ハイエンド半導体パッケージの世界市場 2024-2028

ハイエンド半導体パッケージ市場は2023-2028年に309億2,000万米ドル、予測期間中のCAGRは14％で成長すると予測されます。

当レポートでは、ハイエンド半導体パッケージ市場の全体的な分析、市場規模・予測、動向、成長促進要因、課題、約25のベンダーを網羅したベンダー分析などを掲載しています。

現在の市場シナリオ、最新動向と促進要因、市場環境全体に関する最新分析を提供しています。市場は、小型電子機器への需要拡大、ハイエンド半導体パッケージにおける製品投入の増加、自動車向け半導体電子機器の採用急増などが牽引しています。

本調査では、5G投資の増加が今後数年間のハイエンド半導体パッケージ市場成長を牽引する主要因の1つであるとしています。また、フリップチップ、SiP（システムインパッケージ）、鉛フリーパッケージングソリューションの採用が増加し、半導体材料パッケージング技術の先進化が市場の大きな需要につながります。

目次

第1章 エグゼクティブサマリー

• 市場概要

第2章 市場情勢

• 市場エコシステム

第3章 市場規模

• 市場の定義
• 市場セグメント分析
• 市場規模 2023
• 市場の見通し 2023-2028

第4章 市場規模実績

• ハイエンド半導体パッケージの世界市場 2018-2022
• エンドユーザーセグメント分析 2018-2022
• 技術セグメント分析 2018-2022
• 地域別セグメント分析 2018-2022
• 国別セグメント分析 2018-2022

第5章 ファイブフォース分析

• ファイブフォースの要約
• 買い手の交渉力
• 供給企業の交渉力
• 新規参入業者の脅威
• 代替品の脅威
• 競争の脅威
• 市況

第6章 市場セグメンテーション：エンドユーザー別

• 市場セグメント
• 比較：エンドユーザー別
• 家電：市場規模と予測 2023-2028
• テレコムとデータコム：市場規模と予測 2023-2028
• 自動車：市場規模と予測 2023-2028
• その他：市場規模と予測 2023-2028
• 市場機会：エンドユーザー別

第7章 市場セグメンテーション：技術別

• 市場セグメント
• 比較：技術別
• 3D SoC：市場規模と予測 2023-2028
• 3Dスタックメモリ：市場規模と予測 2023-2028
• 2.5Dインターポーザー：市場規模と予測 2023-2028
• UHD FO：市場規模と予測 2023-2028
• 埋め込みSiブリッジ：市場規模と予測 2023-2028
• 市場機会：技術別

第8章 顧客情勢

• 顧客情勢の概要

第9章 地域別情勢

• 地域別セグメンテーション
• 地域別比較
• アジア太平洋：市場規模と予測 2023-2028
• 北米：市場規模と予測 2023-2028
• 欧州：市場規模と予測 2023-2028
• 南米：市場規模と予測 2023-2028
• 中東・アフリカ：市場規模と予測 2023-2028
• 中国：市場規模と予測 2023-2028
• 米国：市場規模と予測 2023-2028
• ドイツ：市場規模と予測 2023-2028
• 日本：市場規模と予測 2023-2028
• カナダ：市場規模と予測 2023-2028
• 市場機会：地域情勢別

第10章 促進要因、課題、および動向

• 市場促進要因
• 市場の課題
• 促進要因と課題の影響
• 市場動向

第11章 ベンダー情勢

• 概要
• ベンダー情勢
• 混乱の状況
• 業界のリスク

第12章 ベンダー分析

• 対象ベンダー
• ベンダーの市場ポジショニング
• Advanced Micro Devices Inc.
• ASE Technology Holding Co. Ltd.
• Amkor Technology Inc.
• Analog Devices Inc.
• ChipMOS TECHNOLOGIES INC.
• Fujitsu Ltd.
• Intel Corp.
• Jiangsu Changdian Technology Co. Ltd.
• King Yuan Electronics Co. Ltd.
• Kyocera Corp.
• Powertech Technology Inc.
• Samsung Electronics Co. Ltd.
• Taiwan Semiconductor Manufacturing Co. Ltd.
• Texas Instruments Inc.
• Tongfu Microelectronics Co. Ltd.

