市場調査レポート

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先を行くために - 半導体産業分析 (2023年)：レポートセット (7冊) - 台湾・中国・世界のIC設計・IC製造 (ファウンドリ、メモリ)・IC OSAT産業の洞察とサプライチェーン

Stay Ahead - 2023 Semiconductor Industry Research Value Pack: 7 Reports Bundle Encompasses IC Design, IC Manufacturing (Foundry, Memory) and IC OSAT Industry Insights and Supply Chains in Taiwan, China, and the World

出版日: 2023年11月24日 | 発行: MIC - Market Intelligence & Consulting Institute

| ページ情報: 英文 80 Pages | 納期: 即納可能

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当商品は、MIC （マーケットインテリジェンス＆コンサルティングインスティチュート）社が発行するレポート7冊をまとめた、レポートセットです。内訳は、1.世界のIC設計業界、2.世界の半導体ファウンドリ産業、3. 世界のICパッケージング＆テスト業界、4.「中国のIC設計産業の発展と主要企業」、5. 「中国ICパッケージングおよびテスト産業の発展と主要企業」、6. 台湾の半導体産業の展望、7. 台湾半導体産業の主要な動向、で構成されています。

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概要
図表
目次

概要

サンプル依頼リストに入れる

エグゼクティブサマリー

このレポートパックでは、世界および中国・台湾のIC設計・IC製造 (ファウンドリ、メモリ)・IC OSAT (半導体組立・検査アウトソーシング) 業界について包括的に分析すると共に、各々のサプライチェーンの構造や最新情勢 (2022～2023年) について調査しております。

高いインフレ率やロシア・ウクライナ戦争などの悪材料にもかかわらず、世界の半導体産業は2022年を通じて二桁台の成長を維持しています。この動きを支えているのが、上半期の増収や、ネットワーク・データセンター用チップの堅調な販売です。世界の半導体の市場規模は2023年に、マクロ経済環境全般の影響を受け、10.1%減の5,161億米ドルになると予想されます。なかでもメモリーIC部門は今年最も大きな影響を受けました。幸いなことに、2023年第1四半期以降、世界の主要メモリICメーカーは減産制御を実施し、出荷価格を安定させました。前年比成長率が46.3%と予想されたメモリIC業界では、2024年に市場規模が1,343億米ドルに達し、2025年と2026年にもそれぞれ前年比成長率38.7%と13.1%の高成長が続くと予想されます。この分野は今後3年間、世界半導体市場の成長を牽引する主要な原動力になると予想されます。

IC設計
- ピークシーズンの業績は、期待に応えられない (2023年下半期)
- AIブームが続く中、IC設計企業は複数の用途に多角化
IC製造
- ウエハーファウンドリの見通しは慎重：受注の可視性が低いため
- メモリの需要・供給は、2023年第4四半期から2024年上半期にかけて安定すると予想
ICパッケージング・検査
- 消費者市場の勢いの回復に応じたピークシーズンの影響
- HPC・AI用途の新たな動向による、先進パッケージング・検査需要の継続的拡大

付録

企業一覧

図表

List of Topics

Development of the global, China, and Taiwan IC design industry in 2022-2023, covering respective company rankings, their performance overview in 2022, and development strategies of major players such as Qualcomm, MediaTek, Nvidia, AMD, Broadcom, Marvell, Huawei Hisilicon, Unisoc, GigaDevice, Will Semiconductor, etc.

Development of the global and Taiwan semiconductor foundry industry in 2022-2023, addressing respective foundry rankings, their performance overview in 2022, and development strategies of key players such as TSMC, Samsung, UMC, PSMC, VSI (Vanguard), SMIC, GlobalFoundries, etc.

Development of the global, China, and Taiwan IC OSAT (Outsourced Semiconductor Assembly and Testing) industry in 2022-2023, including respective foundry rankings, their performance overview, and development strategies of key players such as ASE, PTI, KYEC, Amkor, JCET, Tongfu Microelectronics, Huatian Technology, etc.

