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市場調査レポート

半導体の世界市場:2019年~2023年

Global Semiconductor Market 2019-2023

発行 TechNavio (Infiniti Research Ltd.) 商品コード 871497
出版日 ページ情報 英文 130 Pages
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半導体の世界市場:2019年~2023年 Global Semiconductor Market 2019-2023
出版日: 2019年06月10日 ページ情報: 英文 130 Pages
概要

半導体材料は部分的な電気導体であり、その導電率は絶縁体と導体の間です。 2018年、ICセグメントは大きな市場シェアを獲得しており、この傾向は予測期間中も続くと予想されます。データセンター市場からのメモリ技術に対する需要の増加などの要因が、市場ポジションを維持する上で、ICセグメントにおいて重要な役割を果たす見込みです。また、世界の半導体市場では、製造工場への投資の増加、自動車への半導体ICの採用の増加、および電気通信インフラストラクチャーへの投資の増加などが成長を促進する要因として注目されています。しかしながら、半導体産業における進行中の貿易戦争、シリコンサイクル(半導体業界に特有の構造的な景気循環)、およびますます複雑になる半導体部品設計などの影響が、予測期間にわたって半導体産業の成長を妨げる可能性があります。

当レポートでは、世界の半導体市場について調査分析し、市場規模と成長率、市場動向、市場促進要因・課題、市場機会について検証するほか、主要ベンダーなどについて、体系的な情報を提供しています。

目次

第1章 エグゼクティブサマリー

第2章 レポートの範囲

  • イントロダクション1
  • イントロダクション2
  • 米ドルの通貨換算レート

第3章 市場状況

  • 市場エコシステム
  • 市場の特徴
  • 市場セグメンテーション分析

第4章 市場規模

  • 市場の定義
  • 市場規模(2018年)
  • 市場規模および予測(2018年~2023年)

第5章 ファイブフォース分析

  • バイヤーの交渉力
  • サプライヤーの交渉力
  • 新規参入の脅威
  • 代替品の脅威
  • 競争相手の脅威
  • 市況

第6章 市場セグメンテーション:製品別

  • 市場セグメンテーション:製品別
  • 製品別比較:市場規模および予測(2018年~2023年)
  • ICS
  • オプトエレクトロニクス
  • ディスクリート半導体
  • センサー
  • 市場機会:製品別

第7章 顧客情勢

第8章 地域情勢

  • 地域別セグメンテーション
  • 地域別比較:市場規模および予測(2018年~2023年)
  • アジア太平洋地域
  • 南北アメリカ
  • 欧州・中東・アフリカ地域
  • 主要国
  • 市場機会

第9章 意思決定の枠組み

第10章 成長要因と課題

  • 市場成長要因
  • 市場の課題

第11章 市場動向

  • FinFET技術の採用の増加
  • パートナーシップの増加
  • ハイエンドグラフィックスDRAMの需要増加
  • 新たな半導体パッケージング技術
  • インソーシングサービスと機器の自動化

第12章 ベンダー情勢

  • 概要
  • 創造的破壊の状況

第13章 ベンダー分析

  • 対象ベンダー
  • ベンダー分類
  • ベンダーの市場ポジショニング
  • Intel Corporation
  • Micron Technology, Inc.
  • Qualcomm Technologies, Inc.
  • SAMSUNG ELECTRONICS CO., LTD.
  • SK HYNIX INC.

