ウエハグラインダーの世界市場（2025年～2035年）

ウエハグラインダーの市場規模は、2024年の7億1,000万米ドルから2035年には12億3,500万米ドルに達すると予測され、予測期間（2025年～2035年）のCAGRは5.9％になるとみられています。スマートフォンやIoT機器など、小型で高性能な電子機器の需要により、半導体ウエハの薄型化が求められています。この規格に対応するためには、半導体技術の進歩とウエハ研磨技術の高度化が不可欠です。5GとIoT用途の成長、自動車と航空宇宙産業の拡大、持続可能性とエネルギー効率への関心の高まりは、さらに精密ウエハ研削ソリューションの需要を促進しています。環境に優しい生産をサポートするウエハグラインダーが人気を集めています。

電子機器、5G技術、IoTの台頭は、高性能半導体への需要を大幅に押し上げ、ウエハグラインダー市場も押し上げています。半導体産業協会によると、2024年3月の世界半導体売上高は5,270億米ドルに回復し、約1兆個が販売されました。2024年には毎年2桁成長を遂げ、高い収益性が期待されています。その需要は、投資の増加と高い収益性の両方によって増強されています。半導体製造の民間投資は、CHIPSと科学法の後、事前にコミットされています。米国はCHIPSの制定以来、過去10年間で半導体製造能力を3倍に増加させ、世界全体の設備投資の28％を取り込んでいます。

先端技術統合は、ウエハの薄片化精度と生産スケーラビリティを高めるために、研削ユニットとプラットフォームを組み合わせることを含みます。例えば、Tokyo Electronは2023年11月、300mmウエハ薄化装置「Ulucus G」を発売しました。これは、研削とLITHIUS Pro Zプラットフォームを組み合わせたもので、より高品質なシリコンウエハをより少ない労力で量産することに主眼を置いています。スクラブ洗浄ユニット、スピンウェットエッチングユニット、枚葉処理ユニットを内蔵しています。

当レポートでは、世界のウエハグラインダー市場について調査し、市場の概要とともに、タイプ別、用途別、地域別の動向、および市場に参入する企業のプロファイルなどを提供しています。

目次

第1章 報告書のサマリー

第2章 市場概要と洞察

第3章 市場の決定要因

• 市場促進要因
• 市場の問題点と課題
• 市場機会

第4章 競合情勢

• 競合ダッシュボード-ウエハグラインダー市場の収益とメーカー別シェア
• ウエハグラインダー製品比較分析
• 市場の主要参入企業のランキングマトリックス
• 主要企業分析
  • DISCO Corp.
  • Applied Materials, Inc.
  • Ebara Corp.
  • Tokyo Electron Ltd.
• 市場参入企業による主な成功戦略
  • 合併と買収
  • 製品発売
  • パートナーシップとコラボレーション

第5章 世界のウエハグラインダー市場（100万米ドル）、タイプ別

• ウエハ表面研削盤
• ウエハエッジグラインダー

第6章 世界のウエハグラインダー市場（100万米ドル）、用途別

• シリコンウエハ
• SiCウエハ
• サファイアウエハ
• 化合物半導体

第7章 地域分析

• 北米
• 欧州
• アジア太平洋
• その他の地域

第8章 企業プロファイル

• Applied Materials, Inc.
• Chevalier Machinery, Inc.
• Daitron Inc.
• Datensicherheit Nord GmbH
• Ebara Corp.
• Engis Corp.
• G&N GmbH
• JTEKT Corp.
• JOEN LIH MACHINERY CO., LTD.
• KINIK Co.
• Koyo Machinery
• Kulicke and Soffa Industries, Inc.
• Logitech Ltd.
• Okamoto Machine Tool Works, Ltd.
• Qingdao Gaoce Technology Co., Ltd.
• Revasum
• S3-Alliance
• SpeedFam Co. Ltd.
• Tokyo Electron Ltd.
• Tokyo Seimitsu Co., Ltd.
• WAIDA MFG. Co., Ltd.

