DRIVERS, RESTRAINTS AND OPPORTUNITIES
  • FIGURE 10. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,BY EQUIPMENT TYPE,2021(%)
  • FIGURE 11. COMPARATIVE SHARE ANALYSIS OF THINNING EQUIPMENT THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, 2021 AND 2031(%)
  • FIGURE 12. COMPARATIVE SHARE ANALYSIS OF DICING EQUIPMENT THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, 2021 AND 2031(%)
  • FIGURE 13. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,BY WAFER SIZE,2021(%)
  • FIGURE 14. COMPARATIVE SHARE ANALYSIS OF LESS THAN 4 INCH THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, 2021 AND 2031(%)
  • FIGURE 15. COMPARATIVE SHARE ANALYSIS OF 5 INCH AND 6 INCH THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, 2021 AND 2031(%)
  • FIGURE 16. COMPARATIVE SHARE ANALYSIS OF 8 INCH THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, 2021 AND 2031(%)
  • FIGURE 17. COMPARATIVE SHARE ANALYSIS OF 12 INCH THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, 2021 AND 2031(%)
  • FIGURE 18. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,BY APPLICATION,2021(%)
  • FIGURE 19. COMPARATIVE SHARE ANALYSIS OF MEMORY AND LOGIC THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, 2021 AND 2031(%)
  • FIGURE 20. COMPARATIVE SHARE ANALYSIS OF MEMS DEVICES THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, 2021 AND 2031(%)
  • FIGURE 21. COMPARATIVE SHARE ANALYSIS OF CMOS IMAGE SENSORS THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, 2021 AND 2031(%)
  • FIGURE 22. COMPARATIVE SHARE ANALYSIS OF POWER DEVICES THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, 2021 AND 2031(%)
  • FIGURE 23. COMPARATIVE SHARE ANALYSIS OF RFID THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, 2021 AND 2031(%)
  • FIGURE 24. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET BY REGION,2021
  • FIGURE 25. U.S. THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 26. CANADA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 27. MEXICO THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 28. UK THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 29. GERMANY THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 30. FRANCE THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 31. REST OF EUROPE THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 32. CHINA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 33. JAPAN THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 34. INDIA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 35. SOUTH KOREA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 36. REST OF ASIA-PACIFIC THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 37. LATIN AMERICA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 38. MIDDLE EAST THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 39. AFRICA THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET,2021-2031($MILLION)
  • FIGURE 40. TOP WINNING STRATEGIES, BY YEAR
  • FIGURE 41. TOP WINNING STRATEGIES, BY DEVELOPMENT
  • FIGURE 42. TOP WINNING STRATEGIES, BY COMPANY
  • FIGURE 43. PRODUCT MAPPING OF TOP 10 PLAYERS
  • FIGURE 44. COMPETITIVE DASHBOARD
  • FIGURE 45. COMPETITIVE HEATMAP OF TOP 10 KEY PLAYERS
  • FIGURE 46. TOP PLAYER POSITIONING, 2021
  • FIGURE 47. SYNOVA SA.: NET SALES ($MILLION)
  • FIGURE 48. PLASMA-THERM.: NET SALES ($MILLION)
  • FIGURE 49. DISCO CORPORATION.: NET SALES ($MILLION)
  • FIGURE 50. PANASONIC.: NET SALES ($MILLION)
  • FIGURE 51. EV GROUP (EVG).: NET SALES ($MILLION)
  • FIGURE 52. SPTS TECHNOLOGIES LTD..: NET SALES ($MILLION)
  • FIGURE 53. UTAC HOLDING, LTD.: NET SALES ($MILLION)
  • FIGURE 54. NEON TECH CO. LTD..: NET SALES ($MILLION)
  • FIGURE 55. LAM RESEARCH CORP..: NET SALES ($MILLION)
  • FIGURE 56. SUZHOU DELPHI LASER CO., LTD..: NET SALES ($MILLION)
目次
Product Code: A14701

The global thin wafer processing and dicing equipment market was valued at $643.78 million in 2021, and is projected to reach $1,196.49 million by 2031, registering a CAGR of 6.67% from 2022 to 2031.

