デフォルト表紙
市場調査レポート
商品コード
1471390

薄ウェーハ市場:技術、ウェハーサイズ、プロセス、アプリケーション別-2024-2030年の世界予測

Thin Wafer Market by Technology (Dicing, Grinding, Polishing), Wafer Size (125 mm, 200 mm, 300 mm), Process, Application - Global Forecast 2024-2030

出版日: | 発行: 360iResearch | ページ情報: 英文 188 Pages | 納期: 即日から翌営業日

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価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=158.31円
薄ウェーハ市場:技術、ウェハーサイズ、プロセス、アプリケーション別-2024-2030年の世界予測
出版日: 2024年04月17日
発行: 360iResearch
ページ情報: 英文 188 Pages
納期: 即日から翌営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 図表
  • 目次
概要

薄ウェーハ市場規模は、2023年に104億7,000万米ドルと推定され、2024年には113億米ドルに達し、CAGR 7.94%で2030年には178億9,000万米ドルに達すると予測されています。

薄ウェーハとは、半導体基板の厚さを著しく薄くしたもので、一般的には数μmから100μm未満です。シリコンのような半導体材料の極薄スライスは、集積回路(IC)やさまざまな微小電気機械システム(MEMS)の製造における基礎部品です。薄ウェーハの需要は、主に民生用電子機器市場の、より薄く、より強力なデバイスへのニーズによって牽引されています。さらに、半導体技術の進歩、IoTデバイスの普及、自動車業界の電気自動車や自律走行車へのシフトも薄ウェーハのニーズを後押ししています。さらに、耐久性や機能性を犠牲にすることなく基板の薄型化を可能にするウエハー加工技術の革新も市場の成長を後押ししています。しかし、ウエハー薄化プロセスにおける技術的限界は、半導体デバイスの完全性と性能に影響を与える可能性があります。さらに、厳しい環境規制が半導体材料の生産と廃棄に影響を与えています。しかし、主なプレーヤーは、持続可能性に関する規制や基準を遵守するため、費用対効果が高く環境に優しいウエハー製造プロセスを開発しています。さらに、シリコンの代替となり得る材料を探索し、コストや環境への影響を抑えつつ同様の特性や強化された特性を提供したり、薄ウェーハの機械的強度を高めて製造や組立時の損傷を防ぐ技術革新は、業界に新たな成長の道をもたらす可能性があります。

主な市場の統計
基準年[2023] 104億7,000万米ドル
予測年[2024] 113億米ドル
予測年 [2030] 178億9,000万米ドル
CAGR(%) 7.94%

技術ウエハーの厚みを電子デバイスの精密な要求に対応させるため、研削プロセスの改善が進む

ダイシングは、ウエハーを個々のダイやチップに切断またはスクライブする工程であり、その後、さまざまな電子機器に使用されます。この工程では、ウエハー上の回路にダメージを与えないよう、高い精度が要求されます。最新のダイシング技術には、ステルスダイシングとレーザーダイシングがあり、いずれも機械的ストレスを低減し、使用可能なチップの歩留まりを向上させることを目的としています。ダイシングは、ウエハー上の集積回路(IC)の分離に不可欠であり、半導体デバイスの最終的な出力と機能を決定づけます。グラインディングは、回路製造後のウエハーを薄くするために使用されます。特に、効率的な熱放散や柔軟性のために薄いプロファイルを必要とするデバイスでは、所望の厚さを達成するために不可欠なステップです。この工程では、研磨材を使用してウエハーの厚みを機械的に減少させます。ウェハーが割れたり、薄くなりすぎたりしてチップが使えなくなるのを防ぐため、正確なコントロールが要求される難しい課題です。ウェハの活性層の完全性を維持するためには、正しい研削ホイールとパラメーターを選択することが重要です。研削後のウエハー表面には、チップの性能を損なう可能性のあるマイクロクラックやその他の欠陥があるかもしれません。研磨、または化学的機械的平坦化(CMP)は、ウェハー表面を平滑化し、これらの欠陥を除去するプロセスです。この工程は、半導体デバイスの機能性と信頼性を確保するために不可欠であり、ウエハーをその後の製造工程で材料を複雑に積層するための準備となります。

アプリケーション高度な3D構成をサポートするメモリーチップにおける薄ウェーハの新たなニーズ

CMOSイメージセンサ(CIS)技術は、薄ウェーハ処理により、イメージング性能を向上させ、よりスマートなデバイス設計を可能にします。ウエハーを薄くすることで、小型カメラモジュールの集光効率と画質を向上させる裏面照射技術が可能になります。インターポーザ、特に3D集積化技術に利用されるインターポーザは、薄ウェーハを利用して、複数の半導体デバイスを接続するプラットフォームを提供し、スペースを削減しながら電気的性能を向上させています。このアプリケーションにおける薄ウェーハは、より高密度な相互接続と、より優れた熱管理を促進します。高輝度LEDの製造において、薄ウェーハは光取り出しと熱性能を高めるために採用されています。この用途では、厚みの減少を利用して欠陥を最小限に抑え、LEDデバイスの効率と寿命を向上させます。基本的な計算機能を実行するロジックチップは、より小さな形状や3D構造への移行に伴い、薄ウェーハの活用が増加しています。薄ウェーハは、より高いパッキング密度と信号伝送速度の高速化を可能にします。ウエハーの薄型化の動向は、プロセッサーの高速化と消費電力の削減を目指しています。3D NANDフラッシュを含むメモリ技術の進歩は、薄ウェーハを利用してメモリセルを垂直に積み重ね、フットプリントを減らしながら記憶容量を大幅に増やします。このアプローチでは、信頼性と性能を確保するためにウエハーを正確に薄くする必要があります。マイクロエレクトロメカニカルシステム(MEMS)デバイスは、機械部品と電気部品を統合しており、感度、信頼性、フォームファクタの面で薄ウェーハ技術の恩恵を大きく受けています。薄型化により、MEMSと他の半導体デバイスとの統合が容易になり、応用の可能性が広がります。ワイヤレス通信に不可欠なRFデバイスは、薄ウェーハを使って信号損失を減らし、デバイス効率を向上させています。薄型化は高周波アプリケーションに不可欠であり、より小型で強力なデバイスを可能にします。

地域別インサイト

南北アメリカ地域は、半導体と電子デバイスの領域でいくつかの進歩を遂げ、強固で高度に発達した技術的枠組みを特徴としています。米国にはシリコンバレーがあり、数多くの新興企業や既存企業がウエハー技術の進歩を推進しています。北米市場は、先進家電、電気自動車、再生可能エネルギー技術に対する高い需要が特徴的で、薄ウェーハの仕様と用途に影響を与えています。欧州連合(EU)諸国は、自動車、再生可能エネルギー、IoTなどの産業において、持続可能性と先端技術導入への強い傾斜を示しており、高度な薄ウェーハソリューションの需要を促進しています。EUの研究とイノベーションの枠組みは、学術機関と半導体業界の協力と相まって、この分野の開発を加速させています。電子機器や半導体の品質や性能に関する厳しい規制や規格の存在も、薄ウェーハの進歩に標準化された枠組みを提供しています。石油からの多角化に重点を置くようになった中東は、半導体を含むテクノロジー分野への投資を進めており、新たな機会をもたらしています。アジア太平洋地域は世界の薄ウェーハ市場の大部分を占めており、その理由は半導体産業の堅調さにあります。中国、日本、インドなどの主要国は、高い民生用電子機器需要と半導体製造に対する政府の支援によって最前線にいます。世界の製造拠点である中国とインドは、モバイル機器、ウェアラブル機器、自動車に薄ウェーハの大規模な需要を示しています。インドは、急成長するエレクトロニクス市場と半導体生産を後押しするイニシアティブにより、急速な成長を遂げています。

FPNVポジショニング・マトリックス

FPNVポジショニングマトリックスは薄ウェーハ市場の評価において極めて重要です。事業戦略と製品満足度に関連する主要指標を調査し、ベンダーの包括的な評価を提供します。この綿密な分析により、ユーザーは各自の要件に沿った十分な情報に基づいた意思決定を行うことができます。評価に基づき、ベンダーは成功の度合いが異なる4つの象限に分類されます:フォアフロント(F)、パスファインダー(P)、ニッチ(N)、バイタル(V)です。

市場シェア分析

市場シェア分析は、薄ウェーハ市場におけるベンダーの現状について、洞察に満ちた詳細な調査を提供する包括的なツールです。全体的な収益、顧客基盤、その他の主要指標についてベンダーの貢献度を綿密に比較・分析することで、企業の業績や市場シェア争いの際に直面する課題について理解を深めることができます。さらに、この分析により、調査対象基準年に観察された蓄積、断片化の優位性、合併の特徴などの要因を含む、この分野の競合特性に関する貴重な考察が得られます。このような詳細レベルの拡大により、ベンダーはより多くの情報に基づいた意思決定を行い、市場で競争優位に立つための効果的な戦略を考案することができます。

本レポートは、以下の側面に関する貴重な洞察を提供しています:

1.市場の浸透度:主要企業が提供する市場に関する包括的な情報を提示しています。

2.市場の開拓度:有利な新興市場を深く掘り下げ、成熟市場セグメントにおける浸透度を分析しています。

3.市場の多様化:新製品の発売、未開拓の地域、最近の開発、投資に関する詳細な情報を提供します。

4.競合の評価と情報:市場シェア、戦略、製品、認証、規制状況、特許状況、主要企業の製造能力などを網羅的に評価します。

5.製品開発およびイノベーション:将来の技術、研究開発活動、画期的な製品開発に関する知的洞察を提供します。

本レポートは、以下のような主要な質問に対応しています:

1.薄ウェーハ市場の市場規模および予測は?

2.薄ウェーハ市場の予測期間中に投資を検討すべき製品、セグメント、用途、分野は何か?

3.薄ウェーハ市場の技術動向と規制枠組みは?

4.薄ウェーハ市場における主要ベンダーの市場シェアは?

5.薄ウェーハ市場への参入に適した形態や戦略的手段は?

