インターコネクト・受動部品市場 - 世界の産業規模、動向、機会、予測：部品別、用途別、地域別、競合別、2018年-2028年

インターコネクト・受動部品の世界市場は2022年に1,852億5,000万米ドルとなり、2028年までのCAGRは4.23%で、予測期間中に力強い成長が予測されます。

世界のインターコネクト・受動部品市場は、産業界と消費者が組み込みシステムを幅広いアプリケーションとデバイスに統合する方法を再構築している多数の要因によって著しい成長を遂げています。組み込みシステムは、電子ソリューションやアプリケーションの機能強化、性能の最適化、信頼性の確保において極めて重要なコンポーネントとなっています。組込み技術は、現代の技術情勢の中心にあり、さまざまな業界において、技術革新、エネルギー効率、卓越した運用を実現する上で極めて重要な役割を果たしています。電子ソリューションが普及し、不可欠な時代において、組込みシステムは、IoTデバイスから産業オートメーションに至るまで、幅広いアプリケーションに不可欠なコンポーネントへと進化しています。組込み技術の採用が急増している主な要因の1つは、接続性と効率性への要求が高まっていることです。相互接続が進む世界では、産業界や消費者は、シームレスなデータ交換を可能にし、全体的な効率を向上させるソリューションを求めています。組込みテクノロジは、このようなニーズに対応する上で中心的な役割を果たします。組込みテクノロジは、通信、データ収集、データ処理を行うデバイスを強化し、生産性と意思決定を向上させます。さらに、産業が自動化を取り入れるにつれて、信頼性が高く高性能な組込みシステムに対する需要は増加の一途をたどっています。これらのシステムは、オートメーション、ロボット工学、および制御アプリケーションに不可欠です。これらのシステムは、自動化されたプロセスや機械のシームレスな動作に不可欠な、正確なデータ処理と実行を保証します。

セキュリティとデータの完全性は、現代の技術状況において最も重要な関心事となっています。組み込み技術は、暗号化、セキュアブート、データ保護などの高度な機能を提供し、システムのセキュリティと信頼性を高めます。これらの機能は、機密データの保護、サイバー脅威の防止、デジタルソリューションの信頼性の確保に不可欠です。さらに、スマートシティ、ヘルスケアソリューション、自律走行車に対する需要が高まる中、組込み技術はこれらのイノベーションを推進するために不可欠です。スマートシティでは、組込みシステムが交通管理、廃棄物削減、省エネルギーのためのリアルタイムデータ処理を可能にします。ヘルスケアでは、遠隔医療や遠隔モニタリングをサポートし、患者のケアを強化します。自律走行車では、組込みシステムが知覚、意思決定、制御の中心となり、より安全で効率的な輸送ソリューションへの道を開きます。

結論として、世界のインターコネクト・受動部品市場は、多様なアプリケーションに接続性、効率性、安全性を提供する上で、組み込みシステムの極めて重要な役割が産業界に認識され、大きな成長を遂げています。技術が進歩し続け、世界がますますデジタル化するにつれ、組込み技術はさまざまな分野で革新と信頼性の最前線に立ち続けるでしょう。この変革は、電子システムとアプリケーションの未来を形作り、世界中の産業の効率性と卓越性に貢献する組込み技術の重要性を強調しています。

市場促進要因

コネクテッドデバイスとIoTソリューションの需要増加：

目次

第1章 概要

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 顧客の声

第5章 インターコネクト・受動部品の世界市場概要

第6章 インターコネクト・受動部品の世界市場展望

• 市場規模と予測
  • 金額別
• 市場シェアと予測
  • 部品別（受動、インターコネクト）
  • 用途別（コンシューマーエレクトロニクス、IT・通信、自動車、産業、航空宇宙・防衛、ヘルスケア、その他）
  • 地域別（北米、欧州、南米、中東・アフリカ、アジア太平洋地域）
• 企業別（2022年）
• 市場マップ

第7章 北米のインターコネクト・受動部品市場の展望

• 市場規模と予測
  • 金額別
• 市場シェアと予測
  • 部品別
  • 用途別
  • 国別
• 北米国別分析
  • 米国
  • カナダ
  • メキシコ

