Product Code: 5035
The global printed circuit board (PCB) market is anticipated to record a significant valuation by 2030 owing to the increasing investments and rollouts of supportive government initiatives to fuel the 5G deployment across economies. For instance, the Q2 2022 report by the Dell'Oro group suggests that China has invested almost 75% in 5G MCN infrastructure to emerge as a global leader in 5G MEC deployments and 5G applications.
The exponential rise in online traffic over recent years has encouraged telecom operators from across the globe to implement necessary growth measures to transform the existing network infrastructure, driving the PCP adoption over the forecast period.
Based on product type, the High-Density Interconnect (HDI) PCB market may depict an appreciable growth rate during the projection period, with an estimated target valuation expected to surpass USD 15 billion by 2030. HDI PCBs comprise more conduction lines and wires per unit area, allowing for high-density interconnections. Driven by their consolidated design, these PCBs find major applications across modern devices such as gaming consoles and smartphones, along with a wide range of medical equipment such as micro-sized cameras in several imaging equipment.
The increasing utilization of such equipment to help doctors in patient diagnosis, combined with the rising space concerns in compact electronic and medical devices, will aid the segment expansion over the coming years.
With respect to the substrate, the report fragments the printed circuit board market into rigid, flexible, and rigid-flex segments. Exhibiting a noticeable growth rate, the flexible PCB market is anticipated to hold a decent revenue share over the prediction period. Flexible PCBs, combined with the ability to handle impedances in high-density circuit board designs, offer a range of benefits, including superior resistance to high temperatures, chemicals, radiation, and UV rays.
The growing requirement for small, unobstructed devices across industrial environments will help the industry gain significant impetus in the foreseeable future.
With respect to applications, the healthcare segment was valued at over USD 6 billion in 2021 and is projected to account for appreciable gains between 2022 and 2030. The segment growth is led by the increasing government investments towards fostering the expansion of existing healthcare infrastructure.
The development of new healthcare facilities coupled with the rising demand for advanced medical equipment capable of handling computerized functions of medical diagnostic, treatment, and research methods will drive the market growth.
Regionally, the Latin America (LAMEA) PCB market may hold a valuation worth USD 3 billion by 2030. Latin America hosts several component manufacturing firms and OEMs, depicting a positive outlook for the regional automotive sector. PCBs are utilized in several advanced equipment that find major applications across the automotive industry. These include transmission controls, GPS support, LED lights, entertainment systems, safety equipment, etc. The emerging demand for autonomous and electrical vehicles may further support the expansion of regional industry in the years to come.
Table of Contents
Chapter 1 Methodology & Scope
- 1.1 Scope & definitions
- 1.2 Methodology and forecast parameters
- 1.3 Region-wise COVID-19 impact analysis:
- 1.3.1 North America
- 1.3.2 Europe
- 1.3.3 Asia Pacific
- 1.3.4 LAMEA
- 1.4 Data Sources
- 1.4.1 Secondary
- 1.4.2 Primary
- 1.5 Industry Glossary
Chapter 2 Executive Summary
- 2.1 PCB industry 360 degree synopsis, 2018 - 2030
- 2.2 Business trends
- 2.3 Regional trends
- 2.4 Type trends
- 2.5 Substrate trends
- 2.6 Application trends
Chapter 3 Printed Circuit Board (PCB) Industry Insights
- 3.1 Introduction
- 3.2 Impact analysis of coronavirus COVID-19 pandemic
- 3.2.1 Global outlook
- 3.2.2 Impact by region
- 3.2.2.1 North America
- 3.2.2.2 Europe
- 3.2.2.3 Asia Pacific
- 3.2.2.4 Latin America
- 3.2.2.5 MEA
- 3.2.3 Industry value chain
- 3.2.3.1 Research and development
- 3.2.3.2 Manufacturing
- 3.2.3.3 Marketing
- 3.2.3.4 Supply
- 3.2.4 Competitive landscape
