DIL (Dual-In-Line) パッケージソケットの世界市場：成長、将来展望、競合分析 (2022年～2030年)

"集積回路市場の拡大が、DILパッケージソケット市場に活力を与える"

世界のDILパッケージソケット市場の全体的規模は、予測期間中 (2022年～2030年) に5.0%のCAGRで成長すると予測されています。DILパッケージソケット市場は、集積回路市場の継続的な成長によって牽引されています。電子機器への依存度が常に高まっていることから、集積回路市場は今後も堅調な成長が見込まれ、それがDILパッケージソケット市場に拍車をかけています。また、より多くの信号と電力供給を必要とする複雑な回路の増加により、DILパッケージソケットに対する高い需要が発生しています。

"家電製品が市場を席巻"

用途別に見ると、家電製品のセグメントが市場を主導しています。ノートパソコンやスマートフォン、PC、タブレット端末など、集積回路を搭載した電子機器の販売が増加しているため、DILパッケージソケットの売上は増加傾向にあります。また、近年の家電製品の小型化や、1枚のディスクに様々な技術を搭載する傾向が、市の成長を牽引しています。さらに、家電製品の売上が伸びていることから、家電製品のセグメントが今後も市場をリードし続けるものと思われます。

"アジア太平洋地域が最速の成長地域となる"

地域別では、北米がDILパッケージソケット市場をリードしています。家電製品や防衛機器の需要拡大、研究開発 (R&D) 活動の急速な増加が北米の主な成長要因です。一方、アジア太平洋地域は最も急速に成長している地域です。消費者の嗜好の変化に伴う製品開発期間の短縮により、DILパッケージソケットの売上が増加すると予想されます。さらに、自動車や家電の成長も市場の成長を後押ししています。

当レポートでは、世界のDIL (Dual-In-Line) パッケージソケット市場について分析し、市場の基本構造やマクロ的・ミクロ的環境要因、全体的な市場規模の動向見通し (2020年～2030年)、製品別・用途別および地域別の詳細動向、主な市場促進・抑制要因、主要企業のプロファイルと成長戦略、といった情報を取りまとめてお届けいたします。

目次

第1章 序文

第2章 エグゼクティブサマリー

第3章 DILパッケージソケット市場：ビジネスの展望と市場力学

• イントロダクション
• 世界のDILパッケージソケットの市場規模 (単位：100万米ドル、2020年～2030年)
• 市場力学
  • 市場促進要因
  • 市場抑制要因
  • 主な課題
  • 主な機会
• 促進・抑制要因の影響分析
• シーソー分析
• ポーターのファイブフォース分析
• PESTEL分析

第4章 DILパッケージソケット市場：製品別 (単位：100万米ドル、2020年～2030年)

• 市場概要
• 成長・収益分析 (2021年/2030年)
• 市場区分
  • オープンフレーム
  • クローズドフレーム

第5章 DILパッケージソケット市場：用途別 (単位：100万米ドル、2020年～2030年)

• 市場概要
• 成長・収益分析 (2021年/2030年)
• 市場区分
  • 家電製品
  • 自動車
  • 医療
  • 防衛

第6章 北米のDILパッケージソケット市場 (単位：100万米ドル、2020年～2030年)

• 市場概要
• DILパッケージソケット市場：製品別 (単位：100万米ドル、2020年～2030年)
• DILパッケージソケット市場：用途別 (単位：100万米ドル、2020年～2030年)
• DILパッケージソケット市場：地域別 (単位：100万米ドル、2020年～2030年)
  • 北米

第7章 英国・EU諸国のDILパッケージソケット市場 (単位：100万米ドル、2020年～2030年)

第8章 アジア太平洋のDILパッケージソケット市場 (単位：100万米ドル、2020年～2030年)

第9章 ラテンアメリカのDILパッケージソケット市場 (単位：100万米ドル、2020年～2030年)

第10章 中東・アフリカのDILパッケージソケット市場 (単位：100万米ドル、2020年～2030年)

第11章 企業プロファイル

• Enplas
• Molex
• Aries Electronics
• 3M
• WinWay
• Chupond Precision
• Loranger
• Foxconn Technology
• Mill-Max
• Johnstech
• Plastronics
• Yamaichi Electronics
• TE Connectivity
• Sensata Technologies