第13章 付録

Exhibits:

• Exhibits1: Executive Summary - Chart on Market Overview
• Exhibits2: Executive Summary - Data Table on Market Overview
• Exhibits3: Executive Summary - Chart on Global Market Characteristics
• Exhibits4: Executive Summary - Chart on Market By Geographical Landscape
• Exhibits5: Executive Summary - Chart on Market Segmentation by End-user
• Exhibits6: Executive Summary - Chart on Market Segmentation by Technology
• Exhibits7: Executive Summary - Chart on Incremental Growth
• Exhibits8: Executive Summary - Data Table on Incremental Growth
• Exhibits9: Executive Summary - Chart on Vendor Market Positioning
• Exhibits10: Parent market
• Exhibits11: Market Characteristics
• Exhibits12: Offerings of vendors included in the market definition
• Exhibits13: Market segments
• Exhibits14: Chart on Global - Market size and forecast 2023-2028 ($ billion)
• Exhibits15: Data Table on Global - Market size and forecast 2023-2028 ($ billion)
• Exhibits16: Chart on Global Market: Year-over-year growth 2023-2028 (%)
• Exhibits17: Data Table on Global Market: Year-over-year growth 2023-2028 (%)
• Exhibits18: Historic Market Size - Data Table on global high end semiconductor packaging market 2018 - 2022 ($ billion)
• Exhibits19: Historic Market Size - End-user Segment 2018 - 2022 ($ billion)
• Exhibits20: Historic Market Size - Technology Segment 2018 - 2022 ($ billion)
• Exhibits21: Historic Market Size - Geography Segment 2018 - 2022 ($ billion)
• Exhibits22: Historic Market Size - Country Segment 2018 - 2022 ($ billion)
• Exhibits23: Five forces analysis - Comparison between 2023 and 2028
• Exhibits24: Chart on Bargaining power of buyers - Impact of key factors 2023 and 2028
• Exhibits25: Bargaining power of suppliers - Impact of key factors in 2023 and 2028
• Exhibits26: Threat of new entrants - Impact of key factors in 2023 and 2028
• Exhibits27: Threat of substitutes - Impact of key factors in 2023 and 2028
• Exhibits28: Threat of rivalry - Impact of key factors in 2023 and 2028
• Exhibits29: Chart on Market condition - Five forces 2023 and 2028
• Exhibits30: Chart on End-user - Market share 2023-2028 (%)
• Exhibits31: Data Table on End-user - Market share 2023-2028 (%)
• Exhibits32: Chart on Comparison by End-user
• Exhibits33: Data Table on Comparison by End-user
• Exhibits34: Chart on Consumer electronics - Market size and forecast 2023-2028 ($ billion)
• Exhibits35: Data Table on Consumer electronics - Market size and forecast 2023-2028 ($ billion)
• Exhibits36: Chart on Consumer electronics - Year-over-year growth 2023-2028 (%)
• Exhibits37: Data Table on Consumer electronics - Year-over-year growth 2023-2028 (%)
• Exhibits38: Chart on Telecom and datacom - Market size and forecast 2023-2028 ($ billion)
• Exhibits39: Data Table on Telecom and datacom - Market size and forecast 2023-2028 ($ billion)
• Exhibits40: Chart on Telecom and datacom - Year-over-year growth 2023-2028 (%)
• Exhibits41: Data Table on Telecom and datacom - Year-over-year growth 2023-2028 (%)
• Exhibits42: Chart on Automotive - Market size and forecast 2023-2028 ($ billion)
• Exhibits43: Data Table on Automotive - Market size and forecast 2023-2028 ($ billion)
• Exhibits44: Chart on Automotive - Year-over-year growth 2023-2028 (%)
• Exhibits45: Data Table on Automotive - Year-over-year growth 2023-2028 (%)
