ダイシングテープ市場- 世界の産業規模、シェア、動向、機会、予測、タイプ別、材料別、最終用途産業別、地域別セグメント、競合、2020年～2030年

ダイシングテープの世界市場規模は2024年に13億4,000万米ドル、2030年には19億4,000万米ドルに達し、予測期間中のCAGRは6.21%で成長すると予測されています。

ダイシングテープは、半導体およびエレクトロニクス製造において、高精度のダイシング工程でウエハー、ガラス、セラミック基板を確実に保持するために使用される特殊な粘着材料です。これらのテープは、機械的またはレーザーによる切断作業中のチッピング、クラック、ミスアライメントを防止するために不可欠です。UV硬化型、非UV型、熱剥離型、感圧型など、さまざまなタイプがあり、多様な用途のニーズに対応しています。市場の拡大は、エレクトロニクス、自動車、電気通信、産業用アプリケーションにおける半導体需要の増加によって推進されています。集積回路の複雑化と小型化が進むにつれ、正確で損傷のない部品分離を実現する信頼性の高い高性能ダイシングテープ・ソリューションに対するニーズも高まっています。

市場概要
予測期間	2026-2030
市場規模：2024年	13億4,000万米ドル
市場規模：2030年	19億4,000万米ドル
CAGR：2025年～2030年	6.21%
急成長セグメント	ポリ塩化ビニル
最大市場	アジア太平洋

市場促進要因

半導体産業の拡大

主な市場課題

先端技術の高コストダイシングテープ

主要市場動向

非紫外線ダイシングテープの採用増加

目次

第1章 概要

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 顧客の声

第5章 世界のダイシングテープ市場展望

• 市場規模・予測
  • 金額別
• 市場シェア・予測
  • タイプ別（UV硬化型ダイシングテープ、非UV型ダイシングテープ、放熱型ダイシングテープ、感圧型ダイシングテープ）
  • 材料別（ポリエチレン、ポリ塩化ビニル、ポリエチレンテレフタレート、ポリオレフィン）
  • 最終用途産業別（半導体、エレクトロニクス、フォトニクス、自動車）
  • 地域別（北米、欧州、南米、中東・アフリカ、アジア太平洋）
• 企業別（2024）
• 市場マップ

第6章 北米のダイシングテープ市場展望

• 市場規模・予測
• 市場シェア・予測
• 北米：国別分析
  • 米国
  • カナダ
  • メキシコ

第7章 欧州のダイシングテープ市場展望

• 市場規模・予測
• 市場シェア・予測
• 欧州：国別分析
  • ドイツ
  • フランス
  • 英国
  • イタリア
  • スペイン

第8章 アジア太平洋地域のダイシングテープ市場展望

• 市場規模・予測
• 市場シェア・予測
• アジア太平洋地域：国別分析
  • 中国
  • インド
  • 日本
  • 韓国
  • オーストラリア

第9章 中東・アフリカのダイシングテープ市場展望

• 市場規模・予測
• 市場シェア・予測
• 中東・アフリカ：国別分析
  • サウジアラビア
  • アラブ首長国連邦
  • 南アフリカ

第10章 南米のダイシングテープ市場展望

• 市場規模・予測
• 市場シェア・予測
• 南米：国別分析
  • ブラジル
  • コロンビア
  • アルゼンチン

第11章 市場力学

• 促進要因
• 課題

第12章 市場動向と発展

• 合併と買収
• 製品上市
• 最近の動向

第13章 企業プロファイル

• Nitto Denko Corporation
• 3M Company
• Tesa SE
• Shinto Paint Co., Ltd
• Momentive Performance Materials Inc
• Dai Nippon Printing Co., Ltd.
• Mitsui Chemicals, Inc.
• Lintec Corporation
• Samsung Fine Chemicals
• Avery Dennison Corporation

第14章 戦略的提言

第15章 調査会社について・免責事項

The Global Dicing Tapes Market was valued at USD 1.34 Billion in 2024 and is projected to reach USD 1.94 Billion by 2030, growing at a CAGR of 6.21% during the forecast period. Dicing tapes are specialized adhesive materials used in semiconductor and electronics manufacturing to securely hold wafers, glass, or ceramic substrates during high-precision dicing processes. These tapes are essential for preventing chipping, cracking, or misalignment during mechanical or laser-based cutting operations. With types ranging from UV curable and non-UV to heat-release and pressure-sensitive variants, these tapes are tailored to meet diverse application needs. The market's expansion is being propelled by the growing demand for semiconductors in electronics, automotive, telecom, and industrial applications. As the complexity and miniaturization of integrated circuits increase, so does the need for reliable, high-performance dicing tape solutions that can ensure accurate and damage-free component separation.

