IO-Link市場：動向、機会、競合分析【2023-2028年】

IO-Link市場の動向と予測

世界のIO-Link市場は、2023年から2028年までのCAGRが20.40%で、2028年までに推定324億米ドルに達すると予測されています。この市場の主な促進要因は、インダストリー4.0に対する需要の高まり、産業オートメーションの導入に向けた政府の取り組みの高まり、製造業における信頼性の高いコンパクトなソリューションに対する消費者の志向の高まりです。世界のIO-Link市場の将来は、工作機械、ハンドリング＆アセンブリオートメーション、イントラロジスティック、パッケージング市場にビジネスチャンスがありそうです。

IO-Link市場の洞察

• Lucintelの予測では、IO-linkマスタは、入力モジュール、バルブ、センサ、バイナリ出力を含む8つのIOリンクデバイスを接続するフィールドアプリケーションのゲートウェイとして使用されることが増えているため、予測期間中に最も成長するセグメントです。
• 工作機械は、IOリンクが多くの種類のセンサやアクチュエータとの互換性と柔軟性を提供するため、このセグメントであり続けると思われます。
• 欧州は、高度に進化したコネクテッドカーや自律走行車に対する需要が増加しており、自動車、航空宇宙、産業用製造業が同地域に存在するため、予測期間中最大の地域であり続けると思われます。

本レポートでは、以下の11の主要な質問に回答している：

• Q.1.市場セグメントのうち、最も有望かつ高成長な機会は何か？
• Q.2.どのセグメントがより速いペースで成長するのか、またその理由は？
• Q.3.今後成長が加速すると思われる地域とその理由は？
• Q.4.市場力学に影響を与える主な要因は何か？市場における主な課題とビジネスリスクは？
• Q.5.この市場におけるビジネスリスクと競合の脅威は？
• Q.6.この市場における新たな動向とその理由は？
• Q.7.市場における顧客の需要の変化にはどのようなものがありますか？
• Q.8.この市場における新たな開発と、その開発をリードしている企業は？
• Q.9.この市場における主要企業は？また、主要企業はどのような戦略的取り組みを進めているのでしょうか。
• Q10.この市場における競合製品にはどのようなものがあり、材料や製品の代替による市場シェア低下の脅威はどの程度あるのか？
• Q11.過去5年間にどのようなM&Aが行われ、業界にどのような影響を与えたか？

目次

第1章 エグゼクティブサマリー

第2章 世界のIO-Link市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2017年から2028年までの市場動向と予測分析

• マクロ経済動向（2017～2022年）と予測（2023～2028年）
• 世界のIO-Link市場動向（2017～2022年）と予測（2023～2028年）
• タイプ別の世界のIO-Link市場
  • IOリンク有線
  • IOリンクワイヤレス
• アプリケーション別の世界のIO-Link市場
  • 工作機械
  • 取り扱いと組立の自動化
  • イントラロジスティクス
  • 包装
• コンポーネント別の世界のIO-Link市場
  • IOリンクマスター
  • IOリンクデバイス
  • センサーノード
  • モジュール
  • アクチュエーター
  • RFID読み取りヘッド
  • その他

第4章 2017年から2028年までの地域別の市場動向と予測分析

• 地域別の世界のIO-Link市場
• 北米のIO-Link市場
• 欧州IO-Link市場
• アジア太平洋 IO-Link市場
• その他地域 IO-Link市場

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
  • タイプ別の世界のIO-Link市場の成長機会
  • アプリケーション別の世界のIO-Link市場の成長機会
  • コンポーネント別の世界のIO-Link市場の成長機会
  • 地域別の世界のIO-Link市場の成長機会
• 世界のIO-Link市場における新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界のIO-Link市場の能力拡大
  • 世界のIO-Link市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 有力企業の企業プロファイル

• Balluff
• ifm electronic
• Banner
• SICK
• Siemens
• Emerson
• Rockwell Automation
• Pepperl+Fuchs
• Hans Turck
• Omron Corporation

IO-Link Market Trends and Forecast

The future of the global IO-link market looks promising with opportunities in the machine tool, handling & assembly automation, intralogistic, and packaging markets. The global IO-link market is expected to reach an estimated $32.4 billion by 2028 with a CAGR of 20.40% from 2023 to 2028. The major drivers for this market are growing demand for growing demand for industry 4.0, rising government initiatives towards the adoption of industrial automation and increasing consumer inclination towards reliable and compact solutions in the manufacturing industry.

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IO-Link Market by Segment

The study includes trends and forecast for the global IO-link market by type, application, component and region, as follows:

IO-Link Market by Type [Shipment Analysis by Value from 2017 to 2028]:

• IO-link Wired
• IO-link Wireless

IO-Link Market by Application [Shipment Analysis by Value from 2017 to 2028]:

• Machine Tool
• Handling & Assembly Automation
• Intralogistics
• Packaging

IO-Link Market by Component [Shipment Analysis by Value from 2017 to 2028]:

• IO-link Master
• IO-link Devices
• Sensor Nodes
• Modules
• Actuators
• RFID Read Heads
• Others

IO-Link Market by Region [Shipment Analysis by Value from 2017 to 2028]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of IO-Link Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, IO-link companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the IO-link companies profiled in this report include:

• Balluff
• ifm electronic
• Banner
• SICK
• Siemens
• Emerson
• Rockwell Automation
• Pepperl+Fuchs
• Hans Turck
• Omron Corporation

IO-Link Market Insights

• Lucintel forecasts that IO-link masters will witness the highest growing segment over the forecast period due to its increasing usage as gateway in field applications for connecting eight IO link devices, which include input modules, valves, sensors, and binary output.
• Machine tools will remain the segment because IO-link delivers compatibility as well as flexibility with many types of sensors and actuators, which is mostly used in the industrial automotive systems.
• Europe will remain the largest region over the forecast period due to the increasing demand for highly advanced connected cars and autonomous vehicles and existence of automotive, aerospace, and industrial manufacturing verticals in the region.

