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市場調査レポート

世界のハイブリッドフォトニック集積回路(PIC)市場:コンポーネント、材料、用途(光通信、光ファイバーセンサー、生物医学、量子コンピューティング)、通信タイプ、地域別 - 成長、動向、予測

Photonic Integrated Circuit Market - Growth, Trends, and Forecast (2019 - 2024)

発行 Mordor Intelligence LLP 商品コード 635827
出版日 ページ情報 英文 100 Pages
納期: 2-3営業日
価格
本日の銀行送金レート: 1USD=108.68円で換算しております。
世界のハイブリッドフォトニック集積回路(PIC)市場:コンポーネント、材料、用途(光通信、光ファイバーセンサー、生物医学、量子コンピューティング)、通信タイプ、地域別 - 成長、動向、予測 Photonic Integrated Circuit Market - Growth, Trends, and Forecast (2019 - 2024)
出版日: 2019年02月01日 ページ情報: 英文 100 Pages
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概要

世界のハイブリッドフォトニック集積回路(PIC)市場は、2018年から2023年の 調査期間に38.47%のCAGRで推移することが予測されています。

当レポートでは、世界のハイブリッドフォトニック集積回路(PIC)市場を調査し、コンポーネント・材料・通信タイプ・用途・地域別の市場動向、市場規模の推移と予測、市場促進要因および阻害要因の分析、競合情勢、主要企業のプロファイルなど、体系的な情報を提供しています。

目次

第1章 イントロダクション

  • 主な調査成果
  • 調査の前提条件
  • 市場の定義
  • 調査結果

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場のダイナミクス

  • 市場概況
  • 成長要因
    • 電気通信およびデータセンターにおける幅広い用途
  • 阻害要因
    • 従来の集積回路に対する需要
  • ファイブフォース分析
    • 買い手の交渉力
    • 供給企業の交渉力
    • 新規参入業者の脅威
    • 代替品の脅威
    • 競争企業間の敵対関係

第5章 世界のハイブリッドフォトニック集積回路(PIC)市場:セグメント別

  • コンポーネント別
    • レーザー(光レーザー)
    • モジュレーター
    • 検出器
    • 減衰器(アッテネータ-)
    • マルチプレクサ/デマルチプレクサ(MUX / DEMUX)
    • 光増幅器
  • 材料別
    • III-V族半導体
    • II-VI族半導体
    • 量子ドット(QD)
    • グラフェン
    • シリコン
    • その他
  • 光通信別
    • センシング
    • バイオフォトニクス
    • 光信号処理
  • 用途別
    • 光通信
    • 光ファイバーセンサー
    • 生物医学
    • 量子コンピューティング(データセンター)
    • その他(計量、潜水艦)
  • 地域別
    • 北米
    • 欧州
    • アジア太平洋地域
    • ラテンアメリカ
    • 中東・アフリカ

第6章 企業プロファイル

  • Infinera Corporation
  • NeoPhotonics Corporation
  • Huawei Global
  • OneChip Photonics
  • Intel Corporation
  • Broadcom Inc
  • Oclaro Inc
  • JDS Uniphase Inc.
  • Ciena Corporation

第7章 投資分析

第8章 市場の将来展望

目次
Product Code: 59006

Market Overview

The global photonic integrated circuit market was valued at USD 472.5 million in 2018, and is expected to register a CAGR of 26.4% over the forecast period (2019-2024). Photonic integrated circuit (PIC) technology is widely used to transfer huge amounts of data at a very high speed and finds applications in the field of optical fiber communications. One of the most significant drawbacks that PICs address is the power consumption issue. In fact, it is estimated that annually more than 5% of all the electricity generated, globally, was used in data center establishments, and this consumption is rising by at least 1.7% every year. But in the case of photonic ICs, it is estimated that the power consumed in such critical applications could be reduced by at least 50%.

Similar to the traditional PICs, which operate at wavelengths of 1.3 and 1.55μm, even hybrid PICs find great applications in telecommunication business and data centers. The need for high rate of data transfer, which cannot be accommodated by the traditional ICs, is the major factor leading to increased adoption of hybrid PIC in both telecom and data center markets.

The increasing number of cloud applications are rapidly up scaling the traffic that has to be handled by data centers. According to Cisco Systems, as of 2017, the volume of cloud traffic alone, across the data centers, exceeded 5 zettabytes per year, indicating a critical need for advanced switching and data transfer hardware, which can be met by hybrid PICs.

Although hybrid photonic integrated circuits are highly efficient and pose several advantages, when compared to their predecessors. They are still new to the market, and hence, experience a very low level of market penetration, when compared to the traditional ICs.

Scope of the Report

Multiple photonic components, such as waveguides, lasers, modulators, and detectors, when integrated on a single chip are referred to as photonic ICs. When compared to traditional ICs, photonic ICs are extremely fast, accommodate higher bandwidth, and are highly power efficient.

