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半導体資本設備の市場規模、シェア、成長分析、タイプ別、プロセスタイプ別、業界別、地域別 - 産業予測、2024年~2031年

Semiconductor Capital Equipment Market Size, Share, Growth Analysis, By Type, By Process Type, By Industry Vertical, By Region - Industry Forecast 2024-2031


出版日
発行
SkyQuest
ページ情報
英文 192 Pages
納期
3~5営業日
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=143.57円
半導体資本設備の市場規模、シェア、成長分析、タイプ別、プロセスタイプ別、業界別、地域別 - 産業予測、2024年~2031年
出版日: 2024年11月23日
発行: SkyQuest
ページ情報: 英文 192 Pages
納期: 3~5営業日
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  • 目次
概要

半導体資本設備の世界市場規模は2022年に758億米ドルと評価され、2023年の812億6,000万米ドルから2031年には1,417億2,000万米ドルに成長し、予測期間中(2024-2031年)のCAGRは7.2%で成長する見通しです。

世界の半導体産業は、自動車セクターの進化と並んで、スマートフォンの利用急増と先端電子デバイスの拡大によって著しい成長を遂げています。5Gや人工知能のような技術革新がこの変革に拍車をかけており、特に5G技術はワイヤレス性能を高め、拡張現実やモノのインターネット(IoT)のような新しいアプリケーションを促進しています。高性能でありながらコスト効率に優れた半導体への持続的な需要は、短期、中期、長期のシナリオにわたって市場のダイナミクスを後押ししています。さらに、スマートデバイスやポータブルデバイスの台頭は、様々な産業におけるデジタル化の進展と相まって、半導体素子を組み込んだデジタルエレクトロニクスの普及に大きく寄与しています。民生用と産業用の両方におけるスマート・ウェアラブルの出現は、さらに高度な半導体集積を必要とします。この動向は、エッチングやウエハー裏面研削を含む最先端の加工技術の必要性を強調するとともに、半導体製造の専門知識も必要とします。AI、機械学習、IoT技術の統合は、高度なロボット工学とともに、特に半導体部品の製造風景を再構築しています。技術の進歩は進化を続け、世界の半導体資本設備市場を前進させ、次世代アプリケーションとサービスをサポートする業界の極めて重要な役割を浮き彫りにしています。

目次

イントロダクション

  • 調査の目的
  • 調査範囲
  • 定義

調査手法

  • 情報調達
  • 二次データと一次データの方法
  • 市場規模予測
  • 市場の前提条件と制限

エグゼクティブサマリー

  • 世界市場の見通し
  • 供給と需要の動向分析
  • セグメント別機会分析

市場力学と見通し

  • 市場概要
  • 市場規模
  • 市場力学
    • 促進要因と機会
    • 抑制要因と課題
  • ポーター分析と影響
    • 競争企業間の敵対関係
    • 代替品の脅威
    • 買い手の交渉力
    • 新規参入業者の脅威
    • 供給企業の交渉力

主な市場の考察

  • 重要成功要因
  • 競合の程度
  • 主な投資機会
  • 市場エコシステム
  • 技術の進歩
  • 規制情勢
  • 特許分析
  • バリューチェーン分析
  • ケーススタディ分析
  • 顧客と購買基準の分析
  • PESTEL分析
  • マクロ経済指標
  • 市場の魅力指数
  • 価格分析

半導体資本設備の市場規模:タイプ別& CAGR(2024-2031)

  • 市場概要
  • ウェーハレベル製造装置
    • リソグラフィー装置
    • エッチング装置
    • 堆積装置
    • 化学機械平坦化(CMP)装置
    • 清掃用具
  • 組立・梱包設備
    • ダイボンダー
    • ワイヤーボンダー
    • フリップチップボンダー
    • カプセル化装置
  • 自動テスト装置(ATE)
    • メモリテストシステム
    • 非メモリテストシステム
    • 個別テストシステム

半導体資本設備の市場規模:プロセスタイプ別 & CAGR(2024-2031)

  • 市場概要
    • ウエハー処理
    • 表面処理
    • 化学機械平坦化(CMP)
    • 化学蒸着法(CVD)
    • 物理蒸着法(PVD)
    • イオン注入
  • 組み立てと梱包
    • ウエハーボンディング
    • ダイアタッチ
    • ワイヤーボンディング
    • カプセル化
  • テスト
    • 電気テスト
    • 機能テスト
    • バーンインテスト

半導体資本設備の市場規模:業界別& CAGR(2024-2031)

  • 市場概要
  • 家電
    • スマートフォン
    • タブレット
    • ノートパソコン
    • ウェアラブル
  • 自動車
    • ADAS(先進運転支援システム)(ADAS)
    • インフォテインメントシステム
    • 電気自動車(EV)
    • 自動運転車
  • ヘルスケア
    • 医療機器
    • 診断機器
    • ウェアラブルヘルスモニター
  • IT・通信
    • データセンター
    • ネットワーク機器
    • 5Gインフラ

