Product Code: SR1523A181_Report
The global semiconductor packaging market size reached US$ 32.4 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 51.7 Billion by 2028, exhibiting a growth rate (CAGR) of 7.78% during 2023-2028.
Semiconductor packaging is a container used for protecting the integrated circuit (IC) chips from surrounding environments and houses one or more discrete and fragile semiconductor components. Embedded die, flip chip, fan-in wafer-level and fan-out wafer-level packaging are some of the commonly available semiconductor packaging variants that are manufactured using plastic, glass and metallic materials. They are widely used to provide a supporting case that prevents physical damage and corrosion to logic units, silicon wafers and memory devices during the final stage of the semiconductor manufacturing process. Semiconductor packaging also aids in protecting the electronic system from radiofrequency noise emission, cooling, electrostatic discharge and mechanical damage. As a result, it finds extensive application across various industries, such as automotive, medical, telecommunications, aerospace and defense.
Semiconductor Packaging Market Trends:
- The widespread product utilization in the consumer electronics industry is one of the key factors driving the growth of the market. Semiconductors are widely used in lightweight, small and portable devices, such as smartphones, tablets, smartwatches, fitness bands and communication devices. Additionally, significant growth in the automotive industry is favoring the market growth. Semiconductor ICs are widely used in various products, such as anti-lock braking systems (ABS), infotainment, airbag control, collision detection technology and windows. Moreover, the increasing utilization of artificial intelligence (AI) and Internet of Things (IoT)-integrated industrial devices with high power requirements is also enhancing the demand for semiconductor packaging. In line with this, rising environmental consciousness among the masses and the increasing need for reducing electronic waste is positively impacting the market growth. Other factors, including the widespread product adoption in the aerospace industry to improve the thermal performance of the aircraft components, along with the increasing demand for semiconductor packaging in medical devices, such as ultrasound devices, mobile X-ray systems and patient monitors, are anticipated to drive the market toward growth.
Key Market Segmentation:
- IMARC Group provides an analysis of the key trends in each sub-segment of the global semiconductor packaging market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on type, packaging material, technology and end user.
Breakup by Type:
- Flip Chip
- Embedded DIE
- Fan-in WLP
- Fan-out WLP
Breakup by Packaging Material:
- Organic Substrate
- Bonding Wire
- Leadframe
- Ceramic Package
- Die Attach Material
- Others
Breakup by Technology:
- Grid Array
- Small Outline Package
- Flat no-leads Package
- Dual In-Line Package
- Others
Breakup by End User:
- Consumer Electronics
- Automotive
- Healthcare
- IT and Telecommunication
- Aerospace and Defense
- Others
Breakup by Region:
- North America
- United States
- Canada
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Australia
- Indonesia
- Others
- Europe
- Germany
- France
- United Kingdom
- Italy
- Spain
- Russia
- Others
- Latin America
- Brazil
- Mexico
- Others
- Middle East and Africa
Competitive Landscape:
- The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Group, ChipMOS Technologies Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., Powertech Technology Inc., Qualcomm Incorporated, Samsung Electronics Co. Ltd., STMicroelectronics International N.V., Taiwan Semiconductor Manufacturing Company Limited, and Texas Instruments Incorporated.
Key Questions Answered in This Report:
- How has the global semiconductor packaging market performed so far and how will it perform in the coming years?
- What has been the impact of COVID-19 on the global semiconductor packaging market?
- What are the key regional markets?
- What is the breakup of the market based on the type?
- What is the breakup of the market based on the packaging material?
- What is the breakup of the market based on the technology?
- What is the breakup of the market based on the end user?
- What are the various stages in the value chain of the industry?
- What are the key driving factors and challenges in the industry?
- What is the structure of the global semiconductor packaging market and who are the key players?
- What is the degree of competition in the industry?