- 3.2.4.1 Strategy
- 3.2.4.2 Distribution channel
- 3.2.4.3 Business growth
- 3.3 Impact of Russia-Ukraine War
- 3.3.1 Response of global enterprises
- 3.3.2 Region-wise response on the Russia-Ukraine crisis
- 3.3.2.1 North America
- 3.3.2.2 Europe
- 3.3.2.3 Asia Pacific
- 3.3.2.4 Latin America
- 3.3.2.5 MEA
- 3.4 Industry ecosystem analysis
- 3.4.1 Raw material and component supplier
- 3.4.2 Manufacturer
- 3.4.3 Marketing and distribution channel
- 3.4.4 End-users
- 3.4.5 Profit margin
- 3.4.6 Vendor matrix
- 3.5 Technological and innovation landscape
- 3.5.1 Surface mount technology (SMT)
- 3.5.2 Through hole mounting technology
- 3.5.3 5G technology
- 3.6 Regulatory landscape
- 3.6.1 North America
- 3.6.1.1 The CHIPS act (Program)
- 3.6.1.2 Semiconductor Industry Association (SIA) act 2020. (Investigation of section 301 act)
- 3.6.2 Europe
- 3.6.2.1 European Chip Act 2021
- 3.6.2.2 Anti-Subsidy regulation
- 3.6.3 Asia Pacific
- 3.6.3.1 E-waste Regulations Japan
- 3.6.3.2 E-Waste Regulations in China
- 3.6.4 Latin America
- 3.6.4.1 Latin America UNIDO E-Waste program
- 3.6.5 MEA
- 3.6.5.1 Toxic Use Reduction Act (TURA)
- 3.7 Investment landscape
- 3.8 Industry impact forces
- 3.8.1 Growth drivers
- 3.8.1.1 Rising integration of electronic component in vehicles
- 3.8.1.2 Increasing demand for printed circuit boards in healthcare wearables
- 3.8.1.3 Increasing demand for automation machinery & industrial robots in the manufacturing sector
- 3.8.1.4 Proliferation of PCBs among the smartphone manufacturers
- 3.8.1.5 Rising investments in 5G technology and telecom infrastructure in developing nations
- 3.8.2 Industry impact forces
- 3.8.2.1 Technical issues associated with PCB designing
- 3.9 Growth potential analysis
- 3.10 Porter's analysis
- 3.10.1 Bargaining power of suppliers
- 3.10.2 Bargaining power of buyers
- 3.10.3 The threat of new entrants
- 3.10.4 The threat of substitutes
- 3.10.5 Competitive rivalry
- 3.11 PESTEL analysis
- 3.11.1 Political
- 3.11.2 Economic
- 3.11.3 Social
- 3.11.4 Technological
- 3.11.5 Legal
- 3.11.6 Environmental
Chapter 4 Competitive Landscape, 2021
- 4.1 Introduction
- 4.2 Company market share
- 4.3 Competitive analysis of major market players
- 4.3.1 Zhen Ding Tech. Group Technology Holding Limited
- 4.3.2 DSBJ
- 4.3.3 Unimicron Technology Corporation
- 4.3.4 TTM Technologies
- 4.3.5 Tripod Technology
- 4.3.6 AT&S
- 4.4 Competitive analysis of innovation leaders, 2021
- 4.4.1 Fujikura Ltd
- 4.4.2 NITTO DENKO CORPORATION
- 4.4.3 NIPPON MEKTRON, LTD.
- 4.4.4 Würth Elektronik GmbH & Co. KG
- 4.4.5 Sumitomo Electric Printed Circuits, Inc
- 4.5 Vendor adoption matrix
Chapter 5 Printed Circuit Board (PCB) Market, By Type
- 5.1 PCB market share, by type, 2021 & 2028
- 5.2 Single-sided
- 5.2.1 Market estimates & forecast, 2018-2030
- 5.3 Double-sided
- 5.3.1 Market estimates & forecast, 2018-2030
- 5.4 Multi-layered
- 5.4.1 Market estimates & forecast, 2018-2030
- 5.5 HDI (High Density Interconnect)
- 5.5.1 Market estimates & forecast, 2018-2030
- 5.6 Other
- 5.6.1 Market estimates & forecast, 2018-2030
Chapter 6 Printed Circuit Board (PCB) Market, By Substrate
- 6.1 PCB market share, by substrate, 2021 & 2028
- 6.2 Rigid
- 6.2.1 Market estimates & forecast, 2018-2030
- 6.3 Flexible
- 6.3.1 Market estimates & forecast, 2018-2030
- 6.4 Rigid-flex
- 6.4.1 Market estimates & forecast, 2018-2030
Chapter 7 Printed Circuit Board (PCB) Market, By Application
- 7.1 PCB market share, by application, 2021 & 2028
- 7.2 Consumer electronics
- 7.2.1 Market estimates & forecast, 2018-2030
- 7.3 Automotive
- 7.3.1 Market estimates & forecast, 2018-2030
- 7.4 Healthcare
- 7.4.1 Market estimates & forecast, 2018-2030
- 7.5 IT & Telecom
- 7.5.1 Market estimates & forecast, 2018-2030
- 7.6 Industrial
- 7.6.1 Market estimates & forecast, 2018-2030
- 7.7 Other
- 7.7.1 Market estimates & forecast, 2018-2030
Chapter 8 Printed Circuit Board (PCB) Market, By Region
- 8.1 PCB market share, by region, 2021 & 2028
- 8.2 North America
- 8.2.1 Market estimates & forecast, by type, 2018-2030
- 8.2.2 Market estimates & forecast, by substrate, 2018-2030
- 8.2.3 Market estimates & forecast, by application, 2018-2030
- 8.2.4 U.S.