List of Tables

• TABLE 1 Global Dual-In-Line Package Sockets Market By Product, 2020-2030, USD (Million)
• TABLE 2 Global Dual-In-Line Package Sockets Market By Application, 2020-2030, USD (Million)
• TABLE 3 North America Dual-In-Line Package Sockets Market By Product, 2020-2030, USD (Million)
• TABLE 4 North America Dual-In-Line Package Sockets Market By Application, 2020-2030, USD (Million)
• TABLE 5 UK and European Union Dual-In-Line Package Sockets Market By Product, 2020-2030, USD (Million)
• TABLE 6 UK and European Union Dual-In-Line Package Sockets Market By Application, 2020-2030, USD (Million)
• TABLE 7 Asia Pacific Dual-In-Line Package Sockets Market By Product, 2020-2030, USD (Million)
• TABLE 8 Asia Pacific Dual-In-Line Package Sockets Market By Application, 2020-2030, USD (Million)
• TABLE 9 Latin America Dual-In-Line Package Sockets Market By Product, 2020-2030, USD (Million)
• TABLE 10 Latin America Dual-In-Line Package Sockets Market By Application, 2020-2030, USD (Million)
• TABLE 11 Middle East and Africa Dual-In-Line Package Sockets Market By Product, 2020-2030, USD (Million)
• TABLE 12 Middle East and Africa Dual-In-Line Package Sockets Market By Application, 2020-2030, USD (Million)

List of Figures

• FIG. 1 Global Dual-In-Line Package Sockets Market: Market Coverage
• FIG. 2 Research Methodology and Data Sources
• FIG. 3 Market Size Estimation - Top Down & Bottom-Up Approach
• FIG. 4 Global Dual-In-Line Package Sockets Market: Quality Assurance
• FIG. 5 Global Dual-In-Line Package Sockets Market, By Product, 2021
• FIG. 6 Global Dual-In-Line Package Sockets Market, By Application, 2021
• FIG. 7 Global Dual-In-Line Package Sockets Market, By Geography, 2021
• FIG. 8 Global Dual-In-Line Package Sockets Market, By Product, 2021 Vs 2030, %
• FIG. 9 Global Dual-In-Line Package Sockets Market, By Application, 2021 Vs 2030, %
• FIG. 10 U.S. Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 11 Canada Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 12 Rest of North America Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 13 UK Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 14 Germany Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 15 Spain Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 16 Italy Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 17 France Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 18 Rest of Europe Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 19 China Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 20 Japan Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 21 India Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 22 Australia Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 23 South Korea Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 24 Rest of Asia Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 25 Brazil Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 26 Mexico Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 27 Rest of Latin America Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 28 GCC Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 29 Africa Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030
• FIG. 30 Rest of Middle East and Africa Dual-In-Line Package Sockets Market (US$ Million), 2020 - 2030

Increase in Integrated Circuits Market to Give Boost to the Dual-In-Line Package Sockets Market

The overall dual-in-line package sockets market is projected to register a CAGR of 5.0% through the estimation period starting from 2022 to 2030. Dual-in-line package sockets market is driven by the continued growth in integrated circuits market. Integrated circuits have become an integral part of nearly all of the electronic devices and components. With consistently growing dependence on electronics, integrated circuits market is expected to continue witnessing robust growth, thereby fueling the dual-in-line package sockets market. Increase in complex circuits which required more signal and power supply, resulted in high demand for dual-in-line package sockets. Subsequently, the market is set to demonstrate strong growth over the forecast period.

Consumer Electronics Set to Dominate the Market

The dual-in-line package sockets market by application type is led by consumer electronics segment. Owing to increased sales of electronics devices that incorporate integrated circuits such as laptops, smartphones, PCs, tablets, and others, the sales of dual-in-line package sockets is on a rise. Also, the recent trend of miniaturization and fabrication of various technologies onto a single disk in consumer devices is driving the growth of dual-in-line package sockets market. Further, due to rising sales of consumer electronics products the consumer electronics segment shall continue to lead the market throughout the forecast period.