Market Overview
Forecast Period	2026-2030
Market Size 2024	USD 1.34 Billion
Market Size 2030	USD 1.94 Billion
CAGR 2025-2030	6.21%
Fastest Growing Segment	Polyvinyl Chloride
Largest Market	Asia Pacific

Key Market Drivers

Expansion of the Semiconductor Industry

The rapid growth of the global semiconductor sector is a major driver of the Dicing Tapes market. With increasing adoption of electronic devices in areas such as consumer electronics, automotive systems, telecom infrastructure, and medical technology, there is a heightened need for precise semiconductor chip fabrication. Dicing tapes are vital to maintaining wafer integrity during dicing, especially as chip designs become more compact and intricate. Advanced adhesion and thermal resistance properties are essential in this context, prompting manufacturers to innovate and deliver next-generation tape solutions. Continued R&D in materials and adhesives ensures compatibility with evolving semiconductor manufacturing standards and supports the industry's demand for performance and reliability.

Key Market Challenges

High Cost of Advanced Dicing Tapes

One of the primary challenges in the Dicing Tapes market is the elevated cost of producing technologically advanced tapes. These specialized tapes are engineered to perform under stringent conditions-such as maintaining adhesion under thermal stress and enabling clean, precise wafer separation. However, the R&D, raw materials, and manufacturing processes required to produce such high-performance products significantly increase production expenses. For semiconductor manufacturers, particularly small and mid-sized firms, these higher costs can impact overall profitability. The financial burden of incorporating premium dicing tapes into production lines may limit adoption and create entry barriers, especially in cost-sensitive regions or for lower-volume applications.

Key Market Trends

Increased Adoption of Non-UV Dicing Tapes

A notable trend shaping the Dicing Tapes market is the growing shift toward non-UV dicing tapes. These tapes eliminate the need for ultraviolet exposure, offering enhanced protection for delicate wafers and components during the dicing process. With better adhesion and compatibility for high-precision applications, non-UV tapes are increasingly used in advanced semiconductor packaging. Their role is especially prominent in the fabrication of chips for 5G networks, artificial intelligence, and memory devices, where clean cuts and wafer stability are critical. These tapes also support high-temperature processing environments and fine-pitch designs, making them ideal for next-generation chip technologies. As manufacturers seek more robust and efficient solutions, non-UV dicing tapes are gaining favor across the semiconductor value chain.

Key Market Players

• Nitto Denko Corporation
• 3M Company
• Tesa SE
• Lintec Corporation
• Momentive Performance Materials Inc
• Dai Nippon Printing Co., Ltd.
• Mitsui Chemicals, Inc.
• Shinto Paint Co., Ltd
• Samsung Fine Chemicals
• Avery Dennison Corporation

Report Scope:

In this report, the Global Dicing Tapes Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Dicing Tapes Market, By Type:

• UV Curable Dicing Tapes
• Non-UV Dicing Tapes
• Heat Release Dicing Tapes
• Pressure Sensitive Dicing Tapes

Dicing Tapes Market, By Material:

• Polyethylene
• Polyvinyl Chloride
• Polyethylene Terephthalate
• Polyolefin

Dicing Tapes Market, By End-use Industry:

• Semiconductor
• Electronics
• Photonics
• Automotive

Dicing Tapes Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
• South America
  • Brazil
  • Argentina
  • Colombia
• Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • South Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Dicing Tapes Market.