Table of Contents
1 Preface
2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
- 4.1 Overview
- 4.2 Key Industry Trends
5 Global Semiconductor Packaging Market
- 5.1 Market Overview
- 5.2 Market Performance
- 5.3 Impact of COVID-19
- 5.4 Market Forecast
6 Market Breakup by Type
- 6.1 Flip Chip
- 6.1.1 Market Trends
- 6.1.2 Market Forecast
- 6.2 Embedded DIE
- 6.2.1 Market Trends
- 6.2.2 Market Forecast
- 6.3 Fan-in WLP
- 6.3.1 Market Trends
- 6.3.2 Market Forecast
- 6.4 Fan-out WLP
- 6.4.1 Market Trends
- 6.4.2 Market Forecast
7 Market Breakup by Packaging Material
- 7.1 Organic Substrate
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
- 7.2 Bonding Wire
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
- 7.3 Leadframe
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
- 7.4 Ceramic Package
- 7.4.1 Market Trends
- 7.4.2 Market Forecast
- 7.5 Die Attach Material
- 7.5.1 Market Trends
- 7.5.2 Market Forecast
- 7.6 Others
- 7.6.1 Market Trends
- 7.6.2 Market Forecast
8 Market Breakup by Technology
- 8.1 Grid Array
- 8.1.1 Market Trends
- 8.1.2 Market Forecast
- 8.2 Small Outline Package
- 8.2.1 Market Trends
- 8.2.2 Market Forecast
- 8.3 Flat no-leads Package
- 8.3.1 Market Trends
- 8.3.2 Market Forecast
- 8.4 Dual In-Line Package
- 8.4.1 Market Trends
- 8.4.2 Market Forecast
- 8.5 Others
- 8.5.1 Market Trends
- 8.5.2 Market Forecast
9 Market Breakup by End User
- 9.1 Consumer Electronics
- 9.1.1 Market Trends
- 9.1.2 Market Forecast
- 9.2 Automotive
- 9.2.1 Market Trends
- 9.2.2 Market Forecast
- 9.3 Healthcare
- 9.3.1 Market Trends
- 9.3.2 Market Forecast
- 9.4 IT and Telecommunication
- 9.4.1 Market Trends
- 9.4.2 Market Forecast
- 9.5 Aerospace and Defense
- 9.5.1 Market Trends
- 9.5.2 Market Forecast
- 9.6 Others
- 9.6.1 Market Trends
- 9.6.2 Market Forecast
10 Market Breakup by Region
- 10.1 North America
- 10.1.1 United States
- 10.1.1.1 Market Trends
- 10.1.1.2 Market Forecast
- 10.1.2 Canada
- 10.1.2.1 Market Trends
- 10.1.2.2 Market Forecast
- 10.2 Asia-Pacific
- 10.2.1 China
- 10.2.1.1 Market Trends
- 10.2.1.2 Market Forecast
- 10.2.2 Japan
- 10.2.2.1 Market Trends
- 10.2.2.2 Market Forecast
- 10.2.3 India
- 10.2.3.1 Market Trends
- 10.2.3.2 Market Forecast
- 10.2.4 South Korea
- 10.2.4.1 Market Trends
- 10.2.4.2 Market Forecast
- 10.2.5 Australia
- 10.2.5.1 Market Trends
- 10.2.5.2 Market Forecast
- 10.2.6 Indonesia
- 10.2.6.1 Market Trends
- 10.2.6.2 Market Forecast
- 10.2.7 Others
- 10.2.7.1 Market Trends
- 10.2.7.2 Market Forecast
- 10.3 Europe
- 10.3.1 Germany
- 10.3.1.1 Market Trends
- 10.3.1.2 Market Forecast
- 10.3.2 France
- 10.3.2.1 Market Trends
- 10.3.2.2 Market Forecast
- 10.3.3 United Kingdom
- 10.3.3.1 Market Trends
- 10.3.3.2 Market Forecast
- 10.3.4 Italy
- 10.3.4.1 Market Trends
- 10.3.4.2 Market Forecast
