市場調査レポート
商品コード
1418090
パッケージ基板市場レポート:2030年までの動向、予測、競合分析Package Substrate Market Report: Trends, Forecast and Competitive Analysis to 2030 |
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パッケージ基板市場レポート:2030年までの動向、予測、競合分析 |
出版日: 2024年01月29日
発行: Lucintel
ページ情報: 英文 150 - page report
納期: 3営業日
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パッケージ基板の動向と予測
世界のパッケージ基板市場は、2024年から2030年にかけてCAGR 6.8%の成長が見込まれています。この市場の主な促進要因は、電子機器の小型化傾向の高まり、先進パッケージング技術の採用拡大、高性能メモリーデバイスの需要拡大です。世界のパッケージ基板市場の将来は、モバイル機器市場や自動車市場に機会があり、有望視されています。
パッケージ基板市場の洞察
Lucintelの予測では、フリップチップ・チップスケールパッケージは熱伝導率が向上し、製造コストが低いため、予測期間中に最も高い成長が見込まれます。
同市場では、通信制御やデータ処理アプリケーションでの利用が増加していることから、自動車向けが高い成長を遂げると予測されています。
アジア太平洋は、主要な半導体製造およびエレクトロニクス生産拠点が存在するため、予測期間中に最も高い成長が見込まれます。
Q1.市場の成長予測は?
A1.世界のパッケージ基板市場は、2024年から2030年にかけてCAGR 6.8%で成長する見込みです。
Q2.市場の成長に影響を与える主な促進要因は?
A2.この市場の主な促進要因は、電子デバイスの小型化傾向の高まり、先進パッケージング技術の採用拡大、高性能メモリーデバイスの需要増です。
Q3.市場の主要セグメントは?
A3.世界のパッケージ基板市場の将来性は、モバイル機器市場と自動車市場に機会があり、有望です。
Q4.市場の主要企業は?
A4.パッケージ基板の主要企業は以下の通り。
Q5.今後、最大となる市場セグメントは?
A5.Lucintelは、フリップチップ・チップスケールパッケージは熱伝導率が向上し、製造コストが低いため、予測期間中に最も高い成長が見込まれると予測しています。
Q6.市場において、今後5年間に最大になると予想される地域は?
A6.アジア太平洋は、主要な半導体製造およびエレクトロニクス生産拠点が存在するため、予測期間中に最も高い成長が見込まれます。
Q7.レポートのカスタマイズは可能?
A7.はい、Lucintelは追加費用なしで10%のカスタマイズを提供します。
Package Substrate Trends and Forecast
The future of the global package substrate market looks promising with opportunities in the mobile device and automotive markets. The global package substrate market is expected to grow with a CAGR of 6.8% from 2024 to 2030. The major drivers for this market are rising trend of miniaturization of electronic devices, growing adoption of advanced packaging technologies, and increasing demand for high-performance memory devices.
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Package Substrate by Segment
The study includes a forecast for the global package substrate by type, application, and region.
List of Package Substrate Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies package substrate companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the package substrate companies profiled in this report include-
Package Substrate Market Insights
Lucintel forecasts that flip chip chip scale package is expected to witness the highest growth over the forecast period due to its improved thermal conductivity and low manufacturing cost.
Within this market, automotive is expected to witness the higher growth due to increasing usage in communication control and data processing applications.
APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturing and electronics production hubs in the region.
Features of the Global Package Substrate Market
Market Size Estimates: Package substrate market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Package substrate market size by type, application, and region in terms of value ($B).
Regional Analysis: Package substrate market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the package substrate market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the package substrate market.
Analysis of competitive intensity of the industry based on Porter's Five Forces model.
FAQ
Q1. What is the growth forecast for package substrate market?
Answer: The global package substrate market is expected to grow with a CAGR of 6.8% from 2024 to 2030.
Q2. What are the major drivers influencing the growth of the package substrate market?
Answer: The major drivers for this market are rising trend of miniaturization of electronic devices, growing adoption of advanced packaging technologies, and increasing demand for high-performance memory devices.
Q3. What are the major segments for package substrate market?
Answer: The future of the global package substrate market looks promising with opportunities in the mobile device and automotive markets.
Q4. Who are the key package substrate market companies?
Answer: Some of the key package substrate companies are as follows.
Q5. Which package substrate market segment will be the largest in future?
Answer: Lucintel forecasts that flip chip chip scale package is expected to witness the highest growth over the forecast period due to its improved thermal conductivity and low manufacturing cost.
Q6. In package substrate market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturing and electronics production hubs in the region.
Q7. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.