A wafer is a thin slice of semiconductor material and dicing is the process which is used to cut or groove semiconductors, glass crystal and many other types of materials. Instrument used during this process is known as dicing equipment. Wafer dicing is the process of separating the dies from a semiconductor wafer after the wafer has been processed. The need for miniaturization towards small, powerful, and inexpensive device configurations has created the need for thin wafers. Most of these have reached 100 µm or even less than 50 µm for applications such as memory and power devices. Wafers below 390 µm are considered thin wafers. These thin wafers are expected to be in high demand for applications in Radio Frequency Identification (RFID), Micro Electro Mechanical Systems (MEMS), and power devices.   

The thin wafer processing and dicing equipment market is segmented on the basis of equipment type, application, wafer size, and region. On the basis of equipment type, the market is divided into thinning equipment and dicing equipment. On the basis of application, it is divided into memory and logic Through Silicon Via (TSV), Micro Electro Mechanical Systems (MEMS) devices, power devices, CMOS image sensors, and Radio Frequency Identification (RFID). On the basis of wafer size, the market is divided into less than 4-inch, 5-inch and 6-inch, 8-inch, and 12-inch. Region-wise, thin wafer processing and dicing equipment market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific) and LAMEA (Latin America, the Middle East, and Africa).   

The key thin wafer processing and dicing equipment market leaders profiled in the report include Suzhou Delphi Laser Co. Ltd., Synova, UTAC Holding, Ltd., Plasma-Therm, Disco Corporation, Neon Tech Co. Ltd., Panasonic System Solutions, EV Group (EVG), Lam Research Corporation, SPTS Technologies Ltd. These key players adopt several strategies such as new product launch and development, acquisition, partnership and collaboration and business expansion to increase the thin wafer processing and dicing equipment market share during the forecast period. 

Key Benefits For Stakeholders

  • This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the thin wafer processing and dicing equipment market analysis from 2021 to 2031 to identify the prevailing thin wafer processing and dicing equipment market opportunities.
  • The market research is offered along with information related to key drivers, restraints, and opportunities.
  • Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders to make profit-oriented business decisions and strengthen their supplier-buyer network.
  • In-depth analysis of the thin wafer processing and dicing equipment market segmentation assists to determine the prevailing market opportunities.
  • Major countries in each region are mapped according to their revenue contribution to the global market.
  • Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
  • The report includes an analysis of the regional as well as global thin wafer processing and dicing equipment market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Wafer Size

  • Less than 4 inch
  • 5 inch and 6 inch
  • 8 inch
  • 12 inch

By Equipment Type

  • Thinning Equipment
  • Dicing Equipment

By Application

  • Memory and Logic
  • MEMS Devices
  • CMOS Image Sensors
  • Power Devices
  • RFID

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

Key Market Players

  • Synova SA
  • Plasma-Therm
  • Disco Corporation
  • Panasonic
  • EV Group (EVG)
  • SPTS Technologies Ltd.
  • UTAC Holding, Ltd
  • Neon Tech Co. Ltd.
  • Lam Research Corp.
  • Suzhou Delphi Laser Co., Ltd.

TABLE OF CONTENTS

CHAPTER 1:INTRODUCTION

  • 1.1.Report description
  • 1.2.Key market segments
  • 1.3.Key benefits to the stakeholders
  • 1.4.Research Methodology
    • 1.4.1.Secondary research
    • 1.4.2.Primary research
    • 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

  • 2.1.Key findings of the study
  • 2.2.CXO Perspective

CHAPTER 3:MARKET OVERVIEW

  • 3.1.Market definition and scope
  • 3.2.Key findings
    • 3.2.1.Top investment pockets
  • 3.3.Porter's five forces analysis
  • 3.4.Market dynamics
    • 3.4.1.Drivers
      • 3.4.1.1. Growing demand for high-performance integrated circuits and developments in semiconductor technology
      • 3.4.1.2. Increasing adoption of Radio Frequency Identification (RFID) tags
    • 3.4.2.Restraints
      • 3.4.2.1. High expenses associated with fabrication, maintenance, and manufacturing processes
    • 3.4.3.Opportunities
      • 3.4.3.1. Investment in wafer enhancement could provide profitable opportunities
  • 3.5.COVID-19 Impact Analysis on the market

