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市場調査レポート
商品コード
957721

クラウドEDAの世界市場

Cloud EDA

出版日: | 発行: Global Industry Analysts, Inc. | ページ情報: 英文 140 Pages | 納期: 即日から翌営業日

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クラウドEDAの世界市場
出版日: 2022年01月01日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 140 Pages
納期: 即日から翌営業日
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  • 概要
  • 目次
概要

世界のクラウドEDAの市場規模は、分析期間(2020年~2027年)に5.3%のCAGRで成長する見通しで、2020年の63億米ドルから2027年には90億米ドルに達すると予測されています。当レポートで分析されているセグメントの1つであるCAEは、分析期間中に6%の年率で成長し、28億米ドルに達すると予測されています。

当レポートは、世界のクラウドEDA市場について調査しており、動向や見通し、成長要因、地域別の市場分析、競合情勢、主要企業のプロファイル等の情報を提供しています。

調査対象企業の例

  • Agnisys Inc.
  • Aldec, Inc.
  • ANSYS, Inc.
  • Cadence Design Systems, Inc.
  • JEDA Technologies, Inc.
  • Mentor Graphics Corporation
  • MunEDA GmbH
  • Synopsys, Inc.
  • Zuken

目次

I. イントロダクション、調査手法、調査範囲

II. エグゼクティブサマリー

  • 市場概要
    • Covid-19の影響と迫り来る世界の景気後退
  • 主要企業
  • 動向と成長要因
  • 世界市場の見通し

III. 市場分析

  • 地域別市場分析
  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他欧州
  • アジア太平洋
  • その他の地域

IV. 競合

  • プロファイルされた企業の総数:48社
目次
Product Code: MCP11069

Abstract:

Global Cloud EDA Market to Reach US$9.1 Billion by the Year 2026

Electronic design automation (EDA) encompasses hardware, software and specific services to streamline the planning, implementation, design, validation and production of semiconductor chips or devices. EDA has been witnessing increasing acceptance among semiconductor chip or device makers owing to rising sophistication of these components, with some of the next-generation devices containing substantially large number of circuit elements. Cloud EDA paves the way for companies in reducing the time to market and in speeding up any innovation at maintained or lower operating costs. The advent of robust security measures for physical and technology resources, moreover, has created an environment for the semiconductor segment in which EDA cloud computing is as indispensable as a foundry is to the manufacturing of IC wafers today. As IC enterprises look more at leveraging more cloud capacities for ensuring more rapid turnaround times, particularly on cutting edge designs of process nodes, a clear comprehension of all cloud EDA options, costs and benefits can aid them in making decisions that best support their respective resources and needs.

Amid the COVID-19 crisis, the global market for Cloud EDA estimated at US$6.6 Billion in the year 2020, is projected to reach a revised size of US$9.1 Billion by 2026, growing at a CAGR of 5.6% over the analysis period. Semiconductor Intellectual Property (SIP), one of the segments analyzed in the report, is projected to grow at a 6.3% CAGR to reach US$3.5 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the Computer Aided Engineering (CAE) segment is readjusted to a revised 6.9% CAGR for the next 7-year period. This segment currently accounts for a 25.7% share of the global Cloud EDA market. Semiconductor IP (SIP) refers to reusable design aspects including chip layout, and cell among other components used in manufacturing advanced Integrated Circuits (IC). The demand for computer-aided engineering (CAE) software is being driven by increasing focus of companies to outsource manufacturing tasks to various emerging economies like China, India and Russia. The integrated software helps companies in dealing with various issues associated with product prototyping along with recall.

The U.S. Market is Estimated at $2 Billion in 2021, While China is Forecast to Reach $1.4 Billion by 2026

The Cloud EDA market in the U.S. is estimated at US$2 Billion in the year 2021. The country currently accounts for a 29.08% share in the global market. China, the world`s second largest economy, is forecast to reach an estimated market size of US$1.4 Billion in the year 2026 trailing a CAGR of 6.9% through the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.6% and 5.3% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5% CAGR while Rest of European market (as defined in the study) will reach US$531.2 Million by the end of the analysis period.

