ナノ銀ソルダーペースト市場レポート：2030年までの動向、予測、競合分析

ナノ銀ソルダーペーストの動向と予測

世界のナノ銀ソルダーペースト市場の将来性は、LED、IGBTパワーデバイス、MOSFETパワーデバイス市場での機会により有望視されています。世界のナノ銀ソルダーペースト市場は、2024～2030年にかけてCAGR 1.3%で成長すると予想されます。この市場の主要促進要因は、高導電性を必要とする小型化電子デバイスの需要拡大、ソルダー付け性能と信頼性を向上させるナノ技術の進歩、環境に優しい製品に対する規制や消費者の嗜好の高まりです。

• Lucintelの予測では、タイプ別では加圧焼結が予測期間中に高い成長を遂げる見込みです。
• 用途別ではLEDが最も高い成長が見込まれます。
• 地域別では、アジア太平洋が予測期間で最も高い成長が見込まれます。

ナノ銀ソルダーペースト市場の戦略的成長機会

ナノ銀ソルダーペースト市場は、エレクトロニクス製造の進歩と高性能ソルダー付けソリューションの需要増加により、戦略的成長機会に満ちています。この市場は、熱伝導性と電気伝導性を向上させ、電子部品の性能を向上させるナノ銀ペーストの進歩によって成長することができます。消費者向けガジェット、自動車システム、通信インフラなどの先端エレクトロニクスでナノ銀ソルダーペーストの使用が増加していることから、機会が生じています。さらに、持続可能性の目標に沿い、より環境に優しい技術への需要に応える、環境に優しくコスト効率の高い配合の開発にますます注目が集まっています。こうした成長機会を見極め、活用することで、イノベーションを活用し、変化する産業要件に対応し、変化の激しいナノ銀ソルダーペースト市場で競合を維持することができます。

• エレクトロニクス産業洗練された電子機器の成長は、ナノ銀ソルダーにとって大きな機会です。小型化・高密度化された電子機器が適切に動作するためには、効率的なソルダーが必要であり、このセグメントでの技術革新と拡大を促進します。
• 自動車用途：自動車セグメントでは、電気自動車やADAS（先進運転支援システム）への移行により、ナノ銀ソルダーを使用する余地が広がっています。先進的信頼性を特徴とするソルダー付け材料は、このような現代の用途に適用される電子機器にとって極めて重要です。
• 再生可能エネルギー再生可能エネルギーで使用される太陽光発電や風力発電技術では、電子部品に耐久性があり効率的なソルダー付け材料が必要です。性能と信頼性を向上させるナノ銀ソルダーペーストを使用することで、性能を向上させることができます。
• 医療機器ナノ銀ソルダーは、ソルダー付け作業の精度と一貫性を必要とする医療機器への適用が増加しています。生体適合性や耐久性など、医療で要求されるほとんどの条件を満たすペーストがすでに開発されています。
• 高周波用途：5Gやその他の高周波技術の出現は、ナノ銀ソルダーペーストの道を開いた。このペーストは洗練されており、高周波や高速アプリケーションの厳しい要件に対応できます。

ナノ炭化ケイ素市場は、多業種にわたるその汎用性の高い用途により、力強い成長を遂げています。エネルギー貯蔵（特にEV用）、パワーエレクトロニクス、研磨剤、コーティング、航空宇宙における主要成長機会は、ナノSiCが次世代技術において重要な役割を担っていることを示しています。パワーデバイスの効率向上から航空宇宙部品の耐久性強化に至るまで、ナノSiCは材料科学の未来を形成しており、継続的なイノベーションと市場拡大のための強固な基盤を提供しています。

ナノ銀ソルダーペースト市場促進要因・課題

ナノ銀ソルダーペースト市場の成長と開拓は、いくつかの主要促進要因・課題の影響を受けています。これらの要因には、高性能電子アセンブリに使用されるナノ銀ペーストの材料科学の進歩によって可能になった、より高い熱伝導性、より優れた電気伝導性などの特性の向上が含まれます。利害関係者は、この市場促進要因に対処し、課題を克服することで、この市場機会を活用し、効果的に技術革新を行い、進化するナノ銀ソルダーペースト技術の世界で競合を維持する必要があります。