• Exhibits46: Chart on Others - Market size and forecast 2023-2028 ($ billion)
• Exhibits47: Data Table on Others - Market size and forecast 2023-2028 ($ billion)
• Exhibits48: Chart on Others - Year-over-year growth 2023-2028 (%)
• Exhibits49: Data Table on Others - Year-over-year growth 2023-2028 (%)
• Exhibits50: Market opportunity by End-user ($ billion)
• Exhibits51: Data Table on Market opportunity by End-user ($ billion)
• Exhibits52: Chart on Technology - Market share 2023-2028 (%)
• Exhibits53: Data Table on Technology - Market share 2023-2028 (%)
• Exhibits54: Chart on Comparison by Technology
• Exhibits55: Data Table on Comparison by Technology
• Exhibits56: Chart on 3D SoC - Market size and forecast 2023-2028 ($ billion)
• Exhibits57: Data Table on 3D SoC - Market size and forecast 2023-2028 ($ billion)
• Exhibits58: Chart on 3D SoC - Year-over-year growth 2023-2028 (%)
• Exhibits59: Data Table on 3D SoC - Year-over-year growth 2023-2028 (%)
• Exhibits60: Chart on 3D stacked memory - Market size and forecast 2023-2028 ($ billion)
• Exhibits61: Data Table on 3D stacked memory - Market size and forecast 2023-2028 ($ billion)
• Exhibits62: Chart on 3D stacked memory - Year-over-year growth 2023-2028 (%)
• Exhibits63: Data Table on 3D stacked memory - Year-over-year growth 2023-2028 (%)
• Exhibits64: Chart on 2.5D interposers - Market size and forecast 2023-2028 ($ billion)
• Exhibits65: Data Table on 2.5D interposers - Market size and forecast 2023-2028 ($ billion)
• Exhibits66: Chart on 2.5D interposers - Year-over-year growth 2023-2028 (%)
• Exhibits67: Data Table on 2.5D interposers - Year-over-year growth 2023-2028 (%)
• Exhibits68: Chart on UHD FO - Market size and forecast 2023-2028 ($ billion)
• Exhibits69: Data Table on UHD FO - Market size and forecast 2023-2028 ($ billion)
• Exhibits70: Chart on UHD FO - Year-over-year growth 2023-2028 (%)
• Exhibits71: Data Table on UHD FO - Year-over-year growth 2023-2028 (%)
• Exhibits72: Chart on Embedded Si bridge - Market size and forecast 2023-2028 ($ billion)
• Exhibits73: Data Table on Embedded Si bridge - Market size and forecast 2023-2028 ($ billion)
• Exhibits74: Chart on Embedded Si bridge - Year-over-year growth 2023-2028 (%)
• Exhibits75: Data Table on Embedded Si bridge - Year-over-year growth 2023-2028 (%)
• Exhibits76: Market opportunity by Technology ($ billion)
• Exhibits77: Data Table on Market opportunity by Technology ($ billion)
• Exhibits78: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
• Exhibits79: Chart on Market share By Geographical Landscape 2023-2028 (%)
• Exhibits80: Data Table on Market share By Geographical Landscape 2023-2028 (%)
• Exhibits81: Chart on Geographic comparison
• Exhibits82: Data Table on Geographic comparison
• Exhibits83: Chart on APAC - Market size and forecast 2023-2028 ($ billion)
• Exhibits84: Data Table on APAC - Market size and forecast 2023-2028 ($ billion)
• Exhibits85: Chart on APAC - Year-over-year growth 2023-2028 (%)
• Exhibits86: Data Table on APAC - Year-over-year growth 2023-2028 (%)
• Exhibits87: Chart on North America - Market size and forecast 2023-2028 ($ billion)
• Exhibits88: Data Table on North America - Market size and forecast 2023-2028 ($ billion)
• Exhibits89: Chart on North America - Year-over-year growth 2023-2028 (%)
• Exhibits90: Data Table on North America - Year-over-year growth 2023-2028 (%)