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

  • 市場力学
    • 促進要因
      • ウエハー薄化技術、材料科学、チップ設計の進歩
      • 3Dパッケージング技術の導入
      • 半導体産業の急速な成長と小型化デバイス
    • 抑制要因
      • 薄型ウェーハの効率維持の難しさ
    • 機会
      • IoT、AI、自動車、ヘルスケアなどの分野で半導体デバイスの用途が拡大
      • ポータブルおよびウェアラブル電子機器への注目の高まり
    • 課題
      • 高圧による被害を受けやすくなる懸念
  • 市場セグメンテーション分析
    • 技術:電子機器の正確な要求に合わせてウェハの厚さを調整するための研削プロセスの改善
    • 用途:高度な3D構成をサポートするメモリチップの薄型ウェーハに対する新たなニーズ
  • 市場ディスラプション分析
  • ポーターのファイブフォース分析
  • バリューチェーンとクリティカルパス分析
  • 価格分析
  • 技術分析
  • 特許分析
  • 貿易分析
  • 規制枠組みの分析

第6章 薄ウェーハ市場:技術別

  • さいの目に切る
  • 研削
  • 研磨

第7章 薄ウェーハ市場ウエハーサイズ別

  • 125ミリメートル
  • 200ミリメートル
  • 300ミリメートル

第8章 薄ウェーハ市場:プロセス別

  • キャリアレス/太鼓プロセス
  • 一時的な接着と剥離

第9章 薄ウェーハ市場:用途別

  • CMOSイメージセンサー
  • インターポーザー
  • 導かれた
  • 論理
  • メモリ
  • マイクロ電気機械システム
  • RFデバイス

第10章 南北アメリカの薄ウェーハ市場

  • アルゼンチン
  • ブラジル
  • カナダ
  • メキシコ
  • 米国

第11章 アジア太平洋地域の薄ウェーハ市場

  • オーストラリア
  • 中国
  • インド
  • インドネシア
  • 日本
  • マレーシア
  • フィリピン
  • シンガポール
  • 韓国
  • 台湾
  • タイ
  • ベトナム

第12章 欧州・中東・アフリカの薄ウェーハ市場

  • デンマーク
  • エジプト
  • フィンランド
  • フランス
  • ドイツ
  • イスラエル
  • イタリア
  • オランダ
  • ナイジェリア
  • ノルウェー
  • ポーランド
  • カタール
  • ロシア
  • サウジアラビア
  • 南アフリカ
  • スペイン
  • スウェーデン
  • スイス
  • トルコ
  • アラブ首長国連邦
  • 英国

第13章 競合情勢

  • 市場シェア分析2023
  • FPNVポジショニングマトリックス、2023
  • 競合シナリオ分析
    • 東京エレクトロン、300mmウエハー製造向けウエハー薄化装置「Ulucus G」を発売
    • 中国、12インチ2D半導体ウエハーの量産で画期的進歩
    • ルネサスとウルフスピード、10年間のSiCウエハー契約を締結
  • 戦略分析と提言