第14章 付録

  • 調査方法
  • 略語のリスト

第15章 TECHNAVIOについて

図表
  • Exhibit 01: Global electronics market
  • Exhibit 02: Segments of global electronics market
  • Exhibit 03: Market characteristics
  • Exhibit 04: Market segments
  • Exhibit 05: Market definition - Inclusions and exclusions checklist
  • Exhibit 06: Market size 2018
  • Exhibit 07: Global market: Size and forecast 2018-2023 ($ billions)
  • Exhibit 08: Global market: Year-over-year growth 2019-2023 (%)
  • Exhibit 09: Five forces analysis 2018
  • Exhibit 10: Five forces analysis 2023
  • Exhibit 11: Bargaining power of buyers
  • Exhibit 12: Bargaining power of suppliers
  • Exhibit 13: Threat of new entrants
  • Exhibit 14: Threat of substitutes
  • Exhibit 15: Threat of rivalry
  • Exhibit 16: Market condition - Five forces 2018
  • Exhibit 17: Product - Market share 2018-2023 (%)
  • Exhibit 18: Comparison by product
  • Exhibit 19: Ics - Market size and forecast 2018-2023 ($ billions)
  • Exhibit 20: Ics - Year-over-year growth 2019-2023 (%)
  • Exhibit 21: Optoelectronics - Market size and forecast 2018-2023 ($ billions)
  • Exhibit 22: Optoelectronics - Year-over-year growth 2019-2023 (%)
  • Exhibit 23: Discrete semiconductors - Market size and forecast 2018-2023 ($ billions)
  • Exhibit 24: Discrete semiconductors - Year-over-year growth 2019-2023 (%)
  • Exhibit 25: Sensors - Market size and forecast 2018-2023 ($ billions)
  • Exhibit 26: Sensors - Year-over-year growth 2019-2023 (%)
  • Exhibit 27: Market opportunity by product
  • Exhibit 28: Customer landscape
  • Exhibit 29: Market share by geography 2018-2023 (%)
  • Exhibit 30: Geographic comparison
  • Exhibit 31: APAC - Market size and forecast 2018-2023 ($ billions)
  • Exhibit 32: APAC - Year-over-year growth 2019-2023 (%)
  • Exhibit 33: Americas - Market size and forecast 2018-2023 ($ billions)
  • Exhibit 34: Americas - Year-over-year growth 2019-2023 (%)
  • Exhibit 35: EMEA - Market size and forecast 2018-2023 ($ billions)
  • Exhibit 36: EMEA - Year-over-year growth 2019-2023 (%)
  • Exhibit 37: Key leading countries
  • Exhibit 38: Market opportunity
  • Exhibit 39: Impact of drivers and challenges
  • Exhibit 40: Vendor landscape
  • Exhibit 41: Landscape disruption
  • Exhibit 42: Vendors covered
  • Exhibit 43: Vendor classification
  • Exhibit 44: Market positioning of vendors
  • Exhibit 45: Intel Corporation - Vendor overview
  • Exhibit 46: Intel Corporation - Business segments
  • Exhibit 47: Intel Corporation - Organizational developments
  • Exhibit 48: Intel Corporation - Geographic focus
  • Exhibit 49: Intel Corporation - Segment focus
  • Exhibit 50: Intel Corporation - Key offerings
  • Exhibit 51: Micron Technology, Inc. - Vendor overview
  • Exhibit 52: Micron Technology, Inc. - Business segments
  • Exhibit 53: Micron Technology, Inc. - Organizational developments
  • Exhibit 54: Micron Technology, Inc. - Geographic focus
  • Exhibit 55: Micron Technology, Inc. - Segment focus
  • Exhibit 56: Micron Technology, Inc. - Key offerings
  • Exhibit 57: Qualcomm Technologies, Inc. - Vendor overview
  • Exhibit 58: Qualcomm Technologies, Inc. - Business segments
  • Exhibit 59: Qualcomm Technologies, Inc. - Organizational developments
  • Exhibit 60: Qualcomm Technologies, Inc. - Geographic focus
  • Exhibit 61: Qualcomm Technologies, Inc. - Segment focus
  • Exhibit 62: Qualcomm Technologies, Inc. - Key offerings
  • Exhibit 63: SAMSUNG ELECTRONICS CO., LTD. - Vendor overview
  • Exhibit 64: SAMSUNG ELECTRONICS CO., LTD. - Business segments
  • Exhibit 65: SAMSUNG ELECTRONICS CO., LTD. - Organizational developments
  • Exhibit 66: SAMSUNG ELECTRONICS CO., LTD. - Geographic focus
  • Exhibit 67: SAMSUNG ELECTRONICS CO., LTD. - Segment focus
  • Exhibit 68: SAMSUNG ELECTRONICS CO., LTD. - Key offerings
  • Exhibit 69: SK HYNIX INC. - Vendor overview
  • Exhibit 70: SK HYNIX INC. - Organizational developments
  • Exhibit 71: SK HYNIX INC. - Geographic focus
  • Exhibit 72: SK HYNIX INC. - Key offerings
  • Exhibit 73: Validation techniques employed for market sizing
目次
Product Code: IRTNTR31133