Asia Pacific to be the Fastest Growing Region

North America led the dual-in-line package sockets market. Growing demand for consumer electronics, defense equipment, and rapid increase in R & D activities are the major growth factors for North America. On the other hand, Asia Pacific will be the fastest growing region. Owing to reduction in time taken for development of a product backed by quick changes in consumer preferences in the region, the sales for dual-in-line package sockets would increase. Further, growth in automotive and consumer electronics is driving the growth of the dual-in-line package sockets market. As a result of the aforementioned factors, Asia Pacific will be the fastest growing segment throughout the forecast period.

Some of the prominent players operating in the dual-in-line package sockets market Enplas, Molex, Aries Electronics, 3M, WinWay, Chupond Precision, Loranger, Foxconn Technology, Mill-Max, Johnstech, Plastronics, Yamaichi Electronics, TE Connectivity and Sensata Technologies, among others.

Historical & Forecast Period

This study report represents analysis of each segment from 2020 to 2030 considering 2021 as the base year. Compounded Annual Growth Rate (CAGR) for each of the respective segments estimated for the forecast period of 2022 to 2030.

The current report comprises of quantitative market estimations for each micro market for every geographical region and qualitative market analysis such as micro and macro environment analysis, market trends, competitive intelligence, segment analysis, porters five force model, top winning strategies, top investment markets, emerging trends and technological analysis, case studies, strategic conclusions and recommendations and other key market insights.

Research Methodology

The complete research study was conducted in three phases, namely: secondary research, primary research, and expert panel review. key data point that enables the estimation of Dual-In-Line Package Sockets market are as follows:

Research and development budgets of manufacturers and government spending

Revenues of key companies in the market segment

Number of end users and consumption volume, price and value.

Geographical revenues generate by countries considered in the report

Micro and macro environment factors that are currently influencing the Dual-In-Line Package Sockets market and their expected impact during the forecast period.

Market forecast was performed through proprietary software that analyzes various qualitative and quantitative factors. Growth rate and CAGR were estimated through intensive secondary and primary research. Data triangulation across various data points provides accuracy across various analyzed market segments in the report. Application of both top down and bottom-up approach for validation of market estimation assures logical, methodical and mathematical consistency of the quantitative data.

ATTRIBUTE DETAILS

Research Period 2020-2030

Base Year 2021

Forecast Period 2022-2030

Historical Year 2020

Unit USD Million

Segmentation

Product

Open Frame

Closed Frame

Application

Consumer Electronics

Automotive

Medical

Defense

Region Segment (2020-2030; US$ Million)

North America

U.S.

Canada

Rest of North America

UK and European Union

UK

Germany

Spain

Italy

France

Rest of Europe

Asia Pacific

China

Japan

India

Australia

South Korea

Rest of Asia Pacific

Latin America

Brazil

Mexico

Rest of Latin America

Middle East and Africa

GCC

Africa

Rest of Middle East and Africa

Global Impact of COVID-19 Segment (2020-2021; US$ Million )

Pre COVID-19 situation

Post COVID-19 situation

Key questions answered in this report:

What are the key micro and macro environmental factors that are impacting the growth of Dual-In-Line Package Sockets market?

What are the key investment pockets with respect to product segments and geographies currently and during the forecast period?

Estimated forecast and market projections up to 2030.

Which segment accounts for the fastest CAGR during the forecast period?

Which market segment holds a larger market share and why?

Are low and middle-income economies investing in the Dual-In-Line Package Sockets market?

Which is the largest regional market for Dual-In-Line Package Sockets market?

What are the market trends and dynamics in emerging markets such as Asia Pacific, Latin America, and Middle East & Africa?

Which are the key trends driving Dual-In-Line Package Sockets market growth?

Who are the key competitors and what are their key strategies to enhance their market presence in the Dual-In-Line Package Sockets market worldwide?

