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半導体パッケージング市場：世界の産業動向、シェア、規模、成長、機会、2023-2028年予測

Semiconductor Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028
出版日: | 発行: IMARC | ページ情報: 英文 151 Pages | 納期: 2～3営業日

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半導体パッケージング市場：世界の産業動向、シェア、規模、成長、機会、2023-2028年予測
出版日: 2023年02月21日
発行: IMARC
ページ情報: 英文 151 Pages
納期: 2～3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界の半導体パッケージングの市場規模は、2022年に324億米ドルに達しました。今後、IMARC Groupは、2023年から2028年の間に7.78%の成長率（CAGR）を示し、2028年までに517億米ドルに達すると予測しています。

半導体パッケージングは、集積回路（IC）チップを周囲の環境から保護するために使用される容器で、1つまたは複数のディスクリートで壊れやすい半導体部品を収容しています。エンベデッドダイ、フリップチップ、ファンインウェハーレベル、ファンアウトウェハーレベルパッケージは、プラスチック、ガラス、金属材料を使用して製造される、一般的に利用できる半導体パッケージングのバリエーションの一部です。半導体製造工程の最終段階で、ロジックユニット、シリコンウエハ、メモリーデバイスの物理的な損傷や腐食を防止する支持ケースとして広く使用されています。また、半導体パッケージングは、高周波ノイズの放射、冷却、静電気放電、機械的損傷から電子システムを保護するのに役立ちます。その結果、自動車、医療、IT・通信、航空宇宙・防衛など、さまざまな産業で幅広く使用されています。

半導体パッケージングの市場動向

  • 民生用電子機器産業で広く利用されていることが、市場の成長を促進する重要な要因の一つです。半導体は、スマートフォン、タブレット、スマートウォッチ、フィットネスバンド、通信機器などの軽量・小型・携帯機器に広く利用されています。さらに、自動車産業の著しい成長が、市場の成長に好影響を与えています。半導体ICは、アンチロック・ブレーキ・システム（ABS）、インフォテインメント、エアバッグ制御、衝突検知技術、窓など、さまざまな製品に広く使用されています。さらに、人工知能（AI）やモノのインターネット（IoT）が統合された産業機器の利用が進み、高い電力要件が求められることも、半導体パッケージングの需要を高めています。これに伴い、大衆の間で環境意識が高まり、電子廃棄物を削減するニーズが高まっていることも、市場成長にプラスの影響を与えています。その他、航空機部品の熱性能を向上させるために航空宇宙産業で広く採用されていることや、超音波診断装置、モバイルX線システム、患者モニターなどの医療機器における半導体パッケージングの需要増加などが、市場の成長を促進すると予想されます。

主要市場のセグメンテーション

  • IMARC Groupは、世界の半導体パッケージング市場レポートの各サブセグメントにおける主要動向の分析と、2023年から2028年までの世界、地域、国レベルでの予測を提供します。当レポートでは、市場をタイプ、包装材料、技術、エンドユーザーに基づいて分類しています。

本レポートで回答した主な質問

  • 世界の半導体パッケージング市場はこれまでどのように推移し、今後数年間はどのように推移するのか？
  • COVID-19は世界の半導体パッケージング市場にどのような影響を与えたか？
  • 主要な地域市場とは？
  • タイプに基づく市場の内訳は？
  • 包装材に基づく市場の内訳は？
  • 技術に基づく市場の内訳は？
  • エンドユーザー別の市場内訳は？
  • 業界のバリューチェーンにおける様々なステージは何か？
  • 業界における主要な促進要因と課題は何か？
  • 世界の半導体パッケージング市場の構造と主要プレイヤーは？
  • 業界における競合の程度は？

目次

第1章 序文

第2章 スコープと調査手法

  • 調査目的
  • 利害関係者について
  • データソース
    • 一次情報
    • 二次情報
  • 市場推定
    • ボトムアップアプローチ
    • トップダウンアプローチ
  • 調査手法

第3章 エグゼクティブサマリー

第4章 イントロダクション

  • 概要
  • 主な業界動向

第5章 半導体パッケージングの世界市場

  • 市場概要
  • 市場実績
  • COVID-19の影響について
  • 市場予測

第6章 タイプ別市場内訳

  • フリップチップ
    • 市場の動向
    • 市場予測
  • エンベデッドDIE
    • 市場の動向
    • 市場予測
  • ファンインWLP
    • 市場の動向
    • 市場予測
  • ファンアウトWLP
    • 市場の動向
    • 市場予測