CHAPTER 4: THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE

  • 4.1 Overview
    • 4.1.1 Market size and forecast
  • 4.2. Thinning Equipment
    • 4.2.1 Key market trends, growth factors and opportunities
    • 4.2.2 Market size and forecast, by region
    • 4.2.3 Market share analysis by country
  • 4.3. Dicing Equipment
    • 4.3.1 Key market trends, growth factors and opportunities
    • 4.3.2 Market size and forecast, by region
    • 4.3.3 Market share analysis by country

CHAPTER 5: THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE

  • 5.1 Overview
    • 5.1.1 Market size and forecast
  • 5.2. Less than 4 inch
    • 5.2.1 Key market trends, growth factors and opportunities
    • 5.2.2 Market size and forecast, by region
    • 5.2.3 Market share analysis by country
  • 5.3. 5 inch and 6 inch
    • 5.3.1 Key market trends, growth factors and opportunities
    • 5.3.2 Market size and forecast, by region
    • 5.3.3 Market share analysis by country
  • 5.4. 8 inch
    • 5.4.1 Key market trends, growth factors and opportunities
    • 5.4.2 Market size and forecast, by region
    • 5.4.3 Market share analysis by country
  • 5.5. 12 inch
    • 5.5.1 Key market trends, growth factors and opportunities
    • 5.5.2 Market size and forecast, by region
    • 5.5.3 Market share analysis by country

CHAPTER 6: THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION

  • 6.1 Overview
    • 6.1.1 Market size and forecast
  • 6.2. Memory and Logic
    • 6.2.1 Key market trends, growth factors and opportunities
    • 6.2.2 Market size and forecast, by region
    • 6.2.3 Market share analysis by country
  • 6.3. MEMS Devices
    • 6.3.1 Key market trends, growth factors and opportunities
    • 6.3.2 Market size and forecast, by region
    • 6.3.3 Market share analysis by country
  • 6.4. CMOS Image Sensors
    • 6.4.1 Key market trends, growth factors and opportunities
    • 6.4.2 Market size and forecast, by region
    • 6.4.3 Market share analysis by country
  • 6.5. Power Devices
    • 6.5.1 Key market trends, growth factors and opportunities
    • 6.5.2 Market size and forecast, by region
    • 6.5.3 Market share analysis by country
  • 6.6. RFID
    • 6.6.1 Key market trends, growth factors and opportunities
    • 6.6.2 Market size and forecast, by region
    • 6.6.3 Market share analysis by country