Features of the IO-Link Market

• Market Size Estimates: IO-link market size estimation in terms of value ($B)
• Trend and Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
• Segmentation Analysis: IO-link market size by various segments, such as by type, application, component, and region
• Regional Analysis: IO-link market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
• Growth Opportunities: Analysis on growth opportunities in different types, applications, components, and regions for the IO-link market.
• Strategic Analysis: This includes M&A, new product development, and competitive landscape for the IO-link market.
• Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

• Q1. What is the IO-link market size?
• Answer: The global IO-link market is expected to reach an estimated $32.4 billion by 2028.
• Q2. What is the growth forecast for IO-link market?
• Answer: The global IO-link market is expected to grow with a CAGR of 20.40% from 2023 to 2028.
• Q3. What are the major drivers influencing the growth of the IO-link market?
• Answer: The major drivers for this market are growing demand for growing demand for industry 4.0, rising government initiatives towards the adoption of industrial automation, and increasing consumer inclination towards reliable and compact solutions in the manufacturing industry.
• Q4. What are the major segments for IO-link market?
• Answer: The future of the global IO-link market looks promising with opportunities in the machine tool, handling & assembly automation, intralogistic, and packaging markets.
• Q5. Who are the key IO-link companies?
• Answer: Some of the key IO-link companies are as follows:
  • Balluff
  • ifm electronic
  • Banner
  • SICK
  • Siemens
  • Emerson
  • Rockwell Automation
  • Pepperl+Fuchs
  • Hans Turck
  • Omron Corporation
• Q6. Which IO-link segment will be the largest in future?
• Answer:Lucintel forecast that IO-link masters will witness the highest growing segment over the forecast period due to its increasing usage as gateway in field applications for connecting eight IO link devices, which includes input modules, valves, sensors, and binary output.
• Q7. In IO-link market, which region is expected to be the largest in next 5 years?
• Answer: Europe will remain the largest region over the forecast period due to the increasing demand for highly advanced connected cars and autonomous vehicles and existence of automotive, aerospace, and industrial manufacturing verticals in the region.
• Q8. Do we receive customization in this report?
• Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the global IO-link market by type (IO-link wired, and IO-link wireless), application (machine tool, handling & assembly automation, intralogistic, and packaging), component (IO-link master, IO-link devices, sensor nodes, modules, actuators, RFID read heads, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global IO-Link Market: Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

• 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
• 3.2: Global IO-Link Market Trends (2017-2022) and Forecast (2023-2028)
• 3.3: Global IO-Link Market by Type
  • 3.3.1: IO-link Wired
  • 3.3.2: IO-link Wireless
• 3.4: Global IO-Link Market by Application
  • 3.4.1: Machine Tool
  • 3.4.2: Handling & Assembly Automation
  • 3.4.3: Intralogistics
  • 3.4.4: Packaging
• 3.5: Global IO-Link Market by Component
  • 3.5.1: IO-link Master
  • 3.5.2: IO-link Devices
  • 3.5.3: Sensor Nodes
  • 3.5.4: Modules
  • 3.5.5: Actuators
  • 3.5.6: RFID Read Heads
  • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

• 4.1: Global IO-Link Market by Region
• 4.2: North American IO-Link Market
  • 4.2.1: North American IO-Link Market by Type: IO-link Wired, and IO-link Wireless
  • 4.2.2: North American IO-Link Market by Application: Machine Tool, Handling & Assembly Automation, Intralogistics, and Packaging
• 4.3: European IO-Link Market
  • 4.3.1: European IO-Link Market by Type: IO-link Wired, and IO-link Wireless
  • 4.3.2: European IO-Link Market by Application: Machine Tool, Handling & Assembly Automation, Intralogistics, and Packaging
• 4.4: APAC IO-Link Market
  • 4.4.1: APAC IO-Link Market by Type: IO-link Wired, and IO-link Wireless
  • 4.4.2: APAC IO-Link Market by Application: Machine Tool, Handling & Assembly Automation, Intralogistics, and Packaging
• 4.5: ROW IO-Link Market
  • 4.5.1: ROW IO-Link Market by Type: IO-link Wired, and IO-link Wireless
  • 4.5.2: ROW IO-Link Market by Application: Machine Tool, Handling & Assembly Automation, Intralogistics, and Packaging

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global IO-Link Market by Type
  • 6.1.2: Growth Opportunities for the Global IO-Link Market by Application
  • 6.1.3: Growth Opportunities for the Global IO-Link Market by Component
  • 6.1.4: Growth Opportunities for the Global IO-Link Market by Region
• 6.2: Emerging Trends in the Global IO-Link Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global IO-Link Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global IO-Link Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Balluff
• 7.2: ifm electronic
• 7.3: Banner
• 7.4: SICK
• 7.5: Siemens
• 7.6: Emerson
• 7.7: Rockwell Automation
• 7.8: Pepperl+Fuchs
• 7.9: Hans Turck
• 7.10: Omron Corporation