第14章 競合ポートフォリオ

  • 主要企業プロファイル
  • 主要製品ポートフォリオ
図表

LIST OF FIGURES

  • FIGURE 1. THIN WAFER MARKET RESEARCH PROCESS
  • FIGURE 2. THIN WAFER MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL THIN WAFER MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL THIN WAFER MARKET SIZE, BY REGION, 2023 VS 2030 (%)
  • FIGURE 5. GLOBAL THIN WAFER MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. THIN WAFER MARKET DYNAMICS
  • FIGURE 7. GLOBAL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 8. GLOBAL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 9. GLOBAL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2023 VS 2030 (%)
  • FIGURE 10. GLOBAL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 11. GLOBAL THIN WAFER MARKET SIZE, BY PROCESS, 2023 VS 2030 (%)
  • FIGURE 12. GLOBAL THIN WAFER MARKET SIZE, BY PROCESS, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 13. GLOBAL THIN WAFER MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 14. GLOBAL THIN WAFER MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 15. AMERICAS THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 16. AMERICAS THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 17. UNITED STATES THIN WAFER MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 18. UNITED STATES THIN WAFER MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 19. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 20. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 21. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 22. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 23. THIN WAFER MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 24. THIN WAFER MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. THIN WAFER MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL THIN WAFER MARKET SIZE, 2018-2023 (USD MILLION)
  • TABLE 4. GLOBAL THIN WAFER MARKET SIZE, 2024-2030 (USD MILLION)
  • TABLE 5. GLOBAL THIN WAFER MARKET SIZE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 6. GLOBAL THIN WAFER MARKET SIZE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 7. GLOBAL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 8. GLOBAL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 9. GLOBAL THIN WAFER MARKET SIZE, BY DICING, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 10. GLOBAL THIN WAFER MARKET SIZE, BY DICING, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 11. GLOBAL THIN WAFER MARKET SIZE, BY GRINDING, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 12. GLOBAL THIN WAFER MARKET SIZE, BY GRINDING, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 13. GLOBAL THIN WAFER MARKET SIZE, BY POLISHING, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 14. GLOBAL THIN WAFER MARKET SIZE, BY POLISHING, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 15. GLOBAL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 16. GLOBAL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 17. GLOBAL THIN WAFER MARKET SIZE, BY 125 MM, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 18. GLOBAL THIN WAFER MARKET SIZE, BY 125 MM, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 19. GLOBAL THIN WAFER MARKET SIZE, BY 200 MM, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 20. GLOBAL THIN WAFER MARKET SIZE, BY 200 MM, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 21. GLOBAL THIN WAFER MARKET SIZE, BY 300 MM, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 22. GLOBAL THIN WAFER MARKET SIZE, BY 300 MM, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 23. GLOBAL THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 24. GLOBAL THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 25. GLOBAL THIN WAFER MARKET SIZE, BY CARRIER-LESS/TAIKO PROCESS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 26. GLOBAL THIN WAFER MARKET SIZE, BY CARRIER-LESS/TAIKO PROCESS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 27. GLOBAL THIN WAFER MARKET SIZE, BY TEMPORARY BONDING & DEBONDING, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 28. GLOBAL THIN WAFER MARKET SIZE, BY TEMPORARY BONDING & DEBONDING, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 29. GLOBAL THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 30. GLOBAL THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 31. GLOBAL THIN WAFER MARKET SIZE, BY CMOS IMAGE SENSOR, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 32. GLOBAL THIN WAFER MARKET SIZE, BY CMOS IMAGE SENSOR, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 33. GLOBAL THIN WAFER MARKET SIZE, BY INTERPOSER, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 34. GLOBAL THIN WAFER MARKET SIZE, BY INTERPOSER, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 35. GLOBAL THIN WAFER MARKET SIZE, BY LED, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 36. GLOBAL THIN WAFER MARKET SIZE, BY LED, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 37. GLOBAL THIN WAFER MARKET SIZE, BY LOGIC, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 38. GLOBAL THIN WAFER MARKET SIZE, BY LOGIC, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 39. GLOBAL THIN WAFER MARKET SIZE, BY MEMORY, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 40. GLOBAL THIN WAFER MARKET SIZE, BY MEMORY, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 41. GLOBAL THIN WAFER MARKET SIZE, BY MICRO-ELECTROMECHANICAL SYSTEM, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 42. GLOBAL THIN WAFER MARKET SIZE, BY MICRO-ELECTROMECHANICAL SYSTEM, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 43. GLOBAL THIN WAFER MARKET SIZE, BY RF DEVICES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 44. GLOBAL THIN WAFER MARKET SIZE, BY RF DEVICES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 45. AMERICAS THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 46. AMERICAS THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 47. AMERICAS THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 48. AMERICAS THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 49. AMERICAS THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 50. AMERICAS THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 51. AMERICAS THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 52. AMERICAS THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 53. AMERICAS THIN WAFER MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
  • TABLE 54. AMERICAS THIN WAFER MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
  • TABLE 55. ARGENTINA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 56. ARGENTINA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 57. ARGENTINA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 58. ARGENTINA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 59. ARGENTINA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 60. ARGENTINA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 61. ARGENTINA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 62. ARGENTINA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 63. BRAZIL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 64. BRAZIL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 65. BRAZIL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 66. BRAZIL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 67. BRAZIL THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 68. BRAZIL THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 69. BRAZIL THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 70. BRAZIL THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 71. CANADA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 72. CANADA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 73. CANADA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 74. CANADA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 75. CANADA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 76. CANADA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 77. CANADA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 78. CANADA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 79. MEXICO THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 80. MEXICO THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 81. MEXICO THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 82. MEXICO THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 83. MEXICO THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 84. MEXICO THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 85. MEXICO THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 86. MEXICO THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 87. UNITED STATES THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 88. UNITED STATES THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 89. UNITED STATES THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 90. UNITED STATES THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 91. UNITED STATES THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 92. UNITED STATES THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 93. UNITED STATES THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 94. UNITED STATES THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 95. UNITED STATES THIN WAFER MARKET SIZE, BY STATE, 2018-2023 (USD MILLION)
  • TABLE 96. UNITED STATES THIN WAFER MARKET SIZE, BY STATE, 2024-2030 (USD MILLION)
  • TABLE 97. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 98. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 99. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 100. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 101. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 102. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 103. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 104. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 105. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
  • TABLE 106. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
  • TABLE 107. AUSTRALIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 108. AUSTRALIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 109. AUSTRALIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 110. AUSTRALIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 111. AUSTRALIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 112. AUSTRALIA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 113. AUSTRALIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 114. AUSTRALIA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 115. CHINA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 116. CHINA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 117. CHINA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 118. CHINA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 119. CHINA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 120. CHINA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 121. CHINA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 122. CHINA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 123. INDIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 124. INDIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 125. INDIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 126. INDIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 127. INDIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 128. INDIA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 129. INDIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 130. INDIA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 131. INDONESIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 132. INDONESIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 133. INDONESIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 134. INDONESIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 135. INDONESIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 136. INDONESIA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 137. INDONESIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 138. INDONESIA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 139. JAPAN THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 140. JAPAN THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 141. JAPAN THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 142. JAPAN THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 143. JAPAN THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 144. JAPAN THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 145. JAPAN THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 146. JAPAN THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 147. MALAYSIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 148. MALAYSIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 149. MALAYSIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 150. MALAYSIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 151. MALAYSIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 152. MALAYSIA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 153. MALAYSIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 154. MALAYSIA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 155. PHILIPPINES THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 156. PHILIPPINES THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 157. PHILIPPINES THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 158. PHILIPPINES THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 159. PHILIPPINES THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 160. PHILIPPINES THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 161. PHILIPPINES THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 162. PHILIPPINES THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 163. SINGAPORE THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 164. SINGAPORE THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 165. SINGAPORE THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 166. SINGAPORE THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 167. SINGAPORE THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 168. SINGAPORE THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 169. SINGAPORE THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 170. SINGAPORE THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 171. SOUTH KOREA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 172. SOUTH KOREA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 173. SOUTH KOREA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 174. SOUTH KOREA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 175. SOUTH KOREA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 176. SOUTH KOREA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 177. SOUTH KOREA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 178. SOUTH KOREA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 179. TAIWAN THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 180. TAIWAN THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 181. TAIWAN THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 182. TAIWAN THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 183. TAIWAN THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 184. TAIWAN THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 185. TAIWAN THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 186. TAIWAN THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 187. THAILAND THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 188. THAILAND THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 189. THAILAND THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 190. THAILAND THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 191. THAILAND THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 192. THAILAND THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 193. THAILAND THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 194. THAILAND THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 195. VIETNAM THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 196. VIETNAM THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 197. VIETNAM THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 198. VIETNAM THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 199. VIETNAM THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 200. VIETNAM THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 201. VIETNAM THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 202. VIETNAM THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 203. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 204. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 205. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 206. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 207. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 208. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 209. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 210. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 211. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
  • TABLE 212. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
  • TABLE 213. DENMARK THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 214. DENMARK THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 215. DENMARK THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 216. DENMARK THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 217. DENMARK THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 218. DENMARK THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 219. DENMARK THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 220. DENMARK THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 221. EGYPT THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 222. EGYPT THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 223. EGYPT THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 224. EGYPT THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 225. EGYPT THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 226. EGYPT THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 227. EGYPT THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 228. EGYPT THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 229. FINLAND THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 230. FINLAND THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 231. FINLAND THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 232. FINLAND THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 233. FINLAND THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 234. FINLAND THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 235. FINLAND THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 236. FINLAND THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 237. FRANCE THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 238. FRANCE THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 239. FRANCE THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 240. FRANCE THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 241. FRANCE THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 242. FRANCE THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 243. FRANCE THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 244. FRANCE THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 245. GERMANY THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 246. GERMANY THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 247. GERMANY THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 248. GERMANY THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 249. GERMANY THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 250. GERMANY THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 251. GERMANY THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 252. GERMANY THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 253. ISRAEL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 254. ISRAEL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 255. ISRAEL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 256. ISRAEL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 257. ISRAEL THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 258. ISRAEL THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 259. ISRAEL THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 260. ISRAEL THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 261. ITALY THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 262. ITALY THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 263. ITALY THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 264. ITALY THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 265. ITALY THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 266. ITALY THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 267. ITALY THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 268. ITALY THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 269. NETHERLANDS THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 270. NETHERLANDS THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 271. NETHERLANDS THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 272. NETHERLANDS THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 273. NETHERLANDS THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 274. NETHERLANDS THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 275. NETHERLANDS THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 276. NETHERLANDS THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 277. NIGERIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 278. NIGERIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 279. NIGERIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 280. NIGERIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 281. NIGERIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 282. NIGERIA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 283. NIGERIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 284. NIGERIA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 285. NORWAY THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 286. NORWAY THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 287. NORWAY THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 288. NORWAY THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 289. NORWAY THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 290. NORWAY THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 291. NORWAY THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 292. NORWAY THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 293. POLAND THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 294. POLAND THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 295. POLAND THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 296. POLAND THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 297. POLAND THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 298. POLAND THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 299. POLAND THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 300. POLAND THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 301. QATAR THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 302. QATAR THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 303. QATAR THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 304. QATAR THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 305. QATAR THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 306. QATAR THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 307. QATAR THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 308. QATAR THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 309. RUSSIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 310. RUSSIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 311. RUSSIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 312. RUSSIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 313. RUSSIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 314. RUSSIA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 315. RUSSIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 316. RUSSIA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 317. SAUDI ARABIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 318. SAUDI ARABIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 319. SAUDI ARABIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 320. SAUDI ARABIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 321. SAUDI ARABIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 322. SAUDI ARABIA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 323. SAUDI ARABIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 324. SAUDI ARABIA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 325. SOUTH AFRICA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 326. SOUTH AFRICA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 327. SOUTH AFRICA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 328. SOUTH AFRICA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 329. SOUTH AFRICA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 330. SOUTH AFRICA THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 331. SOUTH AFRICA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 332. SOUTH AFRICA THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 333. SPAIN THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 334. SPAIN THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 335. SPAIN THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 336. SPAIN THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 337. SPAIN THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 338. SPAIN THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 339. SPAIN THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 340. SPAIN THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 341. SWEDEN THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 342. SWEDEN THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 343. SWEDEN THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 344. SWEDEN THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 345. SWEDEN THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 346. SWEDEN THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 347. SWEDEN THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 348. SWEDEN THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 349. SWITZERLAND THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 350. SWITZERLAND THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 351. SWITZERLAND THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 352. SWITZERLAND THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 353. SWITZERLAND THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 354. SWITZERLAND THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 355. SWITZERLAND THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 356. SWITZERLAND THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 357. TURKEY THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 358. TURKEY THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 359. TURKEY THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 360. TURKEY THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 361. TURKEY THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 362. TURKEY THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 363. TURKEY THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 364. TURKEY THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 365. UNITED ARAB EMIRATES THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 366. UNITED ARAB EMIRATES THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 367. UNITED ARAB EMIRATES THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 368. UNITED ARAB EMIRATES THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 369. UNITED ARAB EMIRATES THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 370. UNITED ARAB EMIRATES THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 371. UNITED ARAB EMIRATES THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 372. UNITED ARAB EMIRATES THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 373. UNITED KINGDOM THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 374. UNITED KINGDOM THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 375. UNITED KINGDOM THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2023 (USD MILLION)
  • TABLE 376. UNITED KINGDOM THIN WAFER MARKET SIZE, BY WAFER SIZE, 2024-2030 (USD MILLION)
  • TABLE 377. UNITED KINGDOM THIN WAFER MARKET SIZE, BY PROCESS, 2018-2023 (USD MILLION)
  • TABLE 378. UNITED KINGDOM THIN WAFER MARKET SIZE, BY PROCESS, 2024-2030 (USD MILLION)
  • TABLE 379. UNITED KINGDOM THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2023 (USD MILLION)
  • TABLE 380. UNITED KINGDOM THIN WAFER MARKET SIZE, BY APPLICATION, 2024-2030 (USD MILLION)
  • TABLE 381. THIN WAFER MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 382. THIN WAFER MARKET, FPNV POSITIONING MATRIX, 2023
目次
Product Code: MRR-4F4C3626368A

