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市場調査レポート
商品コード
1373619
アクティブ電子部品の世界市場規模、シェア、産業動向分析レポート:製品タイプ別、エンドユーザー別、地域別展望と予測、2023年~2030年Global Active Electronic Component Market Size, Share & Industry Trends Analysis Report By Product Type, By End User, By Regional Outlook and Forecast, 2023 - 2030 |
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アクティブ電子部品の世界市場規模、シェア、産業動向分析レポート:製品タイプ別、エンドユーザー別、地域別展望と予測、2023年~2030年 |
出版日: 2023年09月30日
発行: KBV Research
ページ情報: 英文 460 Pages
納期: 即納可能
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アクティブ電子部品の市場規模は、予測期間中にCAGR 6.4%で成長し、2030年には4,777億米ドルに達すると予測されます。2022年の市場規模は53億8,160万台、成長率は5.2%(2019-2022年)。
KBV Cardinal matrixに掲載された分析によると、Broadcom Inc.、Intel Corporation、Texas Instruments, Inc.が市場の先行者です。2022年12月、Broadcom Inc.はRohde & Schwarzと協業し、デュアルバンド2×2 IEEE 802.11be準拠の同時動作をサポートするBroadcom Wi-Fi 7チップセットの自動テストソリューションを発表しました。Analog Devices, Inc.、NXP Semiconductors N.V.、STMicroelectronics N.V.などの企業が、この市場における主要なイノベーターです。
市場成長要因
幅広い産業における自動化の高まり
工業プロセスにおいて、精度と正確さは非常に重要です。センサー、エンコーダー、フィードバック制御システムなどのアクティブ・コンポーネントは、正確な操作を保証するために必要なデータと制御メカニズムを提供します。プログラマブルロジックコントローラ、センサ、アクチュエータを含む産業用オートメーションシステムは、製造プロセスを合理化し、生産性を向上させ、生産時間を短縮します。アクティブ電子部品は、これらのシステムの操作と通信を容易にします。さらに、効率性と応答性を高めるためには、産業オペレーションをリモートで監視・制御することが不可欠です。これらの要因は、今後数年間、市場に有利な見通しをもたらすと思われます。
世界のカーエレクトロニクス需要の増加
EVは、バッテリーパックと電気モーター間の電気の流れを管理するために、インバーターやコンバーターのようなパワーエレクトロニクス・コンポーネントを使用します。これらのコンポーネントは、電力供給、回生ブレーキ、充電を制御します。バッテリー管理システム(BMS)コンポーネントは、バッテリーパックの充電状態、健康状態、温度を監視します。バッテリーの寿命を最大限に延ばしながら、安全で効率的な運転を保証します。電気駆動システムには、電気モーター、モーター・コントローラー、センサーが含まれます。さらに自律走行車は、レーダー、LiDAR、カメラ、超音波センサーなど、さまざまなセンサーを使用して環境を認識します。自律走行車は、他の車両、インフラ、データセンターと通信しなければなりません。車車間(V2V)および車車間(V2I)通信用の電子部品は不可欠です。
市場抑制要因
半導体需給バランスの悪化
半導体の需給不均衡は、確かに市場に大きな影響を与える可能性があります。半導体の需給バランスが崩れて半導体が不足し、高価になると、アクティブ電子部品メーカーは必要な半導体部品の調達で課題に直面する可能性があります。その結果、生産に遅れが生じたり、能動部品の入手性が低下したりする可能性があります。半導体価格の上昇は、アクティブ電子部品の製造コストを押し上げ、最終消費者の価格上昇につながる可能性があります。これは製品の競合に影響し、メーカーの利益率を低下させる可能性があります。半導体部品のリードタイムが長くなると、アクティブ電子部品メーカーのリードタイムも延びる可能性があります。重要な半導体の入荷が遅れれば、生産スケジュールや顧客への納品に支障をきたす可能性があります。
製品展望
製品タイプにより、市場は半導体デバイス、真空管、ディスプレイデバイス、その他に分けられます。2022年には、ディスプレイデバイス分野が市場でかなりの収益シェアを獲得しました。コンシューマーエレクトロニクス産業は、スマートフォン、タブレット、ノートパソコン、テレビ、ゲーム機、ウェアラブルなどのディスプレイデバイスの需要を引き続き大きく牽引しています。消費者がより高解像度の画面、より高速なリフレッシュレート、革新的なフォームファクターを求める中、メーカーはこうした需要に応えるため、先進的なディスプレイ技術の開発を迫られています。OLED(有機発光ダイオード)ディスプレイは、その鮮やかな色、深い黒、柔軟性で人気を博しています。ミニLEDやマイクロLEDディスプレイも、従来のLCDに代わるものとして台頭してきており、明るさとコントラストを向上させています。これらの技術は、さまざまな用途で採用が進むと思われます。これらの利点はすべて、今後数年間のディスプレイ・デバイス需要を押し上げるのに役立つと思われます。
半導体デバイスの展望
半導体デバイス分野は、ダイオード、トランジスタ、集積回路(IC)、オプトエレクトロニクスに細分されます。2022年には、トランジスタのサブセグメントが市場で大きな収益シェアを記録しました。自動車エレクトロニクスでは、エンジン制御ユニット(ECU)、インフォテインメント・システム、安全機能などにトランジスタが使用されています。自動車産業が電気自動車や自律走行車で進化するにつれて、トランジスタの需要は増加する可能性があります。5Gネットワークの展開と通信インフラの継続的な拡大には、RFトランジスタやパワーアンプを含む幅広いトランジスタが必要です。トランジスターは、電圧調整とスイッチング作業を行うパワーエレクトロニクスの主要部品です。
エンドユーザーの展望