第7章 包装材別市場内訳

  • 有機基材
    • 市場の動向
    • 市場予測
  • ボンディングワイヤ
    • 市場の動向
    • 市場予測
  • リードフレーム
    • 市場動向について
    • 市場予測
  • セラミックパッケージ
    • 市場動向について
    • 市場予測
  • ダイ・アタッチ素材
    • 市場動向について
    • 市場予測
  • その他
    • 市場の動向
    • 市場予測

第8章 技術別の市場内訳

  • グリッドアレイ
    • 市場の動向
    • 市場予測
  • 小型アウトラインパッケージ
    • 市場の動向
    • 市場予測
  • フラットノーリードパッケージ
    • 市場の動向
    • 市場予測
  • デュアルインラインパッケージ
    • 市場の動向
    • 市場予測
  • その他
    • 市場の動向
    • 市場予測

第9章 エンドユーザー別市場内訳

  • コンシューマーエレクトロニクス
    • 市場の動向
    • 市場予測
  • 自動車
    • 市場の動向
    • 市場予測
  • ヘルスケア
    • 市場の動向
    • 市場予測
  • IT・通信分野
    • 市場の動向
    • 市場予測
  • 航空宇宙・防衛
    • 市場の動向
    • 市場予測
  • その他
    • 市場の動向
    • 市場予測

第10章 地域別市場内訳

  • 北米
    • 米国
      • 市場の動向
      • 市場予測
    • カナダ
      • 市場の動向
      • 市場予測
  • アジア太平洋地域
    • 中国
      • 市場の動向
      • 市場予測
    • 日本
      • 市場の動向
      • 市場予測
    • インド
      • 市場の動向
      • 市場予測
    • 韓国
      • 市場の動向
      • 市場予測
    • オーストラリア
      • 市場の動向
      • 市場予測
    • インドネシア
      • 市場の動向
      • 市場予測
    • その他
      • 市場の動向
      • 市場予測
  • 欧州
    • ドイツ
      • 市場の動向
      • 市場予測
    • フランス
      • 市場の動向
      • 市場予測
    • 英国
      • 市場の動向
      • 市場予測
    • イタリア
      • 市場の動向
      • 市場予測
    • スペイン
      • 市場の動向
      • 市場予測
    • ロシア
      • 市場の動向
      • 市場予測
    • その他
      • 市場の動向
      • 市場予測
  • ラテンアメリカ
    • ブラジル
      • 市場の動向
      • 市場予測
    • メキシコ
      • 市場の動向
      • 市場予測
    • その他
      • 市場の動向
      • 市場予測
  • 中東・アフリカ地域
    • 市場の動向
    • 国別の市場内訳
    • 市場予測

第11章 SWOT分析

  • 概要
  • ストレングス
  • 弱点
  • 機会
  • 脅威

第12章 バリューチェーン分析

第13章 ポーターズファイブフォース分析

  • 概要
  • 買い手の交渉力
  • 供給企業の交渉力
  • 競合の度合い
  • 新規参入業者の脅威
  • 代替品の脅威

第14章 価格分析

第15章 競合情勢

  • 市場構造
  • 主要企業
  • 主要企業のプロファイル
    • Amkor Technology Inc.
    • ASE Group
    • ChipMOS Technologies Inc.
    • Fujitsu Limited
    • Intel Corporation
    • International Business Machines Corporation
    • Jiangsu Changjiang Electronics Technology Co., Ltd.
    • Powertech Technology Inc.
    • Qualcomm Incorporated
    • Samsung Electronics Co. Ltd.
    • STMicroelectronics International N.V.
    • Taiwan Semiconductor Manufacturing Company Limited
    • Texas Instruments Incorporated
図表