About this market:

Semiconductor materials are partial electricity conductors, and their conductivity lies between insulators and conductors. Technavio's semiconductor market analysis considers the sales of ICs, optoelectronics, discrete semiconductors, and sensors. Our analysis also considers the growth of the semiconductor market in APAC, the Americas, and EMEA. In 2018, the ICs segment had a significant market share, and this trend is expected to continue over the forecast period. Factors such as the increasing demand for memory technologies from data center market will play a significant role in the ICs segment to maintain its market position. Also, our global semiconductor market looks at factors such as increased investments in fabs, rising adoption of semiconductor ICs in automobiles, and growing investments in telecommunication infrastructure. However, the impact of the ongoing trade war in the semiconductor industry, cyclical nature of the semiconductor industry, and increasing design complexity of semiconductor components may hamper the growth of the semiconductor industry over the forecast period.

Market Overview:

Rising adoption of semiconductor ICs in automobiles

The automotive sector is currently the major end-user of semiconductor products. Technological advancements in the automotive industry, such as autonomous vehicles, wireless charging, and EVs have increased the need for semiconductor components. Additionally, the integration of several vehicle safety systems such as ADAS, heads-up display, and multimodal and intuitive user interfaces have increased the adoption of semiconductor ICs in automobiles. The increased adoption of semiconductor ICs is expected to drive the growth of the global semiconductor market at a CAGR of close to 9% during the forecast period. However, the market's momentum will decelerate in the coming years because of the decrease in year-over-year growth.

Increasing design complexity of semiconductor components

The growing number of functionalities in consumer electronics, automotive, and other fields has increased the demand for multifunctional ICs. This demand has forced semiconductor manufacturers to integrate new and more complex architecture and design of semiconductor ICs. The rising complexity in IC design increases the capital investment for manufacturers as they must invest heavily in packaging and assembly equipment, to maintain the performance of semiconductor ICs. Moreover, the consistent disruption in the consumer electronics industry is forcing vendors to modify their manufacturing processes, which has led to a rise in manufacturing costs. These factors are expected to hinder the growth of the global semiconductor market size over the forecast period.

For the detailed list of factors that will drive the global semiconductor market size during the forecast period 2019-2023.

Competitive Landscape:

With the presence of a few players, the global semiconductor market is highly concentrated. Technavio's robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several semiconductor manufacturers, that include Intel Corporation, Micron Technology, Inc., Qualcomm Technologies, Inc., SAMSUNG ELECTRONICS CO., LTD., and SK HYNIX INC.

Also, the semiconductor market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage on all forthcoming growth opportunities.

TABLE OF CONTENTS

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

  • 2.1 Preface
  • 2.2 Preface
  • 2.3 Currency conversion rates for US$

PART 03: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 04: MARKET SIZING

  • Market definition
  • Market sizing 2018
  • Market size and forecast 2018-2023

PART 05: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 06: MARKET SEGMENTATION BY PRODUCT

  • Market segmentation by product
  • Comparison by product
  • Ics - Market size and forecast 2018-2023
  • Optoelectronics - Market size and forecast 2018-2023
  • Discrete semiconductors - Market size and forecast 2018-2023
  • Sensors - Market size and forecast 2018-2023
  • Market opportunity by product

PART 07: CUSTOMER LANDSCAPE

PART 08: GEOGRAPHIC LANDSCAPE

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2018-2023
  • Americas - Market size and forecast 2018-2023
  • EMEA - Market size and forecast 2018-2023
  • Key leading countries
  • Market opportunity

PART 09: DECISION FRAMEWORK

PART 10: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 11: MARKET TRENDS

  • Increasing adoption of FinFET technology
  • Growing number of partnerships
  • Increasing demand for high-end graphics DRAM
  • Emerging semiconductor packaging technologies
  • In-sourcing services and equipment automation

PART 12: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption

PART 13: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Intel Corporation
  • Micron Technology, Inc.
  • Qualcomm Technologies, Inc.
  • SAMSUNG ELECTRONICS CO., LTD.
  • SK HYNIX INC.

PART 14: APPENDIX

  • Research methodology
  • List of abbreviations

PART 15: EXPLORE TECHNAVIO

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