- 8.2.4.1 Market estimates & forecast, by type, 2018-2030
- 8.2.4.2 Market estimates & forecast, by substrate, 2018-2030
- 8.2.4.3 Market estimates & forecast, by application, 2018-2030
- 8.2.5 Canada
- 8.2.5.1 Market estimates & forecast, by type, 2018-2030
- 8.2.5.2 Market estimates & forecast, by substrate, 2018-2030
- 8.2.5.3 Market estimates & forecast, by application, 2018-2030
- 8.3 Europe
- 8.3.1 Market estimates & forecast, by type, 2018-2030
- 8.3.2 Market estimates & forecast, by substrate, 2018-2030
- 8.3.3 Market estimates & forecast, by application, 2018-2030
- 8.3.4 UK
- 8.3.4.1 Market estimates & forecast, by type, 2018-2030
- 8.3.4.2 Market estimates & forecast, by substrate, 2018-2030
- 8.3.4.3 Market estimates & forecast, by application, 2018-2030
- 8.3.5 Germany
- 8.3.5.1 Market estimates & forecast, by type, 2018-2030
- 8.3.5.2 Market estimates & forecast, by substrate, 2018-2030
- 8.3.5.3 Market estimates & forecast, by application, 2018-2030
- 8.3.6 France
- 8.3.6.1 Market estimates & forecast, by type, 2018-2030
- 8.3.6.2 Market estimates & forecast, by substrate, 2018-2030
- 8.3.6.3 Market estimates & forecast, by application, 2018-2030
- 8.3.7 Italy
- 8.3.7.1 Market estimates & forecast, by type, 2018-2030
- 8.3.7.2 Market estimates & forecast, by substrate, 2018-2030
- 8.3.7.3 Market estimates & forecast, by application, 2018-2030
- 8.3.8 Russia
- 8.3.8.1 Market estimates & forecast, by type, 2018-2030
- 8.3.8.2 Market estimates & forecast, by substrate, 2018-2030
- 8.3.8.3 Market estimates & forecast, by application, 2018-2030
- 8.4 Asia Pacific
- 8.4.1 Market estimates & forecast, by type, 2018-2030
- 8.4.2 Market estimates & forecast, by substrate, 2018-2030
- 8.4.3 Market estimates & forecast, by application, 2018-2030
- 8.4.4 China
- 8.4.4.1 Market estimates & forecast, by type, 2018-2030
- 8.4.4.2 Market estimates & forecast, by substrate, 2018-2030
- 8.4.4.3 Market estimates & forecast, by application, 2018-2030
- 8.4.5 Japan
- 8.4.5.1 Market estimates & forecast, by type, 2018-2030
- 8.4.5.2 Market estimates & forecast, by substrate, 2018-2030
- 8.4.5.3 Market estimates & forecast, by application, 2018-2030
- 8.4.6 India
- 8.4.6.1 Market estimates & forecast, by type, 2018-2030
- 8.4.6.2 Market estimates & forecast, by substrate, 2018-2030
- 8.4.6.3 Market estimates & forecast, by application, 2018-2030
- 8.4.7 South Korea
- 8.4.7.1 Market estimates & forecast, by type, 2018-2030
- 8.4.7.2 Market estimates & forecast, by substrate, 2018-2030
- 8.4.7.3 Market estimates & forecast, by application, 2018-2030
- 8.4.8 Taiwan
- 8.4.8.1 Market estimates & forecast, by type, 2018-2030
- 8.4.8.2 Market estimates & forecast, by substrate, 2018-2030
- 8.4.8.3 Market estimates & forecast, by application, 2018-2030
- 8.4.9 Thailand
- 8.4.9.1 Market estimates & forecast, by type, 2018-2030
- 8.4.9.2 Market estimates & forecast, by substrate, 2018-2030
- 8.4.9.3 Market estimates & forecast, by application, 2018-2030
- 8.5 LAMEA
- 8.5.1 Market estimates & forecast, by type, 2018-2030
- 8.5.2 Market estimates & forecast, by substrate, 2018-2030
- 8.5.3 Market estimates & forecast, by application, 2018-2030
- 8.5.4 Brazil
- 8.5.4.1 Market estimates & forecast, by type, 2018-2030
- 8.5.4.2 Market estimates & forecast, by substrate, 2018-2030
- 8.5.4.3 Market estimates & forecast, by application, 2018-2030
- 8.5.5 Mexico
- 8.5.5.1 Market estimates & forecast, by type, 2018-2030
- 8.5.5.2 Market estimates & forecast, by substrate, 2018-2030
- 8.5.5.3 Market estimates & forecast, by application, 2018-2030
- 8.5.6 GCC
- 8.5.6.1 Market estimates & forecast, by type, 2018-2030
- 8.5.6.2 Market estimates & forecast, by substrate, 2018-2030
- 8.5.6.3 Market estimates & forecast, by application, 2018-2030
Chapter 9 Company Profiles
- 9.1 Advanced Circuitry International, Inc
- 9.1.1 Business overview
- 9.1.2 Financial data
- 9.1.3 Product landscape
- 9.1.4 Go-to-market strategy
- 9.1.5 SWOT analysis
- 9.2 Advanced Circuits
- 9.2.1 Business overview
- 9.2.2 Financial data
- 9.2.3 Product landscape
- 9.2.4 Go-to-market strategy
- 9.2.5 SWOT analysis
- 9.3 A-Flex
- 9.3.1 Business overview
- 9.3.2 Financial data
- 9.3.3 Product landscape
- 9.3.4 Go-to-market strategy
- 9.3.5 SWOT analysis
- 9.4 American Standard Circuits
- 9.4.1 Business overview
- 9.4.2 Financial data
- 9.4.3 Product landscape
- 9.4.4 Go-to-market strategy
- 9.4.5 SWOT analysis
- 9.5 Amitron Corp.