ナノ銀ソルダーペースト市場は、以下のようないくつかの原動力に支配されています。

• 技術の進歩：技術の進歩：ナノ銀ソルダーペーストの配合と製造プロセスにおける技術革新が市場の成長を後押ししています。熱伝導率や電気伝導率の向上といった特性は、ハイテク用途におけるこれらの先端材料の採用拡大に役立っています。
• エレクトロニクス需要の増加高性能ソルダーは、ますます複雑化、小型化する電子機器に必要とされています。ナノ銀ソルダーペーストは、ハンドヘルド機器に使用されるような最新の電子産業の仕様に適合しており、それによってその成長を牽引しています。
• 自動車産業の開発：自動車産業の進歩により、ソルダー付けに使用される信頼性が高く耐久性のある材料への需要が高まっています。ナノ銀ソルダーペーストを使用する利点には、電気自動車や航空宇宙部品などの製造における使いやすさが含まれます。
• サステイナブル開発の動向：環境に優しい製品への取り組みは、特性を改善した環境に優しいナノ銀ソルダーを促進します。調査圧力と持続可能性の目標がこのセグメントの研究努力を後押ししています。
• 新たな高周波技術：従来のネットワークよりも高い周波数で動作する5Gネットワークの台頭により、先進的金属ソルダーが強く求められています。ナノ銀ソルダーは、高周波レベルで使用される場合に優れた特性を発揮することで知られており、市場での地位を強化しています。

ナノ銀ソルダーペースト市場課題は以下の通りです。

• 高価であること：ナノ銀ソルダーは、高価な金属と製造プロセスの複雑さに基づいているため、その購入価格は依然として課題となっています。したがって、性能を維持しながら経済的な方法を採用することが重要です。
• 生産の拡大性：高まる顧客需要に対応するためには、品質を維持しながら継続的に生産を拡大する必要があります。生産効率と品質管理は、メーカーが取り組むべき課題です。
• 市場競争：ナノ銀ソルダーペースト市場は、他タイプのソルダーや技術との競合の影響を受ける可能性があります。つまり、この産業では製品の差別化と独自の優位性を強調することが重要です。

これらの促進要因・課題から、ナノ銀ソルダーペースト市場はダイナミックであり、成長機会と克服すべきハードルの両方を示しています。

目次

第1章 エグゼクティブサマリー

第2章 世界のナノ銀ソルダーペースト市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 産業の促進要因と課題

第3章 2018～2030年の市場動向と予測分析

• マクロ経済動向（2018～2023年）と予測（2024～2030年）
• 世界のナノ銀ソルダーペースト市場の動向（2018～2023年）と予測（2024～2030年）
• 世界のナノ銀ソルダーペースト市場：タイプ別
  • 加圧焼結
  • 加圧なし焼結
• 世界のナノ銀ソルダーペースト市場：用途別
  • LED
  • IGBTパワーデバイス
  • MOSFETパワーデバイス
  • その他

第4章 2018～2030年の地域別市場動向と予測分析

• 地域別ナノ銀ソルダーペーストの世界市場
• 北米ナノ銀ソルダーペースト市場
• 欧州ナノ銀ソルダーペースト市場
• アジア太平洋ナノ銀ソルダーペースト市場
• その他地域ナノ銀ソルダーペースト市場

第5章 競合分析

• 製品ポートフォリオ分析
• 運用統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略分析

• 成長機会分析
  • 世界のナノ銀ソルダーペースト市場における成長機会：タイプ別
  • ナノ銀ソルダーペースト市場の成長機会：用途別
  • ナノ銀ソルダーペースト市場の成長機会：地域別
• 世界のナノ銀ソルダーペースト市場の新たな動向
• 戦略分析
  • 新製品開発
  • 世界のナノ銀ソルダーペースト市場の生産能力拡大
  • 世界のナノ銀ソルダーペースト市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 主要企業の企業プロファイル

• Kyocera
• Indium Corporation
• MacDermid Alpha
• Henkel
• Namics
• Advanced Joining Technology
• Tanaka

Nano Silver Solder Paste Trends and Forecast

The future of the global nano silver solder paste market looks promising with opportunities in the LED, IGBT power device, and MOSFET power device markets. The global nano silver solder paste market is expected to grow with a CAGR of 1.3% from 2024 to 2030. The major drivers for this market are the growing demand for miniaturized electronic devices requiring high conductivity, advancements in nanotechnology for improved soldering performance and reliability, and increasing regulations and consumer preferences for environmentally friendly products

• Lucintel forecasts that, within the type category, pressure sintering is expected to witness higher growth over the forecast period.
• Within this application category, LED is expected to witness the highest growth.
• In terms of regions, APAC is expected to witness the highest growth over the forecast period.