エンドユーザー別では、民生用エレクトロニクス、ネットワーキング&通信、自動車、製造、航空宇宙&防衛、ヘルスケア、その他に区分されます。自動車分野は、2022年の市場で有望な収益シェアを示しています。自動車産業は、電気自動車やハイブリッド車へと大きくシフトしています。これらの自動車は、パワーエレクトロニクス、センサー、制御システムなどの高度なアクティブ電子部品に大きく依存しています。自動車メーカーが電気自動車のポートフォリオを拡大するにつれて、パワー・インバータ、モーター・ドライブ、バッテリー管理システムなどのコンポーネントの需要が急増すると予想されます。アダプティブ・クルーズ・コントロール、レーンキーピング・アシスタンス、自動緊急ブレーキなどのADAS技術は、最近の自動車では標準装備になりつつあります。これらのシステムはセンサー、レーダー、LiDAR、カメラに大きく依存しており、高性能センサーの需要を牽引しています。
地域別展望
地域別に見ると、市場は北米、欧州、アジア太平洋、ラテンアメリカ、中東、アフリカに分けられます。2022年の市場では、アジア太平洋セグメントが最も高い収益シェアを獲得しました。アジア太平洋、特に中国、台湾、韓国、日本などの国々は、電子部品や電子デバイスの製造拠点として古くから知られています。多くの大手半導体メーカーや電子部品サプライヤーがこの地域に拠点を置いています。アジア太平洋地域は世界人口の大部分を擁し、民生用電子機器の高い需要を牽引しています。これには、スマートフォン、ノートパソコン、テレビ、その他能動部品に依存する電子機器が含まれます。このような要因から、このセグメントは将来的に急成長すると思われます。
The Global Active Electronic Component Market size is expected to reach $477.7 billion by 2030, rising at a market growth of 6.4% CAGR during the forecast period. In the year 2022, the market attained a volume of 5,381.6 million units, experiencing a growth of 5.2% (2019-2022).
The trend of urbanization is linked to population growth. As more people move to urban areas, there's often an increased demand for consumer electronics due to the need for connectivity, entertainment, and productivity tools. Therefore, the Consumer Electronics segment would acquire around 30% share in the market by 2030. The rollout of 5G networks worldwide is expected to impact consumer electronics. Devices will need to support faster data speeds and lower latency, requiring components like RF (Radio Frequency) modules and antennas to enable 5G connectivity. The Internet of Things ecosystem is expanding, developing IoT devices for smart homes, wearables, and connected appliances. These devices require a range of electronic components, including sensors, microcontrollers, and wireless communication modules.
The major strategies followed by the market participants are Partnerships as the key developmental strategy to keep pace with the changing demands of end users. For instance, In August 2023, Intel Corporation entered into an agreement with Synopsys, Inc., to serve the foundry customers of Intel by developing Intel 3 and Intel 18A using IP (intellectual property) and EDA (electronic design automation). Additionally, In June 2023, Infineon Technologies AG entered into a partnership with Kontrol Technologies Corp, to develop an algorithm-based solution which controls the legal controls and the boundary settings for vehicles.
Based on the Analysis presented in the KBV Cardinal matrix; Broadcom Inc., Intel Corporation and Texas Instruments, Inc. are the forerunners in the Market. In December, 2022, Broadcom Inc. collaborated with Rohde & Schwarz, to launch the automated test solution for Broadcom Wi-Fi 7 chipsets which supports simultaneous dual-band 2×2 IEEE 802.11be compliant operation. Companies such as Analog Devices, Inc., NXP Semiconductors N.V., STMicroelectronics N.V. are some of the key innovators in the Market.