• Exhibits91: Chart on Europe - Market size and forecast 2023-2028 ($ billion)
• Exhibits92: Data Table on Europe - Market size and forecast 2023-2028 ($ billion)
• Exhibits93: Chart on Europe - Year-over-year growth 2023-2028 (%)
• Exhibits94: Data Table on Europe - Year-over-year growth 2023-2028 (%)
• Exhibits95: Chart on South America - Market size and forecast 2023-2028 ($ billion)
• Exhibits96: Data Table on South America - Market size and forecast 2023-2028 ($ billion)
• Exhibits97: Chart on South America - Year-over-year growth 2023-2028 (%)
• Exhibits98: Data Table on South America - Year-over-year growth 2023-2028 (%)
• Exhibits99: Chart on Middle East and Africa - Market size and forecast 2023-2028 ($ billion)
• Exhibits100: Data Table on Middle East and Africa - Market size and forecast 2023-2028 ($ billion)
• Exhibits101: Chart on Middle East and Africa - Year-over-year growth 2023-2028 (%)
• Exhibits102: Data Table on Middle East and Africa - Year-over-year growth 2023-2028 (%)
• Exhibits103: Chart on China - Market size and forecast 2023-2028 ($ billion)
• Exhibits104: Data Table on China - Market size and forecast 2023-2028 ($ billion)
• Exhibits105: Chart on China - Year-over-year growth 2023-2028 (%)
• Exhibits106: Data Table on China - Year-over-year growth 2023-2028 (%)
• Exhibits107: Chart on US - Market size and forecast 2023-2028 ($ billion)
• Exhibits108: Data Table on US - Market size and forecast 2023-2028 ($ billion)
• Exhibits109: Chart on US - Year-over-year growth 2023-2028 (%)
• Exhibits110: Data Table on US - Year-over-year growth 2023-2028 (%)
• Exhibits111: Chart on Germany - Market size and forecast 2023-2028 ($ billion)
• Exhibits112: Data Table on Germany - Market size and forecast 2023-2028 ($ billion)
• Exhibits113: Chart on Germany - Year-over-year growth 2023-2028 (%)
• Exhibits114: Data Table on Germany - Year-over-year growth 2023-2028 (%)
• Exhibits115: Chart on Japan - Market size and forecast 2023-2028 ($ billion)
• Exhibits116: Data Table on Japan - Market size and forecast 2023-2028 ($ billion)
• Exhibits117: Chart on Japan - Year-over-year growth 2023-2028 (%)
• Exhibits118: Data Table on Japan - Year-over-year growth 2023-2028 (%)
• Exhibits119: Chart on Canada - Market size and forecast 2023-2028 ($ billion)
• Exhibits120: Data Table on Canada - Market size and forecast 2023-2028 ($ billion)
• Exhibits121: Chart on Canada - Year-over-year growth 2023-2028 (%)
• Exhibits122: Data Table on Canada - Year-over-year growth 2023-2028 (%)
• Exhibits123: Market opportunity By Geographical Landscape ($ billion)
• Exhibits124: Data Tables on Market opportunity By Geographical Landscape ($ billion)
• Exhibits125: Impact of drivers and challenges in 2023 and 2028
• Exhibits126: Overview on Criticality of inputs and Factors of differentiation
• Exhibits127: Overview on factors of disruption
• Exhibits128: Impact of key risks on business
• Exhibits129: Vendors covered
• Exhibits130: Matrix on vendor position and classification
• Exhibits131: Advanced Micro Devices Inc. - Overview
• Exhibits132: Advanced Micro Devices Inc. - Business segments
• Exhibits133: Advanced Micro Devices Inc. - Key news
• Exhibits134: Advanced Micro Devices Inc. - Key offerings
• Exhibits135: Advanced Micro Devices Inc. - Segment focus