List of Figures

  • Figure 1: Global: Semiconductor Packaging Market: Major Drivers and Challenges
  • Figure 2: Global: Semiconductor Packaging Market: Sales Value (in Billion US$), 2017-2022
  • Figure 3: Global: Semiconductor Packaging Market Forecast: Sales Value (in Billion US$), 2023-2028
  • Figure 4: Global: Semiconductor Packaging Market: Breakup by Type (in %), 2022
  • Figure 5: Global: Semiconductor Packaging Market: Breakup by Packaging Material (in %), 2022
  • Figure 6: Global: Semiconductor Packaging Market: Breakup by Technology (in %), 2022
  • Figure 7: Global: Semiconductor Packaging Market: Breakup by End User (in %), 2022
  • Figure 8: Global: Semiconductor Packaging Market: Breakup by Region (in %), 2022
  • Figure 9: Global: Semiconductor Packaging (Flip Chip) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 10: Global: Semiconductor Packaging (Flip Chip) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 11: Global: Semiconductor Packaging (Embedded DIE) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 12: Global: Semiconductor Packaging (Embedded DIE) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 13: Global: Semiconductor Packaging (Fan-in WLP) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 14: Global: Semiconductor Packaging (Fan-in WLP) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 15: Global: Semiconductor Packaging (Fan-out WLP) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 16: Global: Semiconductor Packaging (Fan-out WLP) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 17: Global: Semiconductor Packaging (Organic Substrate) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 18: Global: Semiconductor Packaging (Organic Substrate) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 19: Global: Semiconductor Packaging (Bonding Wire) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 20: Global: Semiconductor Packaging (Bonding Wire) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 21: Global: Semiconductor Packaging (Leadframe) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 22: Global: Semiconductor Packaging (Leadframe) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 23: Global: Semiconductor Packaging (Ceramic Package) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 24: Global: Semiconductor Packaging (Ceramic Package) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 25: Global: Semiconductor Packaging (Die Attach Material) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 26: Global: Semiconductor Packaging (Die Attach Material) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 27: Global: Semiconductor Packaging (Other Packaging Materials) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 28: Global: Semiconductor Packaging (Other Packaging Materials) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 29: Global: Semiconductor Packaging (Grid Array) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 30: Global: Semiconductor Packaging (Grid Array) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 31: Global: Semiconductor Packaging (Small Outline Package) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 32: Global: Semiconductor Packaging (Small Outline Package) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 33: Global: Semiconductor Packaging (Flat no-leads Package) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 34: Global: Semiconductor Packaging (Flat no-leads Package) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 35: Global: Semiconductor Packaging (Dual In-Line Package) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 36: Global: Semiconductor Packaging (Dual In-Line Package) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 37: Global: Semiconductor Packaging (Other Technologies) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 38: Global: Semiconductor Packaging (Other Technologies) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 39: Global: Semiconductor Packaging (Consumer Electronics) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 40: Global: Semiconductor Packaging (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 41: Global: Semiconductor Packaging (Automotive) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 42: Global: Semiconductor Packaging (Automotive) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 43: Global: Semiconductor Packaging (Healthcare) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 44: Global: Semiconductor Packaging (Healthcare) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 45: Global: Semiconductor Packaging (IT and Telecommunication) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 46: Global: Semiconductor Packaging (IT and Telecommunication) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 47: Global: Semiconductor Packaging (Aerospace and Defense) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 48: Global: Semiconductor Packaging (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 49: Global: Semiconductor Packaging (Other End Users) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 50: Global: Semiconductor Packaging (Other End Users) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 51: North America: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 52: North America: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 53: United States: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 54: United States: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 55: Canada: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 56: Canada: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 57: Asia-Pacific: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 58: Asia-Pacific: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 59: China: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 60: China: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 61: Japan: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 62: Japan: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 63: India: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 64: India: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 65: South Korea: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 66: South Korea: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 67: Australia: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 68: Australia: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 69: Indonesia: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 70: Indonesia: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 71: Others: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 72: Others: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 73: Europe: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 74: Europe: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 75: Germany: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 76: Germany: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 77: France: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 78: France: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 79: United Kingdom: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 80: United Kingdom: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 81: Italy: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 82: Italy: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 83: Spain: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 84: Spain: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 85: Russia: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 86: Russia: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 87: Others: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 88: Others: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 89: Latin America: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 90: Latin America: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 91: Brazil: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 92: Brazil: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 93: Mexico: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 94: Mexico: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 95: Others: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 96: Others: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 97: Middle East and Africa: Semiconductor Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 98: Middle East and Africa: Semiconductor Packaging Market: Breakup by Country (in %), 2022
  • Figure 99: Middle East and Africa: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 100: Global: Semiconductor Packaging Industry: SWOT Analysis
  • Figure 101: Global: Semiconductor Packaging Industry: Value Chain Analysis
  • Figure 102: Global: Semiconductor Packaging Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Semiconductor Packaging Market: Key Industry Highlights, 2022 and 2028
  • Table 2: Global: Semiconductor Packaging Market Forecast: Breakup by Type (in Million US$), 2023-2028
  • Table 3: Global: Semiconductor Packaging Market Forecast: Breakup by Packaging Material (in Million US$), 2023-2028
  • Table 4: Global: Semiconductor Packaging Market Forecast: Breakup by Technology (in Million US$), 2023-2028
  • Table 5: Global: Semiconductor Packaging Market Forecast: Breakup by End User (in Million US$), 2023-2028
  • Table 6: Global: Semiconductor Packaging Market Forecast: Breakup by Region (in Million US$), 2023-2028
  • Table 7: Global: Semiconductor Packaging Market: Competitive Structure
  • Table 8: Global: Semiconductor Packaging Market: Key Players
目次
Product Code: SR1523A181_Report