第8章 欧州のインターコネクト・受動部品市場の展望

• 市場規模と予測
  • 金額別
• 市場シェアと予測
  • 部品別
  • 用途別
  • 国別
• 欧州国別分析
  • ドイツ
  • フランス
  • 英国
  • イタリア
  • スペイン
  • ベルギー

第9章 南米のインターコネクト・受動部品市場の展望

• 市場規模と予測
  • 金額別
• 市場シェアと予測
  • 部品別
  • 用途別
  • 国別
• 南米：国別分析
  • ブラジル
  • コロンビア
  • アルゼンチン
  • チリ
  • ペルー

第10章 中東・アフリカのインターコネクト・受動部品市場の展望

• 市場規模と予測
  • 金額別
• 市場シェアと予測
  • 部品別
  • 用途別
  • 国別
• 中東・アフリカ：国別分析
  • サウジアラビア
  • アラブ首長国連邦
  • 南アフリカ
  • トルコ
  • イスラエル

第11章 アジア太平洋地域のインターコネクト・受動部品市場の展望

• 市場規模と予測
  • 部品別
  • 用途別
  • 国別
• アジア太平洋地域国別分析
  • 中国
  • インド
  • 日本
  • 韓国
  • オーストラリア
  • インドネシア
  • ベトナム

第12章 市場力学

• 促進要因
• 課題

第13章 市場動向と発展

第14章 企業プロファイル

• TE Connectivity Corporation
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Amphenol Corporation
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Molex, LLC
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Kyocera Corporation
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• AVX Corporation
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Yageo Corporation
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Vishay Intertechnology, Inc.
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• STMicroelectronics N.V.
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Murata Manufacturing Co., Ltd.
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• KEMET Corporation
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered

第15章 戦略的提言

第16章 調査会社について・免責事項

Global Interconnects and Passive Components Market was valued at USD 185.25 Billion in 2022 and is anticipated to project robust growth in the forecast period with a CAGR of 4.23% through 2028. The Global Interconnects and Passive Components Market is experiencing remarkable growth due to a multitude of factors that are reshaping how industries and consumers integrate embedded systems into a wide array of applications and devices. Embedded systems have become pivotal components in enhancing functionality, optimizing performance, and ensuring the reliability of electronic solutions and applications. Embedded technology is at the heart of the contemporary technological landscape, playing a pivotal role in delivering innovation, energy efficiency, and operational excellence across various industries. In an era where electronic solutions are pervasive and indispensable, embedded systems have evolved into essential components across applications ranging from IoT devices to industrial automation. One of the primary drivers for the burgeoning adoption of embedded technology is the increasing demand for connectivity and efficiency. In our increasingly interconnected world, industries and consumers seek solutions that enable seamless data exchange and improve overall efficiency. Embedded technology is central to addressing this need, as it empowers devices to communicate, collect, and process data, thereby enhancing productivity and decision-making. Additionally, as industries embrace automation, the demand for reliable and high-performance embedded systems continues to grow. These systems are indispensable for automation, robotics, and control applications. They ensure precise data processing and execution, which is critical for the seamless operation of automated processes and machinery.

Security and data integrity have become paramount concerns in the modern technological landscape. Embedded technology offers advanced features such as encryption, secure boot, and data protection, which enhance system security and reliability. These features are critical in safeguarding sensitive data, preventing cyber threats, and ensuring the trustworthiness of digital solutions. Furthermore, as the demand for smart cities, healthcare solutions, and autonomous vehicles increases, embedded technology is indispensable for powering these innovations. In smart cities, embedded systems enable real-time data processing for traffic management, waste reduction, and energy conservation. In healthcare, they support telemedicine and remote monitoring, enhancing patient care. In autonomous vehicles, embedded systems are central to perception, decision-making, and control, paving the way for safer and more efficient transportation solutions.