Market Growth Factors
Rising automation in a wide range of industries
Precision and accuracy are critical in industrial processes. Active components like sensors, encoders, and feedback control systems provide the necessary data and control mechanisms to ensure precise operations. Industrial automation systems, including programmable logic controllers, sensors, and actuators, streamline manufacturing processes, increasing productivity and reducing production time. Active electronic components facilitate the operation and communication of these systems. In addition, for efficiency and responsiveness, remotely monitoring and controlling industrial operations is essential. These factors will pose a lucrative prospect for the market in the coming years.
Increasing demand in automotive electronics worldwide
EVs use power electronics components like inverters and converters to manage the flow of electricity between the battery pack and the electric motor. These components control power delivery, regenerative braking, and charging. Battery Management Systems (BMS) components monitor the battery pack's state of charge, health, and temperature. They ensure safe and efficient operation while maximizing battery life. Electric drive systems include electric motors, motor controllers, and sensors. Moreover, autonomous vehicles use a variety of sensors, including radar, LiDAR, cameras, and ultrasonic sensors, to perceive their environment. Autonomous vehicles must communicate with other vehicles, infrastructure, and data centres. Electronic components for vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication are integral.
Market Restraining Factors
Rising semiconductor supply-demand imbalance
The semiconductor supply-demand imbalance can indeed have a significant impact on the market. As semiconductors become scarcer and more expensive due to supply imbalances, manufacturers of active electronic components may face challenges in sourcing the necessary semiconductor components. This can lead to production delays and reduced availability of active components. The rising prices of semiconductors can drive up manufacturing costs for active electronic components, potentially leading to higher prices for end consumers. This can affect the competitiveness of products and reduce profit margins for manufacturers. Longer lead times for semiconductor components can also extend the lead times for active electronic component manufacturers. Delays in receiving critical semiconductor inputs can disrupt production schedules and customer deliveries.
Product Outlook
Based on product type, the market is divided into semiconductor devices, vacuum tube, display devices, and others. In 2022, the display devices segment garnered a considerable revenue share in the market. The consumer electronics industry continues to be a significant driver of demand for display devices, which includes smartphones, tablets, laptops, TVs, gaming consoles, and wearables. As consumers seek higher-resolution screens, faster refresh rates, and innovative form factors, manufacturers are under pressure to develop advanced display technologies to meet these demands. OLED (Organic Light-Emitting Diode) displays have gained popularity for their vibrant colors, deep blacks, and flexibility. Mini-LED and Micro-LED displays are also emerging as alternatives to traditional LCDs, offering improved brightness and contrast. These technologies are likely to witness increased adoption in various applications. All these benefits will help to boost the demand for display devices in the coming years.
Semiconductor Devices Outlook
The semiconductor devices segment is sub-segmented into diode, transistors, integrated circuits (ICs), and optoelectronics. In 2022, the transistors subsegment recorded a substantial revenue share in the market. Automobile electronics use transistors for engine control units (ECUs), infotainment systems, and safety features. The demand for transistors may increase as the automotive industry evolves with electric and autonomous vehicles. The rollout of 5G networks and the ongoing expansion of telecommunications infrastructure require a wide range of transistors, including RF transistors and power amplifiers. Transistors are key components in power electronics for voltage regulation and switching tasks.
End user Outlook
On the basis of end-user, the market is segmented into consumer electronics, networking & telecommunication, automotive, manufacturing, aerospace & defense, healthcare, and others. The automotive segment witnessed a promising revenue share in the market in 2022. The automotive industry is undergoing a major shift toward electric and hybrid vehicles. These vehicles rely heavily on advanced active electronic components, including power electronics, sensors, and control systems. The demand for components like power inverters, motor drives, and battery management systems is expected to surge as automakers expand their electric vehicle portfolios. ADAS technologies, such as adaptive cruise control, lane-keeping assistance, and automated emergency braking, are becoming standard features in modern vehicles. These systems heavily rely on sensors, radar, LiDAR, and cameras, driving the demand for high-performance sensors.
