３次元集積回路とシリコン貫通電極（TSV）相互接続市場レポート：2030年までの動向、予測、競合分析

３次元集積回路とシリコン貫通電極（TSV）相互接続の動向と予測

世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場は、2024年から2030年までのCAGRが10.7%で、2030年までに推定373億米ドルに達すると予想されています。この市場の主な促進要因は、エネルギー削減のニーズの高まりです。消費と密度の向上、３次元集積回路およびTSV相互接続ソリューションの採用の増加、高性能で小型化された電子デバイスの需要の高まりです。世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場の将来は、軍事、航空宇宙および防衛、家庭用電化製品、情報通信技術、および自動車市場での機会があり、有望に見えます。

３次元集積回路とシリコン貫通電極（TSV）相互接続市場に関する洞察

Lucintelは、シリコン・オン・インシュレータは予測期間を通じて引き続きより大きなセグメントになると予測しています。

この市場では、航空宇宙および防衛が予測期間中に最も高い成長を遂げると予想されています。

アジア太平洋地域は、スマートフォン製造におけるシリコンウェーハの需要の増加と、この地域での5G技術の採用の増加により、予測期間を通じて最大の地域であり続けると予想されます。

よくある質問

Q.1３次元集積回路とシリコン貫通電極（TSV）相互接続の市場規模はどれくらいですか：

A1.世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場は、2030年までに推定373億米ドルに達すると予想されています。

Q.2３次元集積回路とシリコン貫通電極（TSV）相互接続市場の成長予測は何ですか：

A2.世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場は、2024年から2030年にかけて10.7%のCAGRで成長すると予想されています。

Q.3３次元集積回路とシリコン貫通電極（TSV）相互接続市場の成長に影響を与える主な要因は何ですか：

A3.この市場の主な促進要因は、エネルギー消費量の削減と密度の向上に対するニーズの高まり、３次元集積回路およびTSV相互接続ソリューションの採用の増加、高性能で小型化された電子デバイスの需要の高まりです。

Q4.市場の主要セグメントは：

A4.３次元集積回路とシリコン貫通電極（TSV）相互接続市場の将来は、軍事、航空宇宙および防衛、家庭用電化製品、情報通信技術、および自動車市場での機会があり、有望に見えます。

Q5.市場の主要企業は：

A5.主要な３次元集積回路とシリコン貫通電極（TSV）相互接続会社の一部は次のとおりです。

• Amkor Technology
• Elpida Memory
• Intel Corporation
• Micron Technology
• Monolithic 3d
• Renesas Electronics Corporation

Q6.今後、最大となる市場セグメントは：

A6.Lucintelは、シリコン・オン・インシュレータは、の影響により、予測期間を通じてより大きなセグメントであり続けると予測しています。

Q7.市場において、今後5年間に最大になると予想される地域は：

A7.アジア太平洋地域は、スマートフォン製造におけるシリコンウェーハの需要の増加と、この地域での5G技術の採用の増加により、予測期間を通じて最大の地域であり続けると予想されます。

Q8.レポートのカスタマイズは可能か：

A8.はい、Lucintelは追加費用なしで10%のカスタマイズを提供します。

目次

第1章 エグゼクティブサマリー

第2章 世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2018年から2030年までの市場動向と予測分析

• マクロ経済動向（2018～2023年）と予測（2024～2030年）
• 世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場の動向（2018～2023年）と予測（2024～2030年）
• 技術別の世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場
  • シリコンオンインシュレーター
  • バルクシリコン
• 製品別の世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場
  • メモリ
  • 発光ダイオード
  • センサー
  • 電源とアナログコンポーネント
  • 微小電気機械システム
  • その他
• ボンディング技術による世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場
  • ダイ・トゥ・ダイ
  • ダイ・トゥ・ウエハー
  • ウエハー・トゥ・ウエハー
  • 直接結合
  • 接着剤による接合
  • 金属結合
• アプリケーション別の世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場
  • 軍事
  • 航空宇宙と防衛
  • 家電
  • 情報通信技術
  • 自動車
  • その他