[188 Pages Report] The Thin Wafer Market size was estimated at USD 10.47 billion in 2023 and expected to reach USD 11.30 billion in 2024, at a CAGR 7.94% to reach USD 17.89 billion by 2030.

A thin wafer refers to a semiconductor substrate with a significantly reduced thickness, typically ranging from a few micrometers to less than 100 micrometers. These ultra-thin slices of semiconductor material, such as silicon, are foundational components in the fabrication of integrated circuits (ICs) and various microelectromechanical systems (MEMS). The demand for thin wafers is primarily driven by the consumer electronics market's need for thinner, more powerful devices. Furthermore, advancements in semiconductor technology, the proliferation of IoT devices, and the automotive industry's shift towards electric and autonomous vehicles have also propelled the need for thin wafers. Additionally, innovations in wafer processing techniques that allow for thinner substrates without sacrificing durability or functionality have also bolstered market growth. However, technical limitations in wafer thinning processes may affect the integrity and performance of semiconductor devices. Furthermore, stringent environmental regulations impact the production and disposal of semiconductor materials. However, key players are developing cost-effective and environmentally friendly wafer manufacturing processes to comply with sustainability regulations and standards. Additionally, exploring alternative materials that could substitute silicon, offering similar or enhanced properties at a reduced cost or environmental impact, and innovations to enhance the mechanical strength of thin wafers to prevent damage during manufacturing and assembly can provide new avenues of growth for the industry.

KEY MARKET STATISTICS
Base Year [2023] USD 10.47 billion
Estimated Year [2024] USD 11.30 billion
Forecast Year [2030] USD 17.89 billion
CAGR (%) 7.94%

Technology: Advancements to improve the grinding process in order to prepare the wafer's thickness for the precise demands of electronic devices

Dicing is the process of cutting or scribing the wafer into individual dies or chips, which can then be used in various electronic devices. This process requires high precision to avoid damaging the circuits on the wafer. Modern dicing techniques include stealth dicing and laser dicing, both of which aim to reduce mechanical stress and improve the yield of usable chips. Dicing is critical for the separation of integrated circuits (ICs) on the wafer, dictating the final output and functionality of semiconductor devices. Grinding is used to thin down the wafer after the fabrication of circuits. It's an essential step to achieve the desired thickness, especially for devices that require thin profiles for efficient heat dissipation or flexibility. This process involves mechanically reducing the wafer's thickness using abrasive materials. It is a challenging process that requires precise control to prevent the wafer from breaking or becoming too thin, which could render the chips unusable. Choosing the correct grinding wheel and parameters is crucial for maintaining the integrity of the wafer's active layer. After grinding, the wafer surfaces may have micro-cracks or other defects that could impair the performance of the chips. Polishing, or chemical mechanical planarization (CMP), is a process that smoothens the wafer's surface, removing these imperfections. This step is vital for ensuring the functionality and reliability of the semiconductor devices, as it prepares the wafer for the complex layering of materials in subsequent manufacturing stages.