CHAPTER 7: THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY REGION

  • 7.1 Overview
    • 7.1.1 Market size and forecast
  • 7.2 North America
    • 7.2.1 Key trends and opportunities
    • 7.2.2 North America Market size and forecast, by Equipment Type
    • 7.2.3 North America Market size and forecast, by Wafer Size
    • 7.2.4 North America Market size and forecast, by Application
    • 7.2.5 North America Market size and forecast, by country
      • 7.2.5.1 U.S.
      • 7.2.5.1.1 Key market trends, growth factors and opportunities
      • 7.2.5.1.2 Market size and forecast, by Equipment Type
      • 7.2.5.1.3 Market size and forecast, by Wafer Size
      • 7.2.5.1.4 Market size and forecast, by Application
      • 7.2.5.2 Canada
      • 7.2.5.2.1 Key market trends, growth factors and opportunities
      • 7.2.5.2.2 Market size and forecast, by Equipment Type
      • 7.2.5.2.3 Market size and forecast, by Wafer Size
      • 7.2.5.2.4 Market size and forecast, by Application
      • 7.2.5.3 Mexico
      • 7.2.5.3.1 Key market trends, growth factors and opportunities
      • 7.2.5.3.2 Market size and forecast, by Equipment Type
      • 7.2.5.3.3 Market size and forecast, by Wafer Size
      • 7.2.5.3.4 Market size and forecast, by Application
  • 7.3 Europe
    • 7.3.1 Key trends and opportunities
    • 7.3.2 Europe Market size and forecast, by Equipment Type
    • 7.3.3 Europe Market size and forecast, by Wafer Size
    • 7.3.4 Europe Market size and forecast, by Application
    • 7.3.5 Europe Market size and forecast, by country
      • 7.3.5.1 UK
      • 7.3.5.1.1 Key market trends, growth factors and opportunities
      • 7.3.5.1.2 Market size and forecast, by Equipment Type
      • 7.3.5.1.3 Market size and forecast, by Wafer Size
      • 7.3.5.1.4 Market size and forecast, by Application
      • 7.3.5.2 Germany
      • 7.3.5.2.1 Key market trends, growth factors and opportunities
      • 7.3.5.2.2 Market size and forecast, by Equipment Type
      • 7.3.5.2.3 Market size and forecast, by Wafer Size
      • 7.3.5.2.4 Market size and forecast, by Application
      • 7.3.5.3 France
      • 7.3.5.3.1 Key market trends, growth factors and opportunities
      • 7.3.5.3.2 Market size and forecast, by Equipment Type
      • 7.3.5.3.3 Market size and forecast, by Wafer Size
      • 7.3.5.3.4 Market size and forecast, by Application
      • 7.3.5.4 Rest of Europe
      • 7.3.5.4.1 Key market trends, growth factors and opportunities
      • 7.3.5.4.2 Market size and forecast, by Equipment Type
      • 7.3.5.4.3 Market size and forecast, by Wafer Size
      • 7.3.5.4.4 Market size and forecast, by Application
  • 7.4 Asia-Pacific
    • 7.4.1 Key trends and opportunities
    • 7.4.2 Asia-Pacific Market size and forecast, by Equipment Type
    • 7.4.3 Asia-Pacific Market size and forecast, by Wafer Size
    • 7.4.4 Asia-Pacific Market size and forecast, by Application
    • 7.4.5 Asia-Pacific Market size and forecast, by country
      • 7.4.5.1 China
      • 7.4.5.1.1 Key market trends, growth factors and opportunities
      • 7.4.5.1.2 Market size and forecast, by Equipment Type
      • 7.4.5.1.3 Market size and forecast, by Wafer Size
      • 7.4.5.1.4 Market size and forecast, by Application
      • 7.4.5.2 Japan
      • 7.4.5.2.1 Key market trends, growth factors and opportunities
      • 7.4.5.2.2 Market size and forecast, by Equipment Type
      • 7.4.5.2.3 Market size and forecast, by Wafer Size
      • 7.4.5.2.4 Market size and forecast, by Application
      • 7.4.5.3 India
      • 7.4.5.3.1 Key market trends, growth factors and opportunities
      • 7.4.5.3.2 Market size and forecast, by Equipment Type
      • 7.4.5.3.3 Market size and forecast, by Wafer Size
      • 7.4.5.3.4 Market size and forecast, by Application
      • 7.4.5.4 South Korea
      • 7.4.5.4.1 Key market trends, growth factors and opportunities
      • 7.4.5.4.2 Market size and forecast, by Equipment Type
      • 7.4.5.4.3 Market size and forecast, by Wafer Size
      • 7.4.5.4.4 Market size and forecast, by Application
      • 7.4.5.5 Rest of Asia-Pacific
      • 7.4.5.5.1 Key market trends, growth factors and opportunities
      • 7.4.5.5.2 Market size and forecast, by Equipment Type
      • 7.4.5.5.3 Market size and forecast, by Wafer Size
      • 7.4.5.5.4 Market size and forecast, by Application
  • 7.5 LAMEA
    • 7.5.1 Key trends and opportunities
    • 7.5.2 LAMEA Market size and forecast, by Equipment Type
    • 7.5.3 LAMEA Market size and forecast, by Wafer Size
    • 7.5.4 LAMEA Market size and forecast, by Application
    • 7.5.5 LAMEA Market size and forecast, by country
      • 7.5.5.1 Latin America
      • 7.5.5.1.1 Key market trends, growth factors and opportunities
      • 7.5.5.1.2 Market size and forecast, by Equipment Type
      • 7.5.5.1.3 Market size and forecast, by Wafer Size
      • 7.5.5.1.4 Market size and forecast, by Application
      • 7.5.5.2 Middle East
      • 7.5.5.2.1 Key market trends, growth factors and opportunities
      • 7.5.5.2.2 Market size and forecast, by Equipment Type
      • 7.5.5.2.3 Market size and forecast, by Wafer Size
      • 7.5.5.2.4 Market size and forecast, by Application
      • 7.5.5.3 Africa
      • 7.5.5.3.1 Key market trends, growth factors and opportunities
      • 7.5.5.3.2 Market size and forecast, by Equipment Type
      • 7.5.5.3.3 Market size and forecast, by Wafer Size
      • 7.5.5.3.4 Market size and forecast, by Application