In conclusion, the Global Interconnects and Passive Components Market is witnessing substantial growth as industries recognize the pivotal role of embedded systems in delivering connectivity, efficiency, and security across a diverse range of applications. As technology continues to advance and our world becomes increasingly digital, embedded technology will remain at the forefront of innovation and reliability in various sectors. This transformation underscores the significance of embedded technology in shaping the future of electronic systems and applications, contributing to efficiency and excellence across industries worldwide.

Key Market Drivers:

Increasing Demand for Connected Devices and IoT Solutions:

The Global Interconnects and Passive Components Market is experiencing remarkable growth, primarily driven by the increasing demand for connected devices and Internet of Things (IoT) solutions. As the world becomes more digitally interconnected, there is a growing need for components that enable seamless data exchange and connectivity between devices, whether in industrial settings, smart homes, or wearable technology.

One of the key factors propelling this demand is the rapid proliferation of IoT applications. These applications span various sectors, including healthcare, transportation, agriculture, and smart cities. IoT devices, which range from sensors and actuators to wearable gadgets, rely on Interconnects and Passive Components to function effectively. These components enable data transmission, power distribution, and signal conditioning, which are essential for the IoT ecosystem.

In the healthcare sector, for example, Interconnects and Passive Components play a crucial role in remote patient monitoring. They facilitate the transfer of vital health data from wearable devices to healthcare providers, allowing for real-time health monitoring and timely intervention. In smart agriculture, these components help collect data from sensors in the field, optimizing irrigation and crop management. Furthermore, in smart cities, they enable traffic management, waste reduction, and energy conservation.

The demand for connected devices is not limited to IoT alone. As consumer electronics, such as smartphones, tablets, and laptops, continue to evolve with increasing connectivity features, there is a growing need for Interconnects and Passive Components to enhance performance and user experience.

Growth of Industrial Automation:

The second driving factor in the Global Interconnects and Passive Components Market is the growth of industrial automation. Industries are increasingly adopting automation and robotics to enhance productivity, reduce operational costs, and improve overall efficiency. This surge in industrial automation relies on Interconnects and Passive Components to ensure precise data transmission, power distribution, and control.

In manufacturing plants, robots equipped with sensors and actuators require reliable interconnects to communicate and execute tasks accurately. These components enable the exchange of data between different automation systems, ensuring the smooth operation of machinery and the manufacturing process. Furthermore, passive components are integral in controlling and regulating electrical circuits within automated systems.

Industries such as automotive manufacturing, pharmaceuticals, and electronics assembly heavily rely on industrial automation to achieve precision, consistency, and speed in their processes. As a result, the demand for Interconnects and Passive Components in these sectors is on the rise.

Focus on System Security and Reliability:

The third major driver for the Global Interconnects and Passive Components Market is the increasing focus on system security and reliability. In an era where cyber threats and data breaches are prevalent, ensuring the security and integrity of electronic systems has become paramount.

Interconnects and Passive Components contribute significantly to system security. They offer advanced features such as encryption, secure boot processes, and data protection mechanisms. These security features help safeguard sensitive data and prevent unauthorized access to systems. They are critical in preventing cyber threats and ensuring the trustworthiness of digital solutions.

Reliability is another essential aspect that drives the demand for high-quality Interconnects and Passive Components. Industries rely on these components to operate critical systems, where even a minor failure could have significant consequences. For example, in aerospace and defense applications, the reliability of components is non-negotiable. These components must function flawlessly in extreme conditions and high-stress environments.

In conclusion, the Global Interconnects and Passive Components Market is experiencing substantial growth due to the increasing demand for connected devices and IoT solutions, the growth of industrial automation, and the heightened focus on system security and reliability. As industries continue to advance in these areas, Interconnects and Passive Components will remain pivotal in enabling connectivity, enhancing efficiency, and ensuring the integrity and security of electronic systems. This growth underscores the significance of these components in shaping the future of technology and innovation across various sectors.

Key Market Challenges

Increasing Complexity of Electronic Systems:

One of the foremost challenges in the Global Interconnects and Passive Components Market is coping with the increasing complexity of electronic systems. As technology advances, electronic devices are becoming more intricate, featuring higher processing power, increased functionality, and greater connectivity. This complexity places growing demands on Interconnects and Passive Components to keep pace with evolving electronic designs.