LIST OF TABLES

• 1. Global Wafer Grinder Market Research and Analysis Type, 2024-2035 ($ Million)
• 2. Global Wafer Surface Grinder Market Research and Analysis by Region, 2024-2035 ($ Million)
• 3. Global Wafer Edge Grinder Market Research and Analysis by Region, 2024-2035 ($ Million)
• 4. Global Wafer Grinder Market Research and Analysis by Application, 2024-2035 ($ Million)
• 5. Global Wafer Grinder for Silicon Wafer Market Research and Analysis by Region, 2024-2035 ($ Million)
• 6. Global Wafer Grinder for SiC Wafer Market Research and Analysis by Region, 2024-2035 ($ Million)
• 7. Global Wafer Grinder for Sapphire Wafer Market Research and Analysis by Region, 2024-2035 ($ Million)
• 8. Global Wafer Grinder for Compound Semiconductors Market Research and Analysis by Region, 2024-2035 ($ Million)
• 9. Global Wafer Grinder Market Research and Analysis by Region, 2024-2035 ($ Million)
• 10. North American Wafer Grinder Market Research and Analysis by Country, 2024-2035 ($ Million)
• 11. North American Wafer Grinder Market Research and Analysis Type, 2024-2035 ($ Million)
• 12. North American Wafer Grinder Market Research and Analysis by Application, 2024-2035 ($ Million)
• 13. European Wafer Grinder Market Research and Analysis by Country, 2024-2035 ($ Million)
• 14. European Wafer Grinder Market Research and Analysis Type, 2024-2035 ($ Million)
• 15. European Wafer Grinder Market Research and Analysis by Application, 2024-2035 ($ Million)
• 16. Asia-Pacific Wafer Grinder Market Research and Analysis by Country, 2024-2035 ($ Million)
• 17. Asia-Pacific Wafer Grinder Market Research and Analysis Type, 2024-2035 ($ Million)
• 18. Asia-Pacific Wafer Grinder Market Research and Analysis by Application, 2024-2035 ($ Million)
• 19. Rest Of the World Wafer Grinder Market Research and Analysis by Region, 2024-2035 ($ Million)
• 20. Rest Of the World Wafer Grinder Market Research and Analysis Type, 2024-2035 ($ Million)
• 21. Rest Of the World Wafer Grinder Market Research and Analysis by Application, 2024-2035 ($ Million)

LIST OF FIGURES

• 1. Global Wafer Grinder Market Share Type, 2024 Vs 2035 (%)
• 2. Global Wafer Surface Grinder Market Share by Region, 2024 Vs 2035 (%)
• 3. Global Wafer Edge Grinder Market Share by Region, 2024 Vs 2035 (%)
• 4. Global Wafer Grinder Market Share by Application, 2024 Vs 2035 (%)
• 5. Global Electric Outboard Engine for Silicon Wafer Market Share by Region, 2024 Vs 2035 (%)
• 6. Global Wafer Grinder for SiC Wafer Market Share by Region, 2024 Vs 2035 (%)
• 7. Global Wafer Grinder for Sapphire Wafer Market Share by Region, 2024 Vs 2035 (%)
• 8. Global Wafer Grinder for Compound Semiconductors Market Share by Region, 2024 Vs 2035 (%)
• 9. Global Wafer Grinder Market Share by Region, 2024 Vs 2035 (%)
• 10. US Wafer Grinder Market Size, 2024-2035 ($ Million)
• 11. Canada Wafer Grinder Market Size, 2024-2035 ($ Million)
• 12. UK Wafer Grinder Market Size, 2024-2035 ($ Million)
• 13. France Wafer Grinder Market Size, 2024-2035 ($ Million)
• 14. Germany Wafer Grinder Market Size, 2024-2035 ($ Million)
• 15. Italy Wafer Grinder Market Size, 2024-2035 ($ Million)
• 16. Spain Wafer Grinder Market Size, 2024-2035 ($ Million)
• 17. Russia Wafer Grinder Market Size, 2024-2035 ($ Million)
• 18. Rest Of Europe Wafer Grinder Market Size, 2024-2035 ($ Million)
• 19. India Wafer Grinder Market Size, 2024-2035 ($ Million)
• 20. China Wafer Grinder Market Size, 2024-2035 ($ Million)
• 21. Japan Wafer Grinder Market Size, 2024-2035 ($ Million)
• 22. South Korea Wafer Grinder Market Size, 2024-2035 ($ Million)
• 23. ASEAN Silicon Carbide Fibers Market Size, 2024-2035 ($ Million)
• 24. Australia and New Zealand Silicon Carbide Fibers Market Size, 2024-2035 ($ Million)
• 25. Rest Of Asia-Pacific Wafer Grinder Market Size, 2024-2035 ($ Million)
• 26. Latin America Wafer Grinder Market Size, 2024-2035 ($ Million)
• 27. Middle East and Africa Wafer Grinder Market Size, 2024-2035 ($ Million)

Wafer Grinder Market Size, Share & Trends Analysis Report by Type (Wafer Surface Grinder, and Wafer Edge Grinder), and by Application (Silicon Wafer, SiC Wafer, Sapphire Wafer, and Compound Semiconductors) Forecast Period (2024-2031)

Industry Overview

Wafer grinder market is projected to reach $1,235 million in 2035, from $710 million in 2024, witnessing a CAGR of 5.9% during the forecast period (2025-2035). The demand for compact, high-performance electronics, such as smartphones and IoT devices, necessitates thinner semiconductor wafers. Advancements in semiconductor technology and advanced wafer grinding technologies are essential for meeting the standards. The growth of 5G and IoT applications, expansion in automotive and aerospace industries, and a growing focus on sustainability and energy efficiency are additionally driving the demand for precision wafer grinding solutions. Wafer grinders that support eco-friendly production are gaining traction.

Market Dynamics

Rising Demand for Semiconductors

The rise in electronic devices, 5G technology, and IoT applications has significantly boosted the demand for high-performance semiconductors, and thus the market for wafer-grinding equipment. According to the Semiconductor Industry Association, in March 2024, global semiconductor sales rebounded to $527 billion, with nearly 1 trillion sold. It is expected the high profitability bodes well with double-digit growth annually in the year 2024. Its demand is augmented by both increased investment and high profitability. The semiconductor manufacturing private investments have been committed in advance after the CHIPS and Science Act. The US increased its semiconductor manufacturing capacity by tripling in just the last ten years since the enactment of CHIPS and taking in 28% of the entire global capital spending.

Advanced Technology Integration

Advanced technology integration involves combining grinding units with platforms to enhance wafer thinning precision and production scalability. For instance, in November 2023, Tokyo Electron launched Ulucus G, a 300mm wafer thinning system. It combines grinding with the LITHIUS Pro Z platform, with a focus on the production of higher-quality silicon wafers using less labor in mass production. It incorporates a scrub cleaning unit, spin wet etch unit, and single-wafer processing units.

Market Segmentation

• Based on the type, the market is segmented into wafer surface grinders and wafer edge grinders.
• Based on the application, the market is segmented into silicon wafers, SiC wafers, sapphire wafers, and compound semiconductors.

The Silicon Wafer segment is projected to Hold the Largest Market Share

Silicon wafers are thin semiconductor-grade silicon slices utilized as the base for semiconductor devices and integrated circuits. The silicon wafer is manufactured via the process of polishing surfaces for microfabrication, slicing silicon crystals into wafers, and growing high-purity silicon crystals. Wafers are employed in microelectromechanical systems, optoelectronics, and photovoltaics, and play an important role in research and development.

Wafer Surface Grinder Segment to Hold a Considerable Market Share

Wafer surface grinders are devices that ensure wafer surfaces come out flat and smooth with minimum thickness deviation and can minimize surface roughness to adequately prepare wafers for later processes such as photolithography and etching. It usually comprises precision grinding wheels, advanced cooling systems, and can accommodate many sizes of wafers, and is used for surface planarization, reducing roughness, relieving stresses, and adhesion enhancement.