• Exhibits136: ASE Technology Holding Co. Ltd. - Overview
• Exhibits137: ASE Technology Holding Co. Ltd. - Business segments
• Exhibits138: ASE Technology Holding Co. Ltd. - Key offerings
• Exhibits139: ASE Technology Holding Co. Ltd. - Segment focus
• Exhibits140: Amkor Technology Inc. - Overview
• Exhibits141: Amkor Technology Inc. - Business segments
• Exhibits142: Amkor Technology Inc. - Key offerings
• Exhibits143: Amkor Technology Inc. - Segment focus
• Exhibits144: Analog Devices Inc. - Overview
• Exhibits145: Analog Devices Inc. - Business segments
• Exhibits146: Analog Devices Inc. - Key news
• Exhibits147: Analog Devices Inc. - Key offerings
• Exhibits148: Analog Devices Inc. - Segment focus
• Exhibits149: ChipMOS TECHNOLOGIES INC. - Overview
• Exhibits150: ChipMOS TECHNOLOGIES INC. - Business segments
• Exhibits151: ChipMOS TECHNOLOGIES INC. - Key offerings
• Exhibits152: ChipMOS TECHNOLOGIES INC. - Segment focus
• Exhibits153: Fujitsu Ltd. - Overview
• Exhibits154: Fujitsu Ltd. - Business segments
• Exhibits155: Fujitsu Ltd. - Key news
• Exhibits156: Fujitsu Ltd. - Key offerings
• Exhibits157: Fujitsu Ltd. - Segment focus
• Exhibits158: Intel Corp. - Overview
• Exhibits159: Intel Corp. - Business segments
• Exhibits160: Intel Corp. - Key news
• Exhibits161: Intel Corp. - Key offerings
• Exhibits162: Intel Corp. - Segment focus
• Exhibits163: Jiangsu Changdian Technology Co. Ltd. - Overview
• Exhibits164: Jiangsu Changdian Technology Co. Ltd. - Product / Service
• Exhibits165: Jiangsu Changdian Technology Co. Ltd. - Key offerings
• Exhibits166: King Yuan Electronics Co. Ltd. - Overview
• Exhibits167: King Yuan Electronics Co. Ltd. - Business segments
• Exhibits168: King Yuan Electronics Co. Ltd. - Key offerings
• Exhibits169: King Yuan Electronics Co. Ltd. - Segment focus
• Exhibits170: Kyocera Corp. - Overview
• Exhibits171: Kyocera Corp. - Key offerings
• Exhibits172: Powertech Technology Inc. - Overview
• Exhibits173: Powertech Technology Inc. - Business segments
• Exhibits174: Powertech Technology Inc. - Key offerings
• Exhibits175: Powertech Technology Inc. - Segment focus
• Exhibits176: Samsung Electronics Co. Ltd. - Overview
• Exhibits177: Samsung Electronics Co. Ltd. - Business segments
• Exhibits178: Samsung Electronics Co. Ltd. - Key news
• Exhibits179: Samsung Electronics Co. Ltd. - Key offerings
• Exhibits180: Samsung Electronics Co. Ltd. - Segment focus
• Exhibits181: Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
• Exhibits182: Taiwan Semiconductor Manufacturing Co. Ltd. - Product / Service
• Exhibits183: Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings
• Exhibits184: Texas Instruments Inc. - Overview
• Exhibits185: Texas Instruments Inc. - Business segments
• Exhibits186: Texas Instruments Inc. - Key news
• Exhibits187: Texas Instruments Inc. - Key offerings
• Exhibits188: Texas Instruments Inc. - Segment focus
• Exhibits189: Tongfu Microelectronics Co. Ltd. - Overview
• Exhibits190: Tongfu Microelectronics Co. Ltd. - Product / Service
• Exhibits191: Tongfu Microelectronics Co. Ltd. - Key offerings
• Exhibits192: Inclusions checklist
• Exhibits193: Exclusions checklist
• Exhibits194: Currency conversion rates for US$
• Exhibits195: Research methodology
• Exhibits196: Validation techniques employed for market sizing
• Exhibits197: Information sources
• Exhibits198: List of abbreviations