CHAPTER 8: COMPETITIVE LANDSCAPE

  • 8.1. Introduction
  • 8.2. Top winning strategies
  • 8.3. Product Mapping of Top 10 Player
  • 8.4. Competitive Dashboard
  • 8.5. Competitive Heatmap
  • 8.6. Top player positioning, 2021

CHAPTER 9: COMPANY PROFILES

  • 9.1 Synova SA
    • 9.1.1 Company overview
    • 9.1.2 Key Executives
    • 9.1.3 Company snapshot
    • 9.1.4 Operating business segments
    • 9.1.5 Product portfolio
    • 9.1.6 Business performance
    • 9.1.7 Key strategic moves and developments
  • 9.2 Plasma-Therm
    • 9.2.1 Company overview
    • 9.2.2 Key Executives
    • 9.2.3 Company snapshot
    • 9.2.4 Operating business segments
    • 9.2.5 Product portfolio
    • 9.2.6 Business performance
    • 9.2.7 Key strategic moves and developments
  • 9.3 Disco Corporation
    • 9.3.1 Company overview
    • 9.3.2 Key Executives
    • 9.3.3 Company snapshot
    • 9.3.4 Operating business segments
    • 9.3.5 Product portfolio
    • 9.3.6 Business performance
    • 9.3.7 Key strategic moves and developments
  • 9.4 Panasonic
    • 9.4.1 Company overview
    • 9.4.2 Key Executives
    • 9.4.3 Company snapshot
    • 9.4.4 Operating business segments
    • 9.4.5 Product portfolio
    • 9.4.6 Business performance
    • 9.4.7 Key strategic moves and developments
  • 9.5 EV Group (EVG)
    • 9.5.1 Company overview
    • 9.5.2 Key Executives
    • 9.5.3 Company snapshot
    • 9.5.4 Operating business segments
    • 9.5.5 Product portfolio
    • 9.5.6 Business performance
    • 9.5.7 Key strategic moves and developments
  • 9.6 SPTS Technologies Ltd.
    • 9.6.1 Company overview
    • 9.6.2 Key Executives
    • 9.6.3 Company snapshot
    • 9.6.4 Operating business segments
    • 9.6.5 Product portfolio
    • 9.6.6 Business performance
    • 9.6.7 Key strategic moves and developments
  • 9.7 UTAC Holding, Ltd
    • 9.7.1 Company overview
    • 9.7.2 Key Executives
    • 9.7.3 Company snapshot
    • 9.7.4 Operating business segments
    • 9.7.5 Product portfolio
    • 9.7.6 Business performance
    • 9.7.7 Key strategic moves and developments
  • 9.8 Neon Tech Co. Ltd.
    • 9.8.1 Company overview
    • 9.8.2 Key Executives
    • 9.8.3 Company snapshot
    • 9.8.4 Operating business segments
    • 9.8.5 Product portfolio
    • 9.8.6 Business performance
    • 9.8.7 Key strategic moves and developments
  • 9.9 Lam Research Corp.
    • 9.9.1 Company overview
    • 9.9.2 Key Executives
    • 9.9.3 Company snapshot
    • 9.9.4 Operating business segments
    • 9.9.5 Product portfolio
    • 9.9.6 Business performance
    • 9.9.7 Key strategic moves and developments
  • 9.10 Suzhou Delphi Laser Co., Ltd.
    • 9.10.1 Company overview
    • 9.10.2 Key Executives
    • 9.10.3 Company snapshot
    • 9.10.4 Operating business segments
    • 9.10.5 Product portfolio
    • 9.10.6 Business performance
    • 9.10.7 Key strategic moves and developments