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Eスクラップ・プリント基板（PCB）Eスクラップ市場レポート：2030年までの動向、予測、競合分析

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日: | 発行: Lucintel | ページ情報: 英文 150 Pages | 納期: 3営業日

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Eスクラップ・プリント基板（PCB）Eスクラップ市場レポート：2030年までの動向、予測、競合分析
出版日: 2023年10月03日
発行: Lucintel
ページ情報: 英文 150 Pages
納期: 3営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 目次
概要

Eスクラップ・プリント基板（PCB）Eスクラップの動向と予測

世界のEスクラップ・プリント基板（PCB）Eスクラップ市場は、2024年から2030年までのCAGRが7.7%で、2030年までに推定955億米ドルに達すると予想されます。この市場の主な促進要因は、コンシューマー・エレクトロニクス市場の著しい成長、電子機器の普及拡大、新興国におけるリサイクル・リユースインフラの拡大です。世界のEスクラップ・プリント基板（PCB）Eスクラップ市場の将来性は、家電、IT・通信、娯楽機器、スマートフォン・タブレット、コンピューター・ノートPCの各市場における機会によって有望視されています。

Eスクラップ・プリント基板（PCB）Eスクラップ市場の洞察

Lucintelは、E-wasteリサイクルの重要性に対する認識が高まっていること、および世界中の政府がE-wasteリサイクルを促進するための規制を実施していることから、E-wasteリサイクルが予測期間中に最も高い成長を遂げると予測しています。

テレビ、冷蔵庫、洗濯機など多くの家電製品の寿命が短いため、この市場の中では家電製品が最大のセグメントであり続けるでしょう。

アジア太平洋は、都市化と人口の増加、電子機器の消費の増加、製造業の成長により、引き続き最大の地域であり、同地域では大量の電子廃棄物が発生しています。

市場規模・推計：Eスクラップ・プリント基板（PCB）Eスクラップの市場規模を金額（10億米ドル）で推計。

動向と予測分析：各種セグメント別、地域別の市場動向（2018年～2023年）と予測（2024年～2030年）。

セグメント分析：Eスクラップ・プリント基板（PCB）Eスクラップ市場規模をプロセスタイプ別、材料別、供給源別、地域別に金額（10億米ドル）で推定。

地域別分析：Eスクラップ・プリント基板（PCB）Eスクラップ市場の北米、欧州、アジア太平洋地域、その他世界の地域内訳。

成長機会：Eスクラップ・プリント基板（PCB）Eスクラップ市場のプロセスタイプ、材料、供給源、地域別の成長機会分析。

戦略分析：Eスクラップ・プリント基板（PCB）Eスクラップ市場のM&A、新製品開発、競合情勢など。

ポーターのファイブフォースモデルに基づく業界の競合強度分析。

本レポートは以下の11の主要な質問に回答しています：

  • Q.1.市場セグメントのうち、最も有望かつ高成長な機会は何か？
  • Q.2.どのセグメントがより速いペースで成長するのか、またその理由は？
  • Q.3.今後成長が加速すると思われる地域とその理由は？
  • Q.4.市場力学に影響を与える主な要因は何か？市場における主な課題とビジネスリスクは？
  • Q.5.この市場におけるビジネスリスクと競合の脅威は？
  • Q.6.この市場における新たな動向とその理由は？
  • Q.7.市場における顧客の需要の変化にはどのようなものがありますか？
  • Q.8.この市場における新たな開発と、その開発をリードしている企業は？
  • Q.9.この市場における主要企業は？主要企業は事業成長のためにどのような戦略的取り組みを進めているのか？
  • Q.10.この市場における競合製品にはどのようなものがあり、材料や製品の代替による市場シェア低下の脅威はどの程度ありますか？
  • Q.11.過去5年間にどのようなM&Aが行われ、業界にどのような影響を与えましたか？

目次

第1章 エグゼクティブサマリー

第2章 世界のEスクラップ・プリント基板（PCB）Eスクラップ市場：市場力学

  • イントロダクション、背景、分類
  • サプライチェーン
  • 業界の促進要因と課題

第3章 2018年から2030年までの市場動向と予測分析

  • マクロ経済動向（2018年～2023年）と予測（2024年～2030年）
  • 世界のEスクラップ・プリント基板（PCB）Eスクラップ市場の動向（2018～2023年）と予測（2024年～2030年）
  • プロセスタイプ別の世界のEスクラップ・プリント基板（PCB）Eスクラップ市場
    • 電子機器廃棄物の収集
    • 電子廃棄物管理
    • 電子機器廃棄物のリサイクル
  • 材料別の世界のEスクラップ・プリント基板（PCB）Eスクラップ市場
    • プラスチック
    • ガラス
    • 金属
    • 鉄系コンポーネント
    • 貴金属
    • レアメタル
  • 供給源別の世界のEスクラップ・プリント基板（PCB）Eスクラップ市場
    • 家庭用器具
    • ITと通信
    • エンターテイメント機器
    • スマートフォン＆タブレット
    • コンピュータとラップトップ
    • その他

第4章 2018年から2030年までの地域別の市場動向と予測分析

  • 地域別の世界のEスクラップ・プリント基板（PCB）Eスクラップ市場
  • 北米のEスクラップ・プリント基板（PCB）Eスクラップ市場
  • 欧州のEスクラップ・プリント基板（PCB）Eスクラップ市場
  • アジア太平洋のEスクラップ・プリント基板（PCB）Eスクラップ市場
  • その他地域のEスクラップ・プリント基板（PCB）Eスクラップ市場

第5章 競合の分析

  • 製品ポートフォリオ分析
  • 運用上の統合
  • ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

  • 成長機会分析
    • プロセスタイプ別の世界のEスクラップ・プリント基板（PCB）Eスクラップ市場の成長機会
    • 材料別の世界のEスクラップ・プリント基板（PCB）Eスクラップ市場の成長機会
    • 供給源別の世界のEスクラップ・プリント基板（PCB）Eスクラップ市場の成長機会
    • 地域別の世界のEスクラップ・プリント基板（PCB）Eスクラップ市場の成長機会
  • 世界のEスクラップ・プリント基板（PCB）Eスクラップ市場の新たな動向
  • 戦略的分析
    • 新製品の開発
    • 世界のEスクラップ・プリント基板（PCB）Eスクラップ市場の生産能力の拡大
    • 世界のEスクラップ・プリント基板（PCB）Eスクラップ市場における合併、買収、合弁事業
    • 認証とライセンシング

第7章 有力企業の企業プロファイル

  • Boliden Dowa
  • Holdings
  • Escrap
  • Greentec
  • MAIREC Edelmetallgesellschaft
  • MIS Eletronics
  • Umicore
  • URT Recycling Technology
  • Freeco International
  • Qizheng
目次

E-Scrap and Printed Circuit Board (PCB) E-Scrap Trends and Forecast

The future of the global E-scrap and printed circuit board (PCB) E-scrap market looks promising with opportunities in the household appliance, IT & telecommunication, entertainment device, smartphone & tablet, and computers & laptop markets. The global E-scrap and printed circuit board (PCB) E-scrap market is expected to reach an estimated $95.5 billion by 2030 with a CAGR of 7.7% from 2024 to 2030. The major drivers for this market are significantly growing consumer electronics market, increasing proliferation of electronic device, and expansion of recycle and reuse infrastructure in the emerging countries.

A more than 150-page report is developed to help in your business decisions.

E-Scrap and Printed Circuit Board (PCB) E-Scrap by Segment

The study includes a forecast for the global E-scrap and printed circuit board (PCB) E-scrap by process type, material, source, and region.

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type [Shipment Analysis by Value from 2018 to 2030]:

  • E-Waste Collection
  • E-Waste Management
  • E-Waste Recycling

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Material [Shipment Analysis by Value from 2018 to 2030]:

  • Plastics
  • Glass
  • Metals
  • Ferrous Components
  • Precious Metals
  • Rare Metals

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source [Shipment Analysis by Value from 2018 to 2030]:

  • Household Appliances
  • IT & Telecommunication
  • Entertainment Devices
  • Smartphone & Tablets
  • Computers & Laptops
  • Others

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of E-Scrap and Printed Circuit Board (PCB) E-Scrap Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies E-scrap and printed circuit board (PCB) E-scrap companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the E-scrap and printed circuit board (PCB) E-scrap companies profiled in this report include-

  • Boliden Dowa
  • Holdings
  • Escrap
  • Greentec
  • MAIREC Edelmetallgesellschaft
  • MIS Eletronics
  • Umicore
  • URT Recycling Technology
  • Freeco International
  • Qizheng

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Insights

Lucintel forecasts that E-waste recycling is expected to witness highest growth over the forecast period due to growing awareness of the importance of E-waste recycling and governments around the world are implementing regulations to promote E-waste recycling.

Within this market, household appliances will remain the largest segment due to the short lifespan of many household appliances, such as televisions, refrigerators, and washing machines.

APAC will remain the largest region due to rising urbanization and popuation along with increasing in the consumption of electronic devices, and growing manufacturing sector, which produces a significant amount of electronic waste in the region.

Features of the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market

Market Size Estimates: E-scrap and printed circuit board (PCB) E-scrap market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: E-scrap and printed circuit board (PCB) E-scrap market size by process type, material, source, and region in terms of value ($B).