Regional Outlook
Based on region, the market is divided into North America, Europe, Asia Pacific, and LAMEA. In 2022, the Asia Pacific segment procured the highest revenue share in the market in 2022. Asia Pacific, particularly countries like China, Taiwan, South Korea, and Japan, has long been known as a manufacturing hub for electronic components and devices. Many leading semiconductor manufacturers and electronic component suppliers are based in this region. The Asia Pacific region is home to a significant portion of the world's population, driving high demand for consumer electronics. This includes smartphones, laptops, televisions, and other electronic devices relying on active components. Owing to these factors, the segment will proliferate in the future.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Technologies AG, Advanced Micro Devices, Inc., STMicroelectronics N.V., Microchip Technology, Inc., Analog Devices, Inc., Broadcom Inc., NXP Semiconductors N.V., Intel Corporation, Texas Instruments, Inc., Toshiba Corporation
Recent Strategies Deployed in Active Electronic Component Market
Partnerships, Collaborations, and Agreements:
Aug-2023: Intel Corporation entered into an agreement with Synopsys, Inc., an American electronic design automation company. Through this agreement, the companies intend to serve the foundry customers of Intel by developing Intel 3 and Intel 18A using IP (intellectual property) and EDA (electronic design automation).
Jun-2023: Infineon Technologies AG entered into a partnership with Kontrol Technologies Corp., a leader in smart energy solutions. Through this partnership, autonomous driving technology enhanced to develop an algorithm-based solution which controls the legal controls and the boundary settings for vehicles.
Jun-2023: STMicroelectronics signed an agreement with Sanan Optoelectronics, a compound semiconductor company. Through this agreement, the companies would be releasing a 200mm silicon carbide device in Chongqing, China. The company's' aim to support the demand for car electrification, industrial power and energy applications.
Jun-2023: STMicroelectronics came into an agreement with Airbus, a European multinational aerospace corporation. Through this agreement, the companies aimed to construct well-structured power electronics that are lighter and necessary for future hybrid powered aircraft, facilitating electric urban air vehicles.
May-2023: NXP Semiconductors N.V. teamed up with Taiwan Semiconductor Manufacturing Company Limited, a Taiwanese multinational semiconductor contract manufacturing and design company. Through this collaboration, the companies would impart an automotive embedded MRAM (Magnetic Random Access Memory) involving 16 nm FinFET technology.
Feb-2023: Advanced Micro Devices, Inc. collaborated with Renesas Electronics Corporation, a Japanese semiconductor manufacturer. With this collaboration, Advanced Micro Devices exhibited a full RF front-end solution for 5G Active Antenna Systems (AAS) radios. The RF front end includes switches, pre-drivers, and low-noise amplifiers when paired with the Zynq UltraScale+ RFSoC Digital Front End OpenRAN Radio (O-RU) Reference Design.
Dec-2022: Broadcom Inc. collaborated with Rohde &Schwarz, an international electronics group specializing in the fields of electronic test equipment. Under this collaboration, the automated test solution for Broadcom Wi-Fi 7 chipsets was released which supports simultaneous dual-band 2×2 IEEE 802.11be compliant operation. The IEEE 802.11be amendment satisfies the working of Wi-Fi 7 in bands of 2.4 GHz, 5 GHz and 6 GHz and meets the requirements of upgraded applications on mobile handsets.
Dec-2022: Broadcom Inc. collaborated with Skyworks Solutions, Inc., an American semiconductor company. Through this collaboration, Wi-Fi front-end modules (FEMs) were introduced which enhanced the execution of the needs of the Wi-Fi 6/6E-enabled devices. Additionally, this collaboration has supplied high-speed connectivity to the customers.
Dec-2022: NXP Semiconductors N.V. signed an agreement with Delta Electronics, Inc., a Taiwanese electronics manufacturing company. Through this agreement, the companies introduced traction inverter and a platform for power conversion for use in electric vehicles.
Nov-2022: Infineon Technologies AG teamed up with Taiwan Semiconductor Manufacturing Company Limited, a Taiwanese multinational semiconductor contract manufacturing and design company. Through this partnership, the Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology was launched and integrated into the AURIX microcontrollers (MCU) of Infineon Technologies. Additionally, RRAM offers the services of immunization against disturbance as well as writing in parts without the needed for erasing.
Oct-2022: Analog Devices, Inc. teamed up with Keysight Technologies, Inc., an American company. Through this collaboration, the companies promoted the use of their phased array platforms in those communications and sensing solutions involving higher data rate.
Jul-2022: Infineon Technologies AG extended their collaboration with Delta Electronics, Inc., a Taiwanese electronics manufacturing company. Through this collaboration, the Delta's 1.4 kW server power supply and a 1.6 kW Titanium gaming power platform was launched. Additionally, Delta's proficiency in electronics and Infineon's CoolSiC MOSFET technology, helps these products to achieve 96 percent power efficiency.