Application: Emerging need for thin wafers in memory chips to support advanced 3D configurations

CMOS image sensor (CIS) technology benefits significantly from thin wafer processing to enhance imaging performance and enable sleeker device designs. Thinning the wafer allows for backside illumination technology, which improves light collection efficiency and image quality in compact camera modules. Interposers, particularly those utilized in 3D integration technologies, rely on thin wafers to provide a platform for connecting multiple semiconductor devices, improving electrical performance while reducing space. Thin wafers in this application facilitate denser interconnections and better thermal management. In the production of high-brightness LEDs, thin wafers are employed to enhance light extraction and thermal performance. This application leverages the reduced thickness to minimize defects and improve the efficiency and longevity of LED devices. Logic chips, which perform basic computational functions, are increasingly leveraging thin wafers as they move towards smaller geometries and 3D structures. Thin wafers enable higher packing density and faster signal transmission speeds. The trend towards thinner wafers aims to enhance processor speed and reduce power consumption. Advancements in memory technology, including 3D NAND flash, utilize thin wafers to stack memory cells vertically, significantly increasing storage capacity while reducing footprint. This approach requires precise wafer thinning to ensure reliability and performance. Micro-electromechanical systems (MEMS) devices integrate mechanical and electrical components and benefit significantly from thin wafer technology in terms of sensitivity, reliability, and form factor. Thinning facilitates the integration of MEMS with other semiconductor devices, expanding their application potential. RF devices, essential for wireless communication, use thin wafers to reduce signal loss and improve device efficiency. The reduced thickness is critical for high-frequency applications, enabling smaller, more powerful devices.

Regional Insights

The Americas region features a robust and highly developed technological framework with several advancements in the realm of semiconductors and electronic devices. The presence of Silicon Valley in the U.S. presents a conducive landscape for innovations where numerous startups and established companies drive advancements in wafer technology. North America's market is distinctly characterized by high demand for advanced consumer electronics, electric vehicles, and renewable energy technologies, influencing thin wafer specifications and usage. European Union (EU) countries show a strong inclination towards sustainability and advanced technology adoption in industries such as automotive, renewable energy, and IoT, which fuels the demand for sophisticated thin wafer solutions. The EU's framework for research and innovation, coupled with collaboration between academic institutions and the semiconductor industry, accelerates developments in this sector. The presence of stringent regulations and standards pertaining to the quality and performance of electronic devices and semiconductors also provides a standardized framework for the progress of thin wafers. The Middle East, with its growing emphasis on diversification from oil, is investing in technology sectors, including semiconductors, presenting new opportunities. The Asia Pacific region represents a significant portion of the global thin wafer market, attributed to its robust semiconductor industry. Leading countries such as China, Japan, and India are at the forefront, driven by high consumer electronics demand and governmental support for semiconductor manufacturing. China and India, being global manufacturing hubs, showcase massive demand for thin wafers in mobile devices, wearables, and automobiles. India is experiencing rapid growth due to its burgeoning electronics market and initiatives to boost semiconductor production.

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Thin Wafer Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Thin Wafer Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Thin Wafer Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Aixtron SE, Atecom Technology Co., Ltd., Brewer Science, Inc., Chipmetrics Oy, DISCO Corporation, EV Group, Globalwafers Co., Ltd., Hangzhou Semiconductor Wafer Co., Ltd ., LDK Solar High-Tech Co., Ltd., Okmetic Oy, ROHM Co., Ltd. by KYOCERA AVX, Shin-Etsu Chemical Co., Ltd., Siltronic AG, Siltronix Silicon Technologies, SK Siltron Co., Ltd., Soitec, SPTS Technologies Ltd., Sumco Corporation, SUSS MicroTec SE, UniversityWafer, Inc., Virginia Semiconductor Inc., and Wafer World Inc..

Market Segmentation & Coverage

This research report categorizes the Thin Wafer Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Technology
    • Dicing
    • Grinding
    • Polishing
  • Wafer Size
    • 125 mm
    • 200 mm
    • 300 mm
  • Process
    • Carrier-less/Taiko Process
    • Temporary Bonding & Debonding
  • Application
    • CMOS Image Sensor
    • Interposer
    • LED
    • Logic
    • Memory
    • Micro-Electromechanical System
    • RF Devices
  • Region
    • Americas
      • Argentina
      • Brazil
      • Canada
      • Mexico
      • United States
        • California
        • Florida
        • Illinois
        • New York
        • Ohio
        • Pennsylvania
        • Texas
    • Asia-Pacific
      • Australia
      • China
      • India
      • Indonesia
      • Japan
      • Malaysia
      • Philippines
      • Singapore
      • South Korea
      • Taiwan
      • Thailand
      • Vietnam
    • Europe, Middle East & Africa
      • Denmark
      • Egypt
      • Finland
      • France
      • Germany
      • Israel
      • Italy
      • Netherlands
      • Nigeria
      • Norway
      • Poland
      • Qatar
      • Russia
      • Saudi Arabia
      • South Africa
      • Spain
      • Sweden
      • Switzerland
      • Turkey
      • United Arab Emirates
      • United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Thin Wafer Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Thin Wafer Market?