Companies covered

Alchip
Amazon
AMD
Amkor
Apple
Ardentec
ASE Group
ASEN Semiconductors
Baidu
Biren
Bitmain
Cadence
Geely
Bosch
Broadcom
China Wafer Level
Chipmore Technology
ChipMOS
Chrysler
DB HiTek
Dell
Denso
Episil
Faraday
FlipChip International
FocalTech
Ford
Forehope Electronic
Formosa Advanced
General Motors
GigaDevice
Global Unichip
GlobalFoundries
Google
Hana Microelectronics
Himax
HiSilicon
Hongxin Semiconductor
HP
HSMC
Huawei
Jinan Quanxin
Macronix
Hua Hong Semiconductor
Huahong Group
Huatian Technology
Infineon
Intel
Inventec
JCET
Kore Semiconductor
KYEC
Lingsen Precision
Macronix
Marvell
MediaTek
MediaTek
Micron
OmniVision
Qualcomm
RDA Microelectronics
Siemens
Silead
Micron
Mosel
Nanya Technology
Nepes
Nexchip
Novatek
Nuvoton
Nvidia
NXP
Onsemi
Open AI
Orient Semiconductor
Payton Technology
Powertech Technology
PSMC
Qorvo
Qualcomm
Quanta
Realtek
Samsung
SFA
Sigurd Microelectronics
Siliconware
SJ Semiconductor
SK Hynix
Skyworks
SMIC
Sony
Spreadtrum
Synopsys
STATS ChipPAC
STMicroelectronics
Sunplus
Supermicro
Texas Instruments
Tongfu Electronics
Tower
Tsinghua Unigroup
TSMC
UMC
Unimos Microelectronics
Unisem
Unisoc
Unitech Holdings
UTAC
Vanguard
VIS
Walton Advanced Engineering
Will Semiconductor
Winbond
Wise Road Capital
Wistron
Xilinx
YTEC

Product Code: SCRPT23112401

Executive Summary

This pack offers comprehensive insights into the IC design, IC manufacturing (foundry, memory), and IC OSAT (Outsourced Semiconductor Assembly and Testing) sectors, covering global, Taiwan, and China, along with their respective supply chains for the period 2022-2023 and beyond.

Despite adverse factors such as high inflation rates and the Russia-Ukraine war, the global semiconductor industry sustained double-digit growth throughout 2022, supported by higher revenue in the first half and robust sales of networking and data center chips. In 2023, the global semiconductor market is expected to have declined by 10.1% to US$516.1 billion under the influence of the overall macroeconomic environment. Among them, the memory IC sector has been the most affected this year. Fortunately, since the first quarter of 2023, major global memory IC manufacturers have implemented production reduction controls, stabilizing shipment prices. With an expected year-on-year growth of 46.3%, the memory IC sector is anticipated to reach US$134.3 billion in 2024 and continue high growth in 2025 and 2026, with year-on-year growth rates of 38.7% and 13.1%, respectively. This sector is expected to be a major driving force for the global semiconductor market growth in the next three years.

2022 Recap and 2023 Development of the Global IC Design Industry

1.Development of the Global IC Design Industry in 2022

1.1 Ranking of Global Top Ten IC Design Companies in 2022
1.2 IC Design Industry's Overall Performance in 2022

2. Major IC Design Companies' Business Operations in 2022

2.1 Qualcomm & MediaTek
2.2 Nvidia & AMD
2.3 Broadcom & Marvell

3.Development of the Global IC Design Industry in 2023

3.1 Uncertain Outlook for 2H23 Due to Slow Recovery in the Smartphone and PC Markets
3.2 Rise of AI Applications Driving Opportunities for Cloud Server and Edge Computing Chips

Appendix

List of Companies
2022 Recap and 2023 Development of the Worldwide Semiconductor Foundry Industry

1.Global Foundry Industry Recap 2022

1.1 Global Semiconductor Foundry Market Size in 2022
1.2 Top Ten Global Semiconductor Foundry Rankings in 2022
1.3 Overall Performance of the Semiconductor Foundry Industry in 2022

