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市場調査レポート
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1356868

半導体めっき装置市場レポート：2030年までの動向、予測、競合分析

Semiconductor Plating System Market Report: Trends, Forecast and Competitive Analysis to 2030

出版日
発行
Lucintel
ページ情報
英文 150 Pages
納期
3営業日
カスタマイズ可能
適宜更新あり
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半導体めっき装置市場レポート：2030年までの動向、予測、競合分析
出版日: 2023年09月01日
発行: Lucintel
ページ情報: 英文 150 Pages
納期: 3営業日
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  • 概要
  • 目次
概要

半導体めっきシステムの動向と予測

世界の半導体めっきシステム市場は、2024年から2030年までのCAGRが4.5%で、2030年には推定74億米ドルに達すると予想されています。この市場の主な促進要因は、自動車分野での電子部品の普及率の増加、半導体需要の急増、銅めっきの利用率の上昇です。TSV、銅ピラー、再分配層（RDL）、アンダーバンプメタライゼーション（UBM）、バンピングの各市場における機会により、世界の半導体めっきシステム市場の将来は有望と思われます。

半導体めっき装置市場の洞察

Lucintelの予測では、全自動めっき装置が予測期間中に最も高い成長を遂げる見込みです。

この市場では、再分配層（RDL）が引き続き最大セグメントです。

アジア太平洋は予測期間中に最も高い成長が見込まれます。

本レポートでは、以下の11の主要な質問に回答している：

  • Q.1.市場セグメントのうち、最も有望かつ高成長な機会は何か？
  • Q.2.どのセグメントがより速いペースで成長するのか、またその理由は？
  • Q.3.今後成長が加速すると思われる地域とその理由は？
  • Q.4.市場力学に影響を与える主な要因は何か？市場における主な課題とビジネスリスクは？
  • Q.5.この市場におけるビジネスリスクと競合の脅威は？
  • Q.6.この市場における新たな動向とその理由は？
  • Q.7.市場における顧客の需要の変化にはどのようなものがありますか？
  • Q.8.この市場における新たな開発と、その開発をリードしている企業は？
  • Q.9.この市場における主要企業は？主要企業は事業成長のためにどのような戦略的取り組みを進めているのか？
  • Q.10.この市場における競合製品にはどのようなものがあり、材料や製品の代替による市場シェア低下の脅威はどの程度ありますか？
  • Q.11.過去5年間にどのようなM&Aが行われ、業界にどのような影響を与えましたか？

目次

第1章 エグゼクティブサマリー

第2章 世界の半導体めっきシステム市場：市場力学

  • イントロダクション、背景、分類
  • サプライチェーン
  • 業界の促進要因と課題

第3章 2018年から2030年までの市場動向と予測分析

  • マクロ経済動向（2018～2023年）と予測（2024～2030年）
  • 世界の半導体めっきシステム市場動向（2018～2023年）と予測（2024～2030年）
  • タイプ別の世界の半導体めっきシステム市場
    • 全自動
    • 半自動
    • マニュアル
  • 技術別の世界の半導体めっきシステム市場
    • 電気めっき
    • 無電解
  • ウエハーサイズ別の世界の半導体めっきシステム市場
    • 100mmまで
    • 100mm～200mm
    • 200mm以上
  • 用途別の世界の半導体めっきシステム市場
    • TSV
    • 銅の柱
    • 再配布層（RDL）
    • アンダーバンプメタライゼーション（UBM）
    • ぶつかる
    • その他

第4章 2018年から2030年までの地域別の市場動向と予測分析

  • 地域別の世界の半導体めっきシステム市場
  • 北米半導体めっき装置市場
  • 欧州半導体めっき装置市場
  • アジア太平洋半導体めっきシステム市場
  • その他地域半導体めっき装置市場

第5章 競合の分析

  • 製品ポートフォリオ分析
  • 運用上の統合
  • ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

