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1433454

3D半導体パッケージングの世界市場：2023-2030年

Global 3D Semiconductor Packaging Market 2023-2030
出版日: | 発行: Orion Market Research | ページ情報: 英文 120 Pages | 納期: 2～3営業日

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価格
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本日の銀行送金レート: 1USD=156.76円
3D半導体パッケージングの世界市場：2023-2030年
出版日: 2024年01月12日
発行: Orion Market Research
ページ情報: 英文 120 Pages
納期: 2～3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界の3D半導体パッケージング市場は、予測期間（2024-2031年）に10.2%というかなりのCAGRで成長すると予測されています。マイクロエレクトロニクスデバイスにおける3D半導体パッケージング需要の増加が、3D半導体パッケージング産業の成長を牽引しています。効率が向上し、消費電力が少ない先進パッケージング技術の採用が増加していることが、世界の市場の成長を支える主要因となっています。また、市場プレーヤーは3D半導体パッケージングソリューションの導入にも注力しており、市場成長をさらに後押ししています。例えば、半導体パッケージングとテストサービスを提供するAmkor Technology, Inc.は2023年11月、アリゾナ州ピオリアに先進パッケージングとテスト施設を建設すると発表しました。プロジェクトが完全に完了するまでに、Amkor社はこの新施設に約20億米ドルを投資し、約2,000人を雇用する予定です。

セグメント別展望

3D TSVのサブセグメントが世界の3D半導体パッケージング市場で大きなシェアを占めると予想される

技術別では、3D TSVのサブセグメントが世界の3D半導体パッケージング市場でかなりのシェアを占めると予想されています。このセグメントの成長は、3DパッケージングにおけるTSV構造の影響力の拡大に起因しています。TSVは、複数の半導体ダイを含む2.5Dおよび3Dパッケージングの構築に使用されます。この構造は、かつて有機基板上の積層パッケージングで使用されていたエッジ配線やワイヤーボンディングなしで垂直積層を可能にします。例えば、EVグループ（EVG）は2022年9月、先進ロジック、メモリー、パワーデバイスの形成や3D半導体先進パッケージングを含む前工程の超薄層積層を可能にするシリコン用の画期的なレイヤーリリース技術、NanoCleaveを発表しました。

地域別展望

世界の3D半導体パッケージング市場は、北米（米国、カナダ）、欧州（英国、イタリア、スペイン、ドイツ、フランス、その他欧州地域）、アジア太平洋地域（インド、中国、日本、韓国、その他アジア地域）、世界のその他の地域（中東とアフリカ、ラテンアメリカ）を含む地域別にさらに細分化されます。なかでも、アジア太平洋地域が世界市場で突出したシェアを占めると予想されています。ユーザーのアクセスしやすさを考慮した電子機器の小型化に伴い、小型電子回路への需要が高まっていることが、この地域市場の高いシェアの主な要因となっています。

北米は世界の3D半導体パッケージング市場でかなりのCAGRで成長する見込み

すべての地域の中で、北米地域は予測期間中にかなりのCAGRで成長すると予測されています。この地域の成長の背景には、半導体部品の生産量の増加、エレクトロニクス製品の大規模な消費者基盤の存在、若年層へのスマートフォンの高い普及率、半導体産業の強力な研究開発パイプラインがあります。

国内のパッケージング能力とR&Dに多額の投資を行うことは、この地域の半導体エコシステムを繁栄させるために不可欠です。例えば、2023年11月、米国国立標準技術研究所（NIST）は約30億米ドルの先進パッケージング製造プログラムを発表しました。このプログラムは米国の半導体向け先進パッケージング能力を強化するものです。

目次

第1章 レポート概要

  • 業界の現状分析と成長ポテンシャルの展望
  • 調査方法とツール
  • 市場内訳
    • セグメント別
    • 地域別

第2章 市場概要と洞察

  • 調査範囲
  • アナリストの洞察と現在の市場動向
    • 主な調査結果
    • 推奨事項
    • 結論

第3章 競合情勢

  • 主要企業分析
  • Advanced Micro Devices, Inc.
    • 概要
    • 財務分析
    • SWOT分析
    • 最近の動向
  • Intel Corp.
    • 会社概要
    • 財務分析
    • SWOT分析
    • 最近の動向
  • Samsung Electronics Co., Ltd.
    • 概要
    • 財務分析
    • SWOT分析
    • 最近の動向
  • 主要戦略分析