2. Development Trends of Major Semiconductor Foundries in 2022

2.1 TSMC
2.2 Samsung
2.3 UMC, PSMC, Vanguard
2.4 SMIC
2.5 GlobalFoundries

3. Global Semiconductor Foundry Industry Development in 2023

3.1 Foundry Operations Expected to Bottom Out in 1H23, Recovery Pace Remains Uncertain in 2H23
3.2 Intel’s New IFS Business Model to Change the Global Semiconductor Foundry Landscape

Appendix

List of Companies
2022 Recap and 2023 Development of the Global IC Packaging and Testing Industry

1. Recap of the Global IC Packaging and Testing Industry in 2022

1.1 Market Size and Top Ten OSAT Rankings in the Global IC Packaging and Testing Industry in 2022
1.2 Overall Performance of the Global IC Packaging and Testing Industry in 2022

2.Operational Performance of Major OSAT Companies in 2022

2.1 ASE Holdings, PTI, KYEC
2.2 Amkor, JCET

3. Outlook for the Global IC Packaging and Testing Industry

3.1 OSATs Shifting Focus to Automotive Chips While Consumer Electronics Demand Weakening
3.2 Leading Players Accelerate Advanced Packaging Technology Development to Meet Emerging HPC and AI Application Trends

Appendix

List of Companies
Development of the IC Design Industry and Major Players in China

1.Overview of the IC Design Industry in China

1.1 Changes in the Market Size of the IC Design Industry
1.2 Distribution of IC Design Industry Players
- 1.2.1 Changes in the Number of IC Design Companies
- 1.2.2 Distribution of IC Design Industry Players by Scale
- 1.2.3 Distribution of IC Design Products by Category

2. Development of Major IC Design Companies in China

2.1 Huawei HiSilicon
2.2 Unisoc
2.3 GigaDevice
2.4 Will Semiconductor

3. Development of the IC Design Industry in China

3.1 Independent IC Supply Rate in China
3.2 The Subsequent Impact of the EDA Ban

4.MIC Perspective

Appendix

List of Companies
Development of the China IC Packaging and Testing Industry and Key Players

1.Development of China IC Packaging and Testing Industry

1.1 Market Size and Recent Changes in China's IC Packaging and Testing Industry
1.2 Regional Distribution of IC Packaging and Testing Industry Players in China

2.Development of major IC Packaging and Testing Players in China

2.1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies
2.2 Recent Performance of the Top-3 Chinese IC Packaging and Testing Companies
- 2.2.1 JCET
- 2.2.2 Tongfu Microelectronics
- 2.2.3 Huatian Technology

3.Outlook for the Industry

3.1 Effects of National Integrated Circuit Industry Investment Fund
3.2 Impact of US-China Conflict and Decoupling from China
3.3 China Shifting Focus to Automotive Semiconductors Following Obstacles in Advanced Process Technology

Appendix

List of Companies
Taiwanese Semiconductor Industry Landscape, 2023 and Beyond
Taiwan's Global Position and Development in the Semiconductor Industry
Development of Taiwan's Major Semiconductor Industry Sectors
Key Developments in the Taiwan Semiconductor Industry, 3Q 2023 and Beyond

1.Development of the Semiconductor Industry

1.1 IC Design
- 1.1.1 Peak Season Performance Fails to Meet Expectations in 2H23
- 1.1.2 IC Design Firms Diversify into Multiple Applications amid Continued AI Boom
1.2 IC Manufacturing
- 1.2.1 Wafer Foundry Outlook Cautious due to Low Order Visibility
- 1.2.2 Memory Supply and Demand Expected to Stabilize during 4Q23 to 1H24
1.3 IC Packaging and Testing
- 1.3.1 Peak Season Effect Depending on Consumer Market Momentum Pickups
- 1.3.2 Emerging Trends in HPC and AI Applications Continue to Drive Demand for Advanced Packaging and Testing