  • 成長機会分析
    • タイプ別の世界の半導体めっきシステム市場の成長機会
    • 技術別の世界の半導体めっきシステム市場の成長機会
    • ウエハーサイズ別の世界の半導体めっきシステム市場の成長機会
    • アプリケーション別の世界の半導体めっきシステム市場の成長機会
    • 地域別の世界の半導体めっきシステム市場の成長機会
  • 世界の半導体めっきシステム市場の新たな動向
  • 戦略的分析
    • 新製品の開発
    • 世界の半導体めっき装置市場の能力拡大
    • 世界の半導体めっきシステム市場における合併、買収、合弁事業
    • 認証とライセンシング

第7章 有力企業の企業プロファイル

  • ACM Research
  • Applied Materials
  • ASMPT
  • ClassOne Technology
  • Ebara Technologies
  • Hitachi Power Solutions
  • LAM Research Corporation
  • Mitmo Semicon Engineering
  • RENA Technologies
  • Tanaka Holdings
目次

Semiconductor Plating System Trends and Forecast

The future of the global semiconductor plating system market looks promising with opportunities in the TSV, copper pillar, redistribution layer (RDL), under bump metallization (UBM), and bumping markets. The global semiconductor plating system market is expected to reach an estimated $7.4 billion by 2030 with a CAGR of 4.5% from 2024 to 2030. The major drivers for this market are increasing penetration of electronic components in the automotive sector, surge in the demand for semiconductors, and utilization of copper plating has seen an upswing.

A more than 150-page report is developed to help in your business decisions.

Semiconductor Plating System by Segment

The study includes a forecast for the global semiconductor plating system by type, technology, wafer size, application, and region.

Semiconductor Plating System Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Fully Automatic
  • Semi-Automatic
  • Manual

Semiconductor Plating System Market by Technology [Shipment Analysis by Value from 2018 to 2030]:

  • Electroplating
  • Electroless

Semiconductor Plating System Market by Wafer Size [Shipment Analysis by Value from 2018 to 2030]:

  • Up to 100 mm
  • 100 mm - 200 mm
  • Above 200 mm

Semiconductor Plating System Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • TSV
  • Copper Pillar
  • Redistribution Layer (RDL)
  • Under Bump Metallization (UBM)
  • Bumping
  • Others

Semiconductor Plating System Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Semiconductor Plating System Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor plating system companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor plating system companies profiled in this report include-

  • ACM Research
  • Applied Materials
  • ASMPT
  • Classone Technology
  • Ebara Technologies
  • Hitachi Power Solutions
  • Lam Research Corporation
  • Mitmo Semicon Engineering
  • Rena Technologies
  • Tanaka Holdings

Semiconductor Plating System Market Insights

Lucintel forecasts that fully automatic is expected to witness highest growth over the forecast period.

Within this market, redistribution layer (RDL) will remain the largest segment.

APAC is expected to witness highest growth over the forecast period.

Features of the Global Semiconductor Plating System Market

Market Size Estimates: Semiconductor plating system market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Semiconductor plating system market size by type, technology, and region. in terms of value ($B).

Regional Analysis: Semiconductor plating system market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, technologies, and region.s for the semiconductor plating system market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the semiconductor plating system market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1. What is the semiconductor plating system market size?

Answer: The global semiconductor plating system market is expected to reach an estimated $7.4 billion by 2030.

Q.2. What is the growth forecast for semiconductor plating system market?

Answer: The global semiconductor plating system market is expected to grow with a CAGR of 4.5% from 2024 to 2030.

Q.3. What are the major drivers influencing the growth of the semiconductor plating system market?

Answer: The major drivers for this market are increasing penetration of electronic components in the automotive sector, surge in the demand for semiconductors, and utilization of copper plating has seen an upswing.

Q.4. What are the major segments for semiconductor plating system market?

Answer: The future of the semiconductor plating system market looks promising with opportunities in the TSV, copper pillar, redistribution layer (RDL), under bump metallization (UBM), and bumping markets.

Q.5. Who are the key semiconductor plating system market companies?