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Emerging Trends in the Nano Silver Solder Paste Market

The market for nano silver solder paste is growing at a fast pace due to advances in material science and increasing demand for high-performance electronic devices. The emerging trends shaping this market reflect the significant innovations and shifts that are taking place in the industry. Ultra-fine silver particles improve solder paste performance, enhance thermal and electrical conductivity, and improve paste formulation for more reliable applications and ease of use. Additionally, there is a shift toward ensuring sustainability while reducing costs, with solder paste manufactured under environmentally friendly conditions. This trend is driven by the expanding applications of nano silver solder paste across various sectors such as automotive electronics, telecommunications, and consumer electronics. These emerging trends will shape the future of the nano silver solder paste market as it strives to enhance performance in line with changing customer requirements.

• Enhanced Performance Formulations: There is a growing trend toward the development of nano silver-based solders with improved thermal and electrical conductivity. Innovations have focused on optimizing particle size and distribution to guarantee superior performance, particularly in high-density electronic components used in advanced semiconductors.
• Eco-Friendly Solutions: Regulatory demands regarding environmental issues will require that future nano silver solder pastes be eco-friendly. This will involve a reduction in the use of hazardous substances and an improvement in the recyclability of such pastes to align with global sustainability goals within this sector.
• Miniaturization and High-Density Applications: Increasingly, nano silver solders are being employed for miniaturized and high-density applications due to the continued shrinking complexity of electronics. This has been necessitated by the demand for more sophisticated solders that can meet the contemporary requirements of modern electronic devices and systems.
• Cost Minimization Techniques: In the quest to reduce expenses on nano silver solder paste, more efficient production procedures and alternative materials are being developed. Reducing production costs while ensuring high efficiency is crucial for wider acceptance in various industries.
• Advanced Technology Integration: The extent to which nano silver solder paste is embedded in modern technologies like 5G and electric vehicles is growing. These applications require high-performance solder materials that can meet the demands of current and emerging technologies.

These trends indicate how dynamic the nano silver solder paste market has evolved based on technological advancements and changing industry needs.

Recent Developments in the Nano Silver Solder Paste Market

The advancements in material science and growing demand for high-performance electronic assemblies are driving significant progress within the nano silver solder paste market. There is also a growing trend toward environmentally friendly formulations that meet sustainability objectives while remaining highly productive. These recent developments signify an industry shift toward more efficient, robust, and environmentally friendly soldering solutions that take into account the changing needs of sectors such as consumer electronics, automotive, and telecommunications. This advancement will reshape the nano-silver solder paste market by creating new opportunities for innovation and growth.

• Innovative Formulations: The most recent developments involve creating nano silver solder pastes with better features, such as enhanced thermal and electrical conductivity. Researchers are experimenting with different particle sizes and flux compositions for optimum performance in high-density or higher-frequency applications. These advances are essential to meet the growing demand for contemporary electronics.
• Cost-Effective Production: There has been an effort to reduce the cost of manufacturing nano silver solder paste. This includes developing more efficient manufacturing processes and finding alternative materials to lower costs while maintaining good performance. For these pastes to be affordable for a larger number of companies, inventions in technology have been introduced.
• Environmentally Friendly Solutions: Attention is currently shifting toward environmentally friendly types of nano silver solder with reduced environmental impacts from their manufacturing processes, including sustainable material sourcing. Adherence to environmental legislation, coupled with sustainability aims, is increasingly crucial for manufacturers operating in this sphere.
• Entry into New Markets: In addition to conventional electronics, nano silver solder paste has found its way into other fields such as automotive and renewable energy. This development reflects the broader overall marketplace potential and the increasing appetite for high-tech, high-performance applications across various industries.
• Better Reliability: Another focus for recent advancements is improving the reliability and lifetime of nano silver solder paste in harsh environments. This feature enables its use in high-temperature processes such as aerospace, defense, and industrial applications.

These developments underscore the ongoing progress in the nano silver solder paste market, driven by advancements in formulation, cost reduction, sustainability, and market expansion.

Strategic Growth Opportunities for Nano Silver Solder Paste Market

The market for nano silver solder paste is full of strategic growth opportunities driven by advances in electronics manufacturing and increased demand for high-performance soldering solutions. This market can grow because of advancements in nanosilver paste, which enhances thermal and electrical conductivity, thereby improving the performance of electronic components. Opportunities arise from the increased use of nano silver solder paste in advanced electronics such as consumer gadgets, automotive systems, and telecommunications infrastructure. Moreover, there is an increasing focus on developing environmentally friendly and cost-effective formulations that align with sustainability goals and meet demands for greener technologies. These growth opportunities can be identified and exploited to leverage innovations, address changing industry requirements, and maintain a competitive edge within the fast-moving nano silver solder paste market.

• Electronics Industry: The growth of sophisticated electronic gadgets presents a major opportunity for nano silver solders. For miniaturized and high-density electronics to work properly, there is a need for efficient solders that will drive innovation and expansion within this sector.
• Automotive Applications: In the automotive sector, the transition to electric vehicles and advanced driver assistance systems has opened up space for using nano silver solder. Soldering materials characterized by a high degree of reliability are crucial for electronics applied in these modern-day uses.
• Renewable Energy: Solar and wind power technologies used in renewable energy require durable and efficient soldering materials for their electronic components. Performance can be enhanced through the use of nano silver solder pastes that offer improved performance as well as reliability.
• Medical Devices: Nano silver solder is increasingly being applied in medical devices that require accuracy and consistency in soldering operations. Pastes capable of meeting most requirements set by medicine, such as biocompatibility and durability, have already been developed.
• High-Frequency Applications: The emergence of 5G and other high-frequency technologies has opened up avenues for nano silver solder paste. This paste is sophisticated and can address the stringent requirements of high-frequency and high-speed applications.

The nano silicon carbide market is experiencing strong growth due to its versatile applications across multiple industries. Key growth opportunities in energy storage (especially for EVs), power electronics, abrasives, coatings, and aerospace demonstrate Nano SiC's critical role in next-generation technologies. From improving the efficiency of power devices to enhancing the durability of aerospace components, Nano SiC is shaping the future of materials science, providing a solid foundation for continued innovation and market expansion.

Nano Silver Solder Paste Market Driver and Challenges

The growth and development of the nano silver solder paste market are influenced by several main drivers and challenges. These include improved features such as higher thermal conductivity, better electrical conductivity, and other attributes enabled by advances in material science for nano silver pastes used in high-performance electronic assemblies. Stakeholders need to address these drivers and overcome these challenges to exploit opportunities in this market, effectively innovate, and remain competitive in the evolving world of nano silver solder paste technology.

The market for nano silver solder paste is governed by several driving forces that include:

• Advancements in Technology: Market growth is propelled by innovations in the formulations and manufacturing processes of nano silver solder pastes. Characteristics such as better thermal and electrical conductivity are instrumental in leading to increased adoption of these advanced materials in high-tech applications.
• Increasing Demand for Electronics: High-performance solders are needed for increasingly complex, miniaturized electronic devices. Nano silver solder paste meets modern electronic industry specifications, such as those used in handheld devices, thereby driving its growth.
• Automotive Sector Developments: Advancements in the automotive industry have led to increased demand for reliable, durable materials used in soldering. The benefits of using nano silver solder pastes include ease of use in making electric vehicles and aerospace components, among others.
• Trends in Sustainable Development: Efforts toward environmentally friendly products promote eco-friendly nano silver solders with improved properties. Regulatory pressures and sustainability targets drive research efforts in this area.
• Emerging High-Frequency Technologies: Advanced metal solders are highly demanded due to the rise of 5G networks, which operate at higher frequencies than previous networks. Nano silver solders are known for their excellent properties when used at high-frequency levels, thus reinforcing their market position.

Challenges in the nano silver solder paste market include:

• Expensiveness: The price of purchasing nano silver solders remains a challenge since it is based on costlier metals and the complexity associated with the manufacturing process. Therefore, adopting economical methods while maintaining performance is crucial.
• Scalability in Production: To deal with rising customer demands, production must grow continuously while maintaining quality. Production efficiency and quality control are challenges that manufacturers should address.
• Market Competition: The nano silver solder paste market may be affected by competition from other types of solders and technologies. This means that differentiation of products and highlighting unique advantages is important in this industry.

These drivers and challenges reveal that the nano silver solder paste market is dynamic, indicating both growth opportunities and hurdles to overcome.

List of Nano Silver Solder Paste Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. Through these strategies nano silver solder paste companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the nano silver solder paste companies profiled in this report include-

• Kyocera
• Indium Corporation
• MacDermid Alpha
• Henkel
• Namics
• Advanced Joining Technology
• Tanaka

Nano Silver Solder Paste by Segment

The study includes a forecast for the global nano silver solder paste market by type, application, and region.