3. What are the technology trends and regulatory frameworks in the Thin Wafer Market?

4. What is the market share of the leading vendors in the Thin Wafer Market?

5. Which modes and strategic moves are suitable for entering the Thin Wafer Market?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Advancements in wafer thinning technologies, material science, and chip design
      • 5.1.1.2. Adoption of 3D packaging technologies
      • 5.1.1.3. Proliferating growth of semiconductor industry and miniaturization devices
    • 5.1.2. Restraints
      • 5.1.2.1. Difficulties in efficiency maintenance of thin wafers
    • 5.1.3. Opportunities
      • 5.1.3.1. Expanding applications of semiconductor devices in areas such as IoT, AI, automotive, and healthcare
      • 5.1.3.2. Growing focus towards the portable and wearable electronic devices
    • 5.1.4. Challenges
      • 5.1.4.1. Concerns of more vulnerable to damages caused by high pressure
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Technology: Advancements to improve the grinding process in order to prepare the wafer's thickness for the precise demands of electronic devices
    • 5.2.2. Application: Emerging need for thin wafers in memory chips to support advanced 3D configurations
  • 5.3. Market Disruption Analysis
  • 5.4. Porter's Five Forces Analysis
    • 5.4.1. Threat of New Entrants
    • 5.4.2. Threat of Substitutes
    • 5.4.3. Bargaining Power of Customers
    • 5.4.4. Bargaining Power of Suppliers
    • 5.4.5. Industry Rivalry
  • 5.5. Value Chain & Critical Path Analysis
  • 5.6. Pricing Analysis
  • 5.7. Technology Analysis
  • 5.8. Patent Analysis
  • 5.9. Trade Analysis
  • 5.10. Regulatory Framework Analysis

6. Thin Wafer Market, by Technology

  • 6.1. Introduction
  • 6.2. Dicing
  • 6.3. Grinding
  • 6.4. Polishing

7. Thin Wafer Market, by Wafer Size

  • 7.1. Introduction
  • 7.2. 125 mm
  • 7.3. 200 mm
  • 7.4. 300 mm

8. Thin Wafer Market, by Process

  • 8.1. Introduction
  • 8.2. Carrier-less/Taiko Process
  • 8.3. Temporary Bonding & Debonding

9. Thin Wafer Market, by Application

  • 9.1. Introduction
  • 9.2. CMOS Image Sensor
  • 9.3. Interposer
  • 9.4. LED
  • 9.5. Logic
  • 9.6. Memory
  • 9.7. Micro-Electromechanical System
  • 9.8. RF Devices

10. Americas Thin Wafer Market

  • 10.1. Introduction
  • 10.2. Argentina
  • 10.3. Brazil
  • 10.4. Canada
  • 10.5. Mexico
  • 10.6. United States

11. Asia-Pacific Thin Wafer Market

  • 11.1. Introduction
  • 11.2. Australia
  • 11.3. China
  • 11.4. India
  • 11.5. Indonesia
  • 11.6. Japan
  • 11.7. Malaysia
  • 11.8. Philippines
  • 11.9. Singapore
  • 11.10. South Korea
  • 11.11. Taiwan
  • 11.12. Thailand
  • 11.13. Vietnam

12. Europe, Middle East & Africa Thin Wafer Market

  • 12.1. Introduction
  • 12.2. Denmark
  • 12.3. Egypt
  • 12.4. Finland
  • 12.5. France
  • 12.6. Germany
  • 12.7. Israel
  • 12.8. Italy
  • 12.9. Netherlands
  • 12.10. Nigeria
  • 12.11. Norway
  • 12.12. Poland
  • 12.13. Qatar
  • 12.14. Russia
  • 12.15. Saudi Arabia
  • 12.16. South Africa
  • 12.17. Spain
  • 12.18. Sweden
  • 12.19. Switzerland
  • 12.20. Turkey
  • 12.21. United Arab Emirates
  • 12.22. United Kingdom

13. Competitive Landscape

  • 13.1. Market Share Analysis, 2023
  • 13.2. FPNV Positioning Matrix, 2023
  • 13.3. Competitive Scenario Analysis
    • 13.3.1. Tokyo Electron Launches Ulucus G, a Wafer Thinning System for 300mm Wafer Fabrication
    • 13.3.2. China Makes Breakthrough In Mass Production of 12-inch 2D Semiconductor Wafer
    • 13.3.3. Renesas and Wolfspeed Sign 10 Year SiC Wafer Agreement
  • 13.4. Strategy Analysis & Recommendation

14. Competitive Portfolio

  • 14.1. Key Company Profiles
  • 14.2. Key Product Portfolio