第3世代半導体産業の世界の動向と戦略の見通し

地政学的リスク高まり、継続する紛争、欧州および米国金融引き締め政策の中、世界経済の実績は2023年と比較して横ばいにとどまる見込みです。しかし、半導体市場は在庫調整の終盤に差し掛かっており、自動車、ハイパフォーマンスコンピューティング(HPC)、AIoT分野の需要が成長の回復を支える態勢が整っており、2桁増益につながる可能性があります。さらに、ワイドバンドギャップ化合物半導体（第3世代材料）は、ネット・ゼロ・エミッション達成に不可欠な高耐電圧、温度耐性、エネルギー効率で注目を集めています。この市場では現在、欧州、米国、日本企業がリードしており、中国、韓国、台湾が新たな競合となっています。

この当ポートでは、世界の半導体市場の業績をまとめ、主要DRAMサプライヤーであるSamsung、SK Hynix、Micronの競合情勢を分析し、3D NAND、主要ウエハーファウンドリ、主要地域の第3世代半導体産業の今後の展開を探ります。また、日本、韓国、中国など主要国の第三世代半導体政策についても検証しています。

目次

• 世界の半導体産業チェーンの発展と戦略的位置

第1章 世界の半導体市場のパフォーマンス

• 2023年の世界の半導体市場は縮小
• サプライチェーンの回復により、2024年の半導体市場は2桁成長を遂げる見込み
• ICが世界の半導体市場を独占し、シェアは80%以上
• 2024年の世界の最終製品出荷量の増加が需要の拡大を牽引

第2章 世界の半導体企業の設備投資

• 世界の半導体企業における設備投資の集中
• 半導体装置が設備投資の最大の割合を占める

第3章 DRAMサプライヤー3社の競合情勢

• 韓国の2つのサプライヤーがDRAM市場の72%のシェアを独占
• DRAMが2024年に1γプロセスに移行し、熾烈な競争が予想される
• HPCアプリケーションがHBM開発を推進

第4章 3D NANDは200層時代へ

• 韓国企業2社が52%のシェアでNANDフラッシュ市場をリード
• 300層時代を迎える3D NANDの未来

第5章 大手ウエハーファウンドリが3nmプロセスを量産

• 2022-2023年：主要ファウンドリが3nmプロセスの量産を開始
• 2024-2025：主要ファウンドリが2nm時代で競う

第6章 世界の半導体企業の収益ランキング

• TSMCは2023年も世界最大の半導体企業であり続ける
• Nvidia、2023年に収益87%増で目立った

第7章 MICの視点

付録

• 企業一覧
• 世界の第3世代半導体産業の発展と主要企業の製品戦略

第1章 欧州と米国の第3世代半導体産業の発展

• 欧州
  • 自動車と産業のニッチ分野に注力
  • 豊富な調査リソースと強力なエピタキシーおよびウエハーファウンドリ能力
• 米国
  • 軍事利用を優先し、民生利用も拡大
  • 通信デバイスとパワーデバイスの両方に注力し、SiC基板市場シェアをリード

第2章 米国の主要企業の製品戦略

• STMicroelectronics
• Infineon
• Onsemi
• Wolfspeed
• Navitas
• Qorvo

第3章 東アジアにおける第3世代半導体産業の発展

• 日本
  • 電力と通信機器の開発に等しく注力
  • 特許取得でトップ、エピタキシー技術に強み
• 韓国
  • 電力用途に重点を置いた政府主導の開発
• 中国
  • 政府主導の開発と急速な拡大
  • 国内市場の大きさと政策支援により、外国企業は地元企業と提携