IC Physical Design & Verification Segment to Reach $1.8 Billion by 2026

In the global IC Physical Design & Verification segment, USA, Canada, Japan, China and Europe will drive the 4.4% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.1 Billion in the year 2020 will reach a projected size of US$1.4 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$318.8 Million by the year 2026.

Select Competitors (Total 36 Featured) -

  • Agnisys Inc.
  • Aldec, Inc.
  • ANSYS, Inc.
  • Cadence Design Systems, Inc.
  • JEDA Technologies, Inc.
  • Mentor Graphics Corporation
  • MunEDA GmbH
  • Synopsys, Inc.
  • Zuken

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Moving to the Cloud is a Matter of Survival for Companies in the 21st Century
    • EXHIBIT 1: Cloud is a Matter of Survival, A Urgent Business Need for Businesses to Stay Afloat & Excel in Competitive Markets: Global Market for Cloud Computing Services (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • The Race Between the Virus & Vaccines Intensifies. Amidst this Chaotic Battle, Where is the World Economy Headed in 2021?
    • These are Times When Questions Abound & Answers Are Few
    • So How Fast Or Slow Are We Moving?
    • EXHIBIT 2: How & When Will the World Be Vaccinated? Global Number of Annual COVID-19 Vaccine Doses (In Million) for Years 2020 through 2025 by Geographic Region/Country
    • Split Scenarios Unfold: The Great Vaccine Divide Emerges
    • EXHIBIT 3: Vaccine Imbalances to Stretch the Pandemic Further into 2022: Global Percentage (%) of Population Administered With Vaccines by Region as of October 2021
    • EXHIBIT 4: Time is of Essence! What We Know So Far - "Vaccine Efficiency against New Strains is Decreasing"
    • Progress on Vaccinations, Why Should Businesses Care?
    • With IMF's Upward Revision of Global GDP Forecasts for 2021, Most Companies Are Bullish About an Economic Comeback Despite a Continuing Pandemic
    • EXHIBIT 5: A Strong Yet Exceedingly Patchy & Uncertain Recovery Shaped by New Variants Comes Into Play: World Economic Growth Projections (Real GDP, Annual % Change) for 2020 through 2022
    • EXHIBIT 6: Easing Unemployment Levels in 2021 Although Moderate Will Infuse Hope for Industries Reliant on Consumer Discretionary Incomes: Global Number of Unemployed People (In Million) for Years 2019, 2020, 2021, and 2022
    • Electronic Design Automation (EDA) & Cloud EDA: Definition, Importance & Benefits
    • Companies Move EDA Into the Cloud. Here's Why
    • Recent Market Activity
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • The Storm Wrought by the Pandemic Changes Competitive Dynamics, Forcing Semiconductor Leaders to Weave New Strategies to Survive Post Pandemic Times
    • EDA & IP Are Two Sides of the Same Coin. Competitive Pressure to Secure IPs Push Up Willingness to Invest in Cloud EDA
    • EXHIBIT 7: IP Cores per SoC
    • EXHIBIT 8: The Race to Secure IP Increases Reliance on Innovative EDA Tools to Rapidly Design Chips, Especially Cloud EDA: Global Semiconductor (Silicon) Intellectual Property (SIP) (In US$ Million) for Years 2021, 2023, 2025 and 2027
    • Semiconductor Industry Comes Under Extreme Pressure to Outperform as Time-to-Market Challenges Worsens
    • Pushed to Innovate Semiconductor Companies Adopt Cloud Based EDA Tools
    • Cloud EPA to Tackle Challenges Arising from Growing Complexities in Chip Design
    • EDA in the Cloud Holds Key in Rapidly Innovating SoC Design
    • Accelerating Advanced Networking SoC Design with Cloud-Based Emulation
    • Robust Outlook for CAD, CAM and CAE to Bring Cheer to the Cloud EDA Market
    • EXHIBIT 9: With Adoption of Engineering Software Reaching Mainstream, Focus Now Shifts to Migration to the Cloud: Global Market for Engineering Software (CAD, CAM, CAE, AEC, & EDA) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Advent of Autonomous Vehicles and Rising Demand for Connected Cars to Boost Need for Innovative Chip Design
    • EXHIBIT 10: Autonomous Cars & Vehicle Electronification Push Up the Need for Rapid Designing of Innovative Chips: Global Market for Autonomous Vehicles (In Units) for Years 2021, 2023, 2025 and 2027
    • Healthy Demand for PCBs Bodes Well for Market Growth
    • EXHIBIT 11: Faster Time-to-Market Need Pushes EDA for PCB Design into the Cloud: Global Opportunity for Printed Circuit Boards (PCBs) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Current & Future Analysis for Cloud EDA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 2: World 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2021 & 2027
    • TABLE 3: World Current & Future Analysis for Semiconductor Intellectual Property (SIP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 4: World 7-Year Perspective for Semiconductor Intellectual Property (SIP) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
    • TABLE 5: World Current & Future Analysis for Computer Aided Engineering (CAE) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 6: World 7-Year Perspective for Computer Aided Engineering (CAE) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
    • TABLE 7: World Current & Future Analysis for IC Physical Design & Verification by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 8: World 7-Year Perspective for IC Physical Design & Verification by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
    • TABLE 9: World Current & Future Analysis for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 10: World 7-Year Perspective for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
    • TABLE 11: World Current & Future Analysis for Military / Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 12: World 7-Year Perspective for Military / Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
    • TABLE 13: World Current & Future Analysis for Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 14: World 7-Year Perspective for Aerospace by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
    • TABLE 15: World Current & Future Analysis for Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 16: World 7-Year Perspective for Telecom by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
    • TABLE 17: World Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 18: World 7-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
    • TABLE 19: World Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 20: World 7-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027