半導体資本設備の市場規模:地域別& CAGR(2024-2031)

  • 北米
    • 米国
    • カナダ
  • 欧州
    • 英国
    • ドイツ
    • スペイン
    • フランス
    • イタリア
    • その他欧州地域
  • アジア太平洋
    • 中国
    • インド
    • 日本
    • 韓国
    • その他アジア太平洋地域
  • ラテンアメリカ
    • ブラジル
    • その他ラテンアメリカ地域
  • 中東およびアフリカ
    • GCC諸国
    • 南アフリカ
    • その他中東・アフリカ

競合情報

  • 上位5社の比較
  • 主要企業の市場ポジショニング(2023年)
  • 主な市場企業が採用した戦略
  • 市場の最近の動向
  • 企業の市場シェア分析(2023年)
  • 主要企業の企業プロファイル
    • 会社概要
    • 製品ポートフォリオ分析
    • セグメント別シェア分析
    • 収益の前年比比較(2021-2023)

主要企業プロファイル

  • Applied Materials, Inc.
  • ASML Holding N.V.
  • Tokyo Electron Limited
  • Lam Research Corporation
  • KLA Corporation
  • Advantest Corporation
  • Teradyne Inc.
  • Screen Holdings Co., Ltd.
  • Hitachi High-Technologies Corporation
  • ASM International N.V.
  • Kulicke & Soffa Industries, Inc.
  • Nikon Corporation
  • Canon Inc.
  • Plasma-Therm LLC
  • Veeco Instruments Inc.
  • Nova Measuring Instruments Ltd.
  • Ontoo Innovation
  • Camtek Ltd.
  • ACCRETECH-Tokyo Seimitsu Co., Ltd.
  • Ultratech, Inc.

結論と推奨事項

目次
Product Code: SQMIG15A2433

Global Semiconductor Capital Equipment Market size was valued at USD 75.8 billion in 2022 and is poised to grow from USD 81.26 billion in 2023 to USD 141.72 billion by 2031, growing at a CAGR of 7.2% during the forecast period (2024-2031).

The global semiconductor industry is witnessing significant growth driven by the surge in smartphone usage and the expansion of advanced electronic devices, alongside the automotive sector's evolution. Innovations like 5G and artificial intelligence are catalyzing this transformation, particularly with 5G technology enhancing wireless performance and facilitating new applications, such as augmented reality and the Internet of Things (IoT). The sustained demand for high-performance yet cost-effective semiconductors is propelling market dynamics across short, medium, and long-term scenarios. Furthermore, the rise of smart and portable devices, coupled with increased digitization across various industries, is significantly contributing to the proliferation of digital electronics that incorporate semiconductor elements. The emergence of smart wearables in both consumer and industrial settings further necessitates advanced semiconductor integration. This trend underscores the need for cutting-edge processing techniques, including etching and wafer back grinding, while also requiring expertise in semiconductor manufacturing. The integration of AI, machine learning, and IoT technologies, along with advanced robotics, is reshaping the manufacturing landscape, particularly for semiconductor components. As technological advancements continue to evolve, they are set to drive the global semiconductor capital equipment market forward, highlighting the industry's pivotal role in supporting next-generation applications and services.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Semiconductor Capital Equipment market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Semiconductor Capital Equipment Market Segmental Analysis

Global Semiconductor Capital Equipment Market is segmented by type, process type, industry vertical and region. Based on type, the market is segmented into wafer-level manufacturing equipment (lithography equipment, etching equipment, deposition equipment, chemical mechanical planarization (CMP) equipment, cleaning equipment), assembly and packaging equipment (die bonders, wire bonders, flip chip bonders, encapsulation equipment) and automated test equipment (ATE) (memory test systems, non-memory test systems, discrete test systems). Based on process type, the market is segmented into wafer processing (surface conditioning, chemical mechanical planarization (CMP), chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation), assembly and packaging (wafer bonding, die attach, wire bonding, encapsulation) and testing (electrical testing, functional testing, burn-in testing). Based on industrial vertical, the market is segmented into consumer electronics (smartphones, tablets, laptops, wearables), automotive (advanced driver assistance systems (ADAS), infotainment systems, electric vehicles (EVs), autonomous vehicles), healthcare (medical devices, diagnostic equipment, wearable health monitors) and IT and telecommunication (data centers, networking equipment, 5g infrastructure). Based on end user, the market is segmented into automotive, consumer electronics, healthcare, agriculture, manufacturing, and others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & and Africa.

