表紙:デジタル認証と組み込みセキュリティ:IoTサイバーセキュリティ
市場調査レポート
商品コード
1071886

デジタル認証と組み込みセキュリティ:IoTサイバーセキュリティ

Digital Authentication and Embedded Security: IoT Cybersecurity

出版日: | 発行: ABI Research | ページ情報: 英文 | 納期: 即日から翌営業日

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デジタル認証と組み込みセキュリティ:IoTサイバーセキュリティ
出版日: 2022年04月27日
発行: ABI Research
ページ情報: 英文
納期: 即日から翌営業日
  • 全表示
  • 概要
  • 目次
概要

当レポートでは、世界のデジタル認証と組み込みセキュリティの市場について分析し、以下の情報を取りまとめてお届けいたします。

レポートのメリット:

  • 組み込み認証技術に最適なIoTアプリケーションを特定することができます。
  • 利用可能なセキュリティ機能に基づいて、特定の組み込みシステムに最適なフォームファクタを決定できます。
  • IoT製品開発におけるハードウェア・セキュリティ戦略を最適化します。

分析概略:

  • 3種類の主要ハードウェアベース・組み込みセキュリティ技術の市場予測:TPM、TEE、セキュアMCU
  • 市場の詳細区分:ハードウェアの種類別・アプリケーションの利用別
  • 出荷・収益予測:フォームファクタ別・最終市場別、地域別 (全5地域)

主な質問への回答:

  • ハードウェアベースのセキュリティを活用するのはどの業界か?
  • OEMはどの認証フォームファクタを好むのか?
  • 組み込みシステムをリードするハードウェアセキュリティ技術は何か?
目次
Product Code: MD-IOTDAES-101

Actionable Benefits:

  • Identify the optimal IoT applications for your embedded authentication technologies.
  • Determine the best form factor for your specific embedded systems based on available security features.
  • Optimize hardware security strategies in your IoT product development.

Research Highlights:

  • Market forecasts for three primary hardware-based embedded security technologies: TPM, TEE, and secure MCU
  • A detailed breakdown by hardware type and application use case.
  • Shipment and revenue forecasts for each form factor and end market across the five regions.

Critical Questions Answered:

  • Which industries will leverage hardware-based security?
  • Which authentication form factors will OEMs favor?
  • Which hardware security technologies are likely to lead the way for embedded systems?

Who Should Read This?

  • Semiconductor and silicon IP companies.
  • Embedded systems OEMs.
  • IoT service providers.

Table of Contents

List of Tables:

  • 1. TPM Shipments by End Market, World Markets: 2018 to 2026
  • 2. TPM Shipments by End Market, Asia-Pacific: 2018 to 2026
  • 3. TPM Shipments by End Market, Europe: 2018 to 2026
  • 4. TPM Shipments by End Market, Americas: 2018 to 2026
  • 5. TPM Shipments by End Market, Middle East & Africa: 2018 to 2026
  • 6. TPM Revenue by End Market, World Markets: 2018 to 2026
  • 7. TPM Revenue by End Market, Asia-Pacific: 2018 to 2026
  • 8. TPM Revenue by End Market, Europe: 2018 to 2026
  • 9. TPM Revenue by End Market, Americas: 2018 to 2026
  • 10. TPM Revenue by End Market, Middle East & Africa: 2018 to 2026
  • 11. TEE Shipments by End Market, World Markets: 2018 to 2026
  • 12. TEE Shipments by End Market, Asia-Pacific: 2018 to 2026
  • 13. TEE Shipments by End Market, Europe: 2018 to 2026
  • 14. TEE Shipments by End Market, Americas: 2018 to 2026
  • 15. TEE Shipments by End Market, Middle East & Africa: 2018 to 2026
  • 16. TEE Revenue by End Market, World Markets: 2018 to 2026
  • 17. TEE Revenue by End Market, Asia-Pacific: 2018 to 2026
  • 18. TEE Revenue by End Market, Europe: 2018 to 2026
  • 19. TEE Revenue by End Market, Americas: 2018 to 2026
  • 20. TEE Revenue by End Market, Middle East & Africa: 2018 to 2026
  • 21. Secure MCU Shipments by End Market, World Markets: 2018 to 2026
  • 22. Secure MCU Shipments by End Market, Asia-Pacific: 2018 to 2026
  • 23. Secure MCU Shipments by End Market, Europe: 2018 to 2026
  • 24. Secure MCU Shipments by End Market, Americas: 2018 to 2026
  • 25. Secure MCU Shipments by End Market, Middle East & Africa: 2018 to 2026
  • 26. Secure MCU Revenue by End Market, World Markets: 2018 to 2026
  • 27. Secure MCU Revenue by End Market, Asia-Pacific: 2018 to 2026
  • 28. Secure MCU Revenue by End Market, Europe: 2018 to 2026
  • 29. Secure MCU Revenue by End Market, Americas: 2018 to 2026
  • 30. Secure MCU Revenue by End Market, Middle East & Africa: 2018 to 2026