The demand for miniaturization, driven by the desire for smaller, more portable devices, further exacerbates this challenge. As electronic components shrink in size, Interconnects and Passive Components must become smaller and more densely packed. However, reducing component size can result in issues like signal degradation, increased thermal challenges, and decreased reliability. Meeting these demands for smaller, yet more robust components is a substantial challenge for manufacturers.

Furthermore, complex electronic systems often require Interconnects and Passive Components to operate in extreme conditions, including high temperatures, rapid temperature fluctuations, and exposure to harsh chemicals. Ensuring that these components maintain performance and reliability under such conditions is a significant challenge. Manufacturers must invest in research and development to engineer components that can withstand these demanding environments.

Rapid Technological Advancements:

The second major challenge in the Global Interconnects and Passive Components Market is the pace of technological advancements. As new technologies and electronic standards emerge, the market faces the continuous need to adapt and innovate. This challenge is particularly pronounced in areas like wireless communication, IoT, and automotive electronics, where standards and requirements can change rapidly.

For example, the rollout of 5G technology is driving the need for Interconnects and Passive Components that can operate at higher frequencies while maintaining signal integrity. Additionally, the move towards electric and autonomous vehicles requires components that can handle the increased electrical and thermal demands of these systems.

Rapid technological advancements also present challenges related to obsolescence. Components that were once state-of-the-art can quickly become outdated, making it essential for manufacturers to manage product lifecycles effectively. This includes ensuring the availability of legacy components for repair and maintenance purposes, even as new products are introduced.

Supply Chain Disruptions and Material Shortages:

Another significant challenge facing the Global Interconnects and Passive Components Market is the vulnerability of the supply chain to disruptions and material shortages. The industry relies on a global network of suppliers for raw materials, components, and manufacturing processes. Disruptions such as natural disasters, political instability, or global health crises, as witnessed during the COVID-19 pandemic, can lead to material shortages and production delays.

For instance, passive components often require rare earth materials and metals, which can be subject to fluctuations in supply and pricing. Such dependencies make the industry susceptible to sudden price hikes and shortages. These challenges can affect not only component manufacturers but also the entire electronics supply chain, impacting industries ranging from consumer electronics to automotive manufacturing.

Furthermore, geopolitical tensions and trade disputes can result in tariffs, export restrictions, and other trade-related barriers that impact the supply chain. Manufacturers must adapt to these changing geopolitical dynamics, potentially seeking alternative suppliers or domestic sourcing to mitigate risks.

In conclusion, the Global Interconnects and Passive Components Market faces several key challenges, including the increasing complexity of electronic systems, rapid technological advancements, and supply chain disruptions and material shortages. Addressing these challenges requires ongoing innovation, adaptability, and a strategic approach to supply chain management. As technology continues to evolve, manufacturers must find ways to navigate these challenges to meet the demands of various industries and ensure the reliability and performance of electronic systems.

Key Market Trends

Miniaturization and High-Density Integration:

A prominent trend in the Global Interconnects and Passive Components Market is the relentless pursuit of miniaturization and high-density integration. In today's fast-paced technological landscape, the demand for smaller and more compact electronic devices is on the rise. From smartphones to IoT sensors and medical devices, end-users seek products that are not only powerful but also portable and space-efficient. Interconnects and Passive Components are at the heart of this trend, as they must evolve to meet the stringent size and performance requirements of modern electronics. Manufacturers are challenged to develop smaller connectors, capacitors, resistors, and other passive components without sacrificing functionality or reliability. This trend is driven by the need to make devices more lightweight, energy-efficient, and suitable for various applications, including wearables, drones, and compact industrial sensors.

High-density integration is another facet of this trend. As electronic systems become more complex, they require components that can be densely packed on circuit boards. The challenge is to design and manufacture components that can withstand the resulting thermal challenges and signal interference while maintaining reliability. For instance, micro-connectors and multi-layer ceramic capacitors are increasingly common in electronic designs, enabling the development of cutting-edge devices while conserving space.