Appendix

List of Companies

List of Tables

2022 Recap and 2023 Development of the Global IC Design Industry
Table 1 Ranking of Global Top Ten IC Design Companies in 2022
2022 Recap and 2023 Development of the Worldwide Semiconductor Foundry Industry
Table 1: Top Ten Global Semiconductor Foundry Rankings in 2022
2022 Recap and 2023 Development of the Global IC Packaging and Testing Industry
Table 1 Global Top Ten OSAT Rankings in 2022
Development of the China IC Packaging and Testing Industry and Key Players
Table 1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies in 2022

List of Figures

2022 Recap and 2023 Development of the Global IC Design Industry
Figure 1 Leading IC Design Companies' Changes in Inventory Turnover Days, 1Q21 - 1Q23
Figure 2 Leading IC Design Companies' Revenue Changes, 1Q22 - 1Q23
Figure 3 Qualcomm's 2022 Revenue by Product Line
Figure 4 MediaTek's 2022 Revenue by Product Line
Figure 5 Nvidia's 2022 Revenue by Product Line
Figure 6 AMD's 2022 Revenue by Product Line
Figure 7 Broadcom's 2022 Revenue by Semiconductor Solutions Product Line
Figure 8 Marvell's 2022 Revenue by Product Line
2022 Recap and 2023 Development of the Worldwide Semiconductor Foundry Industry
Figure 1 Comparison of Major Foundries’ Gross Margin Changes, 2021 - 2022
Figure 2 TSMC’s Revenue Changes by Product Applications, 2021-2022
Figure 3 Samsung’s Revenue Changes by Business Segments, 2021-2022
Figure 4 UMC’s Revenue Changes by Product Applications, 2021-2022
Figure 5 PSMC’s Revenue Changes by Product Applications, 2021-2022
Figure 6 Vanguard’s Revenue Changes by Product Applications, 2020-2021
Figure 7 SMIC’s Revenue Changes by Product Applications, 2021-2022
Figure 8 GlobalFoundries’ Revenue Changes by Product Applications, 2021-2022
Figure 9 Intel's IDM 2.0 Business Model
2022 Recap and 2023 Development of the Global IC Packaging and Testing Industry
Figure 1: Revenue Changes of Major OSAT Companies, 1Q22 - 2Q23
Figure 2: Gross Margin Changes of Major OSAT Companies, 1Q22 - 2Q23
Figure 3: ASE ATM’s Revenue Changes by Product Application, 2020 - 2022
Figure 4: ASE ATM’s Revenue Changes by Packaging & Testing Product Portfolio, 2020 - 2022
Figure 5: PTI's Revenue Changes by Services, 2020 - 2022
Figure 6: PTI's Revenue Changes by Products, 2020 - 2022
Figure 7: KYEC's Revenue Changes by Process Nodes, 2020 - 2022
Figure 8: KYEC's Revenue Changes by Product Applications, 2020 - 2022
Figure 9: Amkor's Revenue Changes by Packaging & Testing Types, 2020 - 2022
Figure 10: Amkor's Revenue Changes by End Product Applications, 2020 - 2022
Figure 11: JCET's Revenue Changes by End-Product Applications, 2021 - 2022
Figure 12: Revenue Changes in Major OSAT Companies' Computing Business in 2022
Development of the IC Design Industry and Major Players in China
Figure 1. Shipment Value of the Semiconductor Industry in China, 2017-2021
Figure 2. IC Design Market Size and Changes in China, 2017-2022
Figure 3. Changes in the number of IC Design Companies in China from 2016 to 2022
Figure 4. Scale Distribution of IC Design Industry in China in 2022
Figure 5. Distribution of IC Design Product Revenue and Number of IC Design Companies in China
Figure 6. GigaDevice’s Financial Report Performance from the First Quarter of 2021 to the Third Quarter of 2022
Figure 7. GigaDevice's Revenue Proportion of Each Product Line, 1H 2020 - 1H 2022
Figure 8. Will Semiconductor's Financial Report Performance, 1Q 2021 - 3Q2022
Figure 9. Revenue Proportion of Will Semiconductor’s Product Lines in 2019-2021
Figure 10. Changes in IC Self-Sufficiency Rate in China, 2010-2026
Development of the China IC Packaging and Testing Industry and Key Players
Figure 1 Chinese IC Packaging and Testing Shipment Value, 2018-2022
Figure 2 Regional Distribution of IC Packaging and Testing Brands in China
Figure 3 Financial Information of JCET, 2018-2022
Figure 4 Revenue of JCET by Product Application, 2021-2022
Figure 5 Financial Information of Tongfu Microelectronics, 2018-2022
Figure 6 Financial Information of Huatian Technology, 2018-2022