May-2022: Analog Devices, Inc. collaborated with Synopsys, Inc., an American electronic design automation company, to offer model libraries for DC/DC ICs and µModule (micromodule) regulators. The new library enables powertrain designers working on products like electric vehicles, avionics, instruments, and supercomputers to conduct precise and speedy multi-domain simulations. This accelerates the design process and reduces time-to-market.
Apr-2020: Broadcom Inc. extended its collaboration with Synopsys, Inc., an American electronic design automation company. Through this collaboration, the companies manufactured semiconductors using the Fusion Design Platform of Synopsys. Additionally, this collaboration helped Broadcom to take advantage of the silicon-process offerings and better serve their customers.
Mar-2022: Analog Devices, Inc. joined hands with Gridspertise, an energy transition enabler. Through this collaboration, the quality of smart grids was improved, along with hardware and software were developed that facilitate self-healing and adaptation of distribution grids in the event of changes in energy supply.
Product Launches and Product Expansions:
Jun-2023: Analog Devices, Inc. announced to unveil Apollo MxFE, a front-end platform having advanced software, direct Rf sampling and a wideband mixed signal. Apollo MxFE offers next generation applications and instantaneous bandwidths of 10GHz while it synthesizes frequencies up to 18GHz.
May-2023: STMicroelectronics introduced the STM32 MPUs (microprocessors), which enhance performance and security for applications. The STM32MP2 Series devices help to integrate advanced security features in hardware and for opportunities in secure Industry 4.0, IoT, and rich user-interface applications.
Mar-2023: Texas Instruments, Inc. launched an active electromagnetic interface (EMI) filter integrated circuits (ICs) which magnifies functionality while reducing costs and maintaining regulatory standards. The active EMI filter ICs solved the designing challenges of the engineers and at the same time bettered performance and power density.
Oct-2022: NXP Semiconductors N.V. introduced the OrangeBox automotive-grade development platform which helps connection of NXP wireless technologies. The OrangeBox presents a single interface between the wired and wireless technologies of vehicles and thus makes communication of cars with the world outside easier.
Oct-2022: NXP Semiconductors N.V. launched Matter-enabled development platforms, facilitating Matter devices for smart homes and buildings. The Matter development platforms consist of a range of IoT devices with Thread Border Router and Matter Controller capabilities.
Oct-2022: Infineon Technologies AG revealed the XENSIV connected sensor kit (CSK), an IoT platform facilitating prototyping and formation of personalized solutions. The CSK is an amalgamation of several XENSIV sensors which offer power efficient and high performance for cases based on PSoC 6 microcontroller.
Sep-2021: STMicroelectronics unveiled two products, the VN9D30Q100F and VN9D5D20FN. The VN9D30Q100F comprises two 33mΩ and four 90mΩ channels while the VN9D5D20FN consists of two 7.6mΩ and two 20mΩ channels. The six output channels and a 4-wire SPI interface of the two devices reduces the number of microcontroller I/O pins that is required to facilitate interaction with the device.
Aug-2022: Microchip Technology Inc. added new features to its memory controller portfolio through the SMC 2000 series of Compute Express Link (CXL™)-based Smart Memory Controllers. The two products, SMC 2000 16×32G*and SMC 2000 8×32G memory controllers are set to specifications of CXL 1.1 and CXL 2.0, have DDR4 and DDR5 JEDEC standards and support speeds of PCIe 5.0 specifications.
Jun-2022: Toshiba Corporation released a superconducting motor which satisfies the requirements of the mobility sector. The superconducting motor is of light weight, has high-output density and high-speed rotation.
May-2021: Analog Devices, Inc. has unveiled an extended range of battery management system (BMS) products, incorporating ASIL-D functional safety and innovative low-power capabilities for continuous battery monitoring. These improvements boost ADI's BMS platform, famous for accuracy and compatibility with various battery types, including zero-Cobalt LFP.
Acquisition and Mergers:
Aug-2021: Analog Devices, Inc. completed the acquisition of Maxim Integrated Products, Inc., an integrated analog and mixed-signal semiconductor provider. With this acquisition, innovations in analog semiconductors were carried out, and better solutions were extended to the customers.
Apr-2020: Infineon Technologies AG completed the acquisition of Cypress Semiconductor Corporation, an American semiconductor design and manufacturing company. Through this acquisition, Infineon strengthened its structural growth drivers on a wide variety of applications. Additionally, Infineon boosted its hold on the customers across the world through its foothold on U.S. and Japan.
Market Segments covered in the Report:
By Product Type (Volume, Million Units, USD Million, 2019 to 2030)
By End User (Volume, Million Units, USD Million, 2019 to 2030)
By Geography (Volume, Million Units, USD Million, 2019 to 2030)
Companies Profiled
Unique Offerings from KBV Research