Table of Contents

1. Preface

• 1.1. Report Description
  • 1.1.1. Purpose of the Report
  • 1.1.2. Target Audience
  • 1.1.3. Key Offerings
• 1.2. Market Segmentation
• 1.3. Research Methodology
  • 1.3.1. Phase I - Secondary Research
  • 1.3.2. Phase II - Primary Research
  • 1.3.3. Phase III - Expert Panel Review
  • 1.3.4. Assumptions
  • 1.3.5. Approach Adopted

2. Executive Summary

• 2.1. Market Snapshot: Global Dual-In-Line Package Sockets Market
• 2.2. Global Dual-In-Line Package Sockets Market, By Product, 2021 (US$ Million)
• 2.3. Global Dual-In-Line Package Sockets Market, By Application, 2021 (US$ Million)
• 2.4. Global Dual-In-Line Package Sockets Market, By Geography, 2021 (US$ Million)
• 2.5. Impact of Covid 19
• 2.6. Attractive Investment Proposition by Geography, 2021
• 2.7. Competitive Analysis
  • 2.7.1. Market Positioning of Key Dual-In-Line Package Sockets Market Vendors
  • 2.7.2. Strategies Adopted by Dual-In-Line Package Sockets Market Vendors
  • 2.7.3. Key Industry Strategies

3. Dual-In-Line Package Sockets Market: Business Outlook & Market Dynamics

• 3.1. Introduction
• 3.2. Global Dual-In-Line Package Sockets Market Value, 2020 - 2030, (US$ Million)
• 3.3. Market Dynamics
  • 3.3.1. Market Drivers
  • 3.3.2. Market Restraints
  • 3.3.3. Key Challenges
  • 3.3.4. Key Opportunities
• 3.4. Impact Analysis of Drivers and Restraints
• 3.5. See-Saw Analysis
• 3.6. Porter's Five Force Model
  • 3.6.1. Supplier Power
  • 3.6.2. Buyer Power
  • 3.6.3. Threat Of Substitutes
  • 3.6.4. Threat Of New Entrants
  • 3.6.5. Competitive Rivalry
• 3.7. PESTEL Analysis
  • 3.7.1. Political Landscape
  • 3.7.2. Economic Landscape
  • 3.7.3. Technology Landscape
  • 3.7.4. Legal Landscape
  • 3.7.5. Social Landscape

4. Dual-In-Line Package Sockets Market: By Product, 2020-2030, USD (Million)

• 4.1. Market Overview
• 4.2. Growth & Revenue Analysis: 2021 Versus 2030
• 4.3. Market Segmentation
  • 4.3.1. Open Frame
  • 4.3.2. Closed Frame

5. Dual-In-Line Package Sockets Market: By Application, 2020-2030, USD (Million)

• 5.1. Market Overview
• 5.2. Growth & Revenue Analysis: 2021 Versus 2030
• 5.3. Market Segmentation
  • 5.3.1. Consumer Electronics
  • 5.3.2. Automotive
  • 5.3.3. Medical
  • 5.3.4. Defense

6. North America Dual-In-Line Package Sockets Market, 2020-2030, USD (Million)

• 6.1. Market Overview
• 6.2. Dual-In-Line Package Sockets Market: By Product, 2020-2030, USD (Million)
• 6.3. Dual-In-Line Package Sockets Market: By Application, 2020-2030, USD (Million)
• 6.4.Dual-In-Line Package Sockets Market: By Region, 2020-2030, USD (Million)
  • 6.4.1.North America
    • 6.4.1.1. U.S.
    • 6.4.1.2. Canada
    • 6.4.1.3. Rest of North America

7. UK and European Union Dual-In-Line Package Sockets Market, 2020-2030, USD (Million)

• 7.1. Market Overview
• 7.2. Dual-In-Line Package Sockets Market: By Product, 2020-2030, USD (Million)
• 7.3. Dual-In-Line Package Sockets Market: By Application, 2020-2030, USD (Million)
• 7.4.Dual-In-Line Package Sockets Market: By Region, 2020-2030, USD (Million)
  • 7.4.1.UK and European Union
    • 7.4.1.1. UK
    • 7.4.1.2. Germany
    • 7.4.1.3. Spain
    • 7.4.1.4. Italy
    • 7.4.1.5. France
    • 7.4.1.6. Rest of Europe

8. Asia Pacific Dual-In-Line Package Sockets Market, 2020-2030, USD (Million)

• 8.1. Market Overview
• 8.2. Dual-In-Line Package Sockets Market: By Product, 2020-2030, USD (Million)
• 8.3. Dual-In-Line Package Sockets Market: By Application, 2020-2030, USD (Million)
• 8.4.Dual-In-Line Package Sockets Market: By Region, 2020-2030, USD (Million)
  • 8.4.1.Asia Pacific
    • 8.4.1.1. China
    • 8.4.1.2. Japan
    • 8.4.1.3. India
    • 8.4.1.4. Australia
    • 8.4.1.5. South Korea
    • 8.4.1.6. Rest of Asia Pacific