Manufacturers are investing in advanced materials and manufacturing techniques, including 3D printing and microfabrication, to enable miniaturization and high-density integration. They are also exploring innovative approaches such as flexible and stretchable Interconnects and Passive Components, which are crucial for applications like bendable displays and conformal electronics.

Increased Focus on High-Frequency and RF Components:

The second notable trend in the Interconnects and Passive Components Market is the growing emphasis on high-frequency and radio frequency (RF) components. This trend is closely aligned with the expansion of wireless communication technologies, IoT applications, and the ongoing deployment of 5G networks. High-frequency components, including connectors, inductors, and capacitors, are vital for ensuring the efficient transmission and reception of data in wireless communication systems. As the demand for faster and more reliable data transmission grows, the need for high-frequency components capable of operating at higher frequencies also rises. 5G technology, in particular, requires components that can support millimeter-wave frequencies and ultra-wideband signals.

The IoT boom is driving the need for RF components, as IoT devices rely on wireless connectivity for data exchange. These components are essential for enabling wireless sensor networks, smart home devices, and asset tracking solutions. RF passive components like filters, couplers, and antennas play a critical role in optimizing signal quality and managing interference in crowded wireless environments. Moreover, the automotive industry is integrating high-frequency components to support advanced driver assistance systems (ADAS) and vehicle-to-everything (V2X) communication, contributing to the demand for Interconnects and Passive Components that can operate in challenging automotive environments. Manufacturers are investing in research and development to design components that can meet the rigorous performance requirements of high-frequency and RF applications. This includes enhancing signal integrity, reducing losses, and addressing thermal challenges. The adoption of advanced materials and manufacturing processes, such as thin-film technology and multilayer ceramics, is becoming increasingly prevalent to support these requirements.

Sustainability and Environmental Concerns:

The third significant trend in the Interconnects and Passive Components Market is the growing emphasis on sustainability and environmental concerns. As the world becomes more aware of the environmental impact of electronics manufacturing and disposal, the industry is shifting towards more sustainable practices. One aspect of this trend involves the development of eco-friendly materials and manufacturing processes. Manufacturers are exploring alternatives to traditional materials that may have adverse environmental effects. This includes the use of lead-free and halogen-free materials in components and recyclable packaging. Another key focus is on energy efficiency. Passive components, particularly capacitors and resistors, play a critical role in improving energy efficiency in electronic systems. These components are being designed to have lower power dissipation and enhanced performance, which results in reduced energy consumption and heat generation. This trend is especially important in the context of green technologies and the drive for energy-efficient solutions in applications like electric vehicles and renewable energy systems.

The trend towards sustainability also extends to product lifecycle management. Manufacturers are looking at ways to design components that are more durable, reliable, and longer-lasting. This includes designing components that can withstand a wider range of temperatures and environmental conditions, reducing the need for replacements and contributing to electronic waste reduction.

In conclusion, the Global Interconnects and Passive Components Market is characterized by the trends of miniaturization and high-density integration, increased focus on high-frequency and RF components, and a growing emphasis on sustainability and environmental concerns. These trends are shaping the industry's direction and driving innovation in materials, design, and manufacturing processes. Manufacturers that can adapt to these trends will be well-positioned to meet the evolving demands of modern electronics and align with the values of sustainability and efficiency.

Segmental Insights

Component Insights

The dominating segment in the Global Interconnects and Passive Components market by component is interconnects. This dominance is expected to continue in the coming years, driven by the following factors:

Growing demand for interconnects in electronic devices: Interconnects are used in all electronic devices to connect various components together. As the demand for electronic devices continues to grow, so does the demand for interconnects.

Increasing complexity of electronic devices: Electronic devices are becoming increasingly complex, with more and more components. This is leading to an increased demand for interconnects to connect all of the components together.

Growing adoption of emerging technologies: Emerging technologies, such as 5G, artificial intelligence (AI), and the Internet of Things (IoT), are driving the demand for interconnects. These technologies require high-performance interconnects to support the high data rates and low latency requirements of these applications.

Regional Insights

The dominating region in the Global Interconnects and Passive Components market is Asia-Pacific (APAC). This dominance is expected to continue in the coming years, driven by the following factors:

Strong demand from electronics manufacturing: APAC is home to some of the world's largest electronics manufacturers, such as Foxconn, Huawei, and Samsung. These companies produce a wide range of electronic products, from smartphones and laptops to TVs and appliances. This strong demand for electronics is driving the demand for Interconnects and Passive Components in the region. Government support: Governments in APAC are investing heavily in the electronics industry. For example, the Chinese government has launched a $150 billion investment program to develop the country's semiconductor industry and related industries, including the Interconnects and Passive Components industry. Growing adoption of emerging technologies: APAC is also a major adopter of emerging technologies, such as 5G, artificial intelligence (AI), and the Internet of Things (IoT). These technologies require advanced Interconnects and Passive Components, which is driving the growth of the market in the region.

Key Market Players

TE Connectivity Corporation

Amphenol Corporation

Molex, LLC

Kyocera Corporation

AVX Corporation

Yageo Corporation

STMicroelectronics N.V.

Vishay Intertechnology, Inc.

Murata Manufacturing Co., Ltd.

KEMET Corporation

Report Scope:

In this report, the Global Interconnects and Passive Components Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Interconnects and Passive Components Market, By Component:

• Passive
• Interconnects

Interconnects and Passive Components Market, By Application:

• Consumer Electronics
• IT & Telecommunications
• Automotive
• Industrial
• Aerospace & Defense
• Healthcare
• Others

Interconnects and Passive Components Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Belgium
• Asia-Pacific
• China
• India
• Japan
• Australia
• South Korea
• Indonesia
• Vietnam
• South America
• Brazil
• Argentina
• Colombia
• Chile
• Peru
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE
• Turkey
• Israel

Competitive Landscape

• Company Profiles: Detailed analysis of the major companies present in the Global Interconnects and Passive Components Market.

Available Customizations:

• Global Interconnects and Passive Components market report with the given market data, Tech Sci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Formulation of the Scope
• 2.4. Assumptions and Limitations
• 2.5. Sources of Research
  • 2.5.1. Secondary Research
  • 2.5.2. Primary Research
• 2.6. Approach for the Market Study
  • 2.6.1. The Bottom-Up Approach
  • 2.6.2. The Top-Down Approach
• 2.7. Methodology Followed for Calculation of Market Size & Market Shares
• 2.8. Forecasting Methodology
  • 2.8.1. Data Triangulation & Validation

3. Executive Summary

4. Voice of Customer

5. Global Interconnects and Passive Components Market Overview

6. Global Interconnects and Passive Components Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Component (Passive, Interconnects)
  • 6.2.2. By Application (Consumer Electronics, IT & Telecommunications, Automotive, Industrial, Aerospace & Defense, Healthcare and Others)
  • 6.2.3. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
• 6.3. By Company (2022)
• 6.4. Market Map

7. North America Interconnects and Passive Components Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Component
  • 7.2.2. By Application
  • 7.2.3. By Country
• 7.3. North America: Country Analysis
  • 7.3.1. United States Interconnects and Passive Components Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Component
      • 7.3.1.2.2. By Application
  • 7.3.2. Canada Interconnects and Passive Components Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Component
      • 7.3.2.2.2. By Application
  • 7.3.3. Mexico Interconnects and Passive Components Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Component
      • 7.3.3.2.2. By Application

8. Europe Interconnects and Passive Components Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Component
  • 8.2.2. By Application
  • 8.2.3. By Country
• 8.3. Europe: Country Analysis
  • 8.3.1. Germany Interconnects and Passive Components Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Component
      • 8.3.1.2.2. By Application
  • 8.3.2. France Interconnects and Passive Components Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Component
      • 8.3.2.2.2. By Application
  • 8.3.3. United Kingdom Interconnects and Passive Components Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Component
      • 8.3.3.2.2. By Application
  • 8.3.4. Italy Interconnects and Passive Components Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Component
      • 8.3.4.2.2. By Application
  • 8.3.5. Spain Interconnects and Passive Components Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Component
      • 8.3.5.2.2. By Application
  • 8.3.6. Belgium Interconnects and Passive Components Market Outlook
    • 8.3.6.1. Market Size & Forecast
      • 8.3.6.1.1. By Value
    • 8.3.6.2. Market Share & Forecast
      • 8.3.6.2.1. By Component
      • 8.3.6.2.2. By Application

