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クラウドEDAの世界市場

Cloud EDA

出版日
ページ情報
英文 218 Pages
納期
即日から翌営業日
適宜更新あり
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=146.82円
クラウドEDAの世界市場
出版日: 2024年08月07日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 218 Pages
納期: 即日から翌営業日
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概要

クラウドEDAの世界市場は2030年までに137億米ドルに達する見込み

2023年に92億米ドルと推定されるクラウドEDAの世界市場は、分析期間2023-2030年にCAGR 5.9%で成長し、2030年には137億米ドルに達すると予測されます。本レポートで分析したセグメントの1つである半導体知的財産（SIP）は、CAGR 6.4%を記録し、分析期間終了時には51億米ドルに達すると予測されます。コンピュータ支援エンジニアリング（CAE）分野の成長率は、分析期間を通じてCAGR 6.9％と推定されます。

米国市場は23億米ドル、中国はCAGR7.0%で成長予測

米国のクラウドEDA市場は2023年に23億米ドルと推定されます。世界第2位の経済大国である中国は、2030年までに19億米ドルの市場規模に達すると予測され、分析期間2023-2030年のCAGRは7.0%です。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ4.8%と5.4%と予測されています。欧州では、ドイツがCAGR 5.1%で成長すると予測されています。

世界のクラウドEDA市場- 主要動向と促進要因まとめ

クラウドEDAとは何か、どのように設計環境を変革しているのか？

電子設計自動化（EDA）ツールは、複雑な電子システムや集積回路の設計・製造に不可欠です。従来、EDAツールはローカルのサーバーやシステムに格納されていましたが、クラウドへの移行が進んでおり、柔軟性、拡張性、コラボレーション機能など、従来は実現できなかった機能が提供されています。クラウドEDAでは、複数のユーザーが異なる場所から同じプロジェクトに同時にアクセスして作業できるため、生産性が向上し、新しいエレクトロニクス製品の市場投入までの時間が短縮されます。さらに、クラウド環境では、高価なハードウェアや専任のITメンテナンスチームが不要になるため、資本支出を大幅に削減することができ、コスト構造を設備投資モデルから、より管理しやすいオペックスモデルに移行することができます。

技術の進歩はどのようにクラウドEDAを強化しているのか？

クラウド・コンピューティング技術の進歩は、クラウドEDAセクターにとって恩恵となっています。クラウドサービスで利用可能なハイパフォーマンス・コンピューティング（HPC）機能により、EDAの基本である複雑な設計やシミュレーション・タスクをより高速に処理できるようになりました。これは、スマートフォンやIoTデバイスなど、機能性と信頼性を確保するために大規模なシミュレーションを必要とする電子機器が複雑化していることを考えると、特に重要です。さらに、クラウドにおけるセキュリティプロトコルの進歩により、かつてはクラウドEDAソリューションの採用の大きな障壁と考えられていた、データの機密性とセキュリティに関する懸念の多くが緩和されました。より強力な暗号化方法とデータ取り扱い手順の改善により、企業は知的財産を損なうことなくクラウドEDAツールを活用できるようになりました。

現代のエレクトロニクス開発においてクラウドEDAが果たす役割とは？

クラウドEDAは単なるオペレーションツールではなく、急速に進化するエレクトロニクス業界における戦略的資産です。デバイスの高集積化、多機能化に伴い、回路の複雑さは飛躍的に増大しています。クラウドEDAは、この複雑さを効果的に管理するために必要な計算能力と柔軟性を提供します。新興企業や小規模な企業にとって、クラウドEDAは初期費用が安いため、小規模なチームでも従来のEDAツールのような経済的な負担なく、野心的なエレクトロニクスプロジェクトに取り組むことができます。大企業にとっては、クラウドリソースのスケーラビリティにより、プロジェクトの要求に合わせてコンピューティングリソースをダイナミックに割り当てることができ、コストと開発スケジュールの両方を最適化することができます。さらに、クラウドEDAは、世界チーム間のリアルタイムコラボレーションをサポートします。これは、複数の海外拠点で開発が行われることが多い世界化市場では不可欠な機能です。

クラウドEDA市場の成長の原動力は？

クラウドEDA市場の成長は、電子機器設計の複雑化、エレクトロニクス市場の世界な拡大、テクノロジー分野全体のクラウドベースのソリューションへのシフトなど、いくつかの要因によってもたらされます。より効率的でコスト効率に優れ、設計サイクルを高速化するニーズは、家電、自動車、航空宇宙など、技術革新へのプレッシャーが高く、かつ継続的な業界において特に重要です。さらに、パーソナライズされた高性能な電子機器への消費者行動のシフトは、より洗練された設計とテストを必要とし、クラウドEDAツールはそれを効果的に促進します。さらに、ブロードバンドの普及やネットワークセキュリティの強化に代表されるように、世界の技術インフラの成熟が進むにつれ、クラウドEDAソリューションに移行する企業も増えていくでしょう。このような動向は、クラウドコンピューティングと電子設計の両方における継続的な技術進歩と相まって、クラウドEDA業界の力強い成長軌道を予測しています。

調査対象企業の例（全36件）

  • Autodesk, Inc.
  • Cadence Design Systems, Inc.
  • ANSYS, Inc.
  • Arm Ltd.
  • Aspen Technology, Inc.
  • Aldec, Inc.
  • Altair Engineering, Inc.
  • Bentley Systems, Inc.
  • CAST, Inc.
  • Achronix Semiconductor Corporation
  • Altium Limited
  • Agnisys Inc.
  • ALTEM Technologies
  • 4.ST Belgium
  • Ceetron AS

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他欧州
  • アジア太平洋
  • 世界のその他の地域

第4章 競合

目次
Product Code: MCP11069

Global Cloud EDA Market to Reach US$13.7 Billion by 2030

The global market for Cloud EDA estimated at US$9.2 Billion in the year 2023, is expected to reach US$13.7 Billion by 2030, growing at a CAGR of 5.9% over the analysis period 2023-2030. Semiconductor Intellectual Property (SIP), one of the segments analyzed in the report, is expected to record a 6.4% CAGR and reach US$5.1 Billion by the end of the analysis period. Growth in the Computer Aided Engineering (CAE) segment is estimated at 6.9% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.3 Billion While China is Forecast to Grow at 7.0% CAGR

The Cloud EDA market in the U.S. is estimated at US$2.3 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$1.9 Billion by the year 2030 trailing a CAGR of 7.0% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 4.8% and 5.4% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.1% CAGR.

Global Cloud EDA Market - Key Trends & Drivers Summarized

What Is Cloud EDA, and How Is It Transforming the Design Landscape?

Electronic Design Automation (EDA) tools are critical for the design and production of complex electronic systems and integrated circuits. Traditionally housed on local servers and systems, EDA tools are increasingly being migrated to the cloud, providing flexibility, scalability, and collaborative capabilities that were previously unattainable. Cloud EDA enables multiple users to access and work on the same project simultaneously from different locations, enhancing productivity and reducing the time to market for new electronic products. Moreover, the cloud environment can significantly cut down capital expenditure as it eliminates the need for expensive hardware and dedicated IT maintenance teams, shifting the cost structure from a capex model to a more manageable opex model.

How Are Technological Advancements Enhancing Cloud EDA?

The advancement of cloud computing technologies has been a boon for the Cloud EDA sector. High-performance computing (HPC) capabilities available via cloud services allow for faster processing of complex design and simulation tasks that are fundamental to EDA. This is particularly important given the growing complexity of electronic devices, such as smartphones and IoT devices, which require extensive simulation to ensure functionality and reliability. Furthermore, advancements in security protocols in the cloud have alleviated many of the concerns related to data sensitivity and security, which were once seen as major barriers to the adoption of cloud EDA solutions. With stronger encryption methods and improved data handling procedures, firms can now take advantage of cloud EDA tools without compromising their intellectual property.

What Role Does Cloud EDA Play in Modern Electronics Development?

Cloud EDA is not just an operational tool; it is a strategic asset in the rapidly evolving electronics industry. As devices become more integrated and feature-rich, the underlying complexity of circuits grows exponentially. Cloud EDA provides the necessary computational power and flexibility to manage this complexity effectively. For startups and smaller firms, the lower upfront costs associated with cloud EDA mean that smaller teams can undertake ambitious electronics projects without the financial burden of traditional EDA tools. For larger enterprises, the scalability of cloud resources allows for the dynamic allocation of computing resources to match project demands, optimizing both costs and development timelines. Additionally, cloud EDA supports real-time collaboration across global teams, an indispensable feature in a globalized market where development often occurs across multiple international sites.

What Drives the Growth in the Cloud EDA Market?

The growth in the Cloud EDA market is driven by several factors, including the increasing complexity of electronic device design, the global expansion of the electronics market, and the overall shift towards cloud-based solutions across the technology sector. The need for more efficient, cost-effective, and faster design cycles is particularly critical in industries like consumer electronics, automotive, and aerospace, where the pressure to innovate is high and continuous. Additionally, the shift in consumer behavior towards personalized and high-performance electronic devices requires more sophisticated design and testing, which cloud EDA tools facilitate effectively. Moreover, as the technology infrastructure globally continues to mature—exemplified by wider broadband availability and stronger network security—more firms are likely to transition to cloud EDA solutions. These trends, coupled with ongoing technological advancements in both cloud computing and electronic design, forecast a robust growth trajectory for the Cloud EDA industry.

Select Competitors (Total 36 Featured) -

  • Autodesk, Inc.
  • Cadence Design Systems, Inc.
  • ANSYS, Inc.
  • Arm Ltd.
  • Aspen Technology, Inc.
  • Aldec, Inc.
  • Altair Engineering, Inc.
  • Bentley Systems, Inc.
  • CAST, Inc.
  • Achronix Semiconductor Corporation
  • Altium Limited
  • Agnisys Inc.
  • ALTEM Technologies
  • 4.ST Belgium
  • Ceetron AS

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Cloud EDA - Global Key Competitors Percentage Market Share in 2024 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
    • Moving to the Cloud is a Matter of Survival for Companies in the 21st Century
    • Cloud is a Matter of Survival, A Urgent Business Need for Businesses to Stay Afloat & Excel in Competitive Markets: Global Market for Cloud Computing Services (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Global Economic Outlook
    • Electronic Design Automation (EDA) & Cloud EDA: Definition, Importance & Benefits
    • Companies Move EDA Into the Cloud. Here's Why
    • Recent Market Activity
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • The Storm Wrought by the Pandemic Changes Competitive Dynamics, Forcing Semiconductor Leaders to Weave New Strategies to Survive Post Pandemic Times
    • EDA & IP Are Two Sides of the Same Coin. Competitive Pressure to Secure IPs Push Up Willingness to Invest in Cloud EDA
    • IP Cores per SoC
    • The Race to Secure IP Increases Reliance on Innovative EDA Tools to Rapidly Design Chips, Especially Cloud EDA: Global Semiconductor (Silicon) Intellectual Property (SIP) (In US$ Million) for Years 2021, 2023, 2025 and 2027
    • Semiconductor Industry Comes Under Extreme Pressure to Outperform as Time-to-Market Challenges Worsens
    • Pushed to Innovate Semiconductor Companies Adopt Cloud Based EDA Tools
    • Cloud EPA to Tackle Challenges Arising from Growing Complexities in Chip Design
    • EDA in the Cloud Holds Key in Rapidly Innovating SoC Design
    • Accelerating Advanced Networking SoC Design with Cloud-Based Emulation
    • Robust Outlook for CAD, CAM and CAE to Bring Cheer to the Cloud EDA Market
    • With Adoption of Engineering Software Reaching Mainstream, Focus Now Shifts to Migration to the Cloud: Global Market for Engineering Software (CAD, CAM, CAE, AEC, & EDA) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Advent of Autonomous Vehicles and Rising Demand for Connected Cars to Boost Need for Innovative Chip Design
    • Autonomous Cars & Vehicle Electronification Push Up the Need for Rapid Designing of Innovative Chips: Global Market for Autonomous Vehicles (In Units) for Years 2021, 2023, 2025 and 2027
    • Healthy Demand for PCBs Bodes Well for Market Growth
    • Faster Time-to-Market Need Pushes EDA for PCB Design into the Cloud: Global Opportunity for Printed Circuit Boards (PCBs) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Challenges to Cloud EDA & How They Can be Overcome
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for Cloud EDA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 2: World 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2024 & 2030
    • TABLE 3: World Recent Past, Current & Future Analysis for Semiconductor Intellectual Property (SIP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 4: World 7-Year Perspective for Semiconductor Intellectual Property (SIP) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Computer Aided Engineering (CAE) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 6: World 7-Year Perspective for Computer Aided Engineering (CAE) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for IC Physical Design & Verification by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 8: World 7-Year Perspective for IC Physical Design & Verification by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 9: World Recent Past, Current & Future Analysis for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 10: World 7-Year Perspective for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Military / Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 12: World 7-Year Perspective for Military / Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 14: World 7-Year Perspective for Aerospace by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 15: World Recent Past, Current & Future Analysis for Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 16: World 7-Year Perspective for Telecom by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 18: World 7-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 20: World 7-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 21: World Cloud EDA Market Analysis of Annual Sales in US$ Million for Years 2020 through 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • TABLE 22: USA Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 23: USA 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 24: USA Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 25: USA 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • CANADA
    • TABLE 26: Canada Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 27: Canada 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 28: Canada Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 29: Canada 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • JAPAN
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • TABLE 30: Japan Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 31: Japan 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 32: Japan Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 33: Japan 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • CHINA
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 34: China Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 35: China 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 36: China Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 37: China 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • EUROPE
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 38: Europe Recent Past, Current & Future Analysis for Cloud EDA by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 39: Europe 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2024 & 2030
    • TABLE 40: Europe Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 41: Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 42: Europe Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 43: Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • FRANCE
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • TABLE 44: France Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: France 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 46: France Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 47: France 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • GERMANY
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • TABLE 48: Germany Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 49: Germany 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 50: Germany Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 51: Germany 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • ITALY
    • TABLE 52: Italy Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 53: Italy 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 54: Italy Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 55: Italy 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • UNITED KINGDOM
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • TABLE 56: UK Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: UK 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 58: UK Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 59: UK 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • REST OF EUROPE
    • TABLE 60: Rest of Europe Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 61: Rest of Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 62: Rest of Europe Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 63: Rest of Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • ASIA-PACIFIC
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 64: Asia-Pacific Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 65: Asia-Pacific 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 66: Asia-Pacific Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 67: Asia-Pacific 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • REST OF WORLD
    • TABLE 68: Rest of World Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: Rest of World 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 70: Rest of World Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 71: Rest of World 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030

IV. COMPETITION