Available Customizations:

Global Dicing Tapes Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, and Trends

4. Voice of Customer

5. Global Dicing Tapes Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Type (UV Curable Dicing Tapes, Non-UV Dicing Tapes, Heat Release Dicing Tapes, Pressure Sensitive Dicing Tapes)
  • 5.2.2. By Material (Polyethylene, Polyvinyl Chloride, Polyethylene Terephthalate, Polyolefin)
  • 5.2.3. By End-use Industry (Semiconductor, Electronics, Photonics, Automotive)
  • 5.2.4. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
• 5.3. By Company (2024)
• 5.4. Market Map

6. North America Dicing Tapes Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Type
  • 6.2.2. By Material
  • 6.2.3. By End-use Industry
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Dicing Tapes Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Type
      • 6.3.1.2.2. By Material
      • 6.3.1.2.3. By End-use Industry
  • 6.3.2. Canada Dicing Tapes Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Type
      • 6.3.2.2.2. By Material
      • 6.3.2.2.3. By End-use Industry
  • 6.3.3. Mexico Dicing Tapes Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Type
      • 6.3.3.2.2. By Material
      • 6.3.3.2.3. By End-use Industry

7. Europe Dicing Tapes Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Type
  • 7.2.2. By Material
  • 7.2.3. By End-use Industry
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Dicing Tapes Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Type
      • 7.3.1.2.2. By Material
      • 7.3.1.2.3. By End-use Industry
  • 7.3.2. France Dicing Tapes Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Type
      • 7.3.2.2.2. By Material
      • 7.3.2.2.3. By End-use Industry
  • 7.3.3. United Kingdom Dicing Tapes Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Type
      • 7.3.3.2.2. By Material
      • 7.3.3.2.3. By End-use Industry
  • 7.3.4. Italy Dicing Tapes Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Type
      • 7.3.4.2.2. By Material
      • 7.3.4.2.3. By End-use Industry
  • 7.3.5. Spain Dicing Tapes Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Type
      • 7.3.5.2.2. By Material
      • 7.3.5.2.3. By End-use Industry

8. Asia Pacific Dicing Tapes Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Type
  • 8.2.2. By Material
  • 8.2.3. By End-use Industry
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Dicing Tapes Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Type
      • 8.3.1.2.2. By Material
      • 8.3.1.2.3. By End-use Industry
  • 8.3.2. India Dicing Tapes Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Type
      • 8.3.2.2.2. By Material
      • 8.3.2.2.3. By End-use Industry
  • 8.3.3. Japan Dicing Tapes Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Type
      • 8.3.3.2.2. By Material
      • 8.3.3.2.3. By End-use Industry
  • 8.3.4. South Korea Dicing Tapes Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Type
      • 8.3.4.2.2. By Material
      • 8.3.4.2.3. By End-use Industry
  • 8.3.5. Australia Dicing Tapes Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Type
      • 8.3.5.2.2. By Material
      • 8.3.5.2.3. By End-use Industry

9. Middle East & Africa Dicing Tapes Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Type
  • 9.2.2. By Material
  • 9.2.3. By End-use Industry
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Dicing Tapes Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Type
      • 9.3.1.2.2. By Material
      • 9.3.1.2.3. By End-use Industry
  • 9.3.2. UAE Dicing Tapes Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Type
      • 9.3.2.2.2. By Material
      • 9.3.2.2.3. By End-use Industry
  • 9.3.3. South Africa Dicing Tapes Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Type
      • 9.3.3.2.2. By Material
      • 9.3.3.2.3. By End-use Industry

10. South America Dicing Tapes Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Type
  • 10.2.2. By Material
  • 10.2.3. By End-use Industry
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Dicing Tapes Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Type
      • 10.3.1.2.2. By Material
      • 10.3.1.2.3. By End-use Industry
  • 10.3.2. Colombia Dicing Tapes Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Type
      • 10.3.2.2.2. By Material
      • 10.3.2.2.3. By End-use Industry
  • 10.3.3. Argentina Dicing Tapes Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Type
      • 10.3.3.2.2. By Material
      • 10.3.3.2.3. By End-use Industry

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends and Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Company Profiles

• 13.1. Nitto Denko Corporation
  • 13.1.1. Business Overview
  • 13.1.2. Key Revenue and Financials
  • 13.1.3. Recent Developments
  • 13.1.4. Key Personnel
  • 13.1.5. Key Product/Services Offered
• 13.2. 3M Company
• 13.3. Tesa SE
• 13.4. Shinto Paint Co., Ltd
• 13.5. Momentive Performance Materials Inc
• 13.6. Dai Nippon Printing Co., Ltd.
• 13.7. Mitsui Chemicals, Inc.
• 13.8. Lintec Corporation
• 13.9. Samsung Fine Chemicals
• 13.10. Avery Dennison Corporation

14. Strategic Recommendations

15. About Us & Disclaimer