Answer: Some of the key semiconductor plating system companies are as follows:

  • ACM Research
  • Applied Materials
  • ASMPT
  • ClassOne Technology
  • Ebara Technologies
  • Hitachi Power Solutions
  • LAM Research Corporation
  • Mitmo Semicon Engineering
  • RENA Technologies
  • Tanaka Holdings

Q.6. Which semiconductor plating system market segment will be the largest in future?

Answer: Lucintel forecasts that fully automatic is expected to witness highest growth over the forecast period.

Q.7. In semiconductor plating system market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period.

Q.8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the semiconductor plating system market by type (fully automatic, semi-automatic, and manual), technology (electroplating and electroless), wafer size (up to 100 mm, 100 mm - 200 mm, and above 200 mm), application (TSV, copper pillar, redistribution layer (RDL), under bump metallization (UBM), bumping, and others), and region. (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Semiconductor Plating System Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Semiconductor Plating System Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Semiconductor Plating System Market by Type
    • 3.3.1: Fully Automatic
    • 3.3.2: Semi-Automatic
    • 3.3.3: Manual
  • 3.4: Global Semiconductor Plating System Market by Technology
    • 3.4.1: Electroplating
    • 3.4.2: Electroless
  • 3.5: Global Semiconductor Plating System Market by Wafer Size
    • 3.5.1: Up to 100 mm
    • 3.5.2: 100 mm - 200 mm
    • 3.5.3: Above 200 mm
  • 3.6: Global Semiconductor Plating System Market by Application
    • 3.6.1: TSV
    • 3.6.2: Copper Pillar
    • 3.6.3: Redistribution Layer (RDL)
    • 3.6.4: Under Bump Metallization (UBM)
    • 3.6.5: Bumping
    • 3.6.6: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Semiconductor Plating System Market by Region
  • 4.2: North American Semiconductor Plating System Market
    • 4.2.2: North American Semiconductor Plating System Market by Application: TSV, Copper Pillar, Redistribution Layer (RDL), Under Bump Metallization (UBM), Bumping, and Others
  • 4.3: European Semiconductor Plating System Market
    • 4.3.1: European Semiconductor Plating System Market by Type: Fully Automatic, Semi-Automatic, and Manual
    • 4.3.2: European Semiconductor Plating System Market by Application: TSV, Copper Pillar, Redistribution Layer (RDL), Under Bump Metallization (UBM), Bumping, and Others
  • 4.4: APAC Semiconductor Plating System Market
    • 4.4.1: APAC Semiconductor Plating System Market by Type: Fully Automatic, Semi-Automatic, and Manual
    • 4.4.2: APAC Semiconductor Plating System Market by Application: TSV, Copper Pillar, Redistribution Layer (RDL), Under Bump Metallization (UBM), Bumping, and Others
  • 4.5: ROW Semiconductor Plating System Market
    • 4.5.1: ROW Semiconductor Plating System Market by Type: Fully Automatic, Semi-Automatic, and Manual
    • 4.5.2: ROW Semiconductor Plating System Market by Application: TSV, Copper Pillar, Redistribution Layer (RDL), Under Bump Metallization (UBM), Bumping, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Semiconductor Plating System Market by Type
    • 6.1.2: Growth Opportunities for the Global Semiconductor Plating System Market by Technology
    • 6.1.3: Growth Opportunities for the Global Semiconductor Plating System Market by Wafer Size
    • 6.1.4: Growth Opportunities for the Global Semiconductor Plating System Market by Application
    • 6.1.5: Growth Opportunities for the Global Semiconductor Plating System Market by Region
  • 6.2: Emerging Trends in the Global Semiconductor Plating System Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Semiconductor Plating System Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Semiconductor Plating System Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: ACM Research
  • 7.2: Applied Materials
  • 7.3: ASMPT
  • 7.4: ClassOne Technology
  • 7.5: Ebara Technologies
  • 7.6: Hitachi Power Solutions
  • 7.7: LAM Research Corporation
  • 7.8: Mitmo Semicon Engineering
  • 7.9: RENA Technologies
  • 7.10: Tanaka Holdings