Regional Outlook

The global wafer grinder market is further segmented based on geography including North America (the US, and Canada), Europe (the UK, Germany, France, Italy, Spain, Germany, France, Russia, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, Australia and New Zealand, ASEAN Countries, and the Rest of Asia-Pacific), and the Rest of the World (the Middle East & Africa, and Latin America).

5G Technology Proliferation in the North America Region

The rapid growth of 5G technology is fostering an increase in demand for advanced semiconductors, especially precision wafer grinding for optimal device performance and energy efficiency. According to the 5G Americans, Org., in July 2024, the global adoption of 5G technology reached nearly two billion connections in Q1 2024, with 185 million new additions. North America emerges as the leader in 5G adoption with 32% of all wireless cellular connections. The region is additionally the growth driver, adding 22 million new connections to the operators' networks. Latin America showed growth in 4G LTE and 5G connections, with eight million new LTE connections and nine million new 5G connections, totaling 48 million 5G connections.

Asia-Pacific Holds Major Market Share

Asia-Pacific holds a significant share owing to the expansion of manufacturing capacity in Asia, particularly in China, Taiwan, and South Korea. According to the India Brand Equity Foundation (IBEF) by 2025, the Indian electronics manufacturing industry is anticipated to reach $520 billion, with a projected increase in demand for electronic products to $400 billion by FY25, up from $33 billion in FY20. The electronics system market is expected to grow 2.3 times from its FY19 size, reaching $160 billion by FY25. Electronic goods exports were $29.1 billion in FY24, up from $23.6 billion in FY23. The electronics design segment, growing at 20.1%, accounted for 22% of the ESDM market in FY19 and is expected to make 27% by FY25. As a major consumer electronics market in the Asia Pacific Region, India has significant expertise in electronic chip design and embedded software, aiming for $300 billion in electronics manufacturing and $120 billion in exports by 2025-26.

Market Players Outlook

The major companies serving the wafer grinder market include DISCO Corp., Ebara Corp., G&N GmbH, Infineon Technologies, Applied Material, Inc., Tokyo Electron Ltd., and others. The market players are increasingly focusing on business expansion and product development by applying strategies such as collaborations, mergers, and acquisitions to stay competitive in the market.

Recent Developments

• In July 2023, DISCO Corp. developed an optimized process using laser processing's ingot slicing method, KABRA, for the production of GaN wafers, which has increased wafer production and reduced production time.

The Report Covers:

• Market value data analysis of 2024 and forecast to 2035.
• Annualized market revenues ($ million) for each market segment.
• Country-wise analysis of major geographical regions.
• Key companies operating in the global wafer grinder market. Based on the availability of data, information related to new products, and relevant news is also available in the report.
• Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
• Analysis of market-entry and market expansion strategies.
• Competitive strategies by identifying 'who-stands-where' in the market.

Table of Contents

1. Report Summary

• Current Industry Analysis and Growth Potential Outlook
• Global Wafer Grinder Market Sales Analysis - Product Type| Offering | Application| End-User ($ Million)
• Wafer Grinder Market Sales Performance of Top Countries
• 1.1. Research Methodology
• Primary Research Approach
• Secondary Research Approach
• 1.2. Market Snapshot

2. Market Overview and Insights

• 2.1. Scope of the Study
• 2.2. Analyst Insight & Current Market Trends
  • 2.2.1. Key Wafer Grinder Industry Trends
  • 2.2.2. Market Recommendations
• 2.3. Porter's Five Forces Analysis for the Wafer Grinder Market
  • 2.3.1. Competitive Rivalry
  • 2.3.2. Threat of New Entrants
  • 2.3.3. Bargaining Power of Suppliers
  • 2.3.4. Bargaining Power of Buyers
  • 2.3.5. Threat of Substitutes

3. Market Determinants

• 3.1. Market Drivers
  • 3.1.1. Drivers For Global Wafer Grinder Market: Impact Analysis
• 3.2. Market Pain Points and Challenges
  • 3.2.1. Restraints For Global Wafer Grinder Market: Impact Analysis
• 3.3. Market Opportunities

4. Competitive Landscape

• 4.1. Competitive Dashboard - Wafer Grinder Market Revenue and Share by Manufacturers
• Wafer Grinder Product Comparison Analysis
• Top Market Player Ranking Matrix
• 4.2. Key Company Analysis
  • 4.2.1. DISCO Corp.
    • 4.2.1.1. Overview
    • 4.2.1.2. Product Portfolio
    • 4.2.1.3. Financial Analysis (Subject to Data Availability)
    • 4.2.1.4. SWOT Analysis
    • 4.2.1.5. Business Strategy
  • 4.2.2. Applied Materials, Inc.
    • 4.2.2.1. Overview
    • 4.2.2.2. Product Portfolio
    • 4.2.2.3. Financial Analysis (Subject to Data Availability)
    • 4.2.2.4. SWOT Analysis
    • 4.2.2.5. Business Strategy
    • 4.2.2.6.
  • 4.2.3. Ebara Corp.
    • 4.2.3.1. Overview
    • 4.2.3.2. Product Portfolio
    • 4.2.3.3. Financial Analysis (Subject to Data Availability)
    • 4.2.3.4. SWOT Analysis
    • 4.2.3.5. Business Strategy
  • 4.2.4. Tokyo Electron Ltd.
    • 4.2.4.1. Overview
    • 4.2.4.2. Product Portfolio
    • 4.2.4.3. Financial Analysis (Subject to Data Availability)
    • 4.2.4.4. SWOT Analysis
    • 4.2.4.5. Business Strategy
• 4.3. Top Winning Strategies by Market Players
  • 4.3.1. Merger and Acquisition
  • 4.3.2. Product Launch
  • 4.3.3. Partnership And Collaboration

5. Global Wafer Grinder Market by Type ($ Million)

• 5.1. Wafer Surface Grinder
• 5.2. Wafer Edge Grinder

6. Global Wafer Grinder Market by Application ($ Million)

• 6.1. Silicon Wafer
• 6.2. SiC Wafer
• 6.3. Sapphire Wafer
• 6.4. Compound Semiconductors

7. Regional Analysis

• 7.1. North American Wafer Grinder Market Sales Analysis -Type| Application | Country ($ Million)
• Macroeconomic Factors for North America
  • 7.1.1. United States
  • 7.1.2. Canada
• 7.2. European Wafer Grinder Market Sales Analysis -Type| Application | Country ($ Million)
• Macroeconomic Factors for European
  • 7.2.1. UK
  • 7.2.2. Germany
  • 7.2.3. Italy
  • 7.2.4. Spain
  • 7.2.5. France
  • 7.2.6. Russia
  • 7.2.7. Rest of Europe
• 7.3. Asia-Pacific Wafer Grinder Market Sales Analysis -Type| Application | Country ($ Million)
• Macroeconomic Factors for Asia-Pacific
  • 7.3.1. China
  • 7.3.2. Japan
  • 7.3.3. South Korea
  • 7.3.4. India
  • 7.3.5. Australia & New Zealand
  • 7.3.6. ASEAN Countries (Thailand, Indonesia, Vietnam, Singapore, And Other)
  • 7.3.7. Rest of Asia-Pacific
• 7.4. Rest of the World Wafer Grinder Market Sales Analysis -Type| Application | Country ($ Million)
• Macroeconomic Factors for the Rest of the World
  • 7.4.1. Latin America
  • 7.4.2. Middle East and Africa