第4章 2018年から2030年までの地域別の市場動向と予測分析

• 地域別の世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場
• 北米の３次元集積回路とシリコン貫通電極（TSV）相互接続市場
• 欧州の３次元集積回路とシリコン貫通電極（TSV）相互接続市場
• アジア太平洋の３次元集積回路とシリコン貫通電極（TSV）相互接続市場
• その他地域の３次元集積回路とシリコン貫通電極（TSV）相互接続市場

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略分析

• 成長機会分析
  • 技術別の世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場の成長機会
  • 製品別の世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場の成長機会
  • ボンディング技術による世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場の成長機会
  • アプリケーション別の世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場の成長機会
  • 地域別の世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場の成長機会
• 世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場の容量拡大
  • 世界の３次元集積回路とシリコン貫通電極（TSV）相互接続市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 有力企業の企業プロファイル

• Amkor Technology
• Elpida Memory
• Intel Corporation
• Micron Technology
• Monolithic 3d
• Renesas Electronics Corporation

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Trends and Forecast

The future of the global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market looks promising with opportunities in the military, aerospace and defense, consumer electronics, information and communication technology, and automotive markets. The global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market is expected to reach an estimated $37.3 billion by 2030 with a CAGR of 10.7% from 2024 to 2030. The major drivers for this market are increasing need for decreased energy consumption and enhanced density, growing adoption of 3D IC and TSV interconnect solutions, and rising demand of high-performance and miniaturized electronic devices.

A more than 150-page report is developed to help in your business decisions.

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect by Segment

The study includes a forecast for the global three-dimensional integrated circuit & through-silicon via (TSV) interconnect by technology, product, bonding technique, application, and region.

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology [Shipment Analysis by Value from 2018 to 2030]:

• Silicon on Insulator
• Bulk Silicon

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Product [Shipment Analysis by Value from 2018 to 2030]:

• Memories
• Light Emitting Diodes
• Sensors
• Power and Analog Components
• Micro Electro Mechanical Systems
• Others

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Bonding Technique [Shipment Analysis by Value from 2018 to 2030]:

• Die to Die
• Die to Wafer
• Wafer to Wafer
• Direct Bonding
• Adhesive Bonding
• Metallic Bonding

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application [Shipment Analysis by Value from 2018 to 2030]:

• Military
• Aerospace and Defense
• Consumer Electronics
• Information and Communication Technology
• Automotive
• Others

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies three-dimensional integrated circuit & through-silicon via (TSV) interconnect companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the three-dimensional integrated circuit & through-silicon via (TSV) interconnect companies profiled in this report include-

• Amkor Technology
• Elpida Memory
• Intel Corporation
• Micron Technology
• Monolithic 3D
• Renesas Electronics Corporation

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market Insights

Lucintel forecasts that silicon on insulator will remain the larger segment over the forecast period.

Within this market, aerospace & defense is expected to witness the highest growth over the forecast period.

APAC will remain the largest region over the forecast period due to increasing need for silicon wafers in smartphone manufacturing and rising adoption of 5G technology in the region.

Features of the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market

Market Size Estimates: Three-dimensional integrated circuit & through-silicon via (TSV) interconnect market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Three-dimensional integrated circuit & through-silicon via (TSV) interconnect market size by technology, product, bonding technique, application, and region in terms of value ($B).

Regional Analysis: Three-dimensional integrated circuit & through-silicon via (TSV) interconnect market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different technologies, products, bonding techniques, applications, and regions for the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market size?

Answer: The global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market is expected to reach an estimated $37.3 billion by 2030.

Q.2 What is the growth forecast for three-dimensional integrated circuit & through-silicon via (TSV) interconnect market?

Answer: The global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market is expected to grow with a CAGR of 10.7% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market?

Answer: The major drivers for this market are increasing need for decreased energy consumption and enhanced density, growing adoption of 3D IC and TSV interconnect solutions, and rising demand of high-performance and miniaturized electronic devices.

Q4. What are the major segments for three-dimensional integrated circuit & through-silicon via (TSV) interconnect market?

Answer: The future of the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market looks promising with opportunities in the military, aerospace and defense, consumer electronics, information and communication technology, and automotive markets.

Q5. Who are the key three-dimensional integrated circuit & through-silicon Via (TSV) Interconnect market companies?

Answer: Some of the key three-dimensional integrated circuit & through-silicon via (TSV) interconnect companies are as follows:

• Amkor Technology
• Elpida Memory
• Intel Corporation
• Micron Technology
• Monolithic 3d
• Renesas Electronics Corporation

Q6. Which three-dimensional integrated circuit & through-silicon via (TSV) interconnect market segment will be the largest in future?

Answer: Lucintel forecasts that silicon on insulator will remain the larger segment over the forecast period due to .

Q7. In three-dimensional integrated circuit & through-silicon via (TSV) interconnect market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to increasing need for silicon wafers in smartphone manufacturing and rising adoption of 5G technology in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market by technology (silicon on insulator and bulk silicon), product (memories, light emitting diodes, sensors, power and analog components, micro electro mechanical systems, and others), bonding technique (die to die, die to wafer, wafer to wafer, direct bonding, adhesive bonding, and metallic bonding), application (military, aerospace and defense, consumer electronics, information and communication technology, automotive, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology
  • 3.3.1: Silicon on Insulator
  • 3.3.2: Bulk Silicon
• 3.4: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Product
  • 3.4.1: Memories
  • 3.4.2: Light Emitting Diodes
  • 3.4.3: Sensors
  • 3.4.4: Power and Analog Components
  • 3.4.5: Micro Electro Mechanical Systems
  • 3.4.6: Others
• 3.5: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Bonding Technique
  • 3.5.1: Die to Die
  • 3.5.2: Die to Wafer
  • 3.5.3: Wafer to Wafer
  • 3.5.4: Direct Bonding
  • 3.5.5: Adhesive Bonding
  • 3.5.6: Metallic Bonding
• 3.6: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application
  • 3.6.1: Military
  • 3.6.2: Aerospace and Defense
  • 3.6.3: Consumer Electronics
  • 3.6.4: Information and Communication Technology
  • 3.6.5: Automotive
  • 3.6.6: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Region
• 4.2: North American Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market
  • 4.2.2: North American Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application: Military, Aerospace and Defense, Consumer Electronics, Information and Communication Technology, Automotive, and Others
• 4.3: European Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market
  • 4.3.1: European Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology: Silicon on Insulator and Bulk Silicon
  • 4.3.2: European Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application: Military, Aerospace and Defense, Consumer Electronics, Information and Communication Technology, Automotive, and Others
• 4.4: APAC Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market
  • 4.4.1: APAC Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology: Silicon on Insulator and Bulk Silicon
  • 4.4.2: APAC Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application: Military, Aerospace and Defense, Consumer Electronics, Information and Communication Technology, Automotive, and Others
• 4.5: ROW Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market
  • 4.5.1: ROW Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology: Silicon on Insulator and Bulk Silicon
  • 4.5.2: ROW Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application: Military, Aerospace and Defense, Consumer Electronics, Information and Communication Technology, Automotive, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology
  • 6.1.2: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Product
  • 6.1.3: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Bonding Technique
  • 6.1.4: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application
  • 6.1.5: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Region
• 6.2: Emerging Trends in the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (Tsv) Interconnect Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (Tsv) Interconnect Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (Tsv) Interconnect Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Amkor Technology
• 7.2: Elpida Memory
• 7.3: Intel Corporation
• 7.4: Micron Technology
• 7.5: Monolithic 3d
• 7.6: Renesas Electronics Corporation