Driver of the Global Semiconductor Capital Equipment Market

The Global Semiconductor Capital Equipment market is primarily driven by the rising demand for electrical appliances, particularly in the consumer electronics sector, which is experiencing rapid growth. This surge is largely fueled by the increasing popularity of smartphones amidst a rising global population, serving as a key catalyst for market expansion. The heightened consumption of electronic devices such as tablets, laptops, and wearable technology propels industry growth. Moreover, as semiconductor technology advances, innovative market segments, including machine learning devices, are swiftly incorporated, further elevating the demand for semiconductor capital equipment and shaping the future landscape of the industry.

Restraints in the Global Semiconductor Capital Equipment Market

Restraints in the Global Semiconductor Capital Equipment market include significant premature expenditures, which pose challenges for stakeholders. The dynamics of the copper and semiconductor segments contribute to this issue, as their operational frameworks are influenced by market conditions and external factors. These conditions, compounded by the influx of skilled labor, have a pronounced impact on investment strategies and project timelines. As a result, the interplay of these elements may lead to financial strain and inefficiencies, ultimately affecting the overall growth and stability of the semiconductor capital equipment sector in a competitive global landscape.

Market Trends of the Global Semiconductor Capital Equipment Market

The Global Semiconductor Capital Equipment market is poised for significant expansion between 2024 and 2031, largely driven by the emergence of 5G technology. This transformative period is expected to see the market size double, fueled by escalating demand for advanced applications, including autonomous vehicles and virtual reality solutions. As industries innovate and integrate high-speed connectivity into their platforms, the need for sophisticated semiconductor manufacturing equipment will surge. Consequently, players in the semiconductor capital equipment space are likely to capitalize on this trend, investing in research, development, and production capacities to meet the burgeoning requirements of next-generation technologies.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Driver & Opportunities
    • Restraints & Challenges
  • Porters Analysis & Impact
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Technological Advancement
  • Regulatory Landscape
  • Patent Analysis
  • Value Chain Analysis
  • Case Study Analysis
  • Customer & Buying Criteria Analysis
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Market Attractiveness Index
  • Pricing Analysis

Semiconductor Capital Equipment Market Size by Type & CAGR (2024-2031)

  • Market Overview
  • Wafer-Level Manufacturing Equipment
    • Lithography Equipment
    • Etching Equipment
    • Deposition Equipment
    • Chemical Mechanical Planarization (CMP) Equipment
    • Cleaning Equipment
  • Assembly and Packaging Equipment
    • Die Bonders
    • Wire Bonders
    • Flip Chip Bonders
    • Encapsulation Equipment
  • Automated Test Equipment (ATE)
    • Memory Test Systems
    • Non-Memory Test Systems
    • Discrete Test Systems

Semiconductor Capital Equipment Market Size by Process Type & CAGR (2024-2031)

  • Market Overview
    • Wafer Processing
    • Surface Conditioning
    • Chemical Mechanical Planarization (CMP)
    • Chemical Vapor Deposition (CVD)
    • Physical Vapor Deposition (PVD)
    • Ion Implantation
  • Assembly and Packaging
    • Wafer Bonding
    • Die Attach
    • Wire Bonding
    • Encapsulation
  • Testing
    • Electrical Testing
    • Functional Testing
    • Burn-In Testing

Semiconductor Capital Equipment Market Size by Industry Vertical & CAGR (2024-2031)

  • Market Overview
  • Consumer Electronics
    • Smartphones
    • Tablets
    • Laptops
    • Wearables
  • Automotive
    • Advanced Driver Assistance Systems (ADAS)
    • Infotainment Systems
    • Electric Vehicles (EVs)
    • Autonomous Vehicles
  • Healthcare
    • Medical Devices
    • Diagnostic Equipment
    • Wearable Health Monitors
  • IT and Telecommunication
    • Data Centers
    • Networking Equipment
    • 5G Infrastructure

Semiconductor Capital Equipment Market Size & CAGR (2024-2031)

  • North America, (Type, Process Type, Industry Vertical)
    • US
    • Canada
  • Europe, (Type, Process Type, Industry Vertical)
    • UK
    • Germany
    • Spain
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific, (Type, Process Type, Industry Vertical)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia Pacific
  • Latin America, (Type, Process Type, Industry Vertical)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa, (Type, Process Type, Industry Vertical)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2023
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2023
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2021-2023)

Key Company Profiles

  • Applied Materials, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ASML Holding N.V.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Tokyo Electron Limited
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Lam Research Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • KLA Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Advantest Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Teradyne Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Screen Holdings Co., Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Hitachi High-Technologies Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ASM International N.V.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Kulicke & Soffa Industries, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nikon Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Canon Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Plasma-Therm LLC
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Veeco Instruments Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nova Measuring Instruments Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ontoo Innovation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Camtek Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ACCRETECH - Tokyo Seimitsu Co., Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ultratech, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendation