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自動車用インテリジェントコックピットSoC（2025年）

Automotive Intelligent Cockpit SoC Research Report, 2025

出版日
ページ情報
英文 600 Pages
納期
即日から翌営業日
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価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=144.08円
自動車用インテリジェントコックピットSoC（2025年）
出版日: 2025年05月06日
発行: ResearchInChina
ページ情報: 英文 600 Pages
納期: 即日から翌営業日
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概要

中国の自動車用インテリジェントコックピットSoC市場では、Qualcomm、Renesas、AMDなどのベンダーが依然として優勢ですが、現地化率も急速に高まっています。

ResearchInChinaの統計によると、2024年のインテリジェントコックピットSoCの現地化率は10%を超え、SemiDrive、Huawei HiSilicon、SiEngineに代表される国内ベンダーが急速に台頭しています。

自動車用インテリジェントコックピットSoCは製品のアップグレードサイクルに入りつつあり、今後2～3年でAI指向のコックピットSoCが主流になると予測されます。

自動車用インテリジェントコックピットSoCチップは製品アップグレードサイクルに入りつつあり、主な開発方針は以下の通りです。

チップの主流プロセスは7nmから4nm未満へと進歩しています。2024年に、7nm未満のプロセスのチップが36%を占め、この数字は2030年までに65%を超えると予測されます。次世代は4nmと3nmプロセスへとシフトします。現在広く使用されている7nmや5nmのチップに比べ、4nmはトランジスタ密度、性能、電力効率が大幅に向上し、さまざまな応用シナリオでAIコックピット向けの高スループットで連続的なAIコンピューティングタスクをよりよくサポートします。

NVIDIA DRIVE Thor、Black Sesameの「Wudang」C1200シリーズ、QualcommのSA8795P/SA8775Pシリーズ、MediaTekのCT-X1（MT8678）など、AIコックピットや先進の自動運転をサポートする統合型コックピットドライビングSoCが登場します。

AI指向のコックピットSoCは今後2～3年で主流になり、オンデバイスモデルを現在の1B～1.5B言語モデルから7B～10Bマルチモーダルモデルへと進化させます。例えば、SemiDriveのX10、MediaTekのMT8676、SamsungのExynos Auto V920、Qualcommの8397（Snapdragon Cockpit Elite）、IntelのPanther Lakeなどです。

SemiDriveを例にとると、同社は2025年の上海モーターショーで次世代AIコックピットチップ、X10を発表しました。このSoCは先進の4nmプロセスを採用し、7Bパラメーターのマルチモーダル大規模モデルのオンデバイス展開をサポートします。X10シリーズのチップは2026年から量産が始まる予定です。

仕様面では、SemiDrive X10シリーズ製品は、AIコンピューティングに最適化されたARMv9.2 CPUアーキテクチャを搭載し、最大200K DMIPSのCPU性能を実現します。同時に、X10は1,800GFLOPS GPUと40TOPS NPUを統合しており、9,600 MT/sで動作する128ビットのLPDDR5Xメモリインターフェースを備え、システム全体に現在の主力量産コックピットチップの2倍を超える154GB/sという膨大な帯域幅を提供しています。

AIコックピットの最大の課題は、7Bマルチモーダル大規模モデルのオンデバイス展開にあります。7Bマルチモーダルモデルをオンデバイスで展開するための性能要件は、512トークンの入力長で1秒以内に最初のトークンを出力し、毎秒20トークンの速度を維持することです。このためには、コックピットプロセッサーが約30～40TOPSのNPU演算能力を持ち、約90GB/sのDDR帯域幅を備えている必要があります。市場にある既存の高性能コックピットSoCはNPU性能要件の一部を満たしていますが、そのメモリ帯域幅はほとんどが60～70GB/sの範囲にあり、7Bモデルの展開をサポートすることは困難です。

SemiDrive X10は、AIコックピットシナリオの中核となる要求に焦点を当てています。小規模モデルの高速応答、中規模モデルのマルチモーダルインタラクション、クラウドベースの大規模モデルの複雑なタスクです。また、従来のコックピットチップが直面していたコンピューティングパワーと帯域幅のボトルネックに対処しています。コンピューティングパワーと帯域幅の構成に関しては、7Bマルチモーダルモデルのオンデバイス展開の要件を満たすことを重視しており、40TOPSのNPUコンピューティングパワーと154GB/sの超高帯域幅を提供し、大規模モデルの潜在的な性能をフルに引き出します。

当レポートでは、中国の自動車産業について調査分析し、自動車用インテリジェントコックピットSoCの定義と分類、搭載数と市場シェア、OEMのコックピットSoC展開戦略などの情報を提供しています。

目次

第1章 インテリジェントコックピットSoCの定義と分類

  • コックピットSoCの定義
  • コックピットSoCの分類：コックピットレベル別
  • コックピットSoCの分類：応用シナリオ別
  • コックピットSoCの分類：ナノメートルプロセス別
  • コックピットSoCの分類：EEA別

第2章 中国の乗用車インテリジェントコックピットSoC市場調査とデータアナリティクス

  • インテリジェントコックピットSoCベンダーの競合情勢
  • 異なる価格帯の車両のコックピットSoC構成戦略
  • インテリジェントコックピットSoCの価格とコスト
  • インテリジェントコックピットSoCの市場規模

第3章 インテリジェントコックピットSoC製品のベンチマークと革新的なソリューション

  • L3 AI SoC（コックピット）：代表的な製品の性能の比較
  • L3 AI SoC（先進コックピット・ドライビング統合）：代表的な製品の性能の比較
  • L2 SoC（コックピット）：代表的な製品の性能の比較
  • L2 SoC（中間コックピット・ドライビング統合）：代表的な製品の性能の比較
  • 革新的なコックピットSoCソリューション：オンデバイスAI基盤モデルの展開をどのように満たすか
  • 革新的なコックピットSoCソリューション：コックピット・ドライビング統合とメカトロニクス
  • 革新的なコックピットSoCソリューション：1台の車両に複数のコックピットSoCは必要か
  • 革新的なコックピットSoCソリューション：SIPモジュールのパッケージングと統合の動向
  • 革新的なコックピットSoCソリューション：チップレット

第4章 国外のコックピットSoCベンダー

  • Qualcomm
  • AMD
  • Renesas
  • Intel
  • Samsung
  • Nvidia
  • NXP
  • Telechips
  • TI

第5章 中国のコックピットSoCベンダー

  • SemiDrive
  • SiEngine
  • Huawei HiSilicon
  • MediaTek
  • AutoChips
  • Rockchip
  • UNISOC
  • Arkmicro Technologies

第6章 OEMのコックピットSoC展開戦略

  • BYD
  • Great Wall Motor
  • GAC
  • Changan
  • SAIC
  • Geely
  • BAIC
  • FAW
  • Chery
  • Dongfeng Motor
  • Li Auto
  • NIO
  • Xpeng
  • Leapmotor
  • Xiaomi Auto
  • Tesla
  • BMW
  • Volkswagen
  • Audi
  • Daimler Mercedes-Benz
  • Toyota
  • Honda
目次
Product Code: CL004

Cockpit SoC research: The localization rate exceeds 10%, and AI-oriented cockpit SoC will become the mainstream in the next 2-3 years

In the Chinese automotive intelligent cockpit SoC market, although vendors such as Qualcomm, Renesas, and AMD still dominate, the localization rate is also rapidly increasing.

According to ResearchInChina statistics, the localization rate of intelligent cockpit SoCs in 2024 has exceeded 10%, with domestic vendors represented by SemiDrive, Huawei HiSilicon, and SiEngine rapidly rising.

Automotive intelligent cockpit SoCs are entering a product upgrade cycle, with AI-oriented cockpit SoCs expected to become mainstream in the next 2-3 years

Automotive intelligent cockpit SoC chips are entering a product upgrade cycle, with key development directions including:

The mainstream chip process is advancing from 7nm to 4nm and below. In 2024, chips with 7nm and below processes accounted for 36%, and this figure is expected to exceed 65% by 2030. The next generation will shift toward 4nm and 3nm processes. Compared to the currently widely used 7nm and 5nm chips, 4nm offers significant improvements in transistor density, performance, and power efficiency, better supporting high-throughput, continuous AI computing tasks for AI cockpits across various application scenarios.

The emergence of integrated cockpit-driving SoCs that support AI cockpits and high-level autonomous driving, such as NVIDIA DRIVE Thor, Black Sesame's "Wudang" C1200 series, Qualcomm's SA8795P/SA8775P series, and MediaTek's CT-X1 (MT8678).

AI-oriented cockpit SoCs will become mainstream in the next 2-3 years, driving the evolution of on-device models from the current 1B-1.5B language models to 7B-10B multimodal models. Examples include SemiDrive's X10, MediaTek's MT8676, Samsung's Exynos Auto V920, Qualcomm's 8397 (Snapdragon Cockpit Elite), and Intel's Panther Lake.

Taking SemiDrive as an example, it unveiled its next-generation AI cockpit chip X10 at the 2025 Shanghai Auto Show. This SoC adopts an advanced 4nm process and supports on-device deployment of a 7B-parameter multimodal large model. The X10 series chips are scheduled to enter mass production starting in 2026.

In terms of specifications, the SemiDrive X10 series products feature an ARMv9.2 CPU architecture optimized for AI computing, delivering CPU performance of up to 200K DMIPS. Simultaneously, the X10 integrates a 1800 GFLOPS GPU and a 40 TOPS NPU, equipped with a 128-bit LPDDR5X memory interface running at 9600 MT/s, providing the entire system with a massive bandwidth of 154 GB/s-more than double that of current flagship mass-produced cockpit chips.

The biggest challenge for AI cockpits lies in the on-device deployment of 7B multimodal large models. The performance requirement for deploying a 7B multimodal model on-device is to output the first token within 1 second under a 512-token input length and sustain a speed of 20 tokens per second. This demands that cockpit processors possess NPU computing power of around 30-40 TOPS, paired with DDR bandwidth of approximately 90 GB/s. While existing high-performance cockpit SoCs on the market meet some of the NPU performance requirements, their memory bandwidth mostly falls in the 60-70 GB/s range, making it difficult to support the deployment of 7B models.

The SemiDrive X10 focuses on the core demands of AI cockpit scenarios: "fast response for small models, multimodal interaction for medium-sized models, and complex tasks for cloud-based large models." It addresses the bottlenecks in computing power and bandwidth faced by traditional cockpit chips. In terms of computing power and bandwidth configuration, it emphasizes meeting the requirements for on-device deployment of 7B multimodal models, delivering 40 TOPS of NPU computing power paired with an ultra-large bandwidth of 154 GB/s, ensuring the full performance potential of large models.

Regarding the development toolchain, the X10's accompanying AI toolchain covers functions such as compilation, quantization, simulation, and performance analysis, significantly reducing the cycle for model deployment and performance optimization. Additionally, the X10's SDK provides a universal standardized model invocation interface, simplifying the development and migration of AI applications and enabling plug-and-play AI functionality. This ecosystem strategy aims to lower development barriers, offering automakers, algorithm providers, and application developers flexible customization options to accelerate the adoption of AI technology in cockpit scenarios.

The integration level of automotive intelligent cockpit SoC chips continues to increase

Represented by companies like Qualcomm and MediaTek, vendors are beginning to integrate 5G modems, WiFi 7, Bluetooth, and V2X modules into smart cockpit SoCs. This enables the convergence of high-speed connectivity and intelligent computing capabilities on a single chip, improving the real-time performance, multitasking capabilities, and user experience of in-vehicle systems. At the same time, it helps OEMs reduce costs by eliminating the need for external T-Box units.

Taking the D9000 co-developed by BYD and MediaTek as an example, it integrates:

Integrated 5G Modem: Incorporates MediaTek's M80 baseband, supporting Sub-6GHz bands with downlink speeds up to 7 Gbps, while maintaining compatibility with 2G-4G networks.

Wi-Fi 7: Theoretical peak rate of 6.5 Gbps, supporting dual-band concurrency.

Bluetooth 5.3: Enables low-power connectivity for in-vehicle sensors and peripherals.

BYD's flagship models, including the Bao 8, Denza Z9, Denza N9, and Yangwang U7, have all adopted the D9000.

On the other hand, cockpit SoC SIP packaging modules are rapidly gaining traction. With increasing power demands and growing component complexity, traditional COB designs face challenges in PCB reliability, thickness control, and warpage management. SIP packaging, through BGA ball mounting technology, backside capacitor design, and extensive underfill process expertise, effectively addresses hardware design, manufacturing, and reliability challenges, ensuring stable operation in harsh environments.

Cockpit SoC SIP packaging modules come in two forms:

(1) SIP modules directly offered by chip vendors, represented by Qualcomm, which provides products like the QAM8255P module and QAM8775P module. Taking the QAM8255P module as an example, its core components include:

SA8255P SoC: Main processing chip.

Power management unit: 4- Qualcomm-developed PMM8650AU power management IC + 1* third-party ASIL-D compliant power management chip (likely from NXP or Infineon).

Memory: Micron LPDDR5, 12GB capacity.

(2) SIP module solutions from module manufacturers, such as Quectel's 48 TOPS high-computing 5G smart cockpit integrated solution module AS830M. The AS830M is developed based on the Qualcomm Snapdragon 8 Gen 2 and employs advanced SiP (System-in-Package) technology combined with BGA (Ball Grid Array) ball mounting, significantly reducing hardware design complexity.

The AS830M integrates 5G, Wi-Fi 7, and BT5.3 technologies, delivering efficient data transmission and connected vehicle capabilities.

Table of Contents

1 Definition and Classification of Intelligent Cockpit SoC

  • 1.1 Definition of Cockpit SoC
  • Definition of Cockpit SoC
  • Cockpit SoC Research Framework in This Report (1)
  • Cockpit SoC Research Framework in This Report (2)
  • 1.2 Classification of Cockpit SoC: By Cockpit Level
  • Classification Logic of Cockpit SoC by Cockpit Level
  • Intelligent Cockpit Shipments by Level (L0/L1/L2/L3/L4), 2024-2030E
  • Classification of Cockpit SoC Products by Level (L0/L1/L2/L3/L4)
  • 1.3 Classification of Cockpit SoC: By Application Scenario
  • Cockpit Shipments by Application Scenario (AI Cockpit, Cockpit-Parking, Cockpit-Driving-Parking, etc.), 2024-2030E
  • Typical AI Cockpit Solutions
  • Typical Cockpit-Driving-Parking Integration Solutions (1)
  • Typical Cockpit-Driving-Parking Integration Solutions (2)
  • Typical Cockpit-Parking Integration Solutions
  • 1.4 Classification of Cockpit SoC: By Nanometer Process
  • China's Intelligent Cockpit SoC Shipment Structure by Nanometer Process, 2022-2024
  • China's Intelligent Cockpit SoC Shipment Structure by Nanometer Process, 2022-2024 & 2030E
  • 1.5 Classification of Cockpit SoC: By EEA
  • Current EEA Deployment and Five-Year Trend Forecast, 2024-2030E
  • Current EEA Deployment and Five-Year Trend Forecast, 2024-2030E (Attached Table)
  • Three Development Stages Under EEA Evolution Trend: Multi-Board, One-Board, One-Chip (1)
  • Three Development Stages Under EEA Evolution Trend: Multi-Board, One-Board, One-Chip (2)
  • Multi-Domain DCU - Typical Multi-Board Solution
  • Central Computing Unit (CCU) - Typical One-Board Solution
  • Central Computing Unit (CCU) - Typical One-Chip Solution

2 China's Passenger Car Intelligent Cockpit SoC Market Research and Data Analysis

  • 2.1 Competitive Landscape of Intelligent Cockpit SoC Vendors
  • Intelligent Vehicle Cockpit SoC Installations and Market Share (By Chip Product) in China, 2022-2024 (1)
  • Intelligent Vehicle Cockpit SoC Installations and Market Share (By Chip Product) in China, 2022-2024 (2)
  • Intelligent Vehicle Cockpit SoC Installations and Market Share (By Chip Product) in China, 2022-2024 (3)
  • Intelligent Vehicle Cockpit SoC Installations and Market Share (By Vendor) in China, 2022-2024 & 2030E
  • Revenue and Shipments of Global and Chinese Intelligent Cockpit SoC Vendors, 2023-2024 (1)
  • Revenue and Shipments of Global and Chinese Intelligent Cockpit SoC Vendors, 2023-2024 (2)
  • Revenue and Shipments of Global and Chinese Intelligent Cockpit SoC Vendors, 2023-2024 (3)
  • 2.2 Cockpit SoC Configuration Strategies of Vehicles in Different Price Ranges
  • China Passenger Car Sales (By Price Range), 2023-2024
  • Share of Cockpit SoC in Passenger Cars Priced at >=RMB500,000, 2023-2024
  • Intelligent Cockpit SoC Selection in Mainstream Vehicle Models Priced Above RMB500,000, 2023-2025
  • Share of Cockpit SoC in Passenger Cars Priced at RMB4000,000-500,000, 2023-2024
  • Cockpit SoC Selection in Mainstream Vehicle Models Priced at RMB4000,000-500,000, 2023-2025
  • Share of Cockpit SoC in Passenger Cars Priced at RMB3500,000-4000,000, 2023-2024
  • Cockpit SoC Selection in Mainstream Vehicle Models Priced at RMB3500,000-4000,000, 2023-2025
  • Share of Cockpit SoC in Passenger Cars Priced at RMB3000,000-3500,000, 2023-2024
  • Cockpit SoC Selection in Mainstream Vehicle Models Priced at RMB3000,000-3500,000, 2023-2025
  • Share of Cockpit SoC in Passenger Cars Priced at RMB2500,000-3000,000, 2023-2024
  • Cockpit SoC Selection in Mainstream Vehicle Models Priced at RMB2500,000-3000,000, 2023-2025
  • Share of Cockpit SoC in Passenger Cars Priced at RMB1500,000-2500,000, 2023-2024
  • Cockpit SoC Selection in Mainstream Vehicle Models Priced at RMB1500,000-2500,000, 2023-2025
  • Share of Cockpit SoC in Passenger Cars Priced at <=RMB1500,000, 2023-2024
  • Cockpit SoC Selection in Mainstream Vehicle Models Priced at RMB1500,000-2500,000, 2023-2025
  • 2.3 Price and Cost of Intelligent Cockpit SoC
  • Estimated Intelligent Cockpit SoC Shipment Prices, 2023-2025
  • 2.4 Intelligent Cockpit SoC Market Size
  • China's Intelligent Cockpit SoC Market Size by Level (L0/L1/L2/L3/L4), 2024-2030E,
  • China's Intelligent Cockpit SoC Installations by Level (L0/L1/L2/L3/L4), 2024-2030E

3 Intelligent Cockpit SoC Product Benchmarking and Innovative Solutions

  • 3.1 L3 AI SoC (Cockpit): Performance Comparison between Typical Products
  • L3 AI Cockpit SoC Products and Benchmarking (1)
  • L3 AI Cockpit SoC Products and Benchmarking (2)
  • L3 AI Cockpit SoC Products and Benchmarking (3)
  • L3 AI Cockpit SoC Products and Benchmarking (4)
  • L3 AI Cockpit SoC Products and Benchmarking (5)
  • 3.2 L3 AI SoC (Advanced Cockpit-Driving Integration): Performance Comparison between Typical Products
  • L3 Advanced Cockpit-Driving Integration SoC Products and Benchmarking (1)
  • L3 Advanced Cockpit-Driving Integration SoC Products and Benchmarking (2)
  • L3 Advanced Cockpit-Driving Integration SoC Products and Benchmarking (6)
  • 3.3 L2 SoC (Cockpit): Performance Comparison between Typical Products
  • L2 Intelligent Cockpit SoC Products and Benchmarking (1)
  • L2 Intelligent Cockpit SoC Products and Benchmarking (2)
  • L2 Intelligent Cockpit SoC Products and Benchmarking (9)
  • L2 Intelligent Cockpit SoC Products and Benchmarking (10)
  • 3.4 L2 SoC (Intermediate Cockpit-Driving Integration): Performance Comparison between Typical Products
  • L2 Intermediate Cockpit-Driving Integration SoC Products and Benchmarking (1)
  • L2 Intermediate Cockpit-Driving Integration SoC Products and Benchmarking (2)
  • L2 Intermediate Cockpit-Driving Integration SoC Products and Benchmarking (3)
  • L2 Intermediate Cockpit-Driving Integration SoC Products and Benchmarking (4)
  • 3.5 Innovative Cockpit SoC Solutions: How to Meet On-Device AI Foundation Model Deployment?
  • On-Device AI Deployment in Vehicles: System Framework
  • On-Device AI Deployment in Vehicles: Outlook for AI Application in Vehicle Intelligence
  • On-Device AI Deployment in Vehicles: Platform Capabilities Required for AI Application in Vehicles
  • OEMs Accelerate On-Device AI Deployment: BYD's Xuanji Intelligent Architecture
  • OEMs Accelerate On-Device AI Deployment: NIO (1)
  • OEMs Accelerate On-Device AI Deployment: NIO (2)
  • OEMs Accelerate On-Device AI Deployment: Li Auto
  • OEMs Accelerate On-Device AI Deployment: GAC (1)
  • OEMs Accelerate On-Device AI Deployment: GAC (2)
  • OEMs Accelerate On-Device AI Deployment: GAC (3)
  • OEMs Accelerate On-Device AI Deployment: Geely (1)
  • OEMs Accelerate On-Device AI Deployment: Geely (2)
  • OEMs Accelerate On-Device AI Deployment: Geely (3)
  • Cockpit On-Device AI Deployment: Foundation Model Compression for Deployment in Vehicles, Enabling "Device-Cloud" Integration
  • Cockpit On-Device AI Deployment: Emergence of Cross-Domain SoCs, Accelerating Performance Iteration
  • Cockpit AI Deployment in Vehicles: Cockpits Have Great Demand for NAND Flash in
  • Cockpit AI Deployment in Vehicles: Cockpits Will Introduce UFS 4.0 Standard
  • Cockpit SoC: Performance Parameters and Supported DRAM Memory Bandwidth (1)
  • Cockpit SoC: Performance Parameters and Supported DRAM Memory Bandwidth (2)
  • Cockpit SoC: Performance Parameters and Supported DRAM Memory Bandwidth (3)
  • Cockpit SoC: Performance Parameters and Supported DRAM Memory Bandwidth (4)
  • 3.6 Innovative Cockpit SoC Solutions: Cockpit-Driving Integration and Mechatronics
  • Intelligent Cockpits Evolve Toward Cockpit-Driving Integration, Posing New Challenges to Cockpit SoCs (1)
  • Intelligent Cockpits Evolve Toward Cockpit-Driving Integration, Posing New Challenges to Cockpit SoCs (2)
  • Next-Gen Cockpit Architecture: Cross-Domain Integration and Mechatronics (1)
  • Next-Gen Cockpit Architecture: Cross-Domain Integration and Mechatronics (2)
  • Next-Gen Cockpit Architecture: Cross-Domain Integration and Mechatronics (3)
  • Next-Gen Cockpit Architecture: Cross-Domain Integration and Mechatronics (4)
  • 3.7 Innovative Cockpit SoC Solutions: Does A Single Vehicle Require Multiple Cockpit SoCs?
  • Summary of Vehicle Models Equipped with Multiple Cockpit SoCs
  • Logic of Configuring Multiple Cockpit SoCs
  • 3.8 Innovative Cockpit SoC Solutions: SIP Module Packaging and Integration Trends
  • Some High-Performance Cockpit SoC Products Integrated with 5G Modem
  • Cockpit SoC SIP Module Packaging and Integration Trends (1)
  • Cockpit SoC SIP Module Packaging and Integration Trends (2)
  • 3.9 Innovative Cockpit SoC Solutions: Chiplet
  • Summary of Chiplet Application in High-Performance Cockpit SoCs (1)
  • Summary of Chiplet Application in High-Performance Cockpit SoCs (5)

4 Overseas Cockpit SoC Vendors

  • 4.1 Qualcomm
  • Development Process of Intelligent Cockpit SoC
  • Automotive Grade - Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (1)
  • Automotive Grade - Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (2)
  • Automotive Grade - Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (1)
  • Automotive Grade - Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (2)
  • Automotive Grade - Detailed Performance Parameter Comparison 3 between Intelligent Cockpit SoCs (1)
  • Automotive Grade - Detailed Performance Parameter Comparison 3 between Intelligent Cockpit SoCs (2)
  • Consumer Grade - Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (1)
  • Consumer Grade - Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (2)
  • Consumer Grade - Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (1)
  • Consumer Grade - Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (2)
  • gen5 Cockpit SoC (1)
  • gen5 Cockpit SoC (2)
  • gen5 Cockpit SoC (3)
  • gen4 Cockpit SoC (1)
  • gen4 Cockpit SoC (2)
  • gen3 Cockpit SoC (1)
  • gen3 Cockpit SoC (2)
  • Cockpit-Driving Integration (Ride Flex) SoC (1)
  • Cockpit-Driving Integration (Ride Flex) SoC (2)
  • Cockpit-Driving Integration (Ride Flex) SoC (3)
  • Cockpit-Driving Integration (Ride Flex) SoC (4)
  • Consumer Grade Cockpit SoCs (1)
  • Consumer Grade Cockpit SoCs (2)
  • Consumer Grade Cockpit SoCs (3)
  • Cockpit Platform Ecosystem (1)
  • Cockpit Platform Ecosystem (5)
  • 4.2 AMD
  • Intelligent Cockpit SoC Layout Roadmap
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (2)
  • AI Cockpit SoC 1
  • AI Cockpit SoCs (1)
  • AI Cockpit SoCs (2)
  • Intelligent Cockpit SoC Solutions (1)
  • Intelligent Cockpit SoC Solutions (2)
  • Intelligent Cockpit SoC 2
  • 4.3 Renesas
  • Chip Business
  • R-CAR Product Roadmap
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (2)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (2)
  • Multi-Domain Fusion SoCs (1)
  • Multi-Domain Fusion SoCs (2)
  • Multi-Domain Fusion SoC Planning
  • Intelligent Cockpit SoCs (1)
  • Intelligent Cockpit SoCs (2)
  • Intelligent Cockpit SoC Solutions (1)
  • Intelligent Cockpit SoC Solutions (2)
  • Intelligent Cockpit SoC Solutions (3)
  • Intelligent Cockpit SoC Solutions (4)
  • 4.4 Intel
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (2)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (2)
  • Cockpit Processor Layout
  • Cockpit-Driving Integration SoC
  • gen2 AI Cockpit SoC
  • gen1 AI Cockpit SoC (1)
  • gen1 AI Cockpit SoC (5)
  • Cockpit AI GPU (1)
  • Cockpit AI GPU (2)
  • Intelligent Cockpit SoCs
  • Latest Dynamics in Cockpit
  • 4.5 Samsung
  • Intelligent Cockpit SoCs: Exynos Auto Series
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (2)
  • AI Cockpit SoCs
  • Intelligent Cockpit SoCs (1)
  • Intelligent Cockpit SoCs (2)
  • 4.6 Nvidia
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (2)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (2)
  • Development History of Intelligent Cockpit SoC
  • Cockpit-Parking Integration SoC
  • Intelligent Cockpit SoCs
  • Intelligent Cockpit SoC Solutions
  • Latest Dynamics in Cockpit
  • 4.7 NXP
  • Intelligent Cockpit SoC Roadmap
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (2)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (2)
  • Intelligent Cockpit SoC 1
  • Intelligent Cockpit SoCs (1)
  • Intelligent Cockpit SoCs (5)
  • Intelligent Cockpit SoCs (1)
  • Intelligent Cockpit SoCs (2)
  • Intelligent Cockpit SoCs (3)
  • i.MX 9 Series Solutions (1)
  • i.MX 9 Series Solutions (2)
  • Intelligent Cockpit SoC 2
  • Intelligent Cockpit SoCs (1)
  • Intelligent Cockpit SoCs (2)
  • Operating Systems Supported by i.MX Series Cockpit SoC
  • AI Algorithms Supported by i.MX Series Cockpit SoC
  • i.MX Series Cockpit SoC Products and Future Cockpit Systems (1)
  • i.MX Series Cockpit SoC Products and Future Cockpit Systems (2)
  • 4.8 Telechips
  • Chip Business: Target Mid- and Low-End Products and LCD Clusters
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (2)
  • Intelligent Cockpit SoC 1
  • Intelligent Cockpit SoC Solutions
  • High Performance Intelligent Cockpit SoC
  • Intelligent Cockpit SoC 2
  • Intelligent Cockpit SoC Solutions (1)
  • Intelligent Cockpit SoC Solutions (2)
  • Intelligent Cockpit SoC 3
  • Intelligent Cockpit SoC Solutions (1)
  • Intelligent Cockpit SoC Solutions (5)
  • 4.9 TI
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (2)
  • Intelligent Cockpit SoCs (1)
  • Intelligent Cockpit SoCs (2)
  • Cockpit-Driving Integration Intelligent Cockpit SoCs (1)
  • Cockpit-Driving Integration Intelligent Cockpit SoCs (2)
  • Jacinto 7 Platform (1)
  • Jacinto 7 Platform (2)
  • Intelligent Cockpit SoCs (1)
  • Intelligent Cockpit SoCs (2)

5 Chinese Cockpit SoC Vendors

  • 5.1 SemiDrive
  • Automotive Grade Chip Business
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (2)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (2)
  • AI Cockpit SoCs (1)
  • AI Cockpit SoCs (2)
  • Intelligent Cockpit SoC 1 (1)
  • Intelligent Cockpit SoC 1 (2)
  • Intelligent Cockpit SoC 2
  • Intelligent Cockpit SoC Solutions
  • Intelligent Cockpit SoC 3
  • Intelligent Cockpit SoC Solutions
  • Flagship Intelligent Cockpit SoC
  • Intelligent Cockpit SoC Solutions (1)
  • Intelligent Cockpit SoC Solutions (2)
  • Intelligent Cockpit SoC Solutions (3)
  • Cockpit-Driving Integration Intelligent Cockpit SoC
  • Intelligent Cockpit SoC Solutions (1)
  • Intelligent Cockpit SoC Solutions (2)
  • Cooperation Model (1)
  • Cooperation Model (2)
  • 5.2 SiEngine
  • Automotive Grade Chip Business
  • Intelligent Cockpit SoC Series Product Roadmap
  • Intelligent Cockpit SoC Development Planning
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (2)
  • Intelligent Cockpit SoCs (1)
  • Intelligent Cockpit SoCs (2)
  • Intelligent Cockpit SoCs (3)
  • Intelligent Cockpit SoC Solutions: High-end Cockpit Solution
  • Intelligent Cockpit SoC Solutions: Flagship Cockpit Solution
  • Intelligent Cockpit SoC Solutions: Single-chip Cockpit-Parking Integration Solution
  • Intelligent Cockpit SoC Solutions: Cockpit-Driving Integration Solution
  • 5.3 Huawei HiSilicon
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (2)
  • Cockpit-Driving Integration Intelligent Cockpit SoC
  • Intelligent Cockpit SoCs (1)
  • Intelligent Cockpit SoCs (2)
  • Intelligent Cockpit SoC
  • 5.4 MediaTek
  • Intelligent Cockpit SoC Development Planning
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (2)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (2)
  • Detailed Performance Parameter Comparison 3 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 3 between Intelligent Cockpit SoCs (2)
  • Detailed Performance Parameter Comparison 4 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 4 between Intelligent Cockpit SoCs (2)
  • AI Cockpit SoCs (1)
  • AI Cockpit SoCs (2)
  • Co-create Intelligent Cockpit Chips to Deploy the High-end Market
  • Automotive Solutions
  • Intelligent Cockpit SoC 1 (1)
  • Intelligent Cockpit SoC 1 (2)
  • Intelligent Cockpit SoC 1 (3)
  • Intelligent Cockpit SoC 2 (1)
  • Intelligent Cockpit SoC 2 (2)
  • Intelligent Cockpit SoC 2 (3)
  • Intelligent Cockpit Solutions
  • Intelligent Cockpit SoC 3 (1)
  • Intelligent Cockpit SoC 3 (2)
  • Intelligent Cockpit Solutions
  • Intelligent Cockpit SoC 4
  • Intelligent Cockpit Solutions
  • Cockpit Intelligent SoC with Built-in Self-developed APU (1)
  • Cockpit Intelligent SoC with Built-in Self-developed APU (2)
  • 5.5 AutoChips
  • Intelligent Cockpit SoC Development History
  • Intelligent Cockpit SoC Product Matrix
  • Intelligent Cockpit SoC Development Plan
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (2)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (2)
  • Intelligent Cockpit SoC 1 (1)
  • Intelligent Cockpit SoC 1 (2)
  • Intelligent Cockpit SoC Solutions
  • Cockpit-Driving-Parking Integration Intelligent Cockpit SoC
  • Intelligent Cockpit SoC 2 (1)
  • Intelligent Cockpit SoC 2 (2)
  • Intelligent Cockpit SoC 3 (1)
  • Intelligent Cockpit SoC 3 (2)
  • Intelligent Cockpit SoC Solutions (1)
  • Intelligent Cockpit SoC Solutions (2)
  • Intelligent Cockpit SoC Solutions (3)
  • Intelligent Cockpit SoC Solutions (4)
  • Partners and Customers
  • 5.6 Rockchip
  • Business
  • Vehicle Solution Application: Passenger Car Series
  • Vehicle Solution Application: Commercial Vehicle Series
  • Intelligent Cockpit SoC Evolution
  • Intelligent Cockpit SoC: Advantages of Self-development of IPs
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 1 between Intelligent Cockpit SoCs (2)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison 2 between Intelligent Cockpit SoCs (2)
  • Flagship AI Cockpit SoC
  • Intelligent Cockpit SoC 1
  • Intelligent Cockpit SoC Solutions (1)
  • Intelligent Cockpit SoC Solutions (2)
  • Intelligent Cockpit SoC Solutions (3)
  • Intelligent Cockpit SoC 2
  • Intelligent Cockpit SoC Solutions
  • Intelligent Cockpit SoC 3
  • Intelligent Cockpit SoC 4
  • 5.7 UNISOC
  • Business
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (2)
  • Flagship Intelligent Cockpit SoC
  • Intelligent Cockpit SoC 1
  • Intelligent Cockpit SoC Solutions
  • Intelligent Cockpit SoC 2 (1)
  • Intelligent Cockpit SoC 2 (2)
  • Intelligent Cockpit SoC Solutions
  • 5.8 Arkmicro Technologies
  • Business
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (1)
  • Detailed Performance Parameter Comparison between Intelligent Cockpit SoCs (2)
  • Intelligent Cockpit SoC: Main Control Chip Series
  • Intelligent Cockpit SoC 1
  • Intelligent Cockpit SoC Solutions
  • Intelligent Cockpit SoC 2
  • Intelligent Cockpit SoC Solutions

6 Cockpit SoC Deployment Strategy of OEMs

  • 6.1 BYD
  • Brands
  • DiLink Cockpit Chip Planning
  • Cockpit-Driving Integration Chip Planning
  • Intelligent Cockpit System
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • AI Cockpit Deployment (3)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform) (1)
  • Cockpit SoC Installation (by Vehicle Model Platform) (2)
  • Denza Brand: Application of Cockpit SoC (2023-2024)
  • Yangwang Brand: Application of Cockpit SoC (2023-2024)
  • Fangchengbao Brand: Application of Cockpit SoC (2023-2024)
  • Ocean and Dynasty Brands: Application of Cockpit SoC (2023-2024)
  • 6.2 Great Wall Motor
  • Intelligent Cockpit System Overall Planning
  • Intelligent Cockpit System Development History
  • Intelligent Cockpit System 3.0 (1)
  • Intelligent Cockpit System 3.0 (2)
  • Intelligent Cockpit System 2.0 (1)
  • Intelligent Cockpit System 2.0 (2)
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • ORA Brand: Application of Cockpit SoC (2023-2024)
  • TANK Brand: Application of Cockpit SoC (2023-2024)
  • WEY and Haval Brands: Application of Cockpit SoC (2023-2024)
  • 6.3 GAC
  • GAC Motor's X-Soul Architecture: Autonomous Driving, Digital Cockpit and V2X Software and Hardware System
  • GAC Motor's Intelligent Cockpit System Development History
  • GAC Motor's Intelligent Cockpit Deployment
  • GAC Motor's AI Cockpit Deployment (1)
  • GAC Motor's AI Cockpit Deployment (2)
  • GAC Motor's AI Cockpit Deployment (3)
  • GAC Motor's AI Cockpit Deployment (4)
  • GAC Motor's Cockpit SoC Installation (by Vehicle Model Platform)
  • AION Brand: Application of Cockpit SoC (2023-2024)
  • Hyptec Brand: Application of Cockpit SoC (2023-2024)
  • Trumpchi Brand: Application of Cockpit SoC (2023-2024)
  • 6.4 Changan
  • Intelligent Cockpit Chip Layout
  • Intelligent Cockpit Chip Deployment
  • Intelligent Cockpit System 1
  • Intelligent Cockpit System 2
  • Cockpit-Driving Integration Intelligent Cockpit Deployment
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • AI Cockpit Deployment (3)
  • AI Cockpit Deployment (4)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform) (1)
  • Cockpit SoC Installation (by Vehicle Model Platform) (2)
  • Avatr Brand: Application of Cockpit SoC (2023-2024)
  • Deepal Brand: Application of Cockpit SoC (2023-2024)
  • NEVO Brand: Application of Cockpit SoC (2023-2024)
  • 6.5 SAIC
  • Intelligent Cockpit Chip Layout
  • Intelligent Cockpit System 1
  • Intelligent Cockpit System 2
  • Intelligent Cockpit System 3 (1)
  • Intelligent Cockpit System 3 (2)
  • Intelligent Cockpit System 4
  • Cockpit-Driving Integration Intelligent Cockpit (1)
  • Cockpit-Driving Integration Intelligent Cockpit (2)
  • Cockpit-Driving Integration Intelligent Cockpit (3)
  • Cockpit-Driving Integration Intelligent Cockpit (4)
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform) (1)
  • Cockpit SoC Installation (by Vehicle Model Platform) (2)
  • Cockpit SoC Installation (by Vehicle Model Platform) (3)
  • IM Brand: Application of Cockpit SoC (2023-2024)
  • Rising Brand: Application of Cockpit SoC (2023-2024)
  • SAIC MGB rand: Application of Cockpit SoC (2023-2024)
  • Maxus Brand: Application of Cockpit SoC (2023-2024)
  • Roewe Brand: Application of Cockpit SoC (2023-2024)
  • 6.6 Geely
  • Intelligent Cockpit Layout
  • Intelligent Cockpit
  • Intelligent Cockpit System 1
  • Intelligent Cockpit System 2
  • Intelligent Cockpit SoC Planning
  • Intelligent Cockpit SoC 1
  • Intelligent Cockpit SoC2
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform) (1)
  • Cockpit SoC Installation (by Vehicle Model Platform) (2)
  • Cockpit SoC Installation (by Vehicle Model Platform) (3)
  • Zeekr Brand: Application of Cockpit SoC (2023-2024)
  • Smart and GEOME Brands: Application of Cockpit SoC (2023-2024)
  • Galaxy Brand: Application of Cockpit SoC (2023-2024)
  • Lynk & Co Brand: Application of Cockpit SoC (2023-2024)
  • Livan Brand: Application of Cockpit SoC (2023-2024)
  • 6.7 BAIC
  • Intelligent Cockpit Layout
  • Intelligent Cockpit Chip
  • Intelligent Cockpit System
  • Intelligent Cockpit Deployment
  • AIAI Cockpit System Deployment (1)
  • AIAI Cockpit System Deployment (2)
  • AIAI Cockpit System Deployment (3)
  • AIAI Cockpit System Deployment (4)
  • BAIC's Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • BAIC's Cockpit SoC Installation (by Vehicle Model Platform)
  • ARCFOX Brand: Application of Cockpit SoC (2023-2024)
  • BEIJING Brand: Application of Cockpit SoC (2023-2024)
  • BAIC's Brands: Application of Cockpit SoC (2023-2024)
  • 6.8 FAW
  • Intelligent Cockpit Chip Planning
  • Intelligent Cockpit Chips
  • Intelligent Cockpit System 1 (1)
  • Intelligent Cockpit System 2 (2)
  • Intelligent Cockpit System 3
  • Intelligent Cockpit System 4
  • Intelligent Cockpit Deployment
  • Cockpit-Driving Integration Intelligent Cockpit
  • Cockpit-Driving Integration Intelligent Cockpit (1)
  • Cockpit-Driving Integration Intelligent Cockpit (2)
  • Cockpit-Driving Integration Intelligent Cockpit (3)
  • AI Cockpit Deployment
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • FAW Hongqi Brand: Application of Cockpit SoC (2023-2024)
  • FAW Bestune Brand: Application of Cockpit SoC (2023-2024)
  • 6.9 Chery
  • Brands
  • Intelligent Cockpit Chip Configuration
  • Intelligent Cockpit Chip
  • Intelligent Cockpit System 1 (1)
  • Intelligent Cockpit System 1 (2)
  • Intelligent Cockpit System 1 (3)
  • Intelligent Cockpit System 2
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform) (1)
  • Cockpit SoC Installation (by Vehicle Model Platform) (2)
  • Luxeed and iCAR Brands: Application of Cockpit SoC (2023-2024)
  • EXEED Brand: Application of Cockpit SoC (2023-2024)
  • New Energy Brand: Application of Cockpit SoC (2023-2024)
  • Kaiyi Brand: Application of Cockpit SoC (2023-2024)
  • JETOUR Brand: Application of Cockpit SoC (2023-2024)
  • Chery's Brands: Application of Cockpit SoC (2023-2024)
  • 6.10 Dongfeng Motor
  • Intelligent Cockpit Chip (1)
  • Intelligent Cockpit Chip (2)
  • Intelligent Cockpit System 1
  • Intelligent Cockpit System 2
  • Cockpit-Driving Integration Intelligent Cockpit Deployment (1)
  • Cockpit-Driving Integration Intelligent Cockpit Deployment (2)
  • Cockpit-Driving Integration Intelligent Cockpit Deployment (3)
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • Voyah Brand: Application of Cockpit SoC (2023-2024)
  • Forthing Brand: Application of Cockpit SoC (2023-2024)
  • Aeolus Brand: Application of Cockpit SoC (2023-2024)
  • 6.11 Li Auto
  • Intelligent Cockpit Chip Planning
  • Intelligent Cockpit System 1
  • Intelligent Cockpit System 2
  • Cockpit-Driving Integration Intelligent Cockpit Deployment
  • Intelligent Cockpit System 1
  • Intelligent Cockpit System 2 (1)
  • Intelligent Cockpit System 2 (2)
  • Intelligent Cockpit System 2 (3)
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • Application of Cockpit SoC (2023-2024)
  • 6.12 NIO
  • Intelligent Cockpit Chip Configuration
  • Intelligent Cockpit System Development Route
  • Intelligent Cockpit Deployment
  • Intelligent Cockpit System (1)
  • Intelligent Cockpit System (6)
  • Intelligent Cockpit Chip
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • Application of Cockpit SoC (2023-2024)
  • 6.13 Xpeng
  • Intelligent Cockpit Chip Configuration
  • Intelligent Cockpit AI Chip (1)
  • Intelligent Cockpit AI Chip (2)
  • Intelligent Cockpit AI Chip (3)
  • Intelligent Cockpit System Iteration
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • Application of Cockpit SoC (2023-2024)
  • 6.14 Leapmotor
  • Intelligent Cockpit Chip Configuration
  • Intelligent Cockpit System
  • Intelligent Cockpit 1 (1)
  • Intelligent Cockpit 1 (2)
  • Intelligent Cockpit 2 (1)
  • Intelligent Cockpit 2 (2)
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • AI Cockpit Deployment (3)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • Application of Cockpit SoC (2023-2024)
  • 6.15 Xiaomi Auto
  • Intelligent Cockpit
  • Intelligent Cockpit Deployment (1)
  • Intelligent Cockpit Deployment (2)
  • Intelligent Cockpit System
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • 6.16 Tesla
  • Intelligent Cockpit: Platform Evolution
  • Intelligent Cockpit (1)
  • Intelligent Cockpit (2)
  • Intelligent Cockpit System: Software Evolution Path
  • Intelligent Cockpit System
  • AI Cockpit Deployment
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • Application of Cockpit SoC (2023-2024)
  • 6.17 BMW
  • Intelligent Cockpit Planning (1)
  • Intelligent Cockpit Planning (2)
  • Intelligent Cockpit System (1)
  • Intelligent Cockpit System (2)
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • AI Cockpit Deployment (3)
  • AI Cockpit Deployment (4)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • Application of Cockpit SoC (2023-2024)
  • 6.18 Volkswagen
  • Intelligent Cockpit System: Software Evolution Path
  • Intelligent Cockpit System 1 (1)
  • Intelligent Cockpit System 1 (2)
  • Intelligent Cockpit System 1 (3)
  • Intelligent Cockpit System 2
  • Intelligent Cockpit System 3 (1)
  • Intelligent Cockpit System 3 (2)
  • Intelligent Cockpit (1)
  • Intelligent Cockpit (2)
  • Intelligent Cockpit (3)
  • Intelligent Cockpit (4)
  • Intelligent Cockpit Deployment
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • Application of Cockpit SoC (2023-2024)
  • 6.19 Audi
  • Intelligent Cockpit System: Software Evolution Path
  • Intelligent Cockpit
  • Intelligent Cockpit System
  • AI Cockpit Deployment
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • Audi Brand: Application of Cockpit SoC (2023-2024)
  • 6.20 Daimler Mercedes-Benz
  • Intelligent Cockpit System: Software Evolution
  • Intelligent Cockpit System (1)
  • Intelligent Cockpit System (2)
  • Intelligent Cockpit: Platform Evolution
  • Intelligent Cockpit (1)
  • Intelligent Cockpit (2)
  • AI Cockpit Deployment (1)
  • AI Cockpit Deployment (2)
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • Beijing Benz Brand: Application of Cockpit SoC (2023-2024)
  • 6.21 Toyota
  • Intelligent Cockpit 1
  • Intelligent Cockpit 2
  • Intelligent Cockpit Deployment
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • Application of Cockpit SoC (2023-2024)
  • 6.22 Honda
  • Intelligent Cockpit: Platform Evolution
  • Intelligent Cockpit (1)
  • Intelligent Cockpit (2)
  • Intelligent Cockpit System
  • AI Cockpit Deployment
  • Planning and Vehicle Model Orientation (by Vehicle Model Platform)
  • Cockpit SoC Installation (by Vehicle Model Platform)
  • Application of Cockpit SoC (2023-2024)