第4章 市場セグメンテーション

  • 3D半導体パッケージングの世界市場：技術別
    • 3D TSV
    • 3D PoP
    • 3D FO
    • 3D ボンディングワイヤー
  • 3D半導体パッケージングの世界市場：材料別
    • 有機基板
    • ボンディングワイヤー
    • リードフレーム
    • 封止樹脂
    • セラミックパッケージ
  • 3D半導体パッケージングの世界市場：業種別
    • エレクトロニクス
    • 産業
    • 自動車・輸送
    • ヘルスケア
    • IT・通信
    • 航空宇宙・防衛

第5章 地域分析

  • 北米
    • 米国
    • カナダ
  • 欧州
    • 英国
    • ドイツ
    • イタリア
    • スペイン
    • フランス
    • その他欧州
  • アジア太平洋
    • 中国
    • インド
    • 日本
    • 韓国
    • その他アジア太平洋地域
  • 世界のその他の地域

第6章 企業プロファイル

  • Amkor Technology
  • Analog Devices, Inc.
  • Cadence Design Systems, Inc.
  • GlobalFoundries
  • Indium Corp.
  • Micron Technology, Inc.
  • NVIDIA Corp.
  • Qualcomm Technologies, Inc.
  • Semiconductor Components Industries, LLC
  • Siliconware Precision Industries Co., Ltd.
  • SK HYNIX INC.
  • STMicroelectronics
  • Taiwan Semiconductor Manufacturing Company Ltd.
  • TEKTRONIX, INC.
  • Texas Instruments Inc.
  • Thermo Fisher Scientific Inc.
  • Tower Semiconductor
  • United Microelectronics Corp.
図表

LIST OF TABLES

  • 1. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 2. GLOBAL 3D THROUGH SILICON VIA SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 3. GLOBAL 3D PACKAGE ON PACKAGE SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 4. GLOBAL 3D FAN OUT BASED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 5. GLOBAL 3D WIRE BONDED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 6. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 7. GLOBAL ORGANIC SUBSTRATE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 8. GLOBAL BONDING WIRE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 9. GLOBAL LEADFRAME 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 10. GLOBAL ENCAPSULATION RESIN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 11. GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 12. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
  • 13. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 14. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR INDUSTRIAL MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 15. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR AUTOMOTIVE & TRANSPORT MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 16. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR HEALTHCARE MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 17. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR IT & TELECOMMUNICATION MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 18. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR AEROSPACE & DEFENSE MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 19. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 20. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
  • 21. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 22. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 23. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
  • 24. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
  • 25. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 26. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 27. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
  • 28. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
  • 29. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 30. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 31. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
  • 32. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 33. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 34. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 35. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)

LIST OF FIGURES

  • 1. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023 VS 2031 (%)
  • 2. GLOBAL 3D THROUGH SILICON VIA SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 3. GLOBAL 3D PACKAGE ON PACKAGE SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 4. GLOBAL 3D FAN OUT BASED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 5. GLOBAL 3D WIRE BONDED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 6. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023 VS 2031 (%)
  • 7. GLOBAL ORGANIC SUBSTRATE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 8. GLOBAL BONDING WIRE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 9. GLOBAL LEADFRAME 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 10. GLOBAL ENCAPSULATION RESIN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 11. GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 12. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023 VS 2031 (%)
  • 13. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 14. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR INDUSTRIAL MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 15. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR AUTOMOTIVE & TRANSPORT MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 16. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR HEALTHCARE MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 17. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR IT & TELECOMMUNICATION MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 18. GLOBAL 3D SEMICONDUCTOR PACKAGING AEROSPACE & DEFENSE MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 19. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 20. US 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 21. CANADA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 22. UK 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 23. FRANCE 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 24. GERMANY 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 25. ITALY 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 26. SPAIN 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 27. REST OF EUROPE 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 28. INDIA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 29. CHINA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 30. JAPAN 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 31. SOUTH KOREA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 32. REST OF ASIA-PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 33. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
目次
Product Code: OMR2028041