Regional Analysis: E-scrap and printed circuit board (PCB) E-scrap market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different process types, materials, sources, and regions for the E-scrap and printed circuit board (PCB) E-scrap market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the E-scrap and printed circuit board (PCB) E-scrap market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the E-scrap and printed circuit board (PCB) E-scrap market size?

Answer: The global E-scrap and printed circuit board (PCB) E-scrap market is expected to reach an estimated $95.5 billion by 2030.

Q.2 What is the growth forecast for E-scrap and printed circuit board (PCB) E-scrap market?

Answer: The global E-scrap and printed circuit board (PCB) E-scrap market is expected to grow with a CAGR of 7.7% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the E-scrap and printed circuit board (PCB) E-scrap market?

Answer: The major drivers for this market are significantly growing consumer electronics market, increasing proliferation of electronic device, and expansion of recycle and reuse infrastructure in the emerging countries.

Q4. What are the major segments for E-scrap and printed circuit board (PCB) E-scrap market?

Answer: The future of the global E-scrap and printed circuit board (PCB) E-scrap market looks promising with opportunities in the household appliance, IT & telecommunication, entertainment device, smartphone & tablet, and computers & laptop markets.

Q5. Who are the key E-scrap and printed circuit board (PCB) E-scrap market companies?

Answer: Some of the key E-scrap and printed circuit board (PCB) E-scrap companies are as follows:

  • Boliden Dowa
  • Holdings
  • Escrap
  • Greentec
  • MAIREC Edelmetallgesellschaft
  • MIS Eletronics
  • Umicore
  • URT Recycling Technology
  • Freeco International
  • Qizheng

Q6. Which E-scrap and printed circuit board (PCB) E-scrap market segment will be the largest in future?

Answer: Lucintel forecasts that E-waste recycling is expected to witness highest growth over the forecast period due to growing awareness of the importance of E-waste recycling and governments around the world are implementing regulations to promote E-waste recycling.

Q7. In E-scrap and printed circuit board (PCB) E-scrap market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region due to rising urbanization and popuation along with increasing in the consumption of electronic devices, and growing manufacturing sector, which produces a significant amount of electronic waste in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the E-scrap and printed circuit board (PCB) E-scrap market by process type (E-waste collection, E-waste management, and E-waste recycling), material (plastics, glass, metals, ferrous components, precious metals, and rare metals), source (household appliances, IT & telecommunication, entertainment devices, smartphone & tablets, computers & laptops, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type
    • 3.3.1: E-waste Collection
    • 3.3.2: E-waste Management
    • 3.3.3: E-waste Recycling
  • 3.4: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Material
    • 3.4.1: Plastics
    • 3.4.2: Glass
    • 3.4.3: Metals
    • 3.4.4: Ferrous Components
    • 3.4.5: Precious Metals
    • 3.4.6: Rare Metals
  • 3.5: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source
    • 3.5.1: Household Appliances
    • 3.5.2: IT & Telecommunication
    • 3.5.3: Entertainment Devices
    • 3.5.4: Smartphone & Tablets
    • 3.5.5: Computers & Laptops
    • 3.5.6: Others
  • 3.6: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Region
  • 4.2: North American E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
    • 4.2.2: North American E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source: Household Appliances, IT & Telecommunication, Entertainment Devices, Smartphone & Tablets, Computers & Laptops, and Others
  • 4.3: European E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
    • 4.3.1: European E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type: E-waste Collection, E-waste Management, and E-waste Recycling
    • 4.3.2: European E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source: Household Appliances, IT & Telecommunication, Entertainment Devices, Smartphone & Tablets, Computers & Laptops, and Others
  • 4.4: APAC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
    • 4.4.1: APAC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type: E-waste Collection, E-waste Management, and E-waste Recycling
    • 4.4.2: APAC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source: Household Appliances, IT & Telecommunication, Entertainment Devices, Smartphone & Tablets, Computers & Laptops, and Others
  • 4.5: ROW E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
    • 4.5.1: ROW E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type: E-waste Collection, E-waste Management, and E-waste Recycling
    • 4.5.2: ROW E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source: Household Appliances, IT & Telecommunication, Entertainment Devices, Smartphone & Tablets, Computers & Laptops, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Process Type
    • 6.1.2: Growth Opportunities for the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Material
    • 6.1.3: Growth Opportunities for the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Source
    • 6.1.4: Growth Opportunities for the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Region
  • 6.2: Emerging Trends in the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: CAPACity Expansion of the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Boliden Dowa
  • 7.2: Holdings
  • 7.3: Escrap
  • 7.4: Greentec
  • 7.5: MAIREC Edelmetallgesellschaft
  • 7.6: MIS Eletronics
  • 7.7: Umicore
  • 7.8: URT Recycling Technology
  • 7.9: Freeco International
  • 7.10: Qizheng