Key Market Trends

III-V Material to Hold a Major Market Share

GaAs photonics is a significantly tiny market, whose principal application was data centers. However, after the introduction of a 3D sensing function using GaAs-based VCSELs in Apple's iPhone X, GaAs VCSEL has attained enormous growth.

The growth in 3D sensing applications in the consumer electronics market, automotive lighting, the increasing LiDAR applications, horticultural lighting, IR LED applications and display applications are expected to increase the demand for GaAs photonics over the forecast period.

In III-V materials, the market potential for InP (Indium Phosphide) PIC is considered very high. It can best be understood as a subset of the PIC market, which as a whole is further developed. The increasing potential for data center solutions and data center construction across the world is expected to aid the adoption of InP PIC over the forecast period.

North America to Hold a Major Market Share

In North America, the demand for photonic integrated circuits (PIC)-based products is driven by data centers and WAN applications of fiber optic communication. The need for high-speed data transmission increased the data traffic in cloud computing, and the rapid roll-out of IoT has created a potentially booming photonic integrated circuit industry in the region.

Service providers are facing an increasing demand for bandwidth, much of which is being driven by mobile, video, and cloud-based service. For instance, in the United States, video streaming from Netflix alone accounts for nearly a quarter of all bytes transferred at peak times. Companies are expected to base their optical networks on the PIC, which is expected to contribute to the market's growth positively.

Competitive Landscape

The photonics integrated circuit market is highly competitive and consists of several major players. In terms of market share, few of the major players currently dominate the market. However, with innovative and sustainable packaging, many of the companies are increasing their market presence by securing new contracts and by tapping new markets. For instance, in 2017, Finisar introduced the flextune feature for wavelength-tunable optical transceivers, which simplifies the deployment of Dense Wavelength Division Multiplexing (DWDM) transceivers in Remote PHY access networks constructed by multiple system operators (MSOs). Further, in 2018, Lumentum Holdings Inc. acquired Oclaro Inc. Through this acquisition the company aims to enhance its product portfolio and accelerate its innovations.

Reasons to Purchase this report:

  • The market estimate (ME) sheet in Excel format
  • Report customization as per the client's requirements
  • 3 months of analyst support

Table of Contents

1 INTRODUCTION

  • 1.1 Key Deliverables of the Market
  • 1.2 Study Assumptions
  • 1.3 Scope of the Study

2 RESEARCH METHODOLOGY

  • 2.1 Analysis Methodology
  • 2.2 Research Phases

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Introduction to Market Drivers and Restraints
  • 4.3 Market Drivers
    • 4.3.1 Wide Range of Applications in Telecommunications and Data Centers
  • 4.4 Market Restraints
    • 4.4.1 Strong Demand for Traditional ICs
  • 4.5 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.5.1 Threat of New Entrants
    • 4.5.2 Bargaining Power of Buyers/Consumers
    • 4.5.3 Bargaining Power of Suppliers
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry

5 MARKET SEGMENTATION

  • 5.1 By Type of Component
    • 5.1.1 Laser (Optical Laser)
    • 5.1.2 Modulators
    • 5.1.3 Detectors
    • 5.1.4 Transceivers
    • 5.1.5 Multiplexer / Demultiplexer (MUX/DEMUX)
    • 5.1.6 Optical Amplifiers
  • 5.2 By Type of Raw Material
    • 5.2.1 III-V Material
    • 5.2.2 Lithium Niobate
    • 5.2.3 Silica-on-Silicon
    • 5.2.4 Quantum Dots
    • 5.2.5 Other Raw Materials (Graphene, Silicon-on-Insulator)
  • 5.3 By Integration Process
    • 5.3.1 Hybrid
    • 5.3.2 Monolithic
  • 5.4 By Application
    • 5.4.1 Telecommunications
    • 5.4.2 Biomedical
    • 5.4.3 Data Centers
    • 5.4.4 Other Applications (Optical Sensors(LiDAR), Metrology, etc.)
  • 5.5 Geography
    • 5.5.1 North America
    • 5.5.2 Europe
    • 5.5.3 Asia-Pacific
    • 5.5.4 Rest of the World

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Neophotonics Corporation
    • 6.1.2 Infinera Corporation
    • 6.1.3 Lumentum Holdings Inc.
    • 6.1.4 Intel Corporation
    • 6.1.5 Colorchip Ltd
    • 6.1.6 Ciena Corporation
    • 6.1.7 Finisar Corporation
    • 6.1.8 Huawei Technologies Co. Ltd
    • 6.1.9 Source Photonics Inc.
    • 6.1.10 Luxtera
    • 6.1.11 VLC Photonics
    • 6.1.12 Mellanox Technologies Ltd

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS