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半導体製造後工程装置の世界市場

Semiconductor Manufacturing Back-End Equipment

出版日
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英文 237 Pages
納期
即日から翌営業日
適宜更新あり
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価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=148.16円
半導体製造後工程装置の世界市場
出版日: 2025年08月20日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 237 Pages
納期: 即日から翌営業日
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概要

半導体製造後工程装置の世界市場は2030年までに1,184億米ドルに達する見込み

2024年に692億米ドルと推定される半導体製造後工程装置の世界市場は、2024年から2030年にかけてCAGR 9.4%で成長し、2030年には1,184億米ドルに達すると予測されます。本レポートで分析したセグメントの1つであるウエハテストは、CAGR 11.4%を記録し、分析期間終了時には497億米ドルに達すると予測されます。ダイシングセグメントの成長率は、分析期間でCAGR 6.7%と推定されます。

米国市場は182億米ドルと推定、中国はCAGR 8.9％で成長予測

米国の半導体製造後工程装置市場は、2024年に182億米ドルと推定されます。世界第2位の経済大国である中国は、2030年までに187億米ドルの市場規模に達すると予測され、分析期間2024-2030年のCAGRは8.9%です。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ8.8%と7.7%と予測されています。欧州では、ドイツがCAGR 7.3%で成長すると予測されています。

世界の半導体製造後工程装置市場- 主要動向と促進要因まとめ

なぜ半導体バリューチェーンにおいてバックエンド装置が戦略的重要性を増しているのか？

半導体製造は、前工程と後工程に大別されます。前工程がウエハー製造とリソグラフィを含むのに対し、後工程はウエハーのテスト、ダイシング、ダイアタッチ、ワイヤーボンディング、フリップチップ、封止、パッケージングと出荷前の最終テストを含みます。後工程は、システムインパッケージ（SiP）、2.5D/3Dパッケージング、ヘテロジニアスインテグレーションなど、チップの複雑化に伴い、近年戦略的に重要視されています。このようなパッケージング技術革新により、精度、清浄度、相互接続の完全性に対する要求が高まり、後工程装置の性能に対するハードルが高くなっています。

また、バックエンドプロセスは、チップの性能、フォームファクター、熱挙動を決定する上で非常に重要になっています。例えば、ファンアウト・ウエハーレベル・パッケージング（FOWLP）、チップレット、組み込みダイなどの先進パッケージング技術には、高度に専門化された組立・検査ツールが必要です。複雑な相互接続アーキテクチャをサポートし、大量生産環境全体でプロセスの一貫性を維持する能力により、後工程の装置は半導体のコスト効率と技術革新の中心となっています。デバイスメーカーがフットプリントの縮小と機能性の向上を競う中、市場投入までの時間と歩留まりの優位性を確保するため、後工程装置への設備投資が増加しています。

技術の進歩はどのように後工程製造ツールセットを再構築しているのか？

半導体パッケージングの進化は、後工程製造ツールの躍進と密接に結びついています。ダイシング装置は現在、極薄ウエハーを最小限のダメージで超クリーンかつ高速に分離することが期待されています。プラズマダイシングやステルスレーザーダイシングは、従来の機械的手法に代わるものとして登場し、チッピングや汚染を最小限に抑えています。熱圧着ボンダーやハイブリッドボンダーのような先進パッケージングは、特にハイパフォーマンス・コンピューティング（HPC）、AI、先進メモリ・アプリケーションなどの高密度相互接続やチップレットベースのパッケージに不可欠です。

ワイヤーボンディングは、レガシーアプリケーションやコスト重視のアプリケーションでは引き続き重要ですが、ハイエンドセグメントではダイアタッチ技術とフリップチップ技術が主流となっています。装置メーカーは、新しいアセンブリアーキテクチャをサポートするため、ダイの配置精度、スループット、材料の互換性に注力しています。一方、封止ツールはモールドアンダーフィル、ウエハーレベル封止、コンフォーマルコーティングを取り入れ、機械的完全性と熱的信頼性を確保しています。自動光学検査（AOI）、X線検査、3D計測システムは、リアルタイムの欠陥検出と適応制御のために、後工程ラインへの統合が進んでいます。デジタルツインとAI支援欠陥分析が普及するにつれ、後工程装置の高度化が半導体組立における将来の競争力を決定することになります。

後工程装置の需要を牽引するアプリケーションと地域動向は？

コンシューマーエレクトロニクス、スマートフォン、コンピューティングハードウェアは、特にSoCパッケージングとメモリ統合において、後工程装置の最大のエンドユーザーであり続けています。しかし、マルチチップ集積、電力効率、信頼性が最優先される自動車、データセンター、IoTアプリケーションへの需要が急速に拡大しています。ADAS（先進運転支援システム）、EVパワーモジュール、車載インフォテインメントシステムは、高度なパッケージングとテスト能力を必要とします。5GやエッジAIデバイスの台頭も、小型で熱管理されたマルチダイ・パッケージの需要を押し上げています。

地理的には、台湾、韓国、中国が、半導体製造基盤が強固であることから、後工程の装置消費を支配しています。台湾のOSAT（半導体組立・テストアウトソーシング）業界は、ASEグループに牽引され、高密度パッケージングを拡大し続けており、韓国はサムスンやSKハイニックスのような企業によるメモリーパッケージングのイノベーションに注力しています。中国は、国家主導のインセンティブと現地ファブ建設を通じて、輸入依存度を下げるために国内の後工程能力を拡大しています。米国、日本、欧州は、特に防衛、HPC、フォトニクス向けの先進パッケージングの研究開発に投資しています。日本、ドイツ、米国の装置メーカーは、ハイブリッド・ボンディング、ファンアウト、AI最適化アセンブリなどの新たな需要に対応するため、製品ラインアップを拡充しています。

後工程装置市場の成長を促す要因とは？

半導体後工程装置市場の成長は、パッケージングアーキテクチャの複雑化、先進パッケージングの採用増加、アプリケーション全体における高性能・低遅延チップの需要など、いくつかの要因によってもたらされます。フロントエンドノードが物理的・経済的限界に近づくにつれ、革新的なバックエンドパッケージングからより多くの価値が引き出されるようになっています。このため、2.5Dインターポーザ、3D ICスタッキング、異種集積を可能にするツールへの強い引きが生まれました。放熱とデータ転送を最大化しながらデバイスを小型化する必要性は、OSATとIDMパッケージング・ラインの資本拡大につながっています。

さらに、モノリシック・チップからモジュール型チップレット・ベースのSoCへのシフトは、ダイ・ツー・ダイ・ボンディング装置、再分配層（RDL）処理、高スループット・ダイ・ソーティングに対する需要を生み出しています。自動車や産業用の使用事例では、厳しい品質、信頼性、トレーサビリティ基準が課されるため、インライン検査、分析、スマート・ファクトリー・プラットフォームへの投資が促されています。米国、EU、インドにおける国産チップ生産を支援する政府支援プログラムも、バックエンドツールセットに対する新たな需要につながっています。半導体企業がより統合された設計・製造・組立ワークフローを採用するにつれて、後工程装置の重要性と投資は今後も大幅に増加します。

セグメント

タイプ（ウエハテスト、ダイシング、ボンディング、計測、アセンブリ＆パッケージング）、ディメンション（2次元、2.5次元、3次元）、サプライチェーン（集積デバイスメーカーサプライチェーン、民生用電子機器サプライチェーン、鋳造サプライチェーン）

調査対象企業の例

  • Advantest Corporation
  • Amkor Technology, Inc.
  • Applied Materials
  • ASM International N.V.
  • ASM Pacific Technology Ltd.
  • ASML Holding N.V.
  • BESI（BE Semiconductor）
  • Brooks Automation, Inc.
  • Cohu, Inc.
  • DISCO Corporation
  • Kulicke & Soffa Industries
  • KLA Corporation
  • Lam Research Corporation
  • MKS Instruments, Inc.
  • Nanometrics Incorporated
  • Onto Innovation Inc.
  • Rudolph Technologies（Onto）
  • Screen Holdings（SCREEN）
  • SPTS Technologies（KLA）
  • Teradyne, Inc.
  • Tokyo Electron Limited（TEL）

AIインテグレーション

当社は、有効な専門家コンテンツとAIツールにより、市場情報と競合情報を変革しています。

Global Industry Analystsは、LLMや業界固有のSLMを照会する一般的な規範に従う代わりに、ビデオ記録、ブログ、検索エンジン調査、膨大な量の企業、製品/サービス、市場データなど、世界中の専門家から収集したコンテンツのリポジトリを構築しました。

関税影響係数

Global Industry Analystsは、本社の国、製造拠点、輸出入（完成品とOEM）に基づく企業の競争力の変化を予測しています。この複雑で多面的な市場力学は、売上原価（COGS）の増加、収益性の低下、サプライチェーンの再構築など、ミクロおよびマクロの市場力学の中でも特に競合他社に影響を与える見込みです。

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他欧州
  • アジア太平洋
  • その他の地域

第4章 競合

目次
Product Code: MCP37997

Global Semiconductor Manufacturing Back-End Equipment Market to Reach US$118.4 Billion by 2030

The global market for Semiconductor Manufacturing Back-End Equipment estimated at US$69.2 Billion in the year 2024, is expected to reach US$118.4 Billion by 2030, growing at a CAGR of 9.4% over the analysis period 2024-2030. Wafer Testing, one of the segments analyzed in the report, is expected to record a 11.4% CAGR and reach US$49.7 Billion by the end of the analysis period. Growth in the Dicing segment is estimated at 6.7% CAGR over the analysis period.

The U.S. Market is Estimated at US$18.2 Billion While China is Forecast to Grow at 8.9% CAGR

The Semiconductor Manufacturing Back-End Equipment market in the U.S. is estimated at US$18.2 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$18.7 Billion by the year 2030 trailing a CAGR of 8.9% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 8.8% and 7.7% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 7.3% CAGR.

Global Semiconductor Manufacturing Back-End Equipment Market - Key Trends & Drivers Summarized

Why Is Back-End Equipment Gaining Strategic Significance in Semiconductor Value Chains?

Semiconductor manufacturing is broadly divided into front-end and back-end processes. While front-end involves wafer fabrication and lithography, back-end encompasses wafer testing, dicing, die attach, wire bonding, flip chip, encapsulation, and final testing before packaging and shipping. The back-end segment has gained strategic prominence in recent years as chip complexity increases with system-in-package (SiP), 2.5D/3D packaging, and heterogeneous integration. These packaging innovations place greater demands on precision, cleanliness, and interconnect integrity, raising the bar for back-end equipment performance.

Back-end processes have also become critical in determining chip performance, form factor, and thermal behavior. For example, advanced packaging technologies such as fan-out wafer-level packaging (FOWLP), chiplets, and embedded die require highly specialized assembly and inspection tools. The ability to support complex interconnect architectures and maintain process consistency across high-volume manufacturing environments has made back-end equipment central to semiconductor cost-efficiency and innovation. As device manufacturers race to shrink footprints and boost functionality, capital investments in back-end equipment are rising to ensure time-to-market and yield advantages.

How Are Technological Advancements Reshaping Back-End Manufacturing Toolsets?

The evolution of semiconductor packaging is closely tied to breakthroughs in back-end manufacturing tools. Dicing equipment is now expected to deliver ultra-clean, high-speed separation with minimal damage for ultra-thin wafers. Plasma dicing and stealth laser dicing have emerged as alternatives to traditional mechanical methods, minimizing chipping and contamination. Advanced bonding tools, such as thermocompression bonders and hybrid bonders, are crucial for high-density interconnects and chiplet-based packages, particularly in high-performance computing (HPC), AI, and advanced memory applications.

Wire bonding continues to be relevant in legacy and cost-sensitive applications, but die attach and flip chip technologies are dominating in high-end segments. Equipment manufacturers are focusing on die placement accuracy, throughput, and material compatibility to support new assembly architectures. Meanwhile, encapsulation tools are incorporating molding underfill, wafer-level encapsulation, and conformal coatings to ensure mechanical integrity and thermal reliability. Automated optical inspection (AOI), X-ray inspection, and 3D metrology systems are increasingly integrated into back-end lines for real-time defect detection and adaptive control. As digital twins and AI-assisted defect analytics gain traction, the sophistication of back-end equipment will define future competitiveness in semiconductor assembly.

Which Applications and Regional Trends Are Driving Demand for Back-End Equipment?

Consumer electronics, smartphones, and computing hardware continue to be the largest end-users of back-end equipment, especially in SoC packaging and memory integration. However, demand is rapidly expanding into automotive, data centers, and IoT applications, where multi-chip integration, power efficiency, and reliability are paramount. Advanced driver-assistance systems (ADAS), EV power modules, and vehicle infotainment systems require sophisticated packaging and testing capabilities. The rise of 5G and edge AI devices is also pushing demand for compact, thermally managed multi-die packages.

Geographically, Taiwan, South Korea, and China dominate back-end equipment consumption due to their robust semiconductor manufacturing base. Taiwan’s OSAT (outsourced semiconductor assembly and test) industry, led by ASE Group, continues to scale high-density packaging, while South Korea focuses on memory packaging innovations by companies like Samsung and SK hynix. China, through state-led incentives and local fab construction, is scaling up domestic back-end capacity to reduce import dependency. The U.S., Japan, and Europe are investing in advanced packaging R&D, especially for defense, HPC, and photonics. Equipment manufacturers across Japan, Germany, and the U.S. are expanding offerings to meet emerging demand for hybrid bonding, fan-out, and AI-optimized assembly.

What Factors Are Fueling Growth in the Back-End Equipment Market?

The growth in the semiconductor back-end equipment market is driven by several factors, including the increasing complexity of packaging architectures, rising adoption of advanced packaging, and demand for high-performance, low-latency chips across applications. As front-end nodes approach physical and economic limits, more value is being extracted from innovative back-end packaging. This has created a strong pull for tools that enable 2.5D interposers, 3D IC stacking, and heterogeneous integration. The need to miniaturize devices while maximizing heat dissipation and data transfer is leading to capital expansion in OSATs and IDM packaging lines.

Additionally, the shift from monolithic chips to modular chiplet-based SoCs is creating demand for die-to-die bonding equipment, redistribution layer (RDL) processing, and high-throughput die sorting. Automotive and industrial use cases impose stringent quality, reliability, and traceability standards, prompting investment in inline inspection, analytics, and smart factory platforms. Government-backed programs supporting domestic chip production in the U.S., EU, and India are also translating into new demand for back-end toolsets. As semiconductor companies adopt more integrated design-manufacture-assembly workflows, the importance and investment in back-end equipment will continue to grow significantly.

SCOPE OF STUDY:

The report analyzes the Semiconductor Manufacturing Back-End Equipment market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Wafer Testing, Dicing, Bonding, Metrology, Assembly & Packaging); Dimension (2D Dimension, 2.5D Dimension, 3D Dimension); Supply Chain (Integrated Device Manufacturer Supply Chain, Consumer Electronic Supply Chain, Foundry Supply Chain)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 48 Featured) -

  • Advantest Corporation
  • Amkor Technology, Inc.
  • Applied Materials
  • ASM International N.V.
  • ASM Pacific Technology Ltd.
  • ASML Holding N.V.
  • BESI (BE Semiconductor)
  • Brooks Automation, Inc.
  • Cohu, Inc.
  • DISCO Corporation
  • Kulicke & Soffa Industries
  • KLA Corporation
  • Lam Research Corporation
  • MKS Instruments, Inc.
  • Nanometrics Incorporated
  • Onto Innovation Inc.
  • Rudolph Technologies (Onto)
  • Screen Holdings (SCREEN)
  • SPTS Technologies (KLA)
  • Teradyne, Inc.
  • Tokyo Electron Limited (TEL)

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TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • Semiconductor Manufacturing Back-End Equipment - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Growth in Advanced Packaging Technologies Throws the Spotlight on Back-End Semiconductor Equipment Demand
    • Rising Adoption of Chiplet and 2.5D/3D Architectures Spurs Demand for Precision Die-Attach Tools
    • Proliferation of Heterogeneous Integration Techniques Expands Addressable Market for Advanced Bonding Systems
    • Miniaturization Trends in Consumer Electronics Propel Demand for Fine-Pitch Wire Bonders and Flip-Chip Bonders
    • Increased Outsourcing to OSAT Providers Strengthens Business Case for High-Volume Automated Back-End Lines
    • Emerging Use of Fan-Out Wafer-Level Packaging Drives Innovation in Mold and Singulation Technologies
    • Surging Automotive Semiconductor Demand Spurs Equipment Investments for High-Reliability Back-End Processing
    • Integration of AI and ML in Equipment Control Systems Enhances Throughput and Defect Detection Capabilities
    • Global Capacity Expansion Initiatives Accelerate Equipment Sales Across Emerging Foundry Hubs
    • Focus on Yield Optimization in Advanced Nodes Fuels Growth in Inspection and Metrology Equipment
    • Escalating Demand for Power Semiconductor Devices Drives Adoption of Back-End Equipment for Thick Wafers
    • Advancement in Low-K Dielectric and TSV Technologies Creates New Equipment Requirements
    • Shift Toward Green Manufacturing Practices Encourages Development of Eco-Efficient Equipment Solutions
    • Rise in Government Funding and Semiconductor Subsidies Globally Boosts Capital Equipment Procurement
    • Reliability Requirements in Aerospace and Defense Electronics Create Need for High-Precision Packaging Equipment
    • Integration of IoT in Equipment Monitoring Systems Strengthens Predictive Maintenance Capabilities
    • Convergence of Logic and Memory Packaging Trends Broadens Scope for Hybrid Equipment Tools
    • Increasing Design Complexity in AI and HPC Chips Spurs Demand for Multi-Layer Interconnect Assembly Systems
    • Trade Tensions and Localization Strategies Drive Regional Diversification in Equipment Supply Chains
    • Technological Convergence Between Front-End and Back-End Processes Spurs Cross-Segment Equipment Innovation
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Semiconductor Manufacturing Back-End Equipment Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Semiconductor Manufacturing Back-End Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 4: World 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Wafer Testing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Wafer Testing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 7: World 16-Year Perspective for Wafer Testing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Dicing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Dicing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 10: World 16-Year Perspective for Dicing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Bonding by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Bonding by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 13: World 16-Year Perspective for Bonding by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Metrology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Metrology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 16: World 16-Year Perspective for Metrology by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Assembly & Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Assembly & Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 19: World 16-Year Perspective for Assembly & Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Consumer Electronic Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Consumer Electronic Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 22: World 16-Year Perspective for Consumer Electronic Supply Chain by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Foundry Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Foundry Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 25: World 16-Year Perspective for Foundry Supply Chain by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for Integrated Device Manufacturer Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 27: World Historic Review for Integrated Device Manufacturer Supply Chain by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 28: World 16-Year Perspective for Integrated Device Manufacturer Supply Chain by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for 2D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 30: World Historic Review for 2D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 31: World 16-Year Perspective for 2D Dimension by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for 2.5D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 33: World Historic Review for 2.5D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 34: World 16-Year Perspective for 2.5D Dimension by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030
    • TABLE 35: World Recent Past, Current & Future Analysis for 3D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 36: World Historic Review for 3D Dimension by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 37: World 16-Year Perspective for 3D Dimension by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 38: USA Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 40: USA 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 41: USA Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 42: USA Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 43: USA 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 44: USA Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: USA Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 46: USA 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • CANADA
    • TABLE 47: Canada Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 48: Canada Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 49: Canada 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 50: Canada Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Canada Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 52: Canada 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 53: Canada Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Canada Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 55: Canada 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • JAPAN
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 56: Japan Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Japan Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 58: Japan 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 59: Japan Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Japan Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 61: Japan 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 62: Japan Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Japan Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 64: Japan 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • CHINA
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 65: China Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 66: China Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 67: China 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 68: China Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: China Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 70: China 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 71: China Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 72: China Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 73: China 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • EUROPE
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 74: Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 75: Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 76: Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2025 & 2030
    • TABLE 77: Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 78: Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 79: Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 80: Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 82: Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 83: Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 85: Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • FRANCE
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 86: France Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: France Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 88: France 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 89: France Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 90: France Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 91: France 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 92: France Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: France Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 94: France 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • GERMANY
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 95: Germany Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Germany Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 97: Germany 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 98: Germany Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Germany Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 100: Germany 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 101: Germany Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 102: Germany Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 103: Germany 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • ITALY
    • TABLE 104: Italy Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Italy Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 106: Italy 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 107: Italy Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Italy Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 109: Italy 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 110: Italy Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Italy Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 112: Italy 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • UNITED KINGDOM
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 113: UK Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 114: UK Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 115: UK 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 116: UK Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 117: UK Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 118: UK 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 119: UK Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 120: UK Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 121: UK 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • REST OF EUROPE
    • TABLE 122: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 123: Rest of Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 124: Rest of Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 125: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 126: Rest of Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 127: Rest of Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 128: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Rest of Europe Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 130: Rest of Europe 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • ASIA-PACIFIC
    • Semiconductor Manufacturing Back-End Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 131: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 132: Asia-Pacific Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 133: Asia-Pacific 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 134: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Asia-Pacific Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 136: Asia-Pacific 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 137: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Asia-Pacific Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 139: Asia-Pacific 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030
  • REST OF WORLD
    • TABLE 140: Rest of World Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Rest of World Historic Review for Semiconductor Manufacturing Back-End Equipment by Type - Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 142: Rest of World 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Type - Percentage Breakdown of Value Sales for Wafer Testing, Dicing, Bonding, Metrology and Assembly & Packaging for the Years 2014, 2025 & 2030
    • TABLE 143: Rest of World Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Rest of World Historic Review for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 145: Rest of World 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Supply Chain - Percentage Breakdown of Value Sales for Consumer Electronic Supply Chain, Foundry Supply Chain and Integrated Device Manufacturer Supply Chain for the Years 2014, 2025 & 2030
    • TABLE 146: Rest of World Recent Past, Current & Future Analysis for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Rest of World Historic Review for Semiconductor Manufacturing Back-End Equipment by Dimension - 2D Dimension, 2.5D Dimension and 3D Dimension Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 148: Rest of World 16-Year Perspective for Semiconductor Manufacturing Back-End Equipment by Dimension - Percentage Breakdown of Value Sales for 2D Dimension, 2.5D Dimension and 3D Dimension for the Years 2014, 2025 & 2030

IV. COMPETITION