Global 3D Semiconductor Packaging Market Size, Share & Trends Analysis Report by Technology (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin and Ceramic Package), by Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin and Ceramic Package), and by Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication and Aerospace & Defense), Forecast Period (2024-2031)

The global 3D semiconductor packaging market is anticipated to grow at a considerable CAGR of 10.2% during the forecast period (2024-2031). An increased demand for 3D semiconductor packaging in microelectronic devices drives the growth in the 3D semiconductor packaging industry. The growing adoption of advanced packaging technology with improved efficiency, and less power consumption is the key factor supporting the growth of the market globally. The market players are also focusing on introducing 3D semiconductor packaging solutions that further bolster the market growth. For instance, in November 2023, Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced to building of an advanced packaging and test facility in Peoria, Arizona. By the time of full project completion, Amkor projects to invest approximately $2 billion and employ approximately 2,000 people at the new facility.

Segmental Outlook

The global 3D semiconductor packaging market is segmented on the technology, material, and industry verticals. Based on the technology, the market is sub-segmented into 3D through silicon via, 3D package on package, 3D fan out based and 3D wire bonded. Based on the material, the market is sub-segmented into organic substrate, bonding wire, leadframe, encapsulation resin and ceramic package. Further, on the basis of industry verticals, the market is sub-segmented into electronics, industrial, automotive & transport, healthcare, IT & telecommunication and aerospace & defense. Among the industry vertical, the electronics sub-segment is anticipated to hold a considerable share of the market owing to the rise in the development of 3D packaging integration to the next level by stacking multiple semiconductor dies on top of each other.

The 3D Through silicon via Sub-Segment is Anticipated to Hold a Considerable Share of the Global 3D Semiconductor Packaging Market

Among the technology, the 3D Through silicon via sub-segment is expected to hold a considerable share of the global 3D semiconductor packaging market. The segmental growth is attributed to the growing influence of the Through-Silicon Via (TSV) Structures in 3D Packages. TSVs are used to build 2.5D and 3D packages that contain multiple semiconductor dies. The structures enable vertical stacking without the edge wiring or wire bonding that was formerly used in stacked packages on organic substrates. For instance, in September 2022, EV Group (EVG) launched NanoCleave, a revolutionary layer release technology for silicon that enables ultra-thin layer stacking for front-end processing, including advanced logic, memory and power device formation, as well as 3D semiconductor advanced packaging.

Regional Outlook

The global 3D semiconductor packaging market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America. Among these, Asia-Pacific is anticipated to hold a prominent share of the market across the globe. The increased demand for compact electronic circuitry with the decreasing size of electronic devices for ease of access for users is a key contributor to the high share of the regional market.

Semiconductor Industry Value Added by Activity and Region 2021 (%)

Source: Semiconductor Industry Association

North America is Expected to Grow at a Considerable CAGR in the Global 3D Semiconductor Packaging Market

Among all regions, the North America regions is anticipated to grow at a considerable CAGR over the forecast period. Regional growth is attributed to the increasing production of semiconductor components, the presence of a large consumer base for electronics products, the high penetration of smartphones among the young population and a strong R&D pipeline for the semiconductor industries drive the growth of the market in the region. The key market players include Advanced Micro Devices, Inc., Amkor Technology, Intel Corp., Microchip Technology Inc., NVIDIA Corp. and others.

Making substantial investments in domestic packaging capabilities and R&D is critical to creating a thriving semiconductor ecosystem in the region. For instance, in November 2023, the National Institute of Standards and Technology (NIST) released an approximately $3 billion National Advanced Packaging Manufacturing Program. The program boosts U.S. advanced packaging capabilities for semiconductors.

Market Players Outlook

The major companies serving the 3D semiconductor packaging market include Advanced Micro Devices, Inc., Amkor Technology, Intel Corp., Samsung Electronics Co., Ltd., United Microelectronics Corp., and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers and acquisitions, partnerships, collaborations, funding, and new product launches, to stay competitive in the market. For instance, in June 2023, Cadence Design Systems, Inc. expanded collaboration with Samsung Foundry to accelerate 3D-IC design development for integrity 3D-IC platform supports Samsung's new 3D CODE standard, enabling designers to create a variety of advanced packaging technologies.