The global semiconductor packaging market size reached US$ 32.4 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 51.7 Billion by 2028, exhibiting a growth rate (CAGR) of 7.78% during 2023-2028.

Semiconductor packaging is a container used for protecting the integrated circuit (IC) chips from surrounding environments and houses one or more discrete and fragile semiconductor components. Embedded die, flip chip, fan-in wafer-level and fan-out wafer-level packaging are some of the commonly available semiconductor packaging variants that are manufactured using plastic, glass and metallic materials. They are widely used to provide a supporting case that prevents physical damage and corrosion to logic units, silicon wafers and memory devices during the final stage of the semiconductor manufacturing process. Semiconductor packaging also aids in protecting the electronic system from radiofrequency noise emission, cooling, electrostatic discharge and mechanical damage. As a result, it finds extensive application across various industries, such as automotive, medical, telecommunications, aerospace and defense.

Semiconductor Packaging Market Trends:

  • The widespread product utilization in the consumer electronics industry is one of the key factors driving the growth of the market. Semiconductors are widely used in lightweight, small and portable devices, such as smartphones, tablets, smartwatches, fitness bands and communication devices. Additionally, significant growth in the automotive industry is favoring the market growth. Semiconductor ICs are widely used in various products, such as anti-lock braking systems (ABS), infotainment, airbag control, collision detection technology and windows. Moreover, the increasing utilization of artificial intelligence (AI) and Internet of Things (IoT)-integrated industrial devices with high power requirements is also enhancing the demand for semiconductor packaging. In line with this, rising environmental consciousness among the masses and the increasing need for reducing electronic waste is positively impacting the market growth. Other factors, including the widespread product adoption in the aerospace industry to improve the thermal performance of the aircraft components, along with the increasing demand for semiconductor packaging in medical devices, such as ultrasound devices, mobile X-ray systems and patient monitors, are anticipated to drive the market toward growth.

Key Market Segmentation:

  • IMARC Group provides an analysis of the key trends in each sub-segment of the global semiconductor packaging market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on type, packaging material, technology and end user.

Breakup by Type:

  • Flip Chip
  • Embedded DIE
  • Fan-in WLP
  • Fan-out WLP

Breakup by Packaging Material:

  • Organic Substrate
  • Bonding Wire
  • Leadframe
  • Ceramic Package
  • Die Attach Material
  • Others

Breakup by Technology:

  • Grid Array
  • Small Outline Package
  • Flat no-leads Package
  • Dual In-Line Package
  • Others

Breakup by End User:

  • Consumer Electronics
  • Automotive
  • Healthcare
  • IT and Telecommunication
  • Aerospace and Defense
  • Others

Breakup by Region:

  • North America
  • United States
  • Canada
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
  • Latin America
  • Brazil
  • Mexico
  • Others
  • Middle East and Africa

Competitive Landscape:

  • The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Group, ChipMOS Technologies Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., Powertech Technology Inc., Qualcomm Incorporated, Samsung Electronics Co. Ltd., STMicroelectronics International N.V., Taiwan Semiconductor Manufacturing Company Limited, and Texas Instruments Incorporated.