9. South America Interconnects and Passive Components Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Component
  • 9.2.2. By Application
  • 9.2.3. By Country
• 9.3. South America: Country Analysis
  • 9.3.1. Brazil Interconnects and Passive Components Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Component
      • 9.3.1.2.2. By Application
  • 9.3.2. Colombia Interconnects and Passive Components Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Component
      • 9.3.2.2.2. By Application
  • 9.3.3. Argentina Interconnects and Passive Components Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Component
      • 9.3.3.2.2. By Application
  • 9.3.4. Chile Interconnects and Passive Components Market Outlook
    • 9.3.4.1. Market Size & Forecast
      • 9.3.4.1.1. By Value
    • 9.3.4.2. Market Share & Forecast
      • 9.3.4.2.1. By Component
      • 9.3.4.2.2. By Application
  • 9.3.5. Peru Interconnects and Passive Components Market Outlook
    • 9.3.5.1. Market Size & Forecast
      • 9.3.5.1.1. By Value
    • 9.3.5.2. Market Share & Forecast
      • 9.3.5.2.1. By Component
      • 9.3.5.2.2. By Application

10. Middle East & Africa Interconnects and Passive Components Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Component
  • 10.2.2. By Application
  • 10.2.3. By Country
• 10.3. Middle East & Africa: Country Analysis
  • 10.3.1. Saudi Arabia Interconnects and Passive Components Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Component
      • 10.3.1.2.2. By Application
  • 10.3.2. UAE Interconnects and Passive Components Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Component
      • 10.3.2.2.2. By Application
  • 10.3.3. South Africa Interconnects and Passive Components Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Component
      • 10.3.3.2.2. By Application
  • 10.3.4. Turkey Interconnects and Passive Components Market Outlook
    • 10.3.4.1. Market Size & Forecast
      • 10.3.4.1.1. By Value
    • 10.3.4.2. Market Share & Forecast
      • 10.3.4.2.1. By Component
      • 10.3.4.2.2. By Application
  • 10.3.5. Israel Interconnects and Passive Components Market Outlook
    • 10.3.5.1. Market Size & Forecast
      • 10.3.5.1.1. By Value
    • 10.3.5.2. Market Share & Forecast
      • 10.3.5.2.1. By Component
      • 10.3.5.2.2. By Application

11. Asia Pacific Interconnects and Passive Components Market Outlook

• 11.1. Market Size & Forecast
  • 11.1.1. By Component
  • 11.1.2. By Application
  • 11.1.3. By Country
• 11.2. Asia-Pacific: Country Analysis
  • 11.2.1. China Interconnects and Passive Components Market Outlook
    • 11.2.1.1. Market Size & Forecast
      • 11.2.1.1.1. By Value
    • 11.2.1.2. Market Share & Forecast
      • 11.2.1.2.1. By Component
      • 11.2.1.2.2. By Application
  • 11.2.2. India Interconnects and Passive Components Market Outlook
    • 11.2.2.1. Market Size & Forecast
      • 11.2.2.1.1. By Value
    • 11.2.2.2. Market Share & Forecast
      • 11.2.2.2.1. By Component
      • 11.2.2.2.2. By Application
  • 11.2.3. Japan Interconnects and Passive Components Market Outlook
    • 11.2.3.1. Market Size & Forecast
      • 11.2.3.1.1. By Value
    • 11.2.3.2. Market Share & Forecast
      • 11.2.3.2.1. By Component
      • 11.2.3.2.2. By Application
  • 11.2.4. South Korea Interconnects and Passive Components Market Outlook
    • 11.2.4.1. Market Size & Forecast
      • 11.2.4.1.1. By Value
    • 11.2.4.2. Market Share & Forecast
      • 11.2.4.2.1. By Component
      • 11.2.4.2.2. By Application
  • 11.2.5. Australia Interconnects and Passive Components Market Outlook
    • 11.2.5.1. Market Size & Forecast
      • 11.2.5.1.1. By Value
    • 11.2.5.2. Market Share & Forecast
      • 11.2.5.2.1. By Component
      • 11.2.5.2.2. By Application
  • 11.2.6. Indonesia Interconnects and Passive Components Market Outlook
    • 11.2.6.1. Market Size & Forecast
      • 11.2.6.1.1. By Value
    • 11.2.6.2. Market Share & Forecast
      • 11.2.6.2.1. By Component
      • 11.2.6.2.2. By Application
  • 11.2.7. Vietnam Interconnects and Passive Components Market Outlook
    • 11.2.7.1. Market Size & Forecast
      • 11.2.7.1.1. By Value
    • 11.2.7.2. Market Share & Forecast
      • 11.2.7.2.1. By Component
      • 11.2.7.2.2. By Application

