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厚膜デバイス市場:タイプ別、エンドユーザー別、地域別、2023-2028年Thick Film Devices Market Report by Type (Capacitors, Resistors, Photovoltaic cells, Heaters, and Others), End-user (Automotive, Healthcare, Consumer Electronics, Infrastructure, and Others), and Region 2023-2028 |
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厚膜デバイス市場:タイプ別、エンドユーザー別、地域別、2023-2028年 |
出版日: 2023年11月02日
発行: IMARC
ページ情報: 英文 147 Pages
納期: 2~3営業日
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世界の厚膜デバイス市場規模は、2022年に1,196億1,000万米ドルに達しました。今後、IMARC Groupは、同市場が2028年までに2,495億2,000万米ドルに達し、2022~2028年の成長率(CAGR)は13.0%になると予測しています。複数の基板と高い互換性を持つフィルムデバイスへのニーズの高まり、コンシューマーエレクトロニクスへの需要の加速、電子部品の小型化傾向の変化は、市場を牽引する重要な要因のひとつです。
厚膜デバイスとは、セラミック基板やガラス基板上に抵抗体、導電体、誘電体などの厚い層を蒸着して製造される電子部品を指します。厚膜蒸着技術は、複雑な電子回路や電子部品の製造を支援します。厚膜デバイスは、高い信頼性を持つ比較的厚い材料の層を持ち、材料は良好な接着性と環境要因に対する耐性を示します。厚膜デバイスは、電気伝導性、誘電率、熱伝導性、TCR(抵抗温度係数)、広い温度範囲での安定性に優れているのが特徴です。これらの特性により、複数の回路素子を集積し、より高い電力処理能力を実現することができます。さらに、特定の電気的・機械的要件を満たすために高度にカスタマイズ可能で、幅広い基板材料と互換性があります。その結果、厚膜デバイスは電子回路、ハイブリッドマイクロエレクトロニクス、集積回路製造アプリケーションで幅広く使用されています。
世界市場の主な原動力は、電気・電子産業における複数の基板との高い互換性を実現するフィルムデバイスへのニーズの高まりです。この背景には、コンシューマーエレクトロニクスや産業用電子機器の需要が加速していることがあります。これに伴い、電子部品の小型化傾向が強まり、単一基板上に複数の機能を集積する必要性が生じていることも、市場を活性化しています。さらに、多くの産業用アプリケーションでアナログ回路とデジタル回路を組み合わせたハイブリッド回路の採用が増加していることも、世界レベルでの製品需要を後押ししています。さらに、自動車生産の急速な拡大と、自動車へのエレクトロニクス統合の高まりが市場を牽引しています。これとは別に、バイオセンサー、ウェアラブル機器、ペースメーカー、埋め込み型機器など、さまざまな医療機器の製造における製品の急速な利用が、市場に有利な機会を生み出しています。さらに、製造プロセス、材料科学、設計技術における継続的な技術進歩が、高性能、堅牢、耐腐食性の製品バリエーションの出現につながっており、市場に弾みをつけています。これに加えて、産業オートメーションシステムの採用拡大により、制御、センシング、モニタリングアプリケーションにおける薄膜デバイスの利用が増加しており、これが市場を後押ししています。その他、IoTアプリケーションやデバイスの利用増加、通信業界の大幅な成長、国内製造を奨励する政府の好意的な取り組みなどが市場に貢献しています。
The global thick film devices market size reached US$ 119.61 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 249.52 Billion by 2028, exhibiting a growth rate (CAGR) of 13.0% during 2022-2028. The augmenting need for film devices facilitating high compatibility with multiple substrates, the accelerating demand for consumer electronics, and the shifting trend towards miniaturization of electronic components represent some of the key factors driving the market.
Thick film devices refer to electronic components that are fabricated through a deposition of a thick layer of resistive, conductive, or dielectric material onto a ceramic or glass substrate. The thick film deposition technique assists in the creation of complex electronic circuits and components. Thick film devices have a relatively thick layer of material with high reliability, with materials that exhibit good adhesion and resistance to environmental factors. They are characterized by good electrical conductivity, dielectric constant, thermal conductivity, TCR (Temperature Coefficient of Resistance) and stability over a wide temperature range. These properties enable the integration of multiple circuit elements and higher power handling capabilities. Additionally, they are highly customizable to meet specific electrical and mechanical requirements and are compatible with a wide range of substrate materials. As a result, they are extensively used in electronic circuits, hybrid microelectronics, and integrated circuit manufacturing applications.
The global market is primarily driven by the augmenting need for film devices facilitating high compatibility with multiple substrates in the electrical and electronics industry. This can be attributed to the accelerating demand for consumer electronics as well as industrial electronics. In line with this, the shifting trend towards miniaturization of electronic components resulting in the need for integration of multiple functions on a single substrate is fueling the market. Moreover, the rising adoption of hybrid circuits requiring a combination of analog and digital circuitry in numerous industrial applications is propelling the product demand on the global level. The market is further driven by the rapid expansion of automotive production, coupled with the rising integration of electronics in vehicles. Apart from this, rapid product utilization in the manufacturing of various medical devices such as biosensors, wearable devices, pacemakers, and implantable devices are creating lucrative opportunities in the market. Furthermore, continual technological advancements in the manufacturing processes, material science and design techniques leading to the advent of high-performance, robust, corrosion-resistant product variants are providing an impetus to the market. In addition to this, the growing adoption of industrial automation systems is resulting in the increasing usage of thin film devices in control, sensing, and monitoring applications, which, in turn, is providing a boost to the market. Some of the other factors contributing to the market include the increasing usage of IoT applications and devices, considerable growth in the telecommunications industry, and favorable government initiatives encouraging domestic manufacturing.
IMARC Group provides an analysis of the key trends in each segment of the global thick film devices market, along with forecasts at the global, regional, and country levels from 2023-2028. Our report has categorized the market based on type and end-user.
Capacitors
Resistors
Photovoltaic cells
Heaters
Others
The report has provided a detailed breakup and analysis of the thick film devices market based on the type. This includes capacitors, resistors, photovoltaic cells, heaters, and others. According to the report, capacitors represented the largest segment.
Automotive
Healthcare
Consumer Electronics
Infrastructure
Others
A detailed breakup and analysis of the thick film devices market based on the end-user has also been provided in the report. This includes automotive, healthcare, consumer electronics, infrastructure, and others. According to the report, automotive accounted for the largest market share.
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for thick film devices. Some of the factors driving the Asia Pacific thick film devices market included considerable growth in the electrical and electronics industry, widespread adoption of smart devices, rising trend of device miniaturization, inflating disposable income levels, etc.
The report has also provided a comprehensive analysis of the competitive landscape in the global thick film devices market. The detailed profiles of all major companies have been provided. Some of the companies covered include Bourns Inc., Ferro Techniek BV, KOA Speer Electronics Inc. (KOA Corporation), Panasonic Corporation, Rohm Semiconductor GmbH, Samsung Electronics Co. Ltd., TE Connectivity Ltd, Thermo Heating Elements LLC, Vishay Intertechnology Inc., Watlow Electric Manufacturing Co., Wurth Elektronik GmbH & Co. KG., YAGEO Corp., etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.
Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.