The Report Covers:

  • Market value data analysis of 2023 and forecast to 2031.
  • Annualized market revenues ($ million) for each market segment.
  • Country-wise analysis of major geographical regions.
  • Key companies operating in the global 3D semiconductor packaging market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
  • Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
  • Analysis of market-entry and market expansion strategies.
  • Competitive strategies by identifying 'who-stands-where' in the market.

Table of Contents

1. Report Summary

  • Current Industry Analysis and Growth Potential Outlook
  • 1.1. Research Methods and Tools
  • 1.2. Market Breakdown
    • 1.2.1. By Segments
    • 1.2.2. By Region

2. Market Overview and Insights

  • 2.1. Scope of the Report
  • 2.2. Analyst Insight & Current Market Trends
    • 2.2.1. Key Findings
    • 2.2.2. Recommendations
    • 2.2.3. Conclusion

3. Competitive Landscape

  • 3.1. Key Company Analysis
  • 3.2. Advanced Micro Devices, Inc.
    • 3.2.1. Overview
    • 3.2.2. Financial Analysis
    • 3.2.3. SWOT Analysis
    • 3.2.4. Recent Developments
  • 3.3. Intel Corp.
    • 3.3.1. Overview
    • 3.3.2. Financial Analysis
    • 3.3.3. SWOT Analysis
    • 3.3.4. Recent Developments
  • 3.4. Samsung Electronics Co., Ltd.
    • 3.4.1. Overview
    • 3.4.2. Financial Analysis
    • 3.4.3. SWOT Analysis
    • 3.4.4. Recent Developments
  • 3.5. Key Strategy Analysis

4. Market Segmentation

  • 4.1. Global 3D Semiconductor Packaging Market by Technology
    • 4.1.1. 3D Through silicon via
    • 4.1.2. 3D Package on Package
    • 4.1.3. 3D Fan Out Based
    • 4.1.4. 3D Wire Bonded
  • 4.2. Global 3D Semiconductor Packaging Market by Material
    • 4.2.1. Organic Substrate
    • 4.2.2. Bonding Wire
    • 4.2.3. Leadframe
    • 4.2.4. Encapsulation Resin
    • 4.2.5. Ceramic Package
  • 4.3. Global 3D Semiconductor Packaging Market by Industry Vertical
    • 4.3.1. Electronics
    • 4.3.2. Industrial
    • 4.3.3. Automotive & Transport
    • 4.3.4. Healthcare
    • 4.3.5. IT & Telecommunication
    • 4.3.6. Aerospace & Defense

5. Regional Analysis

  • 5.1. North America
    • 5.1.1. United States
    • 5.1.2. Canada
  • 5.2. Europe
    • 5.2.1. UK
    • 5.2.2. Germany
    • 5.2.3. Italy
    • 5.2.4. Spain
    • 5.2.5. France
    • 5.2.6. Rest of Europe
  • 5.3. Asia-Pacific
    • 5.3.1. China
    • 5.3.2. India
    • 5.3.3. Japan
    • 5.3.4. South Korea
    • 5.3.5. Rest of Asia-Pacific
  • 5.4. Rest of the World

6. Company Profiles

  • 6.1. Amkor Technology
  • 6.2. Analog Devices, Inc.
  • 6.3. Cadence Design Systems, Inc.
  • 6.4. GlobalFoundries
  • 6.5. Indium Corp.
  • 6.6. Micron Technology, Inc.
  • 6.7. NVIDIA Corp.
  • 6.8. Qualcomm Technologies, Inc.
  • 6.9. Semiconductor Components Industries, LLC
  • 6.10. Siliconware Precision Industries Co., Ltd.
  • 6.11. SK HYNIX INC.
  • 6.12. STMicroelectronics
  • 6.13. Taiwan Semiconductor Manufacturing Company Ltd.
  • 6.14. TEKTRONIX, INC.
  • 6.15. Texas Instruments Inc.
  • 6.16. Thermo Fisher Scientific Inc.
  • 6.17. Tower Semiconductor
  • 6.18. United Microelectronics Corp.