12. Market Dynamics

• 12.1. Drivers
• 12.2. Challenges

13. Market Trends and Developments

14. Company Profiles

• 14.1. TE Connectivity Corporation
  • 14.1.1. Business Overview
  • 14.1.2. Key Revenue and Financials
  • 14.1.3. Recent Developments
  • 14.1.4. Key Personnel/Key Contact Person
  • 14.1.5. Key Product/Services Offered
• 14.2. Amphenol Corporation
  • 14.2.1. Business Overview
  • 14.2.2. Key Revenue and Financials
  • 14.2.3. Recent Developments
  • 14.2.4. Key Personnel/Key Contact Person
  • 14.2.5. Key Product/Services Offered
• 14.3. Molex, LLC
  • 14.3.1. Business Overview
  • 14.3.2. Key Revenue and Financials
  • 14.3.3. Recent Developments
  • 14.3.4. Key Personnel/Key Contact Person
  • 14.3.5. Key Product/Services Offered
• 14.4. Kyocera Corporation
  • 14.4.1. Business Overview
  • 14.4.2. Key Revenue and Financials
  • 14.4.3. Recent Developments
  • 14.4.4. Key Personnel/Key Contact Person
  • 14.4.5. Key Product/Services Offered
• 14.5. AVX Corporation
  • 14.5.1. Business Overview
  • 14.5.2. Key Revenue and Financials
  • 14.5.3. Recent Developments
  • 14.5.4. Key Personnel/Key Contact Person
  • 14.5.5. Key Product/Services Offered
• 14.6. Yageo Corporation
  • 14.6.1. Business Overview
  • 14.6.2. Key Revenue and Financials
  • 14.6.3. Recent Developments
  • 14.6.4. Key Personnel/Key Contact Person
  • 14.6.5. Key Product/Services Offered
• 14.7. Vishay Intertechnology, Inc.
  • 14.7.1. Business Overview
  • 14.7.2. Key Revenue and Financials
  • 14.7.3. Recent Developments
  • 14.7.4. Key Personnel/Key Contact Person
  • 14.7.5. Key Product/Services Offered
• 14.8. STMicroelectronics N.V.
  • 14.8.1. Business Overview
  • 14.8.2. Key Revenue and Financials
  • 14.8.3. Recent Developments
  • 14.8.4. Key Personnel/Key Contact Person
  • 14.8.5. Key Product/Services Offered
• 14.9. Murata Manufacturing Co., Ltd.
  • 14.9.1. Business Overview
  • 14.9.2. Key Revenue and Financials
  • 14.9.3. Recent Developments
  • 14.9.4. Key Personnel/Key Contact Person
  • 14.9.5. Key Product/Services Offered
• 14.10. KEMET Corporation
  • 14.10.1. Business Overview
  • 14.10.2. Key Revenue and Financials
  • 14.10.3. Recent Developments
  • 14.10.4. Key Personnel/Key Contact Person
  • 14.10.5. Key Product/Services Offered

15. Strategic Recommendations

16. About Us & Disclaimer