9. Latin America Dual-In-Line Package Sockets Market, 2020-2030, USD (Million)

• 9.1. Market Overview
• 9.2. Dual-In-Line Package Sockets Market: By Product, 2020-2030, USD (Million)
• 9.3. Dual-In-Line Package Sockets Market: By Application, 2020-2030, USD (Million)
• 9.4.Dual-In-Line Package Sockets Market: By Region, 2020-2030, USD (Million)
  • 9.4.1.Latin America
    • 9.4.1.1. Brazil
    • 9.4.1.2. Mexico
    • 9.4.1.3. Rest of Latin America

10. Middle East and Africa Dual-In-Line Package Sockets Market, 2020-2030, USD (Million)

• 10.1. Market Overview
• 10.2. Dual-In-Line Package Sockets Market: By Product, 2020-2030, USD (Million)
• 10.3. Dual-In-Line Package Sockets Market: By Application, 2020-2030, USD (Million)
• 10.4.Dual-In-Line Package Sockets Market: By Region, 2020-2030, USD (Million)
  • 10.4.1.Middle East and Africa
    • 10.4.1.1. GCC
    • 10.4.1.2. Africa
    • 10.4.1.3. Rest of Middle East and Africa

11. Company Profile

• 11.1. Enplas
  • 11.1.1. Company Overview
  • 11.1.2. Financial Performance
  • 11.1.3. Product Portfolio
  • 11.1.4. Strategic Initiatives
• 11.2. Molex
  • 11.2.1. Company Overview
  • 11.2.2. Financial Performance
  • 11.2.3. Product Portfolio
  • 11.2.4. Strategic Initiatives
• 11.3. Aries Electronics
  • 11.3.1. Company Overview
  • 11.3.2. Financial Performance
  • 11.3.3. Product Portfolio
  • 11.3.4. Strategic Initiatives
• 11.4. 3M
  • 11.4.1. Company Overview
  • 11.4.2. Financial Performance
  • 11.4.3. Product Portfolio
  • 11.4.4. Strategic Initiatives
• 11.5. WinWay
  • 11.5.1. Company Overview
  • 11.5.2. Financial Performance
  • 11.5.3. Product Portfolio
  • 11.5.4. Strategic Initiatives
• 11.6. Chupond Precision
  • 11.6.1. Company Overview
  • 11.6.2. Financial Performance
  • 11.6.3. Product Portfolio
  • 11.6.4. Strategic Initiatives
• 11.7. Loranger
  • 11.7.1. Company Overview
  • 11.7.2. Financial Performance
  • 11.7.3. Product Portfolio
  • 11.7.4. Strategic Initiatives
• 11.8. Foxconn Technology
  • 11.8.1. Company Overview
  • 11.8.2. Financial Performance
  • 11.8.3. Product Portfolio
  • 11.8.4. Strategic Initiatives
• 11.9. Mill-Max
  • 11.9.1. Company Overview
  • 11.9.2. Financial Performance
  • 11.9.3. Product Portfolio
  • 11.9.4. Strategic Initiatives
• 11.10. Johnstech
  • 11.10.1. Company Overview
  • 11.10.2. Financial Performance
  • 11.10.3. Product Portfolio
  • 11.10.4. Strategic Initiatives
• 11.11. Plastronics
  • 11.11.1. Company Overview
  • 11.11.2. Financial Performance
  • 11.11.3. Product Portfolio
  • 11.11.4. Strategic Initiatives
• 11.12. Yamaichi Electronics
  • 11.12.1. Company Overview
  • 11.12.2. Financial Performance
  • 11.12.3. Product Portfolio
  • 11.12.4. Strategic Initiatives
• 11.13. TE Connectivity
  • 11.13.1. Company Overview
  • 11.13.2. Financial Performance
  • 11.13.3. Product Portfolio
  • 11.13.4. Strategic Initiatives
• 11.14. Sensata Technologies
  • 11.14.1. Company Overview
  • 11.14.2. Financial Performance
  • 11.14.3. Product Portfolio
  • 11.14.4. Strategic Initiatives