- 10.3.5 Spain
- 10.3.5.1 Market Trends
- 10.3.5.2 Market Forecast
- 10.3.6 Russia
- 10.3.6.1 Market Trends
- 10.3.6.2 Market Forecast
- 10.3.7 Others
- 10.3.7.1 Market Trends
- 10.3.7.2 Market Forecast
- 10.4 Latin America
- 10.4.1 Brazil
- 10.4.1.1 Market Trends
- 10.4.1.2 Market Forecast
- 10.4.2 Mexico
- 10.4.2.1 Market Trends
- 10.4.2.2 Market Forecast
- 10.4.3 Others
- 10.4.3.1 Market Trends
- 10.4.3.2 Market Forecast
- 10.5 Middle East and Africa
- 10.5.1 Market Trends
- 10.5.2 Market Breakup by Country
- 10.5.3 Market Forecast
11 SWOT Analysis
- 11.1 Overview
- 11.2 Strengths
- 11.3 Weaknesses
- 11.4 Opportunities
- 11.5 Threats
12 Value Chain Analysis
13 Porters Five Forces Analysis
- 13.1 Overview
- 13.2 Bargaining Power of Buyers
- 13.3 Bargaining Power of Suppliers
- 13.4 Degree of Competition
- 13.5 Threat of New Entrants
- 13.6 Threat of Substitutes
14 Price Analysis
15 Competitive Landscape
- 15.1 Market Structure
- 15.2 Key Players
- 15.3 Profiles of Key Players
- 15.3.1 Amkor Technology Inc.
- 15.3.1.1 Company Overview
- 15.3.1.2 Product Portfolio
- 15.3.1.3 Financials
- 15.3.1.4 SWOT Analysis
- 15.3.2 ASE Group
- 15.3.2.1 Company Overview
- 15.3.2.2 Product Portfolio
- 15.3.2.3 Financials
- 15.3.3 ChipMOS Technologies Inc.
- 15.3.3.1 Company Overview
- 15.3.3.2 Product Portfolio
- 15.3.3.3 Financials
- 15.3.4 Fujitsu Limited
- 15.3.4.1 Company Overview
- 15.3.4.2 Product Portfolio
- 15.3.4.3 Financials
- 15.3.4.4 SWOT Analysis
- 15.3.5 Intel Corporation
- 15.3.5.1 Company Overview
- 15.3.5.2 Product Portfolio
- 15.3.5.3 Financials
- 15.3.5.4 SWOT Analysis
- 15.3.6 International Business Machines Corporation
- 15.3.6.1 Company Overview
- 15.3.6.2 Product Portfolio
- 15.3.6.3 Financials
- 15.3.6.4 SWOT Analysis
- 15.3.7 Jiangsu Changjiang Electronics Technology Co., Ltd.
- 15.3.7.1 Company Overview
- 15.3.7.2 Product Portfolio
- 15.3.7.3 Financials
- 15.3.8 Powertech Technology Inc.
- 15.3.8.1 Company Overview
- 15.3.8.2 Product Portfolio
- 15.3.8.3 Financials
- 15.3.8.4 SWOT Analysis
- 15.3.9 Qualcomm Incorporated
- 15.3.9.1 Company Overview
- 15.3.9.2 Product Portfolio
- 15.3.9.3 Financials
- 15.3.9.4 SWOT Analysis
- 15.3.10 Samsung Electronics Co. Ltd.
- 15.3.10.1 Company Overview
- 15.3.10.2 Product Portfolio
- 15.3.10.3 Financials
- 15.3.10.4 SWOT Analysis
- 15.3.11 STMicroelectronics International N.V.
- 15.3.11.1 Company Overview
- 15.3.11.2 Product Portfolio
- 15.3.11.3 Financials
- 15.3.11.4 SWOT Analysis
- 15.3.12 Taiwan Semiconductor Manufacturing Company Limited
- 15.3.12.1 Company Overview
- 15.3.12.2 Product Portfolio
- 15.3.12.3 Financials
- 15.3.12.4 SWOT Analysis
- 15.3.13 Texas Instruments Incorporated
- 15.3.13.1 Company Overview
- 15.3.13.2 Product Portfolio
- 15.3.13.3 Financials
- 15.3.13.4 SWOT Analysis