- 9.5.1 Business overview
- 9.5.2 Financial data
- 9.5.3 Product landscape
- 9.5.4 Go-To-market strategy
- 9.5.5 SWOT analysis
- 9.6 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- 9.6.1 Business overview
- 9.6.2 Financial data
- 9.6.3 Product landscape
- 9.6.4 Go-to-Market strategy
- 9.6.5 SWOT analysis
- 9.7 Becker & Muller Schaltungsdruck GmbH
- 9.7.1 Business overview
- 9.7.2 Financial data
- 9.7.3 Product landscape
- 9.7.4 Go-to-market strategy
- 9.7.5 SWOT analysis
- 9.8 Eltek Ltd.
- 9.8.1 Business overview
- 9.8.2 Financial data
- 9.8.3 Product landscape
- 9.8.4 Go-to-market strategy
- 9.8.5 SWOT analysis
- 9.9 Epec, LLC
- 9.9.1 Business overview
- 9.9.2 Financial data
- 9.9.3 Product landscape
- 9.9.4 Go-to-market strategy
- 9.9.5 SWOT analysis
- 9.10 Flex PCB
- 9.10.1 Business overview
- 9.10.2 Financial data
- 9.10.3 Product landscape
- 9.10.4 Go-to-market strategy
- 9.10.5 SWOT analysis
- 9.11 Fujikura Limited
- 9.11.1 Business overview
- 9.11.2 Financial data
- 9.11.3 Product landscape
- 9.11.4 Go-to-market strategy
- 9.11.5 SWOT analysis
- 9.12 Hitech Circuits Co., Ltd
- 9.12.1 Business overview
- 9.12.2 Financial data
- 9.12.3 Product landscape
- 9.12.4 Go-to-market strategy
- 9.12.5 SWOT analysis
- 9.13 Kinwong Electronic Corporation Limited
- 9.13.1 Business overview
- 9.13.2 Financial data
- 9.13.3 Product landscape
- 9.13.4 Go-to-market strategy
- 9.13.5 SWOT analysis
- 9.14 MultiTech Electron HK Limited.
- 9.14.1 Business overview
- 9.14.2 Financial data
- 9.14.3 Product landscape
- 9.14.4 Go-to-market-strategy
- 9.14.5 SWOT analysis
- 9.15 NITTO DENKO CORPORATION
- 9.15.1 Business overview
- 9.15.2 Financial data
- 9.15.3 Product landscape
- 9.15.4 Go-to-market strategy
- 9.15.5 SWOT analysis
- 9.16 Rayming Technology
- 9.16.1 Business overview
- 9.16.2 Financial data
- 9.16.3 Product landscape
- 9.16.4 Go-to-market strategy
- 9.16.5 SWOT analysis
- 9.17 Sumitomo Electric Printed Circuits, Inc.
- 9.17.1 Business overview
- 9.17.2 Financial data
- 9.17.3 Product landscape
- 9.17.4 Go-to-market strategy
- 9.17.5 SWOT analysis
- 9.18 Unimicron Technology (Shenzhen) Corp.
- 9.18.1 Business overview
- 9.18.2 Financial data
- 9.18.3 Product landscape
- 9.18.4 Go-to-market strategy
- 9.18.5 SWOT analysis
- 9.19 TTM Technologies Incorporated
- 9.19.1 Business overview
- 9.19.2 Financial data
- 9.19.3 Product landscape
- 9.19.4 Go-to-market strategy
- 9.19.5 SWOT analysis
- 9.20 Wurth Elektronik GmbH & Co. KG.
- 9.20.1 Business overview
- 9.20.2 Financial data
- 9.20.3 Product landscape
- 9.20.4 Go-to-market strategy
- 9.20.5 SWOT analysis