第4章 東アジアの主要企業の製品戦略

• ROHM
• Sumitomo Group
• Mitsubishi
• Innoscience
• Sanan Optoelectronics

第5章 MICの視点

付録

• 企業一覧
• 日本、韓国、中国における第3世代半導体（SiC）の産業政策

第1章 日本と韓国のSiC産業政策の分析

• 日本、SiC産業の発展を促進するために省エネ計画を導入
• 日本、半導体の自給率を強化、業界流出防止へ
• 高出力市場への期待が高まる中、日本はSiC産業の育成に注力
• 韓国、SiC産業のブレークスルーに向けて省エネアプリケーションに注力
• 世界の半導体不足は韓国の半導体産業にとって重大な転換点となる
• 韓国、車載用SiCパワーデバイス市場開拓に向け研究開発を強化

第2章 中国のSiC産業政策の分析

• 中国は国家エネルギー開発の重要優先課題としてSiCをターゲットに
• 中国は第14次5カ年計画を通じてSiCにおける西側諸国の進歩を追い抜くことを目指す
• 中国、SiC市場での競争力強化に向け地元企業を支援

第3章 主要国のSiC政策動向

• 米国のSiC政策動向
• EUにおけるSiC政策の動向
• 日本と韓国におけるSiC政策の動向
• 中国におけるSiC政策の動向

第4章 MICの視点

付録

• 企業一覧
• 台湾の第三世代半導体産業の発展と主要プレーヤー

第1章 台湾の第三世代半導体産業の発展

• 台湾は第3世代半導体への参入が遅れ、主にウエハーファウンドリに注力
• 明るい見通しが準IDMとファウンドリの生産能力拡大を促進
• 技術・物質的自立を優先する政策だが、さらなる応用には改善の余地あり

第2章 台湾主要企業の動向と戦略

• SAS
• Foxconn Technology Group
• Panjit

第3章 MICの視点

付録

• 企業一覧

List of Tables

• Development and Strategic Position of the Global Semiconductor Industry Chain
• Table 1. 2023 Global Top 25 Semiconductor Companies Revenue Rankings (Including Wafer Foundries)
• Development of the Global Third-Generation Semiconductor Industry and Product Strategies of Leading Companies
• Table 1: Development Strategies of Leading Third-Gen Semiconductor Companies in Europe and the United States
• Table 2: Products of Leading Third-Gen Semiconductor Companies in Europe and the United States
• Table 3: Development Strategies of Leading Third-Gen Semiconductor Companies in East Asia
• Table 4: Products of Leading Third-Gen Semiconductor Companies in East Asia
• Industry Policies of Third-Generation Semiconductors - SiC - in Japan, Korea, and China
• Table 1: Japan's SiC Industry Policies from 1998 to 2020
• Table 2: Japan's SiC Industry Policies from 2021 to 2023
• Table 3: Korea's SiC Industry Policies from 2000 to 2020
• Table 4: Korea's SiC Industry Policies from 2021 to 2023
• Table 5: China's SiC Industry Policies from 2004 to 2016
• Table 6: China's SiC Industry Policies from 2017 to 2020
• Table 7: China's SiC Industry Policies from 2021 to 2023
• Table 8: China's Key Support Measures for SiC in the Special Project on New Displays and Strategic Electronic Materials
• Table 9: Research Status 0f SiC at China’s Major Universities
• Development of Taiwan's Third-Generation Semiconductor Industry and Key Players
• Table 1: Capacity Expansion Timeline for Taiwanese Third-Generation Semiconductor Manufacturers
• Table 2: Key Development Strategies of Taiwanese Third-Generation Semiconductor Companies
• Table 3: Major Products of Taiwanese Third-Generation Semiconductor Companies

List of Figures

• Development and Strategic Position of the Global Semiconductor Industry Chain
• Figure 1. Worldwide Semiconductor Market Value, 2011 - 2024
• Figure 2. End Product Shipment Volume and Growth Rate in 2024
• Figure 3: Global Leading DRAM Manufacturers' Technology Roadmap
• Figure 4. Global Major NAND Flash Manufacturers' Technology Roadmap
• Figure 5. Global Major Wafer Foundries’ Technology Roadmap
• Development of the Global Third-Generation Semiconductor Industry and Product Strategies of Leading Companies
• Figure 1: STMicroelectronics' Third-Gen Semiconductor Development Strategies
• Figure 2: Infineon's Third-Gen Semiconductor Development Strategies
• Figure 3: Onsemi's Third-Gen Semiconductor Development Strategies
• Figure 4: Wolfspeed's Third-Gen Semiconductor Development Strategies
• Figure 5: Navitas' Third-Gen Semiconductor Development Strategies
• Figure 6: Qorvo's Third-Gen Semiconductor Development Strategies
• Figure 7: ROHM's Third-Gen Semiconductor Development Strategies
• Figure 8: SEDI's Vision for Information Transmission by 2030
• Figure 9: Mitsubishi's Third-Gen Semiconductor Development Strategies
• Figure 10: Innoscience's Third-Gen Semiconductor Development Strategies
• Figure 11: Sanan Optoelectronics' Third-Gen Semiconductor Development Strategies
• Industry Policies of Third-Generation Semiconductors - SiC - in Japan, Korea, and China
• Figure 1: Comparison of Major Countries’ SiC Policies
• Development of Taiwan's Third-Generation Semiconductor Industry and Key Players
• Figure 1: Taiwan's Third-Generation Semiconductor Industry Chain
• Figure 2: Business Landscape of SAS Group
• Figure 3: SAS Group's Third-Generation Semiconductor Development Strategy
• Figure 4: Foxconn Technology Group's Vision
• Figure 5: Foxconn Technology Group's Third-Generation Semiconductor Development Strategy
• Figure 6: Development Timeline for Panjit's SiC Products
• Figure 7: Panjit's Third-Generation Semiconductor Development Strategy

Amid escalating geopolitical risks, ongoing conflicts, and tightening monetary policies in Europe and the U.S., global economic performance is expected to remain flat compared to 2023. However, the semiconductor market is nearing the end of its inventory adjustments, with demand in the automotive, high-performance computing (HPC), and Artificial Intelligence of Things (AIoT) sectors poised to support a return to growth, potentially leading to double-digit gains. Additionally, wide-bandgap compound semiconductors, or third-generation materials, are gaining attention for their high voltage resistance, temperature tolerance, and energy efficiency—crucial attributes for achieving net-zero emissions. Companies in Europe, the U.S., and Japan currently lead in this market, with emerging competition from China, South Korea, and Taiwan.

This value pack provides an overview of global semiconductor market performance, analyzes the competitive landscape of leading DRAM suppliers—Samsung, SK Hynix, and Micron—and explores future developments in 3D NAND, major wafer foundries, and the third-generation semiconductor industry across key regions. It also examines policies of major countries for third-generation semiconductors, such as Japan, South Korea, and China.

Table of Contents

• Development and Strategic Position of the Global Semiconductor Industry Chain

1. Global Semiconductor Market Performance

• 1.1 Global Semiconductor Market Declines in 2023
• 1.2 Supply Chain Recovery Likely to Drive Double-Digit Growth in the Semiconductor Market in 2024
• 1.3 ICs Dominating the Global Semiconductor Market with Over 80% Share
• 1.4 Global End-Product Shipment Growth Driving Pull-in Demand in 2024

2. Capex of Global Semiconductor Companies

• 2.1 High Concentration of CapEx among Global Semiconductor Firms
• 2.2 Semiconductor Equipment Takes the Largest Share of CapEx

3. Competitive Landscape of three DRAM suppliers

• 3.1 Two Korea Suppliers Dominates the DRAM Market with a 72% Share
• 3.2 Fierce Competition Expected as DRAM Enters the 1γ Process in 2024
• 3.3 HPC Applications Drive HBM Development

4. 3D NAND Advances into the 200-Layer Era

• 4.1 Two Korean Companies Lead the NAND Flash Market with a 52% Share
• 4.2 The Future of 3D NAND Entering the 300-Layer Era

5. Major Wafer Foundries Have Mass-Produced 3nm Process

• 5.1 2022-2023: Major Foundries Kick off 3nm Process Mass Production
• 5.2 2024-2025: Major Foundries Compete in the 2nm Era

6. Global Semiconductor Companies’ Revenue Ranking

• 6.1 TSMC Remains the World’s Largest Semiconductor Company in 2023
• 6.2 Nvidia Stands Out in 2023 with Revenue Growth of 87%

7. MIC Perspective

Appendix

• List of Companies
• Development of the Global Third-Generation Semiconductor Industry and Product Strategies of Leading Companies

1. Development of European and US Third-Gen Semiconductor Industry

• 1.1 Europe
  • 1.1.1 Focusing on Automotive and Industrial Niches
  • 1.1.2 Abundant Research Resources and Robust Epitaxy and Wafer Foundry Capabilities
• 1.2 US
  • 1.2.1 Prioritizing Military Applications , Expanding to Civilian Uses
  • 1.2.2 Leading SiC Substrate Market Share with Equal Focus on Communication and Power Devices

2. Product Strategies of Leading Companies in Europe and the US

• 2.1 STMicroelectronics
• 2.2 Infineon
• 2.3 Onsemi
• 2.4 Wolfspeed
• 2.5 Navitas
• 2.6 Qorvo

3. Development of Third-Gen Semiconductor Industry in East Asia

• 3.1 Japan
  • 3.1.1 Equal Focus on Development of Power and Communication Devices
  • 3.1.2 Leading in Patents, with Strengths in Epitaxy Technology
• 3.2 Korea
  • 3.2.1 Government-led Development with Focus on Power Applications
• 3.3 China
  • 3.3.1 Government-led Development with Rapid Expansion
  • 3.3.2 Foreign Companies Partnering with Local Firms due to Large Domestic Market and Policy Support

4. Product Strategies of Leading Companies in East Asia

• 4.1 ROHM
• 4.2 Sumitomo Group
• 4.3 Mitsubishi
• 4.4 Innoscience
• 4.5 Sanan Optoelectronics

5. MIC Perspective

Appendix

• List of Companies
• Industry Policies of Third-Generation Semiconductors - SiC - in Japan, Korea, and China

1.Analysis of SiC Industry Policies in Japan and Korea

• 1.1 Japan Introduces Energy-Saving Plans to Boost SiC Industry Development
• 1.2 Japan Reinforces Semiconductor Self-sufficiency to Prevent Industry Exodus
• 1.3 With High Hopes for the High-Power Market, Japan Focuses on SiC Industry Development
• 1.4 Korea Focuses on Energy-Saving Applications for Breakthroughs in SiC Industry
• 1.5 Global Chip Shortages Present a Critical Turning Point for Korea’s Semiconductor Industry
• 1.6 Korea Ramps up R&D to Cultivate the Automotive SiC Power Device Market

2. Analysis of SiC Industry Policies in China

• 2.1 China Targets SiC as a Key Priority for National Energy Development
• 2.2 China Aims to Surpass Western Advancements in SiC via the 14th Five-Year Plan
• 2.3 China Bolsters Local Enterprises to Strengthen Competitiveness in the SiC Market

3. SiC Policy Development Trends of Major Countries

• 3.1 SiC Policy Development Trends in the United States
• 3.2 SiC Policy Development Trends in the EU
• 3.3 SiC Policy Development Trends in Japan and Korea
• 3.4 SiC Policy Development Trends in China

4. MIC Perspective

Appendix

• List of Companies
• Development of Taiwan's Third-Generation Semiconductor Industry and Key Players

1.Taiwanese Third-Generation Semiconductor Industry Development

• 1.1 Taiwan's Late Entry into Third-Generation Semiconductors Focuses Mainly on Wafer Foundry
• 1.2 Positive Outlook Drives Capacity Expansion by Quasi-IDMs and Foundries
• 1.3 Policy Prioritizing Technological and Material Independence, But Further Applications Still Need Improvement

2. Trends and Straties of Major Taiwanese Companies

• 2.1 SAS
• 2.2 Foxconn Technology Group
• 2.3 Panjit

3. MIC Perspective

Appendix

• List of Companies