Key Questions Answered in This Report:

  • How has the global semiconductor packaging market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global semiconductor packaging market?
  • What are the key regional markets?
  • What is the breakup of the market based on the type?
  • What is the breakup of the market based on the packaging material?
  • What is the breakup of the market based on the technology?
  • What is the breakup of the market based on the end user?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global semiconductor packaging market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Semiconductor Packaging Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Flip Chip
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Embedded DIE
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 Fan-in WLP
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast
  • 6.4 Fan-out WLP
    • 6.4.1 Market Trends
    • 6.4.2 Market Forecast

7 Market Breakup by Packaging Material

  • 7.1 Organic Substrate
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Bonding Wire
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Leadframe
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Ceramic Package
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Die Attach Material
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast
  • 7.6 Others
    • 7.6.1 Market Trends
    • 7.6.2 Market Forecast

8 Market Breakup by Technology

  • 8.1 Grid Array
    • 8.1.1 Market Trends
    • 8.1.2 Market Forecast
  • 8.2 Small Outline Package
    • 8.2.1 Market Trends
    • 8.2.2 Market Forecast
  • 8.3 Flat no-leads Package
    • 8.3.1 Market Trends
    • 8.3.2 Market Forecast
  • 8.4 Dual In-Line Package
    • 8.4.1 Market Trends
    • 8.4.2 Market Forecast
  • 8.5 Others
    • 8.5.1 Market Trends
    • 8.5.2 Market Forecast

9 Market Breakup by End User

  • 9.1 Consumer Electronics
    • 9.1.1 Market Trends
    • 9.1.2 Market Forecast
  • 9.2 Automotive
    • 9.2.1 Market Trends
    • 9.2.2 Market Forecast
  • 9.3 Healthcare
    • 9.3.1 Market Trends
    • 9.3.2 Market Forecast
  • 9.4 IT and Telecommunication
    • 9.4.1 Market Trends
    • 9.4.2 Market Forecast
  • 9.5 Aerospace and Defense
    • 9.5.1 Market Trends
    • 9.5.2 Market Forecast
  • 9.6 Others
    • 9.6.1 Market Trends
    • 9.6.2 Market Forecast

10 Market Breakup by Region

  • 10.1 North America
    • 10.1.1 United States
      • 10.1.1.1 Market Trends
      • 10.1.1.2 Market Forecast
    • 10.1.2 Canada
      • 10.1.2.1 Market Trends
      • 10.1.2.2 Market Forecast
  • 10.2 Asia-Pacific
    • 10.2.1 China
      • 10.2.1.1 Market Trends
      • 10.2.1.2 Market Forecast
    • 10.2.2 Japan
      • 10.2.2.1 Market Trends
      • 10.2.2.2 Market Forecast
    • 10.2.3 India
      • 10.2.3.1 Market Trends
      • 10.2.3.2 Market Forecast
    • 10.2.4 South Korea
      • 10.2.4.1 Market Trends
      • 10.2.4.2 Market Forecast
    • 10.2.5 Australia
      • 10.2.5.1 Market Trends
      • 10.2.5.2 Market Forecast
    • 10.2.6 Indonesia
      • 10.2.6.1 Market Trends
      • 10.2.6.2 Market Forecast
    • 10.2.7 Others
      • 10.2.7.1 Market Trends
      • 10.2.7.2 Market Forecast
  • 10.3 Europe
    • 10.3.1 Germany
      • 10.3.1.1 Market Trends
      • 10.3.1.2 Market Forecast
    • 10.3.2 France
      • 10.3.2.1 Market Trends
      • 10.3.2.2 Market Forecast
    • 10.3.3 United Kingdom
      • 10.3.3.1 Market Trends
      • 10.3.3.2 Market Forecast
    • 10.3.4 Italy
      • 10.3.4.1 Market Trends
      • 10.3.4.2 Market Forecast
    • 10.3.5 Spain
      • 10.3.5.1 Market Trends
      • 10.3.5.2 Market Forecast
    • 10.3.6 Russia
      • 10.3.6.1 Market Trends
      • 10.3.6.2 Market Forecast
    • 10.3.7 Others
      • 10.3.7.1 Market Trends
      • 10.3.7.2 Market Forecast
  • 10.4 Latin America
    • 10.4.1 Brazil
      • 10.4.1.1 Market Trends
      • 10.4.1.2 Market Forecast
    • 10.4.2 Mexico
      • 10.4.2.1 Market Trends
      • 10.4.2.2 Market Forecast
    • 10.4.3 Others
      • 10.4.3.1 Market Trends
      • 10.4.3.2 Market Forecast
  • 10.5 Middle East and Africa
    • 10.5.1 Market Trends
    • 10.5.2 Market Breakup by Country
    • 10.5.3 Market Forecast