8. Company Profiles

• 8.1. Applied Materials, Inc.
  • 8.1.1. Quick Facts
  • 8.1.2. Company Overview
  • 8.1.3. Product Portfolio
  • 8.1.4. Business Strategies
• 8.2. Chevalier Machinery, Inc.
  • 8.2.1. Quick Facts
  • 8.2.2. Company Overview
  • 8.2.3. Product Portfolio
  • 8.2.4. Business Strategies
• 8.3. Daitron Inc.
  • 8.3.1. Quick Facts
  • 8.3.2. Company Overview
  • 8.3.3. Product Portfolio
  • 8.3.4. Business Strategies
• 8.4. Datensicherheit Nord GmbH
  • 8.4.1. Quick Facts
  • 8.4.2. Company Overview
  • 8.4.3. Product Portfolio
  • 8.4.4. Business Strategies
• 8.5. Ebara Corp.
  • 8.5.1. Quick Facts
  • 8.5.2. Company Overview
  • 8.5.3. Product Portfolio
  • 8.5.4. Business Strategies
• 8.6. Engis Corp.
  • 8.6.1. Quick Facts
  • 8.6.2. Company Overview
  • 8.6.3. Product Portfolio
  • 8.6.4. Business Strategies
• 8.7. G&N GmbH
  • 8.7.1. Quick Facts
  • 8.7.2. Company Overview
  • 8.7.3. Product Portfolio
  • 8.7.4. Business Strategies
• 8.8. JTEKT Corp.
  • 8.8.1. Quick Facts
  • 8.8.2. Company Overview
  • 8.8.3. Product Portfolio
  • 8.8.4. Business Strategies
• 8.9. JOEN LIH MACHINERY CO., LTD.
  • 8.9.1. Quick Facts
  • 8.9.2. Company Overview
  • 8.9.3. Product Portfolio
  • 8.9.4. Business Strategies
• 8.10. KINIK Co.
  • 8.10.1. Quick Facts
  • 8.10.2. Company Overview
  • 8.10.3. Product Portfolio
  • 8.10.4. Business Strategies
• 8.11. Koyo Machinery
  • 8.11.1. Quick Facts
  • 8.11.2. Company Overview
  • 8.11.3. Product Portfolio
  • 8.11.4. Business Strategies
• 8.12. Kulicke and Soffa Industries, Inc.
  • 8.12.1. Quick Facts
  • 8.12.2. Company Overview
  • 8.12.3. Product Portfolio
  • 8.12.4. Business Strategies
• 8.13. Logitech Ltd.
  • 8.13.1. Quick Facts
  • 8.13.2. Company Overview
  • 8.13.3. Product Portfolio
  • 8.13.4. Business Strategies
• 8.14. Okamoto Machine Tool Works, Ltd.
  • 8.14.1. Quick Facts
  • 8.14.2. Company Overview
  • 8.14.3. Product Portfolio
  • 8.14.4. Business Strategies
• 8.15. Qingdao Gaoce Technology Co., Ltd.
  • 8.15.1. Quick Facts
  • 8.15.2. Company Overview
  • 8.15.3. Product Portfolio
  • 8.15.4. Business Strategies
• 8.16. Revasum
  • 8.16.1. Quick Facts
  • 8.16.2. Company Overview
  • 8.16.3. Product Portfolio
  • 8.16.4. Business Strategies
• 8.17. S3-Alliance
  • 8.17.1. Quick Facts
  • 8.17.2. Company Overview
  • 8.17.3. Product Portfolio
  • 8.17.4. Business Strategies
• 8.18. SpeedFam Co. Ltd.
  • 8.18.1. Quick Facts
  • 8.18.2. Company Overview
  • 8.18.3. Product Portfolio
  • 8.18.4. Business Strategies
• 8.19. Tokyo Electron Ltd.
  • 8.19.1. Quick Facts
  • 8.19.2. Company Overview
  • 8.19.3. Product Portfolio
  • 8.19.4. Business Strategies
• 8.20. Tokyo Seimitsu Co., Ltd.
  • 8.20.1. Quick Facts
  • 8.20.2. Company Overview
  • 8.20.3. Product Portfolio
  • 8.20.4. Business Strategies
• 8.21. WAIDA MFG. Co., Ltd.
  • 8.21.1. Quick Facts
  • 8.21.2. Company Overview
  • 8.21.3. Product Portfolio
  • 8.21.4. Business Strategies