The high end semiconductor packaging market is forecasted to grow by USD 30.92 bn during 2023-2028, accelerating at a CAGR of 14% during the forecast period. The report on the high end semiconductor packaging market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing demand for compact electronic devices, increasing product launches in high end semiconductor packaging, and surge in adoption of semiconductor ics for automobiles.

Technavio's high end semiconductor packaging market is segmented as below:

By End-user

• Consumer electronics
• Telecom and datacom
• Automotive
• Others

By Technology

• 3D SoC
• 3D stacked memory
• 2.5D interposers
• UHD FO
• Embedded Si bridge

By Geographical Landscape

• APAC
• North America
• Europe
• South America
• Middle East and Africa

This study identifies the increase in 5G investments as one of the prime reasons driving the high end semiconductor packaging market growth during the next few years. Also, rising adoption of flip-chip, sip, lead-free packaging solutions and advancements in semiconductor material packaging technologies will lead to sizable demand in the market.

The report on the high end semiconductor packaging market covers the following areas:

• High end semiconductor packaging market sizing
• High end semiconductor packaging market forecast
• High end semiconductor packaging market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading high end semiconductor packaging market vendors that include Advanced Micro Devices Inc., ASE Technology Holding Co. Ltd., Amkor Technology Inc., Analog Devices Inc., Arm Ltd., Chipbond Technology Corp., ChipMOS TECHNOLOGIES INC., Fujitsu Ltd., Intel Corp., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., Kyocera Corp., Microchip Technology Inc., nepes Corp., Powertech Technology Inc., PTI Inspection Systems, Renesas Electronics Corp., Taiwan Semiconductor Manufacturing Co. Ltd., Texas Instruments Inc., Tongfu Microelectronics Co. Ltd., and Samsung Electronics Co. Ltd.. Also, the high end semiconductor packaging market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview

2 Market Landscape

• 2.1 Market ecosystem

3 Market Sizing

• 3.1 Market definition
• 3.2 Market segment analysis
• 3.3 Market size 2023
• 3.4 Market outlook: Forecast for 2023-2028

4 Historic Market Size

• 4.1 Global high end semiconductor packaging market 2018 - 2022
• 4.2 End-user Segment Analysis 2018 - 2022
• 4.3 Technology Segment Analysis 2018 - 2022
• 4.4 Geography Segment Analysis 2018 - 2022
• 4.5 Country Segment Analysis 2018 - 2022

5 Five Forces Analysis

• 5.1 Five forces summary
• 5.2 Bargaining power of buyers
• 5.3 Bargaining power of suppliers
• 5.4 Threat of new entrants
• 5.5 Threat of substitutes
• 5.6 Threat of rivalry
• 5.7 Market condition

6 Market Segmentation by End-user

• 6.1 Market segments
• 6.2 Comparison by End-user
• 6.3 Consumer electronics - Market size and forecast 2023-2028
• 6.4 Telecom and datacom - Market size and forecast 2023-2028
• 6.5 Automotive - Market size and forecast 2023-2028
• 6.6 Others - Market size and forecast 2023-2028
• 6.7 Market opportunity by End-user

7 Market Segmentation by Technology

• 7.1 Market segments
• 7.2 Comparison by Technology
• 7.3 3D SoC - Market size and forecast 2023-2028
• 7.4 3D stacked memory - Market size and forecast 2023-2028
• 7.5 2.5D interposers - Market size and forecast 2023-2028
• 7.6 UHD FO - Market size and forecast 2023-2028
• 7.7 Embedded Si bridge - Market size and forecast 2023-2028
• 7.8 Market opportunity by Technology

8 Customer Landscape

• 8.1 Customer landscape overview

9 Geographic Landscape

• 9.1 Geographic segmentation
• 9.2 Geographic comparison
• 9.3 APAC - Market size and forecast 2023-2028
• 9.4 North America - Market size and forecast 2023-2028
• 9.5 Europe - Market size and forecast 2023-2028
• 9.6 South America - Market size and forecast 2023-2028
• 9.7 Middle East and Africa - Market size and forecast 2023-2028
• 9.8 China - Market size and forecast 2023-2028
• 9.9 US - Market size and forecast 2023-2028
• 9.10 Germany - Market size and forecast 2023-2028
• 9.11 Japan - Market size and forecast 2023-2028
• 9.12 Canada - Market size and forecast 2023-2028
• 9.13 Market opportunity By Geographical Landscape

10 Drivers, Challenges, and Trends

• 10.1 Market drivers
• 10.2 Market challenges
• 10.3 Impact of drivers and challenges
• 10.4 Market trends

11 Vendor Landscape

• 11.1 Overview
• 11.2 Vendor landscape
• 11.3 Landscape disruption
• 11.4 Industry risks

12 Vendor Analysis

• 12.1 Vendors covered
• 12.2 Market positioning of vendors
• 12.3 Advanced Micro Devices Inc.
• 12.4 ASE Technology Holding Co. Ltd.
• 12.5 Amkor Technology Inc.
• 12.6 Analog Devices Inc.
• 12.7 ChipMOS TECHNOLOGIES INC.
• 12.8 Fujitsu Ltd.
• 12.9 Intel Corp.
• 12.10 Jiangsu Changdian Technology Co. Ltd.
• 12.11 King Yuan Electronics Co. Ltd.
• 12.12 Kyocera Corp.
• 12.13 Powertech Technology Inc.
• 12.14 Samsung Electronics Co. Ltd.
• 12.15 Taiwan Semiconductor Manufacturing Co. Ltd.
• 12.16 Texas Instruments Inc.
• 12.17 Tongfu Microelectronics Co. Ltd.

13 Appendix

• 13.1 Scope of the report
• 13.2 Inclusions and exclusions checklist
• 13.3 Currency conversion rates for US$
• 13.4 Research methodology
• 13.5 List of abbreviations