III. MARKET ANALYSIS

  • UNITED STATES
    • TABLE 21: USA Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 22: USA 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
    • TABLE 23: USA Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 24: USA 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027
  • CANADA
    • TABLE 25: Canada Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 26: Canada 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
    • TABLE 27: Canada Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 28: Canada 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027
  • JAPAN
    • TABLE 29: Japan Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 30: Japan 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
    • TABLE 31: Japan Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 32: Japan 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027
  • CHINA
    • TABLE 33: China Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 34: China 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
    • TABLE 35: China Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 36: China 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027
  • EUROPE
    • TABLE 37: Europe Current & Future Analysis for Cloud EDA by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 38: Europe 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2021 & 2027
    • TABLE 39: Europe Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 40: Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
    • TABLE 41: Europe Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 42: Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027
  • FRANCE
    • TABLE 43: France Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 44: France 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
    • TABLE 45: France Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 46: France 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027
  • GERMANY
    • TABLE 47: Germany Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 48: Germany 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
    • TABLE 49: Germany Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 50: Germany 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027
  • ITALY
    • TABLE 51: Italy Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 52: Italy 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
    • TABLE 53: Italy Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 54: Italy 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027
  • UNITED KINGDOM
    • TABLE 55: UK Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 56: UK 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
    • TABLE 57: UK Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 58: UK 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027
  • REST OF EUROPE
    • TABLE 59: Rest of Europe Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 60: Rest of Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
    • TABLE 61: Rest of Europe Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 62: Rest of Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027
  • ASIA-PACIFIC
    • TABLE 63: Asia-Pacific Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 64: Asia-Pacific 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
    • TABLE 65: Asia-Pacific Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 66: Asia-Pacific 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027
  • REST OF WORLD
    • TABLE 67: Rest of World Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 68: Rest of World 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
    • TABLE 69: Rest of World Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 70: Rest of World 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

IV. COMPETITION

  • Total Companies Profiled: 36