Nano Silver Solder Paste Market by Type [Analysis by Value from 2018 to 2030]:

• Pressure Sintering
• Pressure-Less Sintering

Nano Silver Solder Paste Market by Application [Analysis by Value from 2018 to 2030]:

• LED
• IGBT Power Devices
• MOSFET Power Devices
• Others

Nano Silver Solder Paste Market by Region [Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

Country Wise Outlook for the Nano Silver Solder Paste Market

The market is expanding its operations and forming strategic partnerships to strengthen its position. The below content highlights recent developments by major nano silver solder paste producers in key regions: the USA, China, Germany, India, and Japan.

• United States: Recent developments in the U.S. have focused on improving thermal and electrical conductivity in nano silver solder paste formulations. These developments emphasize optimizing particle size distribution (PSD) and dispersion properties to enhance performance in HD electronics based on micro-electronics design methods. Additionally, regulatory compliance and sustainability pressures are major drivers of innovative sustainable formulations.
• China: In China, there has been significant growth in the production capabilities of nano silver solder paste, with an emphasis on increasing efficiency while reducing costs. Research activities target improving the adhesion properties of pastes and exploring their potential use in 5G technologies and electric vehicles, which require highly efficient soldering materials due to increasing demand.
• Germany: Germany's progress in precision manufacturing and miniaturization has led to advancements related to nano silver solder paste development. Recent examples include embedding such pastes within advanced semiconductor packages aimed at high-frequency applications. Innovations also aim at improving their reliability over extended periods under harsh conditions.
• India: India seeks ways to make nano silver solder paste (NSSP) more affordable for local markets by researching alternative materials and more efficient processes during manufacturing. This would also enable it to enter the consumer electronics market, including the automotive industry, as its electronics manufacturing sector grows.
• Japan: In Japan, high-tech applications like robotics and medical devices are increasingly using nano silver solder paste. Japanese companies are also researching the integration of nano silver solder paste in next-generation electronics and advanced manufacturing processes.

Features of the Global Nano Silver Solder Paste Market

Market Size Estimates: Nano silver solder paste market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Nano silver solder paste market size by type, application, and region in terms of value ($B).

Regional Analysis: Nano silver solder paste market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the nano silver solder paste market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the nano silver solder paste market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

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This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the nano silver solder paste market by type (pressure sintering and pressure-less sintering), application (LED, IGBT power devices, MOSFET power devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Nano Silver Solder Paste Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global Nano Silver Solder Paste Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global Nano Silver Solder Paste Market by Type
  • 3.3.1: Pressure Sintering
  • 3.3.2: Pressure-Less Sintering
• 3.4: Global Nano Silver Solder Paste Market by Application
  • 3.4.1: LED
  • 3.4.2: IGBT Power Devices
  • 3.4.3: MOSFET Power Devices
  • 3.4.4: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global Nano Silver Solder Paste Market by Region
• 4.2: North American Nano Silver Solder Paste Market
  • 4.2.1: North American Market by Type: Pressure Sintering and Pressure-Less Sintering
  • 4.2.2: North American Market by Application: LED, IGBT Power Devices, MOSFET Power Devices, and Others
• 4.3: European Nano Silver Solder Paste Market
  • 4.3.1: European Market by Type: Pressure Sintering and Pressure-Less Sintering
  • 4.3.2: European Market by Application: LED, IGBT Power Devices, MOSFET Power Devices, and Others
• 4.4: APAC Nano Silver Solder Paste Market
  • 4.4.1: APAC Market by Type: Pressure Sintering and Pressure-Less Sintering
  • 4.4.2: APAC Market by Application: LED, IGBT Power Devices, MOSFET Power Devices, and Others
• 4.5: ROW Nano Silver Solder Paste Market
  • 4.5.1: ROW Market by Type: Pressure Sintering and Pressure-Less Sintering
  • 4.5.2: ROW Market by Application: LED, IGBT Power Devices, MOSFET Power Devices, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Nano Silver Solder Paste Market by Type
  • 6.1.2: Growth Opportunities for the Global Nano Silver Solder Paste Market by Application
  • 6.1.3: Growth Opportunities for the Global Nano Silver Solder Paste Market by Region
• 6.2: Emerging Trends in the Global Nano Silver Solder Paste Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Nano Silver Solder Paste Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Nano Silver Solder Paste Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Kyocera
• 7.2: Indium Corporation
• 7.3: MacDermid Alpha
• 7.4: Henkel
• 7.5: Namics
• 7.6: Advanced Joining Technology
• 7.7: Tanaka