先を行くために - 半導体産業分析 (2023年)：レポートセット (7冊) - 台湾・中国・世界のIC設計・IC製造 (ファウンドリ、メモリ)・IC OSAT産業の洞察とサプライチェーン

Stay Ahead - 2023 Semiconductor Industry Research Value Pack: 7 Reports Bundle Encompasses IC Design, IC Manufacturing (Foundry, Memory) and IC OSAT Industry Insights and Supply Chains in Taiwan, China, and the World

エグゼクティブサマリー

目次

世界のIC設計業界：概要 (2022年) と発展 (2023年)

第1章 世界のIC設計産業の発展 (2022年)

第2章 大手IC設計企業の事業展開状況 (2022年)

第3章 世界のIC設計産業の発展 (2023年)

付録

第1章 世界のファウンドリ業界の概要 (2022年)

第2章 主要な半導体ファウンドリの開発動向 (2022年)

第3章 世界の半導体ファウンドリ産業の発展(2023年)

付録

第1章 世界のICパッケージング・検査業界の概要 (2022年)

第2章 主要OSAT企業の経営実績 (2022年)

第3章 世界のICパッケージング・検査業界の展望

付録

第1章 中国のIC設計業界の概要

第2章 中国における大手IC設計企業の展開

第3章 中国におけるのIC設計産業の発展

第4章 MICの視点

付録

第1章 中国のICパッケージング・検査産業の発展

第2章 中国におけるの主要なICパッケージング・検査企業の発展

第3章 業界の展望

付録

第1章 半導体産業の発展

付録

List of Topics

Companies covered

Executive Summary

Table of Contents

1.Development of the Global IC Design Industry in 2022

2. Major IC Design Companies' Business Operations in 2022

3.Development of the Global IC Design Industry in 2023

Appendix

1.Global Foundry Industry Recap 2022

2. Development Trends of Major Semiconductor Foundries in 2022

3. Global Semiconductor Foundry Industry Development in 2023

Appendix

1. Recap of the Global IC Packaging and Testing Industry in 2022

2.Operational Performance of Major OSAT Companies in 2022

3. Outlook for the Global IC Packaging and Testing Industry

Appendix

1.Overview of the IC Design Industry in China

2. Development of Major IC Design Companies in China

3. Development of the IC Design Industry in China

4.MIC Perspective

Appendix

1.Development of China IC Packaging and Testing Industry

2.Development of major IC Packaging and Testing Players in China

3.Outlook for the Industry

Appendix

1.Development of the Semiconductor Industry

Appendix

List of Tables

List of Figures

第1章世界のIC設計産業の発展 (2022年)

第2章大手IC設計企業の事業展開状況 (2022年)

第3章世界のIC設計産業の発展 (2023年)

第1章世界のファウンドリ業界の概要 (2022年)

第2章主要な半導体ファウンドリの開発動向 (2022年)

第3章世界の半導体ファウンドリ産業の発展(2023年)

第1章世界のICパッケージング・検査業界の概要 (2022年)

第2章主要OSAT企業の経営実績 (2022年)

第3章世界のICパッケージング・検査業界の展望

第1章中国のIC設計業界の概要

第2章中国における大手IC設計企業の展開

第3章中国におけるのIC設計産業の発展

第1章中国のICパッケージング・検査産業の発展

第2章中国におけるの主要なICパッケージング・検査企業の発展

第3章業界の展望

第1章半導体産業の発展