11 SWOT Analysis

  • 11.1 Overview
  • 11.2 Strengths
  • 11.3 Weaknesses
  • 11.4 Opportunities
  • 11.5 Threats

12 Value Chain Analysis

13 Porters Five Forces Analysis

  • 13.1 Overview
  • 13.2 Bargaining Power of Buyers
  • 13.3 Bargaining Power of Suppliers
  • 13.4 Degree of Competition
  • 13.5 Threat of New Entrants
  • 13.6 Threat of Substitutes

14 Price Analysis

15 Competitive Landscape

  • 15.1 Market Structure
  • 15.2 Key Players
  • 15.3 Profiles of Key Players
    • 15.3.1 Amkor Technology Inc.
      • 15.3.1.1 Company Overview
      • 15.3.1.2 Product Portfolio
      • 15.3.1.3 Financials
      • 15.3.1.4 SWOT Analysis
    • 15.3.2 ASE Group
      • 15.3.2.1 Company Overview
      • 15.3.2.2 Product Portfolio
      • 15.3.2.3 Financials
    • 15.3.3 ChipMOS Technologies Inc.
      • 15.3.3.1 Company Overview
      • 15.3.3.2 Product Portfolio
      • 15.3.3.3 Financials
    • 15.3.4 Fujitsu Limited
      • 15.3.4.1 Company Overview
      • 15.3.4.2 Product Portfolio
      • 15.3.4.3 Financials
      • 15.3.4.4 SWOT Analysis
    • 15.3.5 Intel Corporation
      • 15.3.5.1 Company Overview
      • 15.3.5.2 Product Portfolio
      • 15.3.5.3 Financials
      • 15.3.5.4 SWOT Analysis
    • 15.3.6 International Business Machines Corporation
      • 15.3.6.1 Company Overview
      • 15.3.6.2 Product Portfolio
      • 15.3.6.3 Financials
      • 15.3.6.4 SWOT Analysis
    • 15.3.7 Jiangsu Changjiang Electronics Technology Co., Ltd.
      • 15.3.7.1 Company Overview
      • 15.3.7.2 Product Portfolio
      • 15.3.7.3 Financials
    • 15.3.8 Powertech Technology Inc.
      • 15.3.8.1 Company Overview
      • 15.3.8.2 Product Portfolio
      • 15.3.8.3 Financials
      • 15.3.8.4 SWOT Analysis
    • 15.3.9 Qualcomm Incorporated
      • 15.3.9.1 Company Overview
      • 15.3.9.2 Product Portfolio
      • 15.3.9.3 Financials
      • 15.3.9.4 SWOT Analysis
    • 15.3.10 Samsung Electronics Co. Ltd.
      • 15.3.10.1 Company Overview
      • 15.3.10.2 Product Portfolio
      • 15.3.10.3 Financials
      • 15.3.10.4 SWOT Analysis
    • 15.3.11 STMicroelectronics International N.V.
      • 15.3.11.1 Company Overview
      • 15.3.11.2 Product Portfolio
      • 15.3.11.3 Financials
      • 15.3.11.4 SWOT Analysis
    • 15.3.12 Taiwan Semiconductor Manufacturing Company Limited
      • 15.3.12.1 Company Overview
      • 15.3.12.2 Product Portfolio
      • 15.3.12.3 Financials
      • 15.3.12.4 SWOT Analysis
    • 15.3.13 Texas Instruments Incorporated
      • 15.3.13.1 Company Overview
      • 15.3.13.2 Product Portfolio
      • 15.3.13.3